Patent Grant
10850551
The invention relates to a multi-layer body with two layers or layer systems and to a method for the production thereof.
Multi-layer bodies as a security element can be taken as known from the prior art and are widely used to protect bank notes, securities and identity documents against forgery or for the authentication of products. They are based on a combination of several functional layers, which may, for example, comprise optically variable elements (OVD=Optical Variable Devices), diffractive elements, partially metalized layers or printed features.
It is known to produce such multi-layer bodies by the sequential application of individual layers, building up the desired layer sequence. In order to obtain multi-layer bodies that are particularly forgery-proof, it is desirable to allow features of the individual layers to blend seamlessly into one another. In other words, the layers should be arranged as accurately as possible in register with one another. Where the multi-layer bodies are built up sequentially, however, this cannot always be achieved since the methods used to produce each individual layer are subject to tolerances in terms of the position of the layers relative to one another. As a result, the desired seamless transitions between the features cannot be achieved reliably, which has a negative effect on the anti-forgery security and the optical appearance of such a multi-layer body.
By register or register accuracy is meant the accurately positioned arrangement of superimposed layers relative to one another, maintaining a desired positional tolerance.
The object of the present invention is therefore to provide a method for producing a multi-layer body that makes it possible to produce a multi-layer body with improved anti-forgery security. It is a further object of the present invention to provide a particularly forgery-proof multi-layer body.
This object is achieved by a method with the features of claim 1 and by a multi-layer body with the features of claim 26.
Such a method for producing a multi-layer body, in particular a security element, comprises the following steps:
In this way, a multi-layer body, in particular a security element, is obtained which comprises a substrate, a partial first layer or partial first layer system as well as a partial second layer or partial second layer system, wherein the partial first layer or partial first layer system is structured accurately in register with the partial second layer or partial second layer system using the partial second layer or partial second layer system as a mask and wherein the partial first layer or partial first layer system is present in a first partial area and not in a second partial area and wherein the partial second layer or partial second layer system is present in a third partial area and not in a fourth partial area, and wherein the third partial area overlaps with the first and second partial areas.
By using the partial second layer or partial second layer system as a mask in order to structure the partial first layer or partial first layer system, it is possible to arrange the two layers or layer systems exactly in register with one another. It is of particular importance that the second partial layer or second partial layer system extends not only into those areas covered by the first partial layer or first partial layer system—i.e. the first partial area—but also into the areas not covered by the first partial layer or first partial layer system—i.e. the second partial area. By use of the second partial layer or second partial layer system as a mask is meant here that, during the structuring of the first partial layer or first partial layer system, the latter is either selectively retained in or selectively removed from those areas that are covered by the second partial layer or second partial layer system. During the structuring, therefore, a defined positional relationship between the two layers or layer systems is obtained, so that these are arranged accurately in register with one another, for example adjoining one another seamlessly.
By layer system is meant here any arrangement of several layers. The layers can be arranged one on top of another in the direction of the surface normals of the layer system or also next to one another in a plane. A combination of layers arranged horizontally and vertically in this way is also possible.
By overlapping is meant that the respective partial areas lie at least partially one on top of another in the direction of the surface normals of the planes spanned by the first or second layer, i.e. viewed in the stack direction of the multi-layer body.
The production of the two layers or layer systems does not have to take place in the specified order, i.e. the second partial layer or second partial layer system can also be produced before the first partial layer or first partial layer system. The layers or layer systems can be produced directly on the substrate, directly on top of one another or with the production of any intermediate layers.
The structuring of the partial first layer or partial first layer system in step c) preferably takes place by etching. It is expedient if the partial second layer or partial second layer system is an etch resist or comprises an etch resist.
By an etch resist is meant a substance that is resistant to an etching agent and which can protect a substance that is sensitive to the etching agent from attack by the etching agent where the etch resist covers this substance.
In this embodiment, after production of the two layers or layer systems, an etching agent is therefore applied to the resulting layer stack, which etching agent removes the first partial layer or first partial layer system where this is not covered by the second partial layer or second partial layer system.
The etch resist is preferably a lacquer, which can in particular comprise binders, dyes, pigments, in particular colored or non-colored pigments, special-effect pigments, thin-film systems, cholesteric liquid crystals and/or metallic or non-metallic nanoparticles. Thus, the second partial layer or second partial layer system not only performs a protective function in the structuring of the first partial layer or first partial layer system, but can itself produce a decorative effect. It is also possible that, for the second partial layer or second partial layer system, several different etch resists, for example resist lacquers with different colorations, may be used to produce further visual effects.
The etching agent used for structuring the first partial layer or first partial layer system depends on the composition of this layer or layer system. For largely opaque metallic layers in particular or transparent or translucent HRI layers (HRI=High Refractive Index) in particular, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, tetramethyl ammonium hydroxide or sodium-ethylenediamine tetraacetate are suitable. Suitable etch resists for such etching agents are based for example on PVC (polyvinyl chloride), polyester resins or acrylates, wherein further film-forming substances such as nitrocellulose can typically be incorporated. The etching can be supported by mechanical agitation, for example by brushing, moving the etching bath or ultrasound treatment. Conventional temperatures for the etching operation are preferably between 15° C. and 75° C.
The structuring of the partial first layer or partial first layer system in step c) can further preferably take place by means of a lift-off method. It is expedient if the partial second layer or partial second layer system is or comprises a washcoat.
In lift-off methods, the washcoat is removed using a solvent. The washcoat must therefore be soluble in the solvent. For reasons of environmental protection, water is preferably used as the solvent. Suitable washcoats are composed for example on the basis of polyvinyl alcohol (PVA) or polyvinylpyrrolidone (PVP) and can additionally contain fillers that facilitate the subsequent removal of the washcoat. The removal of the washcoat takes place in a solvent bath or by spraying with solvent, preferably at temperatures of 15° C. to 65° C. As in the case of etching, the removal of the washcoat can also be supported mechanically, for example by brushing, agitating the solvent bath, spraying or ultrasound treatment.
In areas where the partial first layer or partial first layer system is applied to the washcoat, the partial first layer or partial first layer system is removed together with the washcoat. The partial first layer or partial first layer system therefore remains only in areas in which it does not overlap with the partial second layer or partial second layer system. A negative of the overlapping areas is therefore formed. This is useful in particular when the washcoat is a component of a layer system, so that the remaining components of the layer system that are not removed with the washcoat are arranged accurately in register with the remaining areas of the first layer or first layer system.
The structuring of the partial first layer or partial first layer system in step c) can further preferably take place by mask exposure. The partial second layer or partial second layer system itself therefore acts here as an exposure mask or is structured using a separate exposure mask. It is expedient here if the partial second layer or partial second layer system is or comprises a protective lacquer.
By protective lacquer is meant a substance that absorbs in a wavelength range used for exposing the partial first layer or partial first layer system. During exposure, the partial layers or layer systems are irradiated over the entire surface with light in this wavelength range, preferably perpendicular to the plane of the layer. Wavelengths conventionally used for the exposure are for example 250 nm to 420 nm. The exposure preferably takes place with a dose of 10 mJ/cm2 to 500 mJ/cm2. The exposure times are obtained from the sensitivities of the materials used and the output of the available light source.
Where the partial second layer or partial second layer system is present, therefore, less light of this wavelength reaches the partial first layer or partial first layer system.
It is also possible to combine etch resists and protective lacquers, for example by adding absorbing substances, for example so-called UV absorbers, dyes, color pigments or scattering substances, such as for example titanium dioxide, to an etch resist lacquer.
The protective lacquer is preferably a lacquer that comprises in particular binders, dyes, pigments, in particular colored or non-colored pigments, special-effect pigments, thin-film systems, cholesteric liquid crystals and/or metallic or non-metallic nanoparticles. Suitable protective lacquers are formulated for example on the basis of PVC, polyester or acrylates. Thus, the second partial layer or second partial layer system not only performs a protective function in the structuring of the first partial layer or first partial layer system but can also produce a decorative effect itself. It is also possible that, for the second partial layer or second partial layer system, several different protective lacquers, for example with different colorations, are used to produce further visual effects.
In order to achieve the desired structuring, it is expedient if the partial first layer or partial first layer system is or comprises a photoresist.
During exposure to a specific wavelength range, a photoresist alters its chemical and/or physical properties, so that the different properties of the exposed and unexposed areas can be utilized for the selective removal of the photoresist in one of the areas. For example, when the photoresist is exposed, its solubility changes vis-à-vis a solvent which can be used to develop the photoresist after exposure. In the case of positive photoresists, during the developing step that follows exposure, the exposed area is selectively removed and in the case of negative photoresists, the unexposed area is selectively removed. A photoresist can therefore also act as a washcoat.
Suitable positive photoresists are for example AZ 1518 or AZ 4562 from AZ Electronic Materials based on phenolic resin/diazoquinone. Suitable negative photoresists are for example AZ nLOF 2000 or ma-N 1420 from micro resist technology GmbH based for example on cinnamic acid derivatives. These can preferably be exposed by irradiation with light in a wavelength range of 250 nm to 440 nm. The required dose depends on the respective layer thicknesses, the wavelength of the exposure and the sensitivity of the photoresists.
To develop these photoresists, for example tetramethylammonium hydroxide is suitable. The development preferably takes place at temperatures of 15° C. to 65° C. for a preferred development time of 2 seconds to a few minutes. Here too, the development operation and the associated local removal of the photoresist can again be supported by mechanical agitation, such as for example brushing, wiping, exposure to a flow of the developing medium or ultrasound treatment.
The photoresist can also contain in particular binders, dyes, pigments, in particular colored pigments, special-effect pigments, thin-film systems, cholesteric liquid crystals and/or metallic or non-metallic nanoparticles in order to produce additional decorative effects.
It is further expedient if, in steps a) or b), the partial first layer or partial first layer system and/or the partial second layer or partial second layer system is initially produced over the entire surface or at least over large areas of the surface and is then structured. The production over the entire surface or large areas of the surface can take place for example by printing or vapor deposition.
The subsequent structuring of the partial first layer or partial first layer system and/or of the partial second layer or partial second layer system in steps a) or b) then takes place preferably by etching, lift-off or mask exposure. This takes place analogously to the structuring of the partial first layer or partial first layer system in step c), as described above. The required etch resists, protective lacquers or washcoats can, in turn, be a component of one or both of the layer systems or can be applied as additional layers. These layers can in turn remain as a component of the layer system or can also be removed again in a further step. In the case of mask exposure, an external exposure mask can also be used, which is placed on the respective layer or layer system. However, methods are also possible in which specific areas of the first layer or first layer system are partially removed, for example using a laser. Such methods are suitable in particular for the individual marking of security elements.
It is further possible that, during the structuring of the partial second layer or partial second layer system in step b), the structuring of the partial first layer or partial first layer system according to step c) takes place at the same time. This produces a method that is particularly simple and quick to carry out.
Alternatively, it is also possible that, in step a) and/or b), the partial first layer or partial first layer system and/or the partial second layer or partial second layer system are produced in structured form. For this, a printing method is preferably used, in particular intaglio printing, flexographic printing, offset printing, screen printing or digital printing, in particular ink-jet printing.
Preferably, the partial first layer or partial first layer system is or comprises a reflective layer of in particular an opaque metal and/or in particular a transparent or translucent material with a high refractive index (meaning a high real part of the complex refractive index), and/or at least one single- or multi-colored lacquer layer and/or a Fabry-Perot layer system.
It is further preferred if the partial second layer or partial second layer system is or comprises at least one transparent, translucent or largely opaque single- or multi-colored lacquer layer, in particular an etching and/or protective lacquer, and/or a Fabry-Perot layer system. Through the use or combination of such layers or layer systems for the partial first and second layers or the partial first and second layer systems, a variety of optical effects can be produced, which further contribute to anti-forgery security and provide a particularly attractive optical appearance.
Preferably, the partial first layer or partial first layer system and/or the partial second layer or partial second layer system are applied here in the form of at least one motif, pattern, symbol, image, logo or alphanumeric characters, in particular numbers or letters. The layers or layer systems can also complement one another before or only after the structuring of the partial first layer or partial first layer system to form such a motif, pattern, symbol, image, logo or alphanumeric characters, in particular numbers or letters. A graphic element produced in this way, which is formed by the interaction of several layers, is particularly difficult to reproduce and therefore particularly forgery-proof.
It is further advantageous if the partial first layer or partial first layer system and/or the partial second layer or partial second layer system is applied in the form of a one- or two-dimensional line and/or dot grid. Transformed line grids are also possible here, for example with wavy lines, which can also have a variable line width. The dots in a dot grid can have any geometries and/or sizes and do not have to be in the shape of a circular disc. For example, dot grids of triangular, rectangular, any kind of polygonal or star-shaped dots or dots designed in the form of symbols are also possible. The dot grid can also be made up of dots of different sizes and/or different shapes. Precisely when such a grid interacts with a graphic element in the other layer or in the other layer system, further graphic effects, such as for example half-tone images, can be produced.
The line and/or dot grid here preferably has a grid spacing of less than 300 μm, preferably of less than 200 μm and of more than 25 μm and preferably of more than 50 μm. The grid spacing can also vary across the grid. Line thicknesses or dot diameters are preferably from 25 μm to 150 μm and can also vary. Such grids have an effect on other graphic elements on which the grid is superimposed, but are themselves no longer perceived as such by the naked human eye.
It is also advantageous if the substrate comprises a carrier layer, in particular a film made of a plastic, preferably polyester, in particular PET (polyethylene terephthalate), and/or a release layer, for example of a polymer lacquer, for example PMMA (polymethyl methacrylate) or of waxy substances. Such a carrier layer imparts stability to the multi-layer body during its production and subsequent handling and protects it from damage. A release layer facilitates release of the security element from layers that are not required, such as the carrier layer, so that it can be applied to the desired document or object, in particular in the form of a hot stamping film with the carrier layer as a carrier film and the security element as a transfer ply to be transferred from the carrier film onto a substrate.
The substrate preferably comprises a replication layer with a diffractive surface relief. The replication layer can consist of a thermoplastic, i.e. thermally curing or drying, replication lacquer or a UV-curing replication lacquer or a mixture of such lacquers.
It is advantageous if the surface relief introduced into the replication layer forms an optically variable element, in particular a hologram, Kinegram® or Trustseal®, a preferably sinusoidal diffraction grating, an asymmetrical relief structure, a blazed grating, a preferably isotropic or anisotropic matt structure or a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure, a binary or continuous Fresnel lens, a microprism structure, a microlens structure or a combination structure thereof.
Using such structures or combinations thereof, a variety of optical effects can be achieved, which are in addition difficult to imitate and cannot be copied or can be copied only with difficulty using conventional optical copying methods, so that a particularly forgery-proof multi-layer body is obtained.
It is further expedient if, in a further step d), a third layer or third layer system is applied which is or comprises in particular an HRI layer and/or an adhesive layer. Adhesive layers can be used to affix the multi-layer body to a substrate, for example a document to be protected. HRI layers are particularly expedient in connection with extensive flat relief structures which can be made visible through the transparent HRI layer including in areas where the first and/or second layer or the first and/or second layer system do not provide an opaque metalized layer. A suitable material for an HRI layer is for example zinc sulfide or also titanium dioxide or zirconium dioxide.
A multi-layer body obtainable in this way can be used as a security element, in particular for a security document, in particular a bank note, a security, an identity document, a passport or a credit card.
The invention is illustrated more clearly below by way of example, based on several embodiment examples with the aid of the drawings. There are shown in:
As
The layer thickness of the first layer 11 is preferably 5 nm to 100 nm, further preferably 15 nm to 40 nm.
The first vapor-deposited layer can then be partially removed by known methods, for example by the partial application of an etch resist after the vapor deposition and subsequent etching, including removal of the etch resist; by the partial application of a washcoat before the vapor deposition and washing off (lift-off) after the vapor deposition or by partial application of a photoresist after the vapor deposition and subsequent exposure followed by removal of the exposed or unexposed components of the photoresist, depending on the type (positive or negative) of the photoresist.
Alternatively, the substrate is not vapor coated over the entire surface; rather, the layer 11 is partially produced, so that it is present in a first area 111 and not in a second area 112. Various methods of achieving this are known, such as for example screening using a rotating mask or printing of an oil which prevents the deposition of the metal layer in the vapor deposition process.
A replicated diffractive structure, for example in the form of an optically variable element (OVD=optical variable device), in particular a hologram, Kinegram® or Trustseal®, a preferably sinusoidal diffraction grating, an asymmetrical relief structure, a blazed grating, a preferably isotropic or anisotropic matt structure or a light-diffracting and/or light-refracting and/or light-focusing micro- or nanostructure, a binary or continuous Fresnel lens, a microprism structure, a microlens structure or a combination structure thereof, may already have been applied to the substrate beforehand. However, this does not necessarily have to be present.
