Multi-layered polymer based thin film structure for medical grade products

Information

  • Patent Grant
  • 6964798
  • Patent Number
    6,964,798
  • Date Filed
    Thursday, March 21, 2002
    22 years ago
  • Date Issued
    Tuesday, November 15, 2005
    18 years ago
Abstract
A multiple layer structure comprising a first and a second skin layer, each skin layer composed of a polypropylene containing polymer, and a radio frequency (“RF”) susceptible layer adhered to and between the first and second skin layers. The RF layer has a first component of a propylene based polymer, a second component of a non-propylene polyolefin, a third component of a radio frequency susceptible polymer, and a fourth component of a polymeric compatibilizing agent.
Description
TECHNICAL FIELD

The present invention relates generally to polymer blends for fabricating films and more particularly film that have low distortion, that are non-adherent upon steam sterilization, that are radio-frequency sealable, and that are suitable for fabricating into flexible medical containers.


BACKGROUND OF THE INVENTION

In the medical field, where beneficial agents are collected, processed and stored in containers, transported, and ultimately delivered through tubes by infusion to patients to achieve therapeutic effects, materials which are used to fabricate the containers must have a unique combination of properties. For example, in order to visually inspect solutions for particulate contaminants, the container must be optically transparent. To infuse a solution from a container by collapsing the container walls, without introducing air into the container, the material which forms the walls must be sufficiently flexible. The material must be functional over a wide range of temperatures. The material must function at low temperatures by maintaining its flexibility and toughness because some solutions, for example, certain pre-mixed drug solutions are stored and transported in containers at temperatures such as −25° C. to −30° C. to minimize the drug degradation. The material must also be functional at high temperatures to withstand the heat of sterilization; a process which most medical packages and nutritional products are subjected to prior to shipment. The sterilization process usually includes exposing the container to steam at temperatures typically 121° C. and at elevated pressures. Thus, the material needs to withstand the temperature and pressures without significant distortions (“heat distortion resistance”).


For ease of manufacture into useful articles, it is desirable that the material be sealable using radio frequency (“RF”) generally at about 27.12 MHZ. Therefore, the material should possess sufficient dielectric loss properties to convert the RF energy to thermal energy. A further requirement is to minimize the environmental impact upon the disposal of the article fabricated from the material after its intended use. For those articles that are disposed of in landfills, it is desirable to use as little material as possible and avoid the incorporation of low molecular weight leachable components to construct the article. Thus, the material should be light weight and have good mechanical strength. Further benefits are realized by using a material which may be recycled by thermoplastically reprocessing the post-consumer article into other useful articles.


For those containers that are disposed of through incineration, it is necessary to use a material that helps to eliminate the dangers of biological hazards, and to minimize or eliminate entirely the formation of inorganic acids which are environmentally harmful, irritating, and corrosive, or other products which are harmful, irritating, or otherwise objectionable upon incineration.


It is also desirable that the material be free from or have a low content of low molecular weight additives such as plasticizers, stabilizers and the like which could be released into the medications or biological fluids or tissues thereby causing danger to patients using such devices or are contaminating such substances being stored or processed in such devices. For containers which hold solutions for transfusion, such contamination could make its way into the transfusion pathway and into the patient causing injury or death to the patient.


Traditional flexible polyvinyl chloride materials meets a number of, and in some cases, most of the above-mentioned requirements. Polyvinyl chloride (“PVC”) also offers the distinct advantage of being one of the most cost effective materials for constructing devices which meet the above requirements. However, PVC may generate objectionable amounts of hydrogen chloride (or hydrochloric acid when contacted with water) upon incineration, causing corrosion of the incinerator. PVC sometimes contains plasticizers which may leach into drugs or biological fluids or tissues that come in contact with PVC formulations. Thus, many materials have been devised to replace PVC. However, most alternate materials are too expensive to implement and still do not meet all of the above requirements.


There have been many attempts to develop a film material to replace PVC, but most attempts have been unsuccessful for one reason or another. For example, in U.S. Pat. No. 4,966,795, which discloses multilayer film compositions capable of withstanding the steam sterilization, cannot be welded by radio frequency dielectric heating thus cannot be assembled by this rapid, low costs, reliable and practical process. European Application No. EP 0 310 143 A1 discloses multilayer films that meet most of the requirements, and can be RF welded. However, components of the disclosed film are cross-linked by radiation and, therefore, cannot be recycled by the standard thermoplastic processing methods. In addition, due to the irradiation step, appreciable amounts of acetic acid is liberated and trapped in the material. Upon steam sterilization, the acetic acid migrates into the packaging contents as a contaminant and by altering the pH of the contents acts as a potential chemical reactant to the contents or as a catalyst to the degradation of the contents.


U.S. Pat. No. 5,998,019, which is owned by the same assignee of the present invention, discloses multi-layered polymer structures that solve many, if not all, of the foregoing problems. However, one problem with the structures of the '019 patent is that the internal solution contact layer of those structures sticks to either itself or to other similar structures (such as other films or when formed into a container) after the autoclave sterilization process. The internal solution contact layer of the '019 patent is either an RF sealable layer or a blend of two polyolefins and a compatibilizing agent of a styrene and hydrocarbon block copolymer. The specific composition of the RF sealable layer is disclosed therein and is also the subject of U.S. Pat. Nos. 5,849,843; 5,854,347 and 5,686,527, which are owned by the present assignee and are incorporated by reference.


U.S. Pat. No. 6,083,587, also owned by the present assignee, provides a multilayer structure where the internal solution contact layer can be a polyolefin selected from the homopolymers and copolymers of alpha-olefins having about 2 to about 20 carbons. However, the '587 patent does not disclose a structure wherein an internal, non-solution contact layer is RF sealable layer or comprised of an RF susceptible polymer.


The main objective of the present invention is the creation of thermoplastic materials which are, overall, superior to those materials, of which we are aware, which have been heretofore known to the art or have been commercially used or marketed. The properties of such materials includes flexibility, extensibility, and strain recoverability, not just at room temperatures, but through a wide range of ambient and refrigerated temperatures. The material should be sufficiently optically transparent for visual inspection, and steam sterilizable at temperatures up to 121° C. The material should be capable of being subjected to significant strains without exhibiting strain whitening, which can indicate a physical and a cosmetic defect. A further objective is that the material be capable of assembly by the RF methods.


Another objective is that the material be substantially free of low molecular weight leachable additives, and be capable of safe disposal by incineration without the generation of significant amounts of corrosive inorganic acids. Another objective is that the material be recyclable by standard thermoplastic processing methods after use. It is also desirable that the material incorporate reground scrap material recovered during the manufacturing process to save material costs and reduce manufacturing waste. It is also desirable that the material not have its RF sealable layer able to contact itself of that of another film, minimizing the film from sticking to itself or to other films during, or subsequent to, the autoclave process. It is also desirable that the material not be oriented, as oriented films may shrink when subjected to heat. Finally, the material should serve as a cost effective alternative to various PVC formulations currently being used for medical devices.


