Patent Grant
10461423
This non-provisional application claims priority under 35 U.S.C. ยง 119(a) on Taiwan Patent Application No. 105214817 filed Sep. 29, 2016, the entire contents of which are incorporated herein by reference.
The invention relates to a multi-frequency antenna for transmitting or receiving signals with different frequencies, and its advantage is to reduce the size and production costs of multi-frequency antennae.
Noting the continued fast progression of wireless communication technologies, wireless communication products are increasingly widely used in our daily lives. The antenna is one of the most important devices for wireless communication products. In general, the antenna may occupy considerable space in wireless communication products. Thus, the reduction of antenna size in order to minimize the size of communication products is a large issue and of great concern.
A microstrip antenna usually refers to an antenna fabricated through the use of microstrip techniques. Microstrip antennae have attracted a great deal of attention due to their plane structure, low cost, ease to be mass produced, and integrated with active components or circuit boards. Thus, microstrip antennae have been widely used in many portable devices that require wireless communication capability, such as mobile phones, smart phones, tablet computers, notebook computers, GPS (Global Positioning System) units, and RFID devices. Despite the many advantages of microstrip antennae, they have several basic disadvantages, such as narrow bandwidth, low gain, and relatively large size.
With the aim of reducing the size and weight of portable computers, the PIFA (Planar Inverted F Antenna) or monopole antenna can be set up on the circuit board of the portable device. However, because of rapid developments in the wireless communication industry, most mobile devices are installed with communication modules that must transmit or receive signals at various frequency bands. Therefore, antennae with multiple resonance frequencies are essential elements in most mobile devices. To design a monopole or PIFA antenna with multiple resonance frequencies, the area or space of a circuit board needs to be large. In actual application, in order to meet the requirement of at least a quarter of the wavelength, the dimensions of the monopole or PIFA antenna cannot be further reduced.
Therefore, the main objective of the present invention is to provide a multi-frequency antenna that comprises one or more filtering elements connected between two resonance units of the antenna, thereby allowing the antenna to generate two or more resonant frequencies. In one embodiment, the resonance unit may be a resonant segment and the antenna may be a chip antenna.
In order to achieve the above objects, the present invention provides a multi-frequency antenna that comprises a circuit board, at least one substrate, a first resonance unit, a first filtering element, and a second resonance unit. The circuit board includes a clearance area and at least one signal feeding terminal, and the substrate is disposed within the clearance area. The first resonance unit is connected to the signal feeding terminal, with part or all of the first resonance unit located on the surface of the substrate or within the substrate. The first filtering element is located between the first resonance unit and the second resonance unit, with part or all of the second resonance unit disposed on the surface of or within the substrate. The first resonance unit forms the first resonant frequency of the multi-frequency antenna. The first resonance unit, the first filtering element, and the second resonance unit jointly form the second resonant frequency of the multi-frequency antenna, wherein the second resonant frequency is lower than the first resonant frequency. The first filtering element shows a high impedance towards the electronic signal with the first resonant frequency to prevent the first resonant frequency signal from entering the second resonance unit. Further, the first filtering element shows a low impedance towards the second resonant frequency signal, with the second resonant frequency signal being capable of passing through the first filtering element.
The structure as well as preferred modes of use, further objects, and advantages of this invention will be best understood by referring to the following detailed descriptions of illustrated embodiments in conjunction with the accompanying drawings, in which:
One end of the first resonance unit 15 is connected to the signal feeding terminal 113, and the other end of the first resonance unit 15 is connected to the first filtering element 171. Partial or all of the first resonance unit 15 may be located on the surface of the substrate 13 or within the substrate 13. For example, portion of the first resonance unit 15 is located on the surface of the substrate 13, portion of the first resonance unit 15 is located within the clearance area 111 of the circuit board 11 to connect with the signal feeding terminal 113 and portion of the first resonance unit 15 is embedded within the substrate 13.
The second resonance unit 18 is connected to the first filtering element 171, and thus the first filtering element 171 is located between the first resonance unit 15 and the second resonance unit 18. Part or all of the second resonance unit 18 may be located on the surface of the substrate 13 or within the substrate 13.
The first resonance unit 15 is used to form the first resonant frequency f1 of the multi-frequency antenna 10, and the first resonance unit 15, the first filtering element 171, and the second resonance unit 18 jointly form the second resonant frequency f2 of the multi-frequency antenna 10. The second resonant frequency f2 is lower than the first resonant frequency f1.
More specifically, the first filtering element 171 shows a high impedance towards the electronic signal with first resonant frequency f1, and the first resonant frequency signal f1 is isolated from the second resonance unit 18 without transmitting to the second resonance unit 18. Furthermore, the first filtering element 171 shows a low impedance towards the signal with the second resonant frequency f2, and thus the second resonant frequency signal f2 can pass through the first filtering element 171.
In practical application, a suitable first filtering element 171 may be selected based on the first resonant frequency f1 and the second resonant frequency f2 of the multi-frequency antenna 10. For example, the first filtering element 171 may comprise at least one inductor or a resonance circuit consisting of inductors and capacitors. Further, because the second resonant frequency f2 is jointly formed by the first resonance unit 15, the first filtering element 171, and the second resonance unit 18, the frequency of the second resonant frequency f2 will change based on the replacement of the first filtering element 171.
Further, the first resonance unit 15 and the second resonance unit 18 may comprise a plurality of conducting segments, such as conducting wires, connecting units, conducting planes, or curved conducting surfaces. More specifically, the conducting wire, the conducting plane, or the curved conducting surface is disposed on the surface of the substrate 13, within the substrate 13, or within the clearance area 111 of the circuit board 11, and the connecting unit penetrates through part or all of the substrate 13 in order to connect with the conducting wire, the conducting plane, or the curved conducting surface.
In this embodiment of the invention, the first resonance unit 15 may comprise a plurality of first conducting layers 151, such as conducting wires, and a plurality of first connecting units 153. Each first conducting layer 151 may be respectively disposed on different planes or surfaces of the substrate 13. For example, the first conducting layers 151 are disposed on the top surface and/or the bottom surface of the substrate 13. The first connecting units 153 that penetrate through part or all of the substrate 13 are connected with first conducting layers 151 disposed on different planes or surfaces of the substrate 13. Similarly, the second resonance unit 18 may also comprise a plurality of second conducting layers 181, such as conducting wires, and a plurality of second connecting units 183. Each second conducting layer 181 may be disposed on different planes or surfaces of the substrate 13. For example, the second conducting layers 181 are disposed on the top surface and/or the bottom surface of the substrate 13. The second connecting units 183 that penetrate through part or all of the substrate 13 are connected to the second conducting layers 151 disposed on different planes or surfaces of the substrate 13.
In this embodiment of the invention, the first filtering element 171 is disposed on the surface of the substrate 13, as shown in
One end of the first resonance unit 15 is connected to the signal feeding terminal 113, and the other end of the first resonance unit 15 is connected to one end of the first filtering element 271, wherein part or all of the first resonance unit 15 is located on the surface of the substrate 13 or within the substrate 13. For example, part of the first resonance unit 15 is disposed on the surface and interior of the substrate 13, and part of the first resonance unit 15 is disposed within the clearance area 111 of the circuit board 11 in order to connect to the signal feeding terminal 113.
The second resonance unit 18 is connected to the other end of the first filtering element 271, and thus the first filtering element 171 is disposed between the first resonance unit 15 and the second resonance unit 18, wherein part or all of the second resonance unit 18 is disposed on the surface of the substrate 13 or within the substrate 13.
One end of the second filtering element 273 is connected to the second resonance unit 18, and the third resonance unit 29 is connected to the other end of the second filtering element 273. Thus, the second filtering element 273 is disposed between the second resonance unit 18 and the third resonance unit 29, and part or all of the third resonance unit 29 is disposed on the surface of or within the substrate 13. The first filtering element 271 and the second filtering element 273 may respectively comprise at least one inductor or a resonant circuit consisting of capacitors and inductors.
The first resonance unit 15 forms the first resonant frequency f1 of the multi-frequency antenna 20, and the first resonance unit 15, the first filtering element 271, and the second resonance unit 18 jointly form the second resonant frequency f2 of the multi-frequency antenna 20, wherein the second resonant frequency f2 is lower than the first resonant frequency f1. Further, the first resonance unit 15, the first filtering element 271, the second resonance unit 18, the second filtering element 273, and the third resonance unit 29 jointly form a third resonant frequency f3 of the multi-frequency antenna 20, and the third resonant frequency f3 is lower than the second resonant frequency f2.
More specifically, the first filtering element 271 shows a high impedance towards the signal with the first resonant frequency f1 to isolate the first resonant frequency signal f1 from the second resonance unit 18. Thus, the signal with the first resonant frequency f1 is unable to be transmitted to the second resonance unit 18. Further, the first filtering element 271 shows a low impedance towards the signals with the second resonant frequency f2 and the third resonant frequency f3. Thus, the second resonant frequency signal f2 and the third resonant frequency signal f3 can pass through the first filtering element 271.
The second filtering element 273 shows a high impedance towards signal with the second resonant frequency f2 to isolate the second resonant frequency signal f2 from the third resonance unit 29. Thus, the second resonant frequency signal f2 is unable to be transmitted to the third resonance unit 29. Furthermore, the second filtering element 273 shows a low impedance towards the signal with the third resonant frequency f3, and thus the third resonant frequency signal f3 can pass through the second filtering element 273.
In one embodiment of the invention, the third resonance unit 29 comprises a plurality of conducting segments, such as conducting wires, connecting units, conducting planes, or curved conducting surfaces. In this embodiment of the invention, the third resonance unit 29 comprises a plurality of third conducting layers 291, such as conducting wires, and a plurality of third connecting units 293, wherein each third conducting layer 291 is disposed on different planes or surfaces of the substrate 13. For example, each third conducting layer 291 is disposed on the top or bottom surface of the substrate 13. The third connecting unit 293 passes through part or all of the substrate 13 in order to connect to the third conducting layers 291 disposed on different planes or surfaces of the substrate 13.
In this embodiment of the invention, the first filtering element 271 and the second filtering element 273 are disposed on the surface of the substrate 13, as shown in
The first resonance unit 35 is connected to the signal feeding terminal 113, and part or all of the first resonance unit 35 is disposed on the surface of or within the substrate 13. For example, part of the first resonance unit 35 is disposed on the surface of the substrate 13 or within the substrate 13, and part of the first resonance unit 35 is disposed within the clearance area 111 of the circuit board 11 in order to connect to the signal feeding terminal 113. The second resonance unit 38 is connected to the first resonance unit 35 via the first filtering element 371, and thus the first filtering element 371 is located between the first resonance unit 35 and the second resonance unit 38, wherein part or all of the second resonance unit 38 is disposed on the surface of the substrate 13 or within the substrate 13.
The first resonance unit 35 forms the first resonant frequency f1 of the multi-frequency antenna 30, and the first resonance unit 35, the first filtering element 371, and the second resonance unit 38 jointly form the second resonant frequency f2 of the multi-frequency antenna 30, wherein the frequency of the second resonant frequency f2 is lower than the first resonant frequency f1. Further, the first filtering element 371 shows a high impedance towards the signal with the first resonant frequency f1 to isolate the first resonant frequency signal f1 from the second resonance unit 38. The first filtering element 371 shows a low impedance towards the signal with the second resonant frequency f2, thus the second resonant frequency signal f2 can pass through the first filtering element 371.
In one embodiment of the invention, the first resonance unit 35 comprises a first conducting plane 351, and the second resonance unit 38 comprises a second conducting plane 381 and a rounded conducting plane 382 with curve boundary. For example, the first conducting plane 351 and the second conducting plane 381 may be a square, and the rounded conducting plane 382 may comprise region with curve boundary. The second conducting plane 381 is connected to the rounded conducting plane 382.
In this embodiment of the invention, the first filtering element 371 is disposed on the surface of the substrate 13, and is connected to the first resonance unit 35 and the second resonance unit 38. Thus, the first filtering element 371 is located between the first resonance unit 35 and the second resonance unit 38, as shown in
In another embodiment of the invention, the first filtering element 371 is disposed within the clearance area 111 of the circuit board 11, and the first resonance unit 35 and the second resonance unit 38 are connected to the first filtering element 371 within the clearance area 111 via the conducting wires within the clearance area 111, as shown in
The first resonance unit 45 is connected to the signal feeding terminal 113, and part or all of the first resonance unit 45 is located on the surface of the substrate 13 or within the substrate 13. For example, part of the first resonance unit 45 is disposed on the top surface of the substrate 13, and part of the first resonance unit 45 is extended within the clearance area 111 of the circuit board 11 to connect to the signal feeding terminal 113. The first filtering element 471 is disposed on the surface of the substrate 13, and the second resonance unit 48 is connected to the first resonance unit 45 via the first filtering element 471. Part or all of the second resonance unit 48 is disposed on the surface of the substrate 13, such as the top surface, or within the substrate 13.
In one embodiment of the invention, the multi-frequency antenna 40 comprises at least one extended unit 46 disposed on the surface of the substrate 13 or within the substrate 13. One end of the extended unit 46 is connected to the first resonance unit 45, such as the extended unit 46 disposed on the top surface of the substrate 13, as shown in
In another embodiment of the invention, the extended unit 46 may be connected to the second resonance unit 48, wherein the extended unit 46 is disposed on the surface of the substrate 13 or within the substrate 13, or is extended to the clearance area 111 of the circuit board 11. For example, one end of the extended unit 46 is connected to the second resonance unit 48. Part of the extended unit 46 is disposed on the surface of the substrate 13 or within the substrate 13, and part of the extended unit 46 is extended to the clearance area 111 via the side surface of the substrate 13, as shown in
The first resonance unit 55 is connected to the signal feeding terminal 113, and part or all of the first resonance unit 55 is located on the surface of the substrate 13 or within the substrate 13. For example, part of the first resonance unit 55 is disposed on the top surface or the side surface of the substrate 13, and part of the first resonance unit 55 is disposed within the clearance area 111 of the circuit board 11 to connect to the signal feeding terminal 113. The first filtering element 571 is disposed on the surface of the substrate 13, and the second resonance unit 58 is connected to the first resonance unit 55 via the first filtering element 571. Part or all of the second resonance unit 58 is disposed on the surface of the substrate 13 or within the substrate 13, such as the second resonance unit 58 being disposed on the top surface of the substrate 13.
In one embodiment of the invention, the coupling unit 56 of the multi-frequency antenna 50 is disposed on the surface of the substrate 13 or within the substrate 13. A portion of the first resonance unit 55 is adjacent to partial portion of the coupling unit 56 to form a gap 52 therebetween. For example, part of the coupling unit 56 is disposed on the top surface and/or side surface of the substrate 13, and part of the coupling unit 56 is disposed within the clearance area 111. In another embodiment, one end of the coupling unit 56 is connected to the ground layer 115 of the circuit board 11. Further, the shape of the coupling unit 56 may be similar to the shapes of the first resonance unit 55 and the second resonance unit 58. However, this is one embodiment of the invention and is not a limitation of the invention. In another embodiment, the coupling unit 56 may not be connected to the ground layer 115, and the shape of the coupling unit 56 may not be similar to the shape of the first and second resonance unit 55/58.
In one embodiment of the invention, the first resonance unit 65 is connected to the signal feeding terminal 113, and part or all of the first resonance unit 65 is located on the surface of the substrate 13 or within the substrate 13. For example, part of the first resonance unit 65 is disposed on the bottom surface of the substrate 13, and part of the first resonance unit 65 is extended to the clearance area 111 of the circuit board 11 to connect to the signal feeding terminal 113. The first filtering element 671 is disposed within the clearance area 111 of the circuit board 11, and the second resonance unit 68 is connected to the first resonance unit 65 via the first filtering element 671. Part or all of the second resonance unit 68 is disposed on the surface of the substrate 13 or within the substrate 13, such as the second resonance unit 68 being disposed on the bottom surface of the substrate 13.
In one embodiment of the invention, the multi-frequency antenna 60 further comprises at least one extended unit 66, and one end of the extended unit 66 is connected to the first resonance unit 65. Part of the extended unit 66 is disposed on the surface of the substrate 13, and part of the extended unit 66 is extended to the clearance area 111. For example, part of the extended unit 66 is disposed on the bottom surface of the substrate 13, and part of the extended unit 66 is extended to the clearance area 111, as shown in
In another embodiment of the invention, the circuit board 11 further comprises a ground layer 115, and the extended unit 66 shown in
One end of the first resonance unit 75 is connected to the signal feeding terminal 113, and the other end of the first resonance unit 75 is connected to the first filtering element 771. The second resonance unit 78 is connected to the first resonance unit 75 via the first filtering element 771, thus the first filtering element 771 is located between the first resonance unit 75 and the second resonance unit 78.
In this embodiment of the invention, the first resonance unit 75 comprises a plurality of first conducting layers 751 and at least one first connecting unit 753. Each first conducting layer 751 may be disposed on different planes or surfaces of the substrate 13, and the first connecting unit 753 penetrates through part or all of the substrate 13 in order to connect with the first conducting layers 751 disposed on different planes or surfaces of the substrate 13. For example, part of the first conducting layer 751 is disposed on the bottom surface of the substrate 13, and part of the first conducting layer 751 is disposed on the top surface of the substrate 13. Further, the first conducting layers 751 disposed on the top surface and the bottom surface of the substrate 13 are connected to each other via the first connecting unit 753.
Furthermore, the second resonance unit 78 comprises a plurality of second conducting layer 781 and at least one second connecting unit 783. Each second conducting layer 781 is disposed on different planes or surfaces of the substrate 13 respectively, and the second connecting unit 783 penetrates through part or all of the substrate 13 and is connected to the second conducting layers 781 disposed on different planes or surfaces of the substrate 13. For example, part of the second conducting layer 781 is disposed on the bottom surface of the substrate 13, and part of the second conducting layer 781 is disposed within the substrate 13. Further, the second conducting layers 781 disposed on the bottom surface of the substrate 13 and within the substrate 13 are connected to each other via the second connecting unit 783.
In this embodiment of the invention, the first resonance unit 85 comprises a plurality of first conducting wires 851, and part or all of the first resonance unit 85 is disposed on the surface of the substrate 13 or within the substrate 13. For example, part of the first resonance unit 85 is disposed on the top surface of the substrate 13, and part of the first resonance unit 85 is extended to the clearance area 111 via the side surface of the substrate 13. One end of each first conducting wire 851 can be connected to the signal feeding terminal 113, and the other end of each first conducting wire 851 can be connected to the first filtering element 871. Further, the second resonance unit 88 comprises a plurality of second conducting wires 881. One end of each second conducting wire 881 can be connected to the first filtering element 871, and the other end of each second conducting wire 881 can or cannot be connected to each other. Furthermore, part or all of the second resonance unit 88 is disposed on the surface of the substrate 13 or within the substrate 13. For example, part of the second resonance unit 88 is disposed on the top surface of the substrate 13, and part of the second resonance unit 88 is extended to the clearance area 111 via the side surface of the substrate 13.
The first resonance units 15/35/45/55/65/75/85, the second resonance units 18/38/48/58/68/78/88, and/or the third resonance unit 29 described in the invention can be disposed on any surface of the substrate 13, such as on the top surface, the bottom surface, or the side surface of the substrate, or within the substrate 13.
The above disclosures are only the preferred embodiments of the present invention, and are not to be used to limit the scope of the present invention. All equivalent variations and modifications on the basis of shapes, structures, features, and spirits described in the claims of the present invention should be included in the claims of the present invention.
| Number | Date | Country | Kind |
|---|---|---|---|
| 105214817 U | Sep 2016 | TW | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 7136020 | Yamaki | Nov 2006 | B2 |
| Number | Date | Country | |
|---|---|---|---|
| 20180090839 A1 | Mar 2018 | US |