The first layer 11 also does not have to be continuous, as shown, but can have any structure and any shape.
In the next step, the second layer 12, here in the form of a radial pattern, is printed onto the first layer. Intaglio printing, flexographic printing, offset printing, screen printing or digital printing, in particular ink-jet printing, is preferably used as the printing technique.
The second layer 12 here extends both into the area 111 covered by the first layer 11, but does not completely cover this, and into the area 112 not covered by the first layer 11. Where a replicated diffractive structure is present, the printing preferably takes place in register with this structure, with target tolerances of +/−1 mm, preferably +/−0.5 mm, depending on the printing method.
The lacquer used for printing the second layer 12 is an etch resist, i.e. resistant to an etching agent that can dissolve the metal of the first layer 11. If aluminum is used for the first layer, this etching agent can be for example sodium hydroxide solution. A lacquer based on PVC/PVAc (polyvinyl acetate) copolymer, for example, is then suitable as etch resist.
The lacquer further contains dyes, pigments, in particular colored or non-colored pigments or special-effect pigments, thin-film systems or cholesteric liquid crystals or nanoparticles, so that it produces an optically visible effect.
After the second layer 12 has been printed, the intermediate product shown in
Instead of a metal layer as first layer 11, several adjoining color layers can also be used, which are printed on the substrate. Suitable lacquers for this purpose are for example photoresists, such as for example AZ 1518 from AZ Electronic Materials. The second layer 12 is then preferably a protective lacquer, for example a transparent or opaque lacquer with a UV blocker. Benzophenone derivatives or highly disperse titanium dioxide are particularly suitable for this purpose. The second layer 12 is then preferably printed overlapping with the border areas of the color layers of the first layer 11. After exposure over the entire surface in a wavelength range of preferably 320 nm to 430 nm, a preferred exposure dose of 10 mJ/cm2 to 500 mJ/cm2 and etching with for example 0.3% NaOH at a preferred temperature of approximately 50° C. for a period of preferably 10 seconds to 30 seconds, only the colored components of the first layer 11 then remain where they were covered by the second layer 12 and thus form a multi-colored decoration. If e.g. the second layer 12 is present in the form of guilloche lines, the finished multi-layer body 10 therefore displays guilloche lines in which color transitions can be seen, i.e. so-called rainbow printing.
The multi-layer body 10 shown in
After the etching, which is carried out as described in
Here too, as explained with reference to
For this, a release layer 14 and a replication layer 15 of for example a thermoplastic material or a radiation- or heat-curing replication lacquer are first applied to a carrier layer 13 of polyester, in particular PET, wherein these layers can in turn consist of several plies. In the replication layer 15, diffractive structures 151 are then formed, for example by stamping with a metallic stamping tool. The first layer 11, which in this case is formed as a layer of a transparent highly refractive material (HRI=High Refractive Index), for example of zinc sulfide or titanium dioxide, is then applied to the replication layer 15. The second layer 12, which again consists of two different-colored lacquers 121, 122, which adjoin one another, is then applied to the first layer 11 over the entire surface or at least in large areas of the surface. The lacquers 121, 122 are UV-sensitive photoresists, such as for example AZ 1518 from AZ Electronic Materials based on phenolic resin/diazoquinone. A mask layer 16 is then printed partially onto the second layer 12. The mask layer 16 simultaneously serves as an etching lacquer and a protective lacquer. An etch resist lacquer, for example based on PVC/PVAc (polyvinyl acetate) copolymer, can be provided for example with UV-absorbing titanium dioxide particles or other UV blockers for this. This is followed by exposure to UV light from the side of the mask layer 16. The exposure preferably takes place at a wavelength of 365 nm with a dose of 25 mJ/cm2 to 500 mJ/cm2.
The intermediate product shown in
NaOH in a preferred concentration of 0.05% to 2.5%, which preferably acts on the intermediate product for a period of 2 seconds to 60 seconds at a temperature of 20° C. to 65° C., is for example suitable for this.
In the areas not protected by the mask layer 16, the photoresist 121, 122 of the layer 12 was exposed during the UV irradiation and therefore now dissolves in the developing bath. The intermediate product represented in
In
Diffractive structures are thus visible in the opaque metallic areas of the first layer 11 and in the areas of the transparent HRI layer 17, but typically not in the printing areas of the second layer 12, because the diffractive structures are obliterated by the colored lacquer of the second layer 12 printed directly onto the diffractive structures, because the colored lacquer preferably has a similar refractive index (approximately 1.5) to the replication layer and therefore no optically active boundary layer is formed between colored lacquer and replication layer. The refractive indices of the two adjacent layers should preferably differ from one another by no more than 0.1.
The embodiment example according to
The structuring of the first layer 11 can take place in two steps since, for example, different etching agents have to be utilized for the two metals or metal alloys used. Where Al and Cu are used for the first layer 11, these are for example NaOH and FeCl3. However, since the same printed mask, namely the second layer 12, is used for the structuring, the transitions of the two metals 113, 114 of the first layer 11 take place in perfect register, in other words in an exact relative position to the printing of the second layer 12.
The embodiment example according to
Overprinting is then carried out with for example a red-colored layer as the second layer 12, so that the situation according to
In another process step, the areas of the two reflective layers 113, 17 that have not been overprinted are removed, optionally also in two process steps with chemicals adapted corresponding to the layers to be removed, e.g. two different alkaline solutions. While NaOH can be used to remove the aluminum parts under the conditions described, to remove an HRI layer of ZnS, NaOH or also Na2CO3 is preferably likewise used at a temperature of 20° C. to 60° C. for a period of 5 seconds to 60 seconds.
The finished multi-layer body is seen in
The embodiment according to
The colored printing of the second layer 12 then takes place according to
In the last step, the colored printing of the layer 12 serves as a mask for the removal of the first layer 11 in accurate register, so that the multi-layer body 10 shown in
If, for example, first layer 11 and second layer 12 are finely structured line grids, depending on their relative position to one another, overlay effects occur and the structure ultimately formed is a finely structured overlay structure of the first layer 11 and second layer 12. The overlay structure can produce for example a desired moiré effect.
The fine structuring of the first layer 11 can also be designed for example as a guilloche of a large number of fine lines, preferably as a metallic reflective layer in combination with optically diffractive structures, for example with a KINEGRAM®, as shown by
The colored printing of the second layer 12 then takes place according to
In the last step, the colored printing of the layer 12 serves as a mask for the removal of the first layer 11 in accurate register, so that the multi-layer body 10 shown in
In the embodiment shown in
Another embodiment with a finely structured first layer 11 is shown in
The printing of the second layer 12 then takes place according to
Corresponding to the surface of the first layer 11 coated with etch resist, the fine structure of the first layer 11 is removed by means of etching in the areas where the etch resist is not provided.
A colored photoresist is then printed on, which comprises at least the area that is not covered by the colorless etch resist. The photoresist can also, however, overlap with the etch resist. By exposure of the colored photoresist using the colorless etch resist with the UV absorber as an exposure mask, the colored photoresist is cured in those areas that do not have any transparent etch resist and can be removed in the other areas in accurate register with the etch resist and with the areas of the finely structured first layer 11 that are protected and defined by the etch resist.
In the embodiment shown in
For this, a release layer 14 and a replication layer 15 are initially applied to a carrier layer 13 of polyester or PET. Diffractive structures 151 are then formed in the replication layer 15. The first layer 11, which in this case is present as a finely structured metal layer, for example in the form of a grid, is then applied to the replication layer 15.
As shown in
Instead of a mask layer 16, a film mask can also be utilized which lies in contact with the layers 121 and 122 only during the exposure process and is then removed again.
The intermediate product shown in
Examples of possible gridded forms of the first layer 11 and the second layer 12 are shown in
The embodiment examples discussed up to now are based on the fact that a partial reflective layer of opaque metal or transparent HRI material (first layer 11) is first produced and then a print (second layer 12) is applied. The print of the second layer 12 serves as a mask layer, for example analogous to an etch resist print, for the further structuring of the partial metal layer 11.
In the embodiment example according to
In a further step, a first partial metal area (first layer 11) is produced, as represented in
In the next step, the print that is already present in the input material is utilized as an exposure mask for a photoresist layer applied thereon in order to structure the first layer 11 in perfect register with the print of the second layer 12. The materials and process parameters used correspond to those already described above.
The second layer 12 is therefore produced completely independently of the first layer 11 in terms of time and location. The second layer 12 can also, for example, be arranged on the reverse of the substrate, which is not shown, and the first layer 11 on the front thereof. For specific purposes, the second layer 12 could optionally be removed when it has served its purpose as a structuring aid for the first layer 11.
In top view, therefore, both colored metallic areas with the diffractive structures and only colored areas with no diffractive effect can be recognized, wherein these areas, corresponding to the layers 11, 12, blend into one another in perfect register.
The line widths do not have to be constant but can additionally be modulated, resulting in different local surface densities of the grid, forming an additional piece of information. The line widths are preferably from 25 μm to 150 μm. The grid spacing can also be modulated and is preferably less than 300 μm and preferably less than 200 μm, and preferably more than 25 μm.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10 2013 113 283 | Nov 2013 | DE | national |
This application is a divisional application of U.S. application Ser. No. 15/038,874, filed on May 24, 2016, which claims priority based on an International Application filed under the Patent Cooperation Treaty, PCT/EP2014/075928, filed on Nov. 28, 2014, and German Application No. DE 102013113283.9, filed on Nov. 29, 2013.
| Number | Name | Date | Kind |
|---|---|---|---|
| 7029757 | Levy | Apr 2006 | B1 |
| 7821716 | Staub et al. | Oct 2010 | B2 |
| 10029505 | Brehm | Jul 2018 | B2 |
| 20020056758 | Stenzel et al. | May 2002 | A1 |
| 20060054043 | Luthi | Mar 2006 | A1 |
| 20070095224 | Brehm et al. | May 2007 | A1 |
| 20070296037 | Dozen et al. | Dec 2007 | A1 |
| 20080088895 | Argoitia et al. | Apr 2008 | A1 |
| 20080246158 | Mascolo et al. | Oct 2008 | A1 |
| 20090081428 | Keller et al. | Mar 2009 | A1 |
| 20090269519 | Lazzerini | Oct 2009 | A1 |
| 20090317595 | Brehm et al. | Dec 2009 | A1 |
| 20100045024 | Attner | Feb 2010 | A1 |
| 20100109317 | Hoffmuller et al. | May 2010 | A1 |
| 20110091665 | Heim | Apr 2011 | A1 |
| 20110115212 | Hoffmuller et al. | May 2011 | A1 |
| 20110127762 | Hoffmuller et al. | Jun 2011 | A1 |
| 20110239885 | Marchant | Oct 2011 | A1 |
| 20120064303 | Yashiki et al. | Mar 2012 | A1 |
| 20120156446 | Brehm | Jun 2012 | A1 |
| 20120189159 | Vincent | Jul 2012 | A1 |
| 20140205852 | Brehm et al. | Jul 2014 | A1 |
| 20140505852 | Brehm et al. | Jul 2014 | |
| 20160185150 | Brehm et al. | Jun 2016 | A1 |
| Number | Date | Country |
|---|---|---|
| 101516634 | Aug 2009 | CN |
| 102056748 | May 2011 | CN |
| 102177033 | Sep 2011 | CN |
| 102460236 | May 2012 | CN |
| 102574411 | Jul 2012 | CN |
| 10226116 | Jul 2003 | DE |
| 10333255 | Jan 2005 | DE |
| 102007007914 | Aug 2008 | DE |
| 102008013073 | Sep 2009 | DE |
| 1747905 | Jan 2007 | EP |
| 2464496 | Apr 2010 | GB |
| 2008203738 | Sep 2008 | JP |
| 2011520638 | Jul 2011 | JP |
| 2012189935 | Oct 2012 | JP |
| 9723357 | Jul 1997 | WO |
| WO2006084685 | Aug 2006 | WO |
| WO2009053673 | Apr 2009 | WO |
| 2010015381 | Feb 2010 | WO |
| 2010015384 | Feb 2010 | WO |
| 2011006634 | Jan 2011 | WO |
| 2014207165 | Dec 2014 | WO |
| Entry |
|---|
| Japanese Office Action from corresponding Japanese Patent Application No. 2016-534897 dated Oct. 9, 2018, pp. 1-6. |
| Number | Date | Country | |
|---|---|---|---|
| 20180290480 A1 | Oct 2018 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 15038874 | US | |
| Child | 15944262 | US |