When more than one polymer is blended to form an alloying composition, it is difficult to achieve all of the above objectives simultaneously. For example, in most instances alloy composition may scatter light; thus, they fail to meet the optical clarity objective. The light scattering intensity (measured by haze) depends on the domain size of components in the micrometer (μm) range, and the proximity of the refractive indices of the components. As a general rule, the selection of components that can be satisfactorily processed into very small domain sizes, and yet with a minimum of refractive index mismatches, is a difficult task. Also, film structures heretofore known usually contain stearates or fatty acids in the solution-contact layer of the structure, thereby permitting those undesirable components to leach into the solution in contact with the film structure.


The present invention is provided to solve these and other problems.


SUMMARY OF THE INVENTION

In accordance with the present invention, certain multiple layer polymer based structures are disclosed. The films may be fabricated into medical grade articles such as containers for storing medical solutions or blood products, blood bags, and related items, or other products constructed from multi-layered structures.


It is an object of the present invention to prepare a multi-layered film having the following physical properties: (1) a mechanical modulus less than 40,000 psi and more preferably less than 25,000 psi when measured in accordance with ASTM D-882, (2) a greater than or equal to 70%, and more preferably greater than or equal to 75%, recovery in length after an initial deformation of 20%, (3) and optical haze of less than 30%, and more preferably less than 15%, when measured for a composition 9 mils thick and in accordance to ASTM D-1003, (4) a loss tangent measured at 1 Hz at processing temperatures is greater than 1.0, and more preferably greater than 2.0, (5) the content of elemental halogens is less than 0.1%, and more preferably less than 0.01%, (6) the low molecular weight water soluble fraction is less than 0.1%, and more preferably less than 0.005%, (7) the maximum dielectric loss between 1 and 60 MHZ and between the temperature range of 25° C. to 250° C. is greater than or equal to 0.05 and more preferably greater than or equal to 0.1, (8) autoclave resistance measured by sample creep at 121° C. under 27 psi loading is less than or equal to 60% and more preferably less than or equal to 20%, and (9) there is no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute at about 100% elongation and the presence of strain whitening is noted or the lack thereof.


The multiple layer structure of the present invention has two separate skin layers, each preferably containing a propylene containing polymer. The structure further includes a radio frequency (“RF”) susceptible layer adhered to the skin layer. The RF layer is composed of a first component of a polypropylene polymer, a second component of a non propylene polyolefin (one that does not contain propylene repeating units), a third component of a radio frequency susceptible polymer, and a fourth component of a polymeric compatibilizing agent. In alternate embodiments, additional layers such as core, scrap, and barrier layers are added to the skin and RF layers to confer additional or enhanced functionality of the resultant film structure.


As stated above, the RF layer is the subject of U.S. Pat. Nos. 5,849,843; 5,854,347 and 5,686,527, which are incorporated herein by reference and made a part hereof. The multi-layered film structure of the present invention offers additional features that the compositions of the RF layer alone do not provide. The additional features of the multi-layer film include an exterior surface gloss and reduced tackiness to the outside surface of the film structure. Additionally, the multilayered film structure has improved vapor barrier properties, greater strength and optical clarity, and is cleaner or has reduced tendency to migrate into the contents of the container. Finally, the internal solution contact layer of the present invention minimizes partial and total sticking of that layer to itself or other films during, and subsequent to, the autoclave process.


The core layer, which is interposed between the skin layer and the RF layer consists of three components. Preferably, the first component is polypropylene which constitutes about 40% of the core layer, the second component is an ultra low density polyethylene (“ULDPE”) which constitutes about 50% by weight of the core layer, and the third component is styrene-hydrocarbon block copolymer and more preferably an SEBS block copolymer which constitutes about 10% by weight of the core layer. The entire core layer should be about 4.0 mils thick.


It is also desirable, for economic reasons among others, to incorporate reground scrap material recovered during the processing of the film material back into the composition of a film structure. This can lead to using significant amount of scrap material as a weight percent of the entire layer structure, thereby substantially decreasing the costs of the film product. The reground scrap may be incorporated into the above-described structure either as an additional discrete layer located somewhere between the skin layer and the RF layer or may be blended into the core layer as an additional component. In either case, significant resources are saved by reprocessing the scrap material.


To increase gas barrier properties of the structure, it is desirable to incorporate a barrier layer between the skin layer and the RF layer. The barrier layer may be attached to surrounding layers using adhesive tie layers. The barrier layer may be selected from ethylene vinyl alcohols such as that sold under the name Evalca (Evalca Co.), highly glassy or crystalline polyamide such as Sclar PA® (Dupont Chemical Co.), high nitrile content acrylonitrile copolymers such as those sold under the tradename Barex® sold by British Petroleum.


Films having the aforesaid structure and compositions have been found to be flexible, optically clear, non-strain whitening, and steam and radiation sterilizable. Additionally, the films are compatible with medical applications because the components that constitute the film have a minimal extractability to the fluids and contents with which the composition comes into contact. Further, the films are environmentally sound in that they do not generate harmful degradants upon incineration. Finally, the films provide a cost effective alternative to PVC.


Additional features and advantages of the present invention are described in, and will be apparent from, the drawing and the detailed description of the presently preferred embodiments.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 shows a cross-sectional view of a three layered film structure of the present invention;



FIG. 2 shows a cross-sectional view of a three layered film structure of the present invention including a core layer added to the film of FIG. 1;



FIG. 3 shows a cross-sectional view of a four layered structure of the present invention having a discrete layer of scrap material between the RF and the core layers;



FIG. 4 shows a cross-sectional view of a film structure using reground scrap as a discrete layer that splits the core layer into two core layers;



FIG. 5 shows a cross-sectional view of a film structure of the present invention having a barrier layer between the core and the RF layers;



FIG. 6 shows the same structure of FIG. 5 except the barrier layer divides the core layer into two core layers; and



FIG. 7 shows a container constructed from one of the film structures of the present invention.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT:

While this invention is susceptible of embodiments in many different forms, and will herein be described in detail, preferred embodiments of the invention are disclosed with the understanding that the present disclosure is to be considered as exemplifications of the principles of the invention and are not intended to limit the broad aspects of the invention to the embodiments illustrated.


According to the present invention, multiple layered film structures are provided which meet the requirements set forth above.



FIG. 1 shows a three layered film structure 10 having a first skin layer 12, second skin layer 14, and a radio frequency (“RF”) susceptible layer 16. The first skin layer 12 and second skin layer 14 confer heat distortion resistance and abrasion resistance. Another benefit of the skin layers is that it each of them is substantially, and preferably completely, free of erucamide and stearate components, thereby reducing, and preferably eliminating, any leaching of those components into the solution in contact with the film structure. A further benefit of the second skin layer is that it improves the overall appearance of the film structure by reducing surface blemishes.


The first skin layer and the second skin layer each preferably are a propylene-containing polymer. Suitable propylene-containing polymers include those selected from the group consisting of homopolymers of polypropylene, copolymers and terpolymers of propylene with one or more comonomers selected from α-olefins having from 2 to about 18 carbons. Suitable polypropylene copolymers and terpolymers include random or block propylene and ethylene copolymers or random or block propylene/ethylene/butene terpolymers. Suitable propylene and α-olefin copolymers are sold by Montell under the tradenames PRO FAX, PRO FAX ULTRA and CATALLOY and by Fina Oil & Chemical Company (n/k/a ATOFINA) under the Fina® tradename series, such as Fina 6671 XBB, 6573 XHC, 7450 HC, and 7602 Z. The first skin layer 12 and the second skin layer 14 should have a thickness within the range of from about 0.2 to about 3.0 mils thick. Both skin layers may further include a second component of a styrene and hydrocarbon copolymer, more preferable a styrene and hydrocarbon block copolymer and even more preferably a styro-ethylene butene styrene tri-block copolymer SEBS, which is commercially available from the Shell Chemical Company/Ripplewood Holdings LLC under the tradename KRATON™ product series. More preferably, the SEBS component is KRATON™ G-1657.


The RF susceptible layer 16 of the present invention should have a dielectric loss of greater than 0.05 at frequencies within the range of 1-60 MHz within a temperature range of ambient to 250° C. The RF layer 16 preferably has four components. The RF layer 16 confers RF sealability, flexibility, heat distortion resistance, and compatibility to the film structure 10. The first component of the RF layer 16 is chosen from polypropylene copolymers and preferably the propylene alpha-olefin random copolymers (“PPE”). The PPE's possess the required rigidity and the resistance to yielding at the autoclave temperatures of about 121° C. However, by themselves, the PPE's are too rigid to meet the flexibility requirements. When combined by alloying with certain low modulus polymers, good flexibility can be achieved.


These low modulus copolymers can include ethylene based copolymers such as ethylene-co-vinyl acetate (“EVA”), ethylene co-alpha olefins, or the so-called ultra low density (typically less than 0.90 Kg/L) polyethylenes (“ULDPE”). These ULDPE include those commercially available products sold under the trademarks TAFMER® (Mitsui Petrochemical Co.) under the product designation A485, Exact® (Exxon Chemical Company) under the product designations 4023-4024, and Insite® technology polymers (Dow Chemical Co.). In addition, polybutene-1 (“PB”), such as those sold by Shell Chemical Company under product designations PB-8010, PB-8310; thermoplastic elastomers based on SEBS block copolymers, (Shell Chemical Company), poly isobutene (“PIB”) under the product designations Vistanex L-80, L-100, L-120, L-140 (Exxon Chemical Company), ethylene alkyl acrylate, the methyl acrylate copolymers (“EMA”) such as those under the product designation EMAC 2707, and DS-1130 (Chevron), and n-butyl acrylates (“ENBA”) (Quantum Chemical) were found to be acceptable copolymers. Ethylene copolymers such as the acrylic and methacrylic acid copolymers and their partially neutralized salts and ionomers, such as PRIMACOR® (Dow Chemical Company) and SURYLN® (E.I. DuPont de Nemours & Company) were also acceptable. Typically, ethylene based copolymers have melting point temperatures of less than about 110° C. are not suited for autoclaving at 121° C. applications. Furthermore, only a limited range of proportions of each component allows the simultaneous fulfillment of the flexibility and autoclavability requirements.


Preferably the first component is chosen from the group of polypropylene homo and random copolymers with alpha olefins. The first component constitutes approximately 30-60%, more preferably 35-45%, and most preferably 45%, by weight of the RF layer. For example, a preferred first component comprises random copolymers of propylene and ethylene where the ethylene content is in an amount within the range of 0-6%, and more preferably from about 2% to about 6% by weight of the copolymer.


The second component of the RF layer 16 confers flexibility and low temperature ductility to the RF layer 16 and is chosen from the group consisting of polyolefins that do not have propylene repeating units (“non-propylene based polyolefins”) including ethylene copolymers including ULDPE, polybutene, butene ethylene copolymers, ethylene vinyl acetate copolymers with vinyl acetate contents between approximately 18-50%, ethylene methyl acrylate copolymers with methyl acrylate contents being between approximately 20-40%, ethylene n-butyl acrylate copolymers with n-butyl acrylate content of between 20-40%, ethylene acrylic acid copolymers with the acrylic acid content of greater than approximately 15%. An example of these products are sold under such product designations as Tafmer A-4085 (Mitsui), EMAC DS-1130 (Chevron), Exact 4023, 4024 and 4028 (Exxon). Preferably, the second component is either ULDPE sold by Mitsui Petrochemical Company under the designation TAFMER A-4085, or polybutene-1, PB8010 and PB8310 (Shell Chemical Co.), and should constitute approximately 25-50%, more preferably 35-45%, and most preferably 45%, by weight of the film.


The first and second components of the RF layer 16 may be replaced by a single component selected from a high melting temperature and flexible olefins such as those polypropylenes sold by the Rexene Company under the product designation FPO. The melting point temperature of this component should be greater than 130° C. and the modulus less than 20,000 psi. This component should constitute between 30-60% by weight of the RF layer.


To impart RF dielectric loss to the RF layer 16, certain known high dielectric loss ingredients are included as the third component of the film structure 10. For example, EVA and EMA of sufficiently high co-monomer contents exhibit significant loss properties at 27 MHZ to allow the compositions to be sealed by the dielectric process. Polyamides as a class of material, and ethylene vinyl alcohol (“EVOH”) copolymers (typically produced by hydrolysing EVA copolymers), both possess high dielectric loss properties at suitable temperatures. Other active materials include PVC, vinylidine chlorides, and fluorides, copolymer of bis-phenol-A and epichlorohydrines known as PHENOXYS® (Union Carbide). However, significant contents of these chlorine and fluorine containing polymers would make them environmentally unsound as incineration of such a material would generate inorganic acids. Therefore, the third component of the RF layer 16 is preferably chosen from the class of polyamides.


Preferably, the polyamides of the present invention will be chosen from aliphatic polyamides resulting from the condensation reaction of di-amines having a carbon number within a range of 2-13, aliphatic polyamides resulting from a condensation reaction of di-acids having a carbon number within a range of 2-13, polyamides resulting from the condensation reaction of dimer fatty acids, and amide containing copolymers (random, block or graft).


Polyamides such as nylons are widely used in film material because they offer abrasion resistance to the film. However, rarely are the nylons found in the layer that contacts medical solutions as they typically contaminate the solution by leaching out into the solution. However, it has been found by the applicants of the present invention that various dimer fatty acid polyamides sold by, for example, Henkel Corporation under the product designations MACROMELT and VERSAMID do not lead to such contamination and thus are the most preferred third component of the RF layer 16. The third component should constitute approximately 3-40%, more preferably between 7-13%, and most preferably 10%, by weight of the RF layer 16.


The fourth component of the RF layer 16 confers compatibility between the polar and nonpolar components of the RF layer 16. The fourth component was chosen from styrene-hydrocarbon block copolymers and preferably SEBS block copolymers that are modified by maleic anhydride, epoxy, or carboxylate functionalities. Most preferably the fourth component is an SEBS block copolymer that is maleic anhydride functionalized. Such a product is sold by Shell Chemical Company/Ripplewood Holdings LLC under product designation KRATON™ RP-6509. The fourth component should constitute approximately 5-40%, more preferably 7-13%, and most preferably 10% by weight of the RF layer 16.


It may also be desirable to include a fifth component to the RF layer 16 of an SEBS block copolymer, not modified by the above functional groups, such as the one sold by the Shell Chemical Company/Ripplewood Holdings LLC under the product designation KRATON™ G-1652. This component should constitute between 5-40% by weight of the RF layer 16, more preferably between 7-13%, and most preferably 10%.


Preferably the RF susceptible layer 16 will have a thickness within the range of 1-15 mils are more preferably 5.0 mils-8.0 mils, and most preferably 6.0 mils. The skin layer will have a thickness within the range of 0.2-3.0 mils and most preferably 0.5 mils.



FIG. 2 shows another embodiment of the present invention having a non-radio frequency susceptible core layer 18 interposed between the first skin layer 12 and the RF layer 16. The core layer 18 confers heat distortion resistance, and flexibility to the film structure 10 and compatibility among the components of the film structure 10. Preferably, the core layer will have a thickness within the range of 0.5-10 mils and more preferably 1-4 mils. The core layer 18 includes three components. The first component is a polyolefin and preferably a polypropylene in an amount that constitutes from about 20 to about 60% by weight of the core layer 18, more preferably from about 35 to about 50%, and most preferably 45% of the core layer 18.


The second component of the core layer 18 is chosen from a group consisting of compounds that confer flexibility to the core layer 18 including ULDPE, polybutene copolymers. Preferably, the second component of the core layer is ULDPE or polybutene-1 in an amount by weight of from about 40% to about 60%, more preferably from about 40 to about 50%, and most preferably 40%.


The third component of the core layer 18 is chosen from a group of compounds that confer compatibility among the components of the core layer 18 and includes styrene-hydrocarbon block copolymers and most preferably SEBS block copolymers. The third component is in an amount preferably within a range of from about 5 to about 40% by weight of the core layer 18, more preferably from about 7 to about 15%, and most preferably 15%.


It is also possible to add as a fourth component of the core layer 18, reground trim scrap material recovered during the manufacturing of containers. The scrap material is dispersed throughout the core layer 18. Scrap may be added in an amount preferably between approximately from about 0 to about 50% by weight of the core layer 18, and more preferably within the range of from about 10 to about 30% and most preferably within the range of from about 3 to about 12%. The present invention also contemplates any predetermined number of core layers (e.g., a second core layer) disposed in the multilayer film structure.



FIG. 3 shows another embodiment of the multiple layer film structure having the first skin layer 12, the second skin layer 14, the RF layer 16, and the core layer 18 as described above with an additional discrete layer of scrap 20 between the core layer 18 and the RF layer 16. Another embodiment (not shown) positions the layer of scrap 20 between the first skin layer 12 and the core layer 18. FIG. 4 shows the scrap layer 20 dividing the core layer 16 into first and second core layers 18a and 18b. Preferably, the layer of regrind should have a thickness within the range of 0.5-5.0 mils and most preferably 1.0 mils.



FIG. 5 shows another embodiment of the present invention having five layers including the first skin 12, the second skin 14, the RF layer 16, and the core layer 18 as discussed above, with a barrier layer 22 interposed between the core 18 and RF layers 16. In another embodiment (not shown), the barrier layer 22 is interposed between the first skin layer 12 and the core layer 18. In still yet another embodiment (not shown), the barrier layer 22 divides the core layer 18 into a first core layer 18a and second core layer 18b. As shown in FIG. 6, the present invention also provides the barrier layer 22 being interposed between two opposing tie layers 24a and 24b, which are further interposed between the first and second core layers 18a and 18b.


The barrier layer 22 increases the gas barrier properties of the film structure 10. The barrier layer 22 is selected from the group consisting ethylene vinyl alcohols such as that sold under the name Evalca (Evalca Co.), highly glassy or crystalline polyamide such as Sclar PA® (Dupont Chemical Co.), high nitrile content acrylonitrile copolymers such as Barex® sold by British Petroleum. Preferably, the barrier layer 22 is ethylene vinyl alcohol, and has a thickness within the range of 0.3-1.5 mils and most preferably 1.0 mils. The tie layers 24 may be selected from modified ethylene and propylene copolymers such as those sold under the product designations Prexar (Quantum Chemical Co.) and Bynel (Dupont) and should have a thickness within the range of 0.2-1.0 mils and most preferably 0.5 mil.


The above layers may be processed by coextrusion, extrusion coating, or other acceptable process. These materials may be used to manufacture I.V. therapy bags such as the one shown in FIG. 7 and generally designated as 50.


EXAMPLES

It is understood that the present invention is not limited to the particular examples described herein. The examples of Table 1 are proffered for the purpose of describing particular embodiments and are not intended to be limiting.












TABLE 1





Formula





No.
First Skin
RF Susceptible Skin
Second Skin







1
Fina ® 6671 XBB
40-47% Polypropylene
Fina ® 6671 XBB




40-51% Polyethylene




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap


2
80-100% Fina ® 6671 XBB
40-47% Polypropylene
80-100% Fina ® 6671 XBB



20-0% Kraton ™ G-1657
40-51% Polyethylene
 0-20% Kraton ™ G-1657




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap


3
Fina ® 7602 Z
40-47% Polypropylene
Fina ® 7602Z




40-51% Polyethylene




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap


4
Fina ® 4540 HC
40-47% Polypropylene
Fina ® 7450 HC




40-51% Polyethylene




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap


5
Fina 6573 ® XGC
40-47% Polypropylene
Fina ® 6573 XHC




40-51% Polyethylene




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap


6
80-100% Fina 6573 XHC
40-47% Polypropylene
80-100% Fina ® XHC



20-0% Kraton ™ G-1657
40-51% Polyethylene
 0-20% Kraton ™ G-1657




 3-10% SEBS




 3-10% Polyamide




 0-30% Regrind scrap









The above working examples, as well as other embodiments contemplated by the present invention, are believed to having the following properties measured in conformance with the experimental details the inventors disclosed in U.S. Pat. No. 6,261,655, which is incorporated by reference:

    • (a) a mechanical modulus less than 40,000 psi measured according to ASTM D-882;
    • (b) a percent recovery in length of greater than or equal to about 70% percent after an initial 20% deformation;
    • (c) an optical haze of less than about 30%, preferably less than 20%, measured in accordance to ASTM D-1003 when the composition is processed into a film 9 mils in thickness;
    • (d) a loss tangent greater than about 1.0 at 1 Hz measured at melt processing temperatures;
    • (e) an elemental halogen content by weight of less than about 0.1%;
    • (f) a low molecular weight water soluble fraction of less than about 0.1%;
    • (g) a dielectric loss of greater than or equal to about 0.05 when measured between 1 and 60 MHZ and over temperatures of 25 to 250° C. of the composition;
    • (h) a sample creep of less than or equal to about 60% when measured at 121° C. for a 1 inch strip under 27 psi loading for one hour; and,
    • (i) no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute to about 100% elongation (twice the original length).


It will be understood that the invention may be embodied in other specific forms without departing from the spirit or central characteristics thereof. The present examples and embodiments, therefore, are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein.

Claims
  • 1. A multiple layer structure comprising: a first skin layer; a radio frequency (“RF”) susceptible layer adhered to the first skin layer, the RF layer having a first component of a propylene based polymer, a second component of a non-propylene polyolefin, a third component of a radio frequency susceptible polymer, and a fourth component of a polymeric compatibilizing agent; and a second skin layer adhered to the RF layer and opposed to the first skin layer; the structure having physical properties within the range a<40,000 psi; b>=70%; c<30%; d>1.0; e<0.1%; f<0.1%; g>=0.05 h<=60%; i=0;  wherein: a is the mechanical modulus of the composition measured according to ASTM D-882; b is the percent recovery in length of the composition after an initial 20% deformation; c is the optical haze of the composition processed into a film 9 mils in thickness measured in accordance to ASTM D-1003; d is the loss tangent of the composition at 1 Hz measured at melt processing temperatures; e is the elemental halogen content by weight of the composition; f is the low molecular weight water soluble fraction of the composition; g is the dielectric loss between 1 and 60 MHZ and over temperatures of 25 to 250° C. of the composition; h is the sample creep measured at 121° C. for a 1 inch strip of the composition under 27 psi loading; and, i the composition exhibits no strain whitening after being strained at moderate speeds of about 20 inches (50 cm) per minute to about 100% elongation (twice the original length) and the presence of strain whitening (indicated by 1) or lack thereof (indicated by 0) is noted.
  • 2. A multiple layer structure comprising: a first skin layer of a propylene-containing polymer; a radio frequency (“RF”) susceptible layer adhered to the first skin layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., the RF layer having a first component of a propylene based polymer, a second component of a non-propylene polyolefin, a third component of a radio frequency susceptible polymer, and a fourth component of a polymeric compatibilizing agent; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 3. The structure of claim 2 wherein the non propylene polyolefin of the RF layer is selected from the group of ethylene copolymers including ultra low density polyethylene, polybutene, butene ethylene copolymers, ethylene vinyl acetate copolymers with vinyl acetate contents between approximately 18-50%, ethylene methyl acrylate copolymers with methyl acrylate contents being between approximately 20-40%, ethylene n-butyl acrylate copolymers with n-butyl acrylate content of between 20-40%, ethylene acrylic acid copolymers with the acrylic acid content of greater than approximately 15%.
  • 4. The structure of claim 2 wherein the radio frequency susceptible polymer is selected from the group consisting of polyamides, ethylene vinyl acetate with vinyl acetate in an amount of 18-50% by weight, ethylene methyl acrylate copolymers with methyl acrylate in an amount between 20%-40% by weight, ethylene vinyl alcohol with vinyl alcohol in an amount of 15%-70%.
  • 5. The structure of claim 4 wherein the polyamide is selected from a group consisting of: aliphatic polyamides resulting from the condensation reaction of di-amines having a carbon number within a range of 2-13, aliphatic polyamides resulting from a condensation reaction of di-acids having a carbon number within a range of 2-13, polyamides resulting from the condensation reaction of dimer fatty acids, and amide containing copolymers.
  • 6. The structure of claim 2 wherein the polymeric compatibilizing agent of the RF layer is a styrene ethylene-butene styrene block copolymer.
  • 7. The structure of claim 6 wherein the styrene ethylene-butene styrene block copolymer is maleic anhydride functionalized.
  • 8. The structure of claim 2 further including a first non radio frequency susceptible core layer interposed between the first skin layer and the RF layer.
  • 9. The structure of claim 8 wherein the first core layer includes: a first component of a polyolefin; a second component selected from the group consisting of ultra low density polyethylene, polybutene copolymers, and, a third component of a compatibilizing agent.
  • 10. The structure of claim 9 wherein the polyolefin of the first component of the first core layer is a polypropylene.
  • 11. The structure of claim 9 wherein the second component of the first core layer is an ultra low density polyethylene.
  • 12. The structure of claim 9 wherein the third component of the first core layer is a styrene ethylene-butene styrene block copolymer.
  • 13. The structure of claim 9 wherein the first core layer includes a fourth component consisting of a scrap material.
  • 14. The structure of claim 9 further including a layer of scrap material interposed between the first core layer and the first skin layer.
  • 15. The structure of claim 9 further including a layer of scrap material interposed between the first core layer and the radio frequency susceptible layer.
  • 16. The structure of claim 9 further including: a scrap layer adhered to the first core layer on a side opposite the first skin layer; and, a second core layer attached to the scrap layer on a side opposite the first core layer.
  • 17. The structure of claim 9 further including a barrier layer.
  • 18. The structure of claim 17 wherein the barrier layer is interposed between the first core layer and the RF layer.
  • 19. The structure of claim 17 wherein the barrier layer is interposed between the first core layer and the first skin layer.
  • 20. The structure of claim 17 wherein the barrier layer is selected from the group consisting of ethylene vinyl alcohols, and glassy polyamides.
  • 21. The structure of claim 9 further including a barrier layer adhered to the first core layer on a side opposite the first skin layer; and, a second core layer adhered to the barrier layer on side opposite the first core layer.
  • 22. The structure of claim 21 further including two tie layers one of each tie layers being adhered to opposite sides of the barrier layer.
  • 23. The structure of claim 21 wherein the tie layers are modified ethylene and propylene copolymers.
  • 24. A multiple layer structure comprising: a first skin layer of a propylene-containing polymer; a radio frequency (“RF”) susceptible layer adhered to the first skin layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., the RF layer having a first component of a propylene based polymer in an amount in a range of 30-60% by weight of the RF layer, a second component of a non-propylene polyolefin in an amount within the range of 0-60% by weight of the RF layer, a third component of a radio frequency susceptible polymer in an amount within the range of 3-40% by weight of the RF layer, and a fourth component of a polymeric compatibilizing agent in an amount within the range of 5-40% by weight of the RF layer; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 25. The structure of claim 24 wherein the first component of the RF susceptible layer is polypropylene.
  • 26. The structure of claim 25 wherein the second component of the RF susceptible layer is selected from the group of ultra low density polyethylene and polybutene-1.
  • 27. The structure of claim 26 wherein the third component is a fatty acid polyamide.
  • 28. The structure of claim 27 wherein the fourth component is styrene ethylene-butene styrene block copolymer.
  • 29. The structure of claim 28 wherein the styrene ethylene-butene styrene block copolymer is maleic anhydride functionalized.
  • 30. The structure of claim 29 wherein the components of the RF layer are in an amount within the range as a weight percentage of the RF layer as follows: first component 35-45%; second component 35-45%; third component 7-13%; and, fourth component 7-13%.
  • 31. The structure of claim 30 wherein the fatty acid polyamide is a dimer fatty acid polyamide.
  • 32. A multiple layer structure comprising: a first skin layer of a propylene-containing polymer; a core layer having a side adhered to the first skin layer; a radio frequency (“RF”) susceptible layer adhered to the core layer on a side opposite the first skin layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., the RF layer being composed of a first component of a propylene based polymer in an amount in a range of 30-60% of the weight of the RF layer, a second component of a non-propylene polyolefin in an amount within the range of 25-50% of the weight of the RF layer, a third component of a radio frequency susceptible polymer in an amount within the range of 3-40% by weight of the RF layer, and a fourth component of a polymeric compatibilizing agent in an amount within the range of 5-40% by weight of the RF layer; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 33. The structure of claim 32 wherein the core layer is non radio frequency susceptible.
  • 34. The structure of claim 33 wherein the second component of the RF susceptible layer is selected from the group of ultra low density polyethylene and polybutene-1, the radio frequency susceptible polymer is a dimer fatty acid polyamide, the fourth component of the RF susceptible layer is an SEBS block copolymer, the core layer includes: a first component of a polyolefin; a second component selected from the group consisting of ultra low density polyethylene, and polybutene copolymers; and a third component of a compatibilizing agent.
  • 35. The structure of claim 34 wherein the polyolefin of the first component of the core layer is a polypropylene.
  • 36. The structure of claim 35 wherein the second component of the core layer is an ultra low density polyethylene.
  • 37. The structure of claim 36 wherein the compatibilizing agent of the third component of the core layer is a styrene ethylene-butene styrene block copolymer.
  • 38. The structure of claim 37 wherein the core layer further includes a component of scrap material.
  • 39. A multiple layer structure of stacked layers comprising: a first skin layer of a propylene-containing polymer; a radio frequency (“RF”) susceptible layer, the RF layer being composed of a first component of a propylene based polymer in an amount in a range of 30-60% of the weight of the RF layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., a second component of a non-propylene polyolefin in an amount within the range of 25-50% of the weight of the RF layer, a third component of a radio frequency susceptible polymer in an amount within the range of 3-40% by weight of the RF layer, and a fourth component of a polymeric compatibilizing agent in an amount within the range of 5-40% by weight of the RF layer; a first core layer between the first skin layer and the RF layer; and, a scrap layer attached to the core layer; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 40. The structure of claim 39 wherein one side of the first skin layer is attached to the core layer, the scrap layer is attached to the core layer on the side opposite the first skin layer, and the RF susceptible layer is attached to the scrap layer on the side opposite the core layer.
  • 41. The structure of claim 39 wherein one side of the first skin layer is attached to the scrap layer, the core layer is attached to the scrap layer on a side opposite the first skin layer, and the RF susceptible layer is attached to the core layer on the side opposite the scrap layer.
  • 42. The structure of claim 41 further including a second core layer interposed between the core layer and the RF susceptible layer.
  • 43. The structure of claim 39 wherein the second component of the RF susceptible layer is selected from the group of ultra low density polyethylene and polybutene-1, the radio frequency susceptible polymer is a dimer fatty acid polyamide, the fourth component of the RF susceptible layer is an SEBS block copolymer, the first core layer includes: a first component of a polyolefin; a second component selected from the group consisting of ultra low density polyethylene, and polybutene copolymers; and, a third component of a compatibilizing agent.
  • 44. A multiple layer structure comprising: a first skin layer of a propylene-containing polymer; a radio frequency (“RF”) susceptible layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., the RF layer being composed of a first component of a propylene based polymer in an amount in a range of 30-60% of the weight of the RF layer, a second component of a non-propylene polyolefin in an amount within the range of 25-50% of the weight of the RF layer, a third component of a radio frequency susceptible polymer in an amount within the range of 3-40% by weight of the RF layer, and a fourth component of a polymeric compatibilizing agent in an amount within the range of 5-40% by weight of the RF layer; a first core layer between the first skin layer and the RF layer; a barrier layer attached to the core layer; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 45. The structure of claim 44 wherein one side of the first skin layer is attached to the barrier layer, the core layer is attached to the barrier layer on a side opposite the first skin layer, and the RF susceptible layer is attached to the core layer on the side opposite the barrier layer.
  • 46. The structure of claim 45 wherein a second core layer is interposed between the core layer and the RF susceptible layer.
  • 47. The structure of claim 44 wherein one side of the first skin layer is attached to the core layer, the barrier layer is attached to the core layer on the side opposite the first skin layer, and the RF susceptible layer is attached to the barrier layer on the side opposite the core layer.
  • 48. The structure of claim 44 wherein the second component of the RF susceptible layer is selected from the group of ultra low density polyethylene and polybutene-1, the radio frequency susceptible polymer is a dimer fatty acid polyamide, the fourth component of the RF susceptible layer is an SEBS block copolymer, wherein the barrier layer is selected from the group consisting of ethylene vinyl alcohols, and glassy polyamides.
  • 49. The structure of claim 44 further including two tie layers one on each side of the barrier layer.
  • 50. The structure of claim 49 wherein the tie layers are modified ethylene and propylene copolymers.
  • 51. A multiple layer structure comprising: a first skin layer of a propylene-containing polymer; a core layer having one side adhered to the first skin layer; a radio frequency (“RF”) susceptible layer adhered to the core layer on a side opposite the first skin layer, the radio frequency susceptible layer having a dielectric loss greater than 0.05 at 1-60 MHz at temperatures of ambient to 250° C., the RF layer being composed of a high melting temperature and flexible polypropylene in an amount in a range of 30-60% of the weight of the RF layer, a radio frequency susceptible polymer in an amount within the range of 5-20% by weight of the RF layer, and a polymeric compatibilizing agent in an amount within the range of 5-20% by weight of the RF layer; and a second skin layer adhered to the RF layer and opposed to the first skin layer, the second skin layer being a propylene-containing polymer.
  • 52. The structure of claim 51 wherein the radio frequency susceptible polymer of the RF susceptible layer is a dimer fatty acid polyamide and the polymeric compatibilizing agent is a styrene ethylene-butene styrene block copolymer.
  • 53. The structure of claim 52 wherein the core includes: a first component of a polyolefin; a second component selected from the group consisting of ultra low density polyethylene, and polybutene copolymers; and a third component of a compatibilizing agent.
CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation-in-part application of U.S. patent application Ser. No. 09/498,674, which was filed on Feb. 7, 2000 U.S. Pat. No. 6,461,696; which is a continuation-in-part of U.S. patent application Ser. No. 09/334,957, which was filed on Jun. 17, 1999, and is now U.S. Pat. No. 6,261,655; which is a continuation of U.S. patent application Ser. No. 08/153,602 filed on Nov. 16, 1993, and is now U.S. Pat. No. 5,998,019, all of which are incorporated herein by reference and made a part hereof.

US Referenced Citations (396)
Number Name Date Kind
2705223 Renfrew et al. Mar 1955 A
3255923 Soto Jun 1966 A
3375300 Ropp Mar 1968 A
3494897 Reding et al. Feb 1970 A
3514359 Frese May 1970 A
3536693 Schrader et al. Oct 1970 A
3772136 Workman Nov 1973 A
3912843 Brazier Oct 1975 A
3937758 Castagna Feb 1976 A
3955040 Schirmer May 1976 A
3995084 Berger et al. Nov 1976 A
4005710 Zeddies et al. Feb 1977 A
4041103 Davison et al. Aug 1977 A
4058647 Inoue et al. Nov 1977 A
4064296 Bornstein et al. Dec 1977 A
4082854 Yamada et al. Apr 1978 A
4082877 Shadle Apr 1978 A
4087587 Shida et al. May 1978 A
4087588 Shida et al. May 1978 A
4095012 Schirmer Jun 1978 A
4103686 LeFevre Aug 1978 A
4110303 Gergen et al. Aug 1978 A
4147827 Breidt, Jr. et al. Apr 1979 A
4197326 Wakamatsu et al. Apr 1980 A
4212956 Katsura Jul 1980 A
4212966 McClain Jul 1980 A
4220684 Olson Sep 1980 A
4230830 Tanny et al. Oct 1980 A
4233367 Ticknor et al. Nov 1980 A
4239826 Knott, II et al. Dec 1980 A
4244378 Brignola Jan 1981 A
4254169 Schroeder Mar 1981 A
4255490 Katsura Mar 1981 A
4281045 Sumi et al. Jul 1981 A
4284674 Sheptak Aug 1981 A
4286628 Paradis et al. Sep 1981 A
4310017 Raines Jan 1982 A
4311807 McCullough, Jr. et al. Jan 1982 A
4322465 Webster Mar 1982 A
4322480 Tuller et al. Mar 1982 A
4327726 Kwong May 1982 A
4332655 Berejka Jun 1982 A
4336352 Sakurai et al. Jun 1982 A
4349644 Iwanami et al. Sep 1982 A
4350797 Marzola et al. Sep 1982 A
4355721 Knott, II et al. Oct 1982 A
4361628 Krueger et al. Nov 1982 A
4369812 Paradis et al. Jan 1983 A
4387184 Coquard et al. Jun 1983 A
4397916 Nagano Aug 1983 A
4397917 Chi et al. Aug 1983 A
4405667 Christensen et al. Sep 1983 A
4407873 Christensen et al. Oct 1983 A
4407877 Rasmussen Oct 1983 A
4407888 Crofts Oct 1983 A
4417753 Bacehowski et al. Nov 1983 A
4429076 Saito et al. Jan 1984 A
4445550 Davis et al. May 1984 A
4457960 Newsome Jul 1984 A
4460632 Adur et al. Jul 1984 A
4464438 Lu Aug 1984 A
4465487 Nakamura et al. Aug 1984 A
4468427 Degrassi et al. Aug 1984 A
4479989 Mahal Oct 1984 A
4486497 Mizutani Dec 1984 A
4501798 Koschak et al. Feb 1985 A
4521437 Storms Jun 1985 A
4528219 Yamada et al. Jul 1985 A
4536409 Farrell et al. Aug 1985 A
4536532 Miller et al. Aug 1985 A
4548348 Clements Oct 1985 A
4551371 Eckstein Nov 1985 A
4552714 Krueger et al. Nov 1985 A
4552716 Habich Nov 1985 A
4552801 Odorzynski et al. Nov 1985 A
4561110 Herbert Dec 1985 A
4561920 Foster Dec 1985 A
4562118 Maruhashi et al. Dec 1985 A
4568333 Sawyer et al. Feb 1986 A
4568723 Lu Feb 1986 A
4572854 Dallmann et al. Feb 1986 A
4573994 Fischell et al. Mar 1986 A
4579784 Lemstra et al. Apr 1986 A
4588177 White May 1986 A
4588648 Krueger et al. May 1986 A
4590131 Yazaki et al. May 1986 A
4599276 Martini Jul 1986 A
4605576 Jabarin Aug 1986 A
4615922 Newsome et al. Oct 1986 A
4615926 Hsu et al. Oct 1986 A
4617240 Krueger et al. Oct 1986 A
4619849 Anzawa et al. Oct 1986 A
4627844 Schmitt Dec 1986 A
4628969 Jurgens, Jr. et al. Dec 1986 A
4636412 Field Jan 1987 A
4639398 Bergström Jan 1987 A
4640870 Akazawa et al. Feb 1987 A
4643926 Mueller Feb 1987 A
4645695 Negi et al. Feb 1987 A
4647483 Tse et al. Mar 1987 A
4650452 Jensen Mar 1987 A
4650721 Ashcraft et al. Mar 1987 A
4659903 Berne et al. Apr 1987 A
4668571 Moriarty, Jr. May 1987 A
4672087 Miller et al. Jun 1987 A
4677017 DeAntonis et al. Jun 1987 A
4683916 Raines Aug 1987 A
4684364 Sawyer et al. Aug 1987 A
4684573 Mueller et al. Aug 1987 A
4684576 Tabor et al. Aug 1987 A
4686125 Johnston et al. Aug 1987 A
4692361 Johnston et al. Sep 1987 A
4695491 Kondo et al. Sep 1987 A
4699816 Galli Oct 1987 A
4702966 Farrell et al. Oct 1987 A
4705708 Briggs et al. Nov 1987 A
4707389 Ward Nov 1987 A
4722725 Sawyer et al. Feb 1988 A
4724028 Zabielski et al. Feb 1988 A
4724185 Shah Feb 1988 A
4726984 Shah Feb 1988 A
4726997 Mueller et al. Feb 1988 A
4729476 Lulham et al. Mar 1988 A
4731266 Bonnebat et al. Mar 1988 A
4732795 Ohya et al. Mar 1988 A
4734327 Vicik Mar 1988 A
4735855 Wofford et al. Apr 1988 A
4740582 Coquard et al. Apr 1988 A
4746562 Fant May 1988 A
4753222 Morishita Jun 1988 A
4755419 Shah Jul 1988 A
4758463 Vicik et al. Jul 1988 A
4760114 Haaf et al. Jul 1988 A
4764404 Genske et al. Aug 1988 A
4767651 Starczewski et al. Aug 1988 A
4770944 Farrell et al. Sep 1988 A
4772497 Maasola Sep 1988 A
4778697 Genske et al. Oct 1988 A
4789575 Gibbons et al. Dec 1988 A
4792488 Schirmer Dec 1988 A
4795782 Lutz et al. Jan 1989 A
4800129 Deak Jan 1989 A
4803102 Raniere et al. Feb 1989 A
4808482 Benge et al. Feb 1989 A
4818592 Ossian Apr 1989 A
4826955 Akkapeddi et al. May 1989 A
4828915 Schroeder et al. May 1989 A
4834755 Silvestrini et al. May 1989 A
4839235 Shah Jun 1989 A
4842947 Jachec et al. Jun 1989 A
4855356 Holub et al. Aug 1989 A
4856259 Woo et al. Aug 1989 A
4856260 Woo et al. Aug 1989 A
4857399 Vicik Aug 1989 A
4857408 Vicik Aug 1989 A
4857409 Hazelton et al. Aug 1989 A
4863996 Nakazima et al. Sep 1989 A
4871410 Bonnebat et al. Oct 1989 A
4871799 Kobayashi et al. Oct 1989 A
4873287 Holub et al. Oct 1989 A
4875587 Lulham et al. Oct 1989 A
4877662 Yazaki et al. Oct 1989 A
4877682 Sauers et al. Oct 1989 A
4881649 Hsu et al. Nov 1989 A
4883696 Iwanami et al. Nov 1989 A
4883837 Zabrocki Nov 1989 A
4885119 Mueller et al. Dec 1989 A
4902558 Henricksen Feb 1990 A
4910085 Raniere et al. Mar 1990 A
4911963 Lustig et al. Mar 1990 A
4911979 Nishimoto et al. Mar 1990 A
4915893 Gogolewski et al. Apr 1990 A
4917925 Loretti et al. Apr 1990 A
4923470 Dumican May 1990 A
4929479 Shishido et al. May 1990 A
4931520 Yamanashi et al. Jun 1990 A
4937139 Genske et al. Jun 1990 A
4948643 Mueller Aug 1990 A
4950515 Mason et al. Aug 1990 A
4957966 Nishio et al. Sep 1990 A
4957967 Mizuno et al. Sep 1990 A
RE33376 Gibbons et al. Oct 1990 E
4963426 Nishimoto et al. Oct 1990 A
4966795 Genske et al. Oct 1990 A
4971864 McCord Nov 1990 A
4975207 Lee Dec 1990 A
4977213 Giroud-Abel et al. Dec 1990 A
4983432 Bissot Jan 1991 A
4992511 Yamamoto et al. Feb 1991 A
4996054 Pietsch et al. Feb 1991 A
4999254 Ofstein Mar 1991 A
5003019 Ishimaru et al. Mar 1991 A
5004647 Shah Apr 1991 A
5006114 Rogers et al. Apr 1991 A
5006601 Lutz et al. Apr 1991 A
5008356 Ishimaru et al. Apr 1991 A
5017652 Abe et al. May 1991 A
5034457 Serini et al. Jul 1991 A
5034458 Serini et al. Jul 1991 A
5039565 Deyrup Aug 1991 A
5040583 Lin et al. Aug 1991 A
5049449 Ofstein Sep 1991 A
5053259 Vicik Oct 1991 A
5053457 Lee Oct 1991 A
5061771 Oshima et al. Oct 1991 A
5066290 Measells et al. Nov 1991 A
5070143 Pucci et al. Dec 1991 A
5071686 Genske et al. Dec 1991 A
5071911 Furuta et al. Dec 1991 A
5071912 Furuta et al. Dec 1991 A
5075376 Furuta et al. Dec 1991 A
5077109 Lustig et al. Dec 1991 A
5079295 Furuta et al. Jan 1992 A
RE33832 Yoshimura et al. Feb 1992 E
5085649 Flynn Feb 1992 A
5085816 McCord Feb 1992 A
5087677 Brekner et al. Feb 1992 A
5093164 Bauer et al. Mar 1992 A
5093194 Touhsaent et al. Mar 1992 A
5094921 Itamura et al. Mar 1992 A
5108807 Tucker Apr 1992 A
5108844 Blemberg et al. Apr 1992 A
5110642 Genske May 1992 A
5116906 Mizuno et al. May 1992 A
5126198 Schinkel et al. Jun 1992 A
5127904 Loo et al. Jul 1992 A
5129894 Sommermeyer et al. Jul 1992 A
5132149 Kotani et al. Jul 1992 A
5132363 Furuta et al. Jul 1992 A
5135785 Millon Aug 1992 A
5137763 Bauer et al. Aug 1992 A
5139831 Mueller Aug 1992 A
5141795 Kai et al. Aug 1992 A
5143570 Freedman Sep 1992 A
5145731 Lund et al. Sep 1992 A
5149739 Lee Sep 1992 A
5154979 Kerschbaumer et al. Oct 1992 A
5156921 Lin et al. Oct 1992 A
5159004 Furuta et al. Oct 1992 A
5164258 Shida et al. Nov 1992 A
5164267 D'Heur et al. Nov 1992 A
5165988 Schaefer Nov 1992 A
5169697 Langley et al. Dec 1992 A
5171640 Wirth Dec 1992 A
5176634 Smith et al. Jan 1993 A
5176956 Jevne et al. Jan 1993 A
5183706 Bekele Feb 1993 A
5185189 Stenger et al. Feb 1993 A
5186782 Freedman Feb 1993 A
5189091 Laughner Feb 1993 A
5194316 Horner et al. Mar 1993 A
5196254 Akiyama Mar 1993 A
5206290 Mizuno et al. Apr 1993 A
5207983 Liebert et al. May 1993 A
5208082 Chou May 1993 A
5208094 Sun May 1993 A
5212238 Schelbelhoffer et al. May 1993 A
5216062 Lausberg et al. Jun 1993 A
5218048 Abe et al. Jun 1993 A
5218049 Yamamