The present invention is generally directed to solid oxide fuel cells (SOFC) and more specifically to coatings that provide corrosion resistance to zirconia based electrolytes for solid oxide fuel cells.
Fuel cells are electrochemical devices which can convert energy stored in fuels to electrical energy with high efficiencies. Electrolyzer cells are electrochemical devices which can use electrical energy to reduce a given material, such as water, to generate a fuel, such as hydrogen. The fuel and electrolyzer cells may comprise reversible cells which operate in both fuel cell and electrolysis mode.
In a high temperature fuel cell system, such as a solid oxide fuel cell (SOFC) system, an oxidizing flow is passed through the cathode side of the fuel cell, while a fuel flow is passed through the anode side of the fuel cell. The oxidizing flow is typically air, while the fuel flow can be a hydrocarbon fuel, such as methane, natural gas, propane, ethanol, or methanol. The fuel cell, operating at a typical temperature between 750° C. and 950° C., enables combination of the oxygen and free hydrogen, leaving surplus electrons behind. The excess electrons are routed back to the cathode side of the fuel cell through an electrical circuit completed between anode and cathode, resulting in an electrical current flow through the circuit.
Fuel cell stacks may be either internally or externally manifolded for fuel and air. In internally manifolded stacks, the fuel and air is distributed to each cell using risers contained within the stack. In other words, the gas flows through openings or holes in the supporting layer of each fuel cell, such as the electrolyte layer, and gas separator of each cell. In externally manifolded stacks, the stack is open on the fuel and air inlet and outlet sides, and the fuel and air are introduced and collected independently of the stack hardware. For example, the inlet and outlet fuel and air flow in separate channels between the stack and the manifold housing in which the stack is located.
Fuel cell stacks are frequently built from a multiplicity of cells in the form of planar elements, tubes, or other geometries. Fuel cell stacks, particularly those with planar geometry, often use seals between electrolyte and interconnect surfaces to contain fuel and air at various locations within the stack. As shown in
An embodiment relates to a solid oxide fuel cell (SOFC) stack including a plurality of SOFCs and a plurality of interconnects. Each interconnect is located between two adjacent SOFCs, and each interconnect contains a Mn or Co containing, electrically conductive metal oxide layer on an air side of the interconnect. The SOFC stack also includes a barrier layer located between the electrically conductive metal oxide layer and an adjacent SOFC. The barrier layer is configured to prevent Mn or Co diffusion from the electrically conductive metal oxide layer to the adjacent SOFC.
Another embodiment relates to a planar interconnect for a solid oxide fuel cell (SOFC) including a fuel inlet riser opening, a fuel outlet riser opening, a plurality of first flow channels on an air side of the interconnect and a plurality of second flow channels on a fuel side of the interconnect. The planar interconnect also includes an electrically conductive metal oxide layer covering the air side of the interconnect, and a barrier layer over the conductive metal oxide layer in regions adjacent to the fuel inlet riser opening and the fuel outlet riser opening.
Another embodiment relates to a method of making a stack of solid oxide fuel cells (SOFC). The method includes providing a plurality of SOFCs and providing a plurality of electrically conductive interconnects, each conductive interconnect comprising an electrically conductive metal oxide layer on an air side of the interconnect. The method also includes providing a seal between each of the plurality of the electrically conductive interconnects and an adjacent SOFC in the stack. A barrier layer is located between the conductive metal oxide layer and the adjacent SOFC, the barrier layer configured to prevent Mn or Co diffusion from the metal oxide layer to the adjacent SOFC.
Another embodiment relates to an interconnect for a solid oxide fuel cell (SOFC), comprising, a plurality of first flow channels on an air side of the interconnect, a plurality of second flow channels on a fuel side of the interconnect, and a passivating or protective barrier layer located over at least a portion of the air or the fuel side of the interconnect. The barrier layer comprises at least one of a clay, a ceramic other than a perovskite or a spinel, an alkali earth silicate or a glass ceramic.
The present inventors realized that solid oxide fuel cell electrolyte corrosion and cracking may be reduced or eliminated by reducing or eliminating manganese diffusion from an electrically conductive manganese containing perovskite layer on the interconnect into the ceramic electrolyte. The inventors have observed that manganese from the manganese containing perovskite layer diffuses or leaches into a glass or glass ceramic seal and the manganese (and/or a manganese containing compound, such as a manganese rich silicate) then diffuses into the zirconia based electrolyte and accumulates at the electrolyte grain boundaries, resulting in intergranular corrosion of the electrolyte. The inventors further observed that absent a glass seal, manganese from the perovskite layer, such as lanthanum strontium manganate (“LSM”), located on the interconnect does not attack the zirconia based electrolyte, such as yttria and/or scandia stabilized zirconia. In fact, the SOFC cathode electrode directly on the electrolyte may comprise LSM without attacking the electrolyte. Thus, in an embodiment in which a stack is internally manifolded for fuel, corrosion of the stabilized zirconia electrolyte can be reduced or prevented by isolating the electrolyte from manganese diffusion from the conductive perovskite layer by depositing a manganese diffusion barrier between the manganese containing perovskite layer and the glass seal. In another embodiment, the barrier layer may be deposited between the glass seal and the stabilized zirconia electrolyte. Alternatively, barrier layers may be deposited between both the manganese containing perovskite layer and the glass seal and between the glass seal and the stabilized zirconia electrolyte. While the use of the barrier layer with a manganese containing LSM layer is described above, the barrier layer may be used with any other manganese and/or cobalt containing metal oxide layer on the interconnect, such as other perovskite layer (e.g., lanthanum strontium cobaltite or lanthanum strontium manganate-cobaltite) or spinel layer (e.g., a manganese cobalt oxide spinel, such as a MnxCo3-xO4 spinel, where x ranges between 1 and 2). However, LSM is used as an exemplary metal oxide coating below for brevity.
While vertically oriented stacks are shown in
The interconnect 9 may contain an upraised or boss region below the seal 15 if desired. If desired, the interconnect may be configured for a stack which is internally manifolded for both air and fuel. In this case, the interconnect and the corresponding fuel cell electrolyte would also contain additional air inlet and outlet openings.
Optionally, at least one side of the electrolyte 5, such as the air side, has a smaller roughness in first 27A and second 27B regions adjacent to the fuel inlet and fuel outlet openings 26A, 26B than in a third region under the cathode electrode 7, as shown in FIGS. 5A and 5B. Regions 27A, 27B may comprise ring shaped regions which surround the fuel inlet and outlet openings 26A, 26B. Regions 27A, 27B may have any suitable shape, such as hollow circular, oval, polygonal, etc. The fuel cell electrodes, such as the anode or cathode, may have a straight edge, as shown in
Openings 26A, 26B in electrolyte 5 are lined up with the respective openings 16A, 16B in the interconnect 9 to form portions of the fuel inlet and outlet risers of the stack, as will be described in more detail with respect to
In
The manganese diffusion barrier 12a, 12b may be made of any suitable material that can block manganese and/or a manganese containing compound diffusion, such as a clay, ceramic and/or glass ceramic material. Specific materials include, but are not limited to alumina (e.g., non-stoichiometric alumina or stoichiometric Al2O3), zirconia (e.g., non-stoichiometric zirconia or stoichiometric ZrO2), zirconium silicate ZrSiO4, calcium, barium, magnesium and/or aluminum silicate, feldspar (such as potassium feldspar) and combinations thereof. In one embodiment, the barrier layer comprises a combination of a clay and at least one of a glass ceramic or a ceramic, such as a mixture of potassium feldspar and zirconium silicate. The mixture may comprise a 25-75:75-25 volume fraction ratio, such as 50:50 volume fraction ratio of the clay to the ceramic or the glass ceramic. Alternatively, the calcium, barium, magnesium and/or aluminum silicate can be used as a glassy phase in combination with the feldspar and/or zirconium silicate as the polycrystalline (i.e., ceramic) phase.
Similar to the other SOFC ceramic components, such as the electrolyte 5, the diffusion barrier 12a, 12b may be made from a sintered powder or a mixture of powders (e.g., a mixture of clay and ceramic powders). The sintering temperature may be selected depending on the material of the manganese diffusion barrier 12 and may be, for example, greater than 900 C, or greater than 100° C. The diffusion barrier material preferably comprises a dense sintered material, such as a polycrystalline and/or a sintered packed powder material. Barrier layer 12a is deposited on the conductive perovskite layer 11 while barrier layer 12b is preferably deposited on the electrolyte 5.
Thus, the manganese diffusion barrier layer(s) 12a and/or 12b are located between the conductive perovskite layer 11 and the electrolyte 5. The diffusion barrier layer may be located between the conductive perovskite layer 11 and the glass ring seal 15 (barrier layer 12a) or between the glass ring seal 15 and the electrolyte 5 (barrier layer 12b) or in both locations. Thus, even if manganese diffuses from the conductive perovskite layer 11 into the glass ring seal 15, the manganese cannot further diffuse into the electrolyte layer 5.
A second ring seal 15 and barrier layer(s) around the fuel outlet opening 16B in the interconnect 9 are not shown for clarity. However, it should be understood that a second ring shaped glass or glass ceramic seal 15 and barrier layer(s) 12a and/or 12b are located on the air side of each interconnect 9 over the fuel outlet opening 16B in the interconnect 9 as shown in
The barrier(s) 12a, 12b of the embodiments of the invention reduce or prevent the interaction of the components of the LSM coating (or another Mn or Co containing metal oxide coating) with the silica based glass seals and/or prevent the interaction of manganese contaminated silica based glass seals with the electrolyte. Specifically, a barrier layer which preferably lacks any Mn and/or Co (or at least contains less than 5 at % of Mn and/or Co) prevents Mn and/or Co diffusion from the metal oxide layer into the glass seal and/or prevents the Mn and/or Co containing mobile phase diffusion from the glass seal to the electrolyte.
A method of forming a planar, electrolyte supported SOFC stack shown in
Then, the fuel inlet and fuel outlet openings 26A, 26B are punched in the green electrolyte. The openings 26A, 26B may be punched after the electrolyte 5 is formed into its final shape from a green tape. Alternatively, the electrolyte 5 may be punched into its final shape (such as a rectangular shape) from a green tape during the same punching step as the opening 26A, 26B punching step. In other words, the same punch apparatus may be used to punch out the electrolyte from the green tape and form openings in the electrolyte during a single punch step. Optionally, the punch die has a smoother surface adjacent to the tip portion used to punch the openings. The smooth surface of the punch die smoothes the surface in regions 27A, 27B of the electrolyte 5 such that these regions have a roughness of less than 4 microinches. Opposing punch die may have opposing smooth surfaces adjacent to the tip used to punch the openings to form the smooth regions 27A, 27B on both sides of the electrolyte 5. Alternatively, only one die may have a smooth surface to form smooth regions on only one side of the electrolyte 5.
Optionally, one or both die of the punch apparatus may also have a rough surface to roughen the active regions on one or both sides of the electrolyte 5 under the cathode and/or anode electrodes to achieve a roughness of greater than 32 microinches. Thus, the electrolyte may be hole punched, smoothed around the openings and roughened in the active area in the same punching/pressing steps. Peripheral region 28 may be left with the initial as-cast roughness of about 8-12 microinches or it may be roughened together with the active region(s). Alternatively, other suitable smoothing and/or roughening methods described in U.S. Pat. No. 7,045,237, which is incorporated herein by reference in its entirety, may be used instead of the die punching methods.
After the optional smoothing/roughening step, a cathode electrode is formed on the first side of the electrolyte and an anode electrode is formed on the second side of the electrolyte (such as on a roughened region on the fuel side of the electrolyte). The electrodes may be formed by screen printing or other suitable deposition methods. At least one of the electrolyte, cathode electrode and the anode electrode are then fired or sintered. One or more firing or sintering steps may be conducted. For example, one firing step may be conducted after the hole punching, another firing step after cathode deposition and a third firing step after the anode deposition. The anode and cathode deposition may be performed in either order. The three firing steps may be combined into two firing steps or into a single firing step after both electrodes are deposited.
If desired, the second barrier layer 12b shown in
In another embodiment, the barrier layer 12 is formed on portions of the interconnect that are not covered by the metal oxide layer 11 (e.g., LSM, etc.) or on interconnects that completely lack the metal oxide layer 11 coating. In this embodiment, the barrier layer 12 does not act as a manganese diffusion barrier, but acts to passivate and/or protect the surface of the interconnect. Therefore, the barrier layer 12 acts as a passivation and/or protective barrier for the interconnect. The barrier layer 12 may be formed on the air and/or fuel sides of an interconnect that lacks the metal oxide layer 11. Alternatively, the barrier layer 12 may be formed on the fuel side and/or on peripheral portions of the interconnect in which the metal oxide layer 11 is formed on the central portion of the air side of the interconnect. The barrier layer may comprises at least one of a clay, a ceramic other than a perovskite or a spinel (e.g., a material different from LSM and other typical air side IC coatings), an alkali earth silicate or a glass ceramic, as described in the prior embodiments.
In the comparative examples illustrated in
A comparison of samples with and without the barrier layer 12a is illustrated in
The foregoing description of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed, and modifications and variations are possible in light of the above teachings or may be acquired from practice of the invention. The description was chosen in order to explain the principles of the invention and its practical application. It is intended that the scope of the invention be defined by the claims appended hereto, and their equivalents.
Number | Name | Date | Kind |
---|---|---|---|
4135041 | Jung et al. | Jan 1979 | A |
4755429 | Nickols et al. | Jul 1988 | A |
4913982 | Kotchick et al. | Apr 1990 | A |
5162167 | Minh et al. | Nov 1992 | A |
5213910 | Yamada | May 1993 | A |
5215946 | Minh | Jun 1993 | A |
5248712 | Takeuchi et al. | Sep 1993 | A |
5256499 | Minh et al. | Oct 1993 | A |
5273837 | Aiken et al. | Dec 1993 | A |
5290642 | Minh et al. | Mar 1994 | A |
5342705 | Minh et al. | Aug 1994 | A |
5368667 | Minh et al. | Nov 1994 | A |
5382315 | Kumar | Jan 1995 | A |
5385792 | Shiratori et al. | Jan 1995 | A |
5453331 | Bloom et al. | Sep 1995 | A |
5494700 | Anderson et al. | Feb 1996 | A |
5501914 | Satake et al. | Mar 1996 | A |
5518829 | Satake et al. | May 1996 | A |
5589017 | Minh | Dec 1996 | A |
5641585 | Lessing et al. | Jun 1997 | A |
5702837 | Xue | Dec 1997 | A |
5733499 | Takeuchi et al. | Mar 1998 | A |
5955392 | Takeuchi et al. | Sep 1999 | A |
6001761 | Hata et al. | Dec 1999 | A |
6361892 | Ruhl et al. | Mar 2002 | B1 |
6492053 | Donelson et al. | Dec 2002 | B1 |
6582845 | Helfinstine et al. | Jun 2003 | B2 |
6589681 | Yamanis | Jul 2003 | B1 |
6638575 | Chen et al. | Oct 2003 | B1 |
6835488 | Sasahara et al. | Dec 2004 | B2 |
7045237 | Sridhar et al. | May 2006 | B2 |
8852825 | El Batawi et al. | Oct 2014 | B2 |
20020012825 | Sasahara et al. | Jan 2002 | A1 |
20020132156 | Ruhl et al. | Sep 2002 | A1 |
20030170527 | Finn et al. | Sep 2003 | A1 |
20030180602 | Finn | Sep 2003 | A1 |
20040101742 | Simpkins et al. | May 2004 | A1 |
20040200187 | Warrier et al. | Oct 2004 | A1 |
20050017055 | Kurz et al. | Jan 2005 | A1 |
20050136312 | Bourgeois et al. | Jun 2005 | A1 |
20050227134 | Nguyen | Oct 2005 | A1 |
20070037031 | Cassidy | Feb 2007 | A1 |
20070134532 | Jacobson et al. | Jun 2007 | A1 |
20070231676 | Cassidy et al. | Oct 2007 | A1 |
20080081223 | Yasumoto et al. | Apr 2008 | A1 |
20080085439 | Hilliard | Apr 2008 | A1 |
20080193825 | Nguyen | Aug 2008 | A1 |
20100055533 | Kebbede et al. | Mar 2010 | A1 |
20100119917 | Kumar et al. | May 2010 | A1 |
20100159344 | Gottmann | Jun 2010 | A1 |
20100239937 | Janousek et al. | Sep 2010 | A1 |
20110200909 | Parihar | Aug 2011 | A1 |
20130130146 | Batawi et al. | May 2013 | A1 |
20140342267 | Parihar | Nov 2014 | A1 |
Number | Date | Country |
---|---|---|
101682043 | Mar 2010 | CN |
0615299 | Sep 1994 | EP |
1850412 | Oct 2007 | EP |
1950824 | Jul 2008 | EP |
06-215778 | Aug 1994 | JP |
09-199143 | Jul 1997 | JP |
09-223506 | Aug 1997 | JP |
09-245810 | Sep 1997 | JP |
09-245811 | Sep 1997 | JP |
09-277226 | Oct 1997 | JP |
2000-281438 | Oct 2000 | JP |
2009004297 | Aug 2009 | JP |
2009-212046 | Sep 2009 | JP |
2009212046 | Sep 2009 | JP |
2009293106 | Dec 2009 | JP |
2010062145 | Mar 2010 | JP |
201042810 | Dec 2010 | TW |
WO2006016628 | Feb 2006 | WO |
WO2010061585 | Jun 2010 | WO |
WO2010108057 | Sep 2010 | WO |
WO2013074746 | May 2013 | WO |
Entry |
---|
Cao et al., “Ceramic materials for thermal barrier coatings”, Mar. 7, 2003, Journal of the European Ceramic Society, pp. 1-10. |
First Office Action of Taiwanese Patent Application No. 101138786, dated Apr. 12, 2016, 4 pages. |
Search Report for Taiwanese Patent Application No. 101138786, completed Apr. 1, 2016, 2 pages. |
Japanese Office Communication, Notification of Reasons for Refusal for JP Patent Application No. JP 2014-542450, dated Jun. 21, 2016, 11 pages. |
State Intellectual Property Office of P.R.C. Notice of Allowance of Patent and Search Report for P.R.C. (China) Patent Application No. 201280056866.3, dated Sep. 7, 2016, 4 pages. |
Japanese Notification of Reasons for Refusal for Japanese Patent Application No. 2014-542450, dispatch date Jan. 17, 2017, 7 pages. |
First Office Action of Chinese Patent Application No. 201280056866.3, dated Nov. 2, 2015, with English Language Translation, (11 pages). |
Choi, J. P. et al., “Development of MnGoO Coating with New Aluminizing Process for Planar SOFC Stacks,” International Journal of Hydrogen Energy, vol. 36, pp. 4549-4556, (2011). |
Piccardo, P. et al., “Interconnect Materials for Next-Generation Solid Oxide Fuel Cells,” J. Appl. Electrochem., vol. 39, pp. 545-551, (2009). |
European Office Communication and Supplementary EP Search Report for EP Application No. EP12849352.5, dated Jun. 1, 2015 (8 Sheets). |
European Office Communication Rules 70(2) and 70a(2) for EP Application No. EP12849352.5, dated Jun. 18, 2015 (1 Sheet). |
Haynes International High-Temperature Alloys, “HAYNES (Reg.) 214 (TM) alloy”, 1996, pp. 1-19. |
Haynes International High-Temperature Alloys, “HAYNES (Reg.) 230(TM) alloy”, 2004, pp. 1-27. |
International Search Report & Written Opinion, International Application No. PCT/US2007/08224, dated Nov. 26, 2008, 10 pgs. |
International Search Report, International Application No. PCT/US2003/04808, dated Aug. 19, 2003, 9pgs. |
Supplementary European Search Report, International Application No. PCT/US2003/04808, dated Jun. 2, 2008, 3pgs. |
International Search Report & Written Opinion, International Application No. PCT/US2010/027899, dated Oct. 20, 2010, 11pgs. |
International Preliminary Report on Patentability, International Application No. PCT/US2010/027899, dated Sep. 20, 2011, 6pgs. |
International Search Report and Written Opinion, International Application No. PCT/US2012/065213, dated Mar. 29, 2013. |
Number | Date | Country | |
---|---|---|---|
20140377680 A1 | Dec 2014 | US |
Number | Date | Country | |
---|---|---|---|
61560893 | Nov 2011 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 13677836 | Nov 2012 | US |
Child | 14476963 | US |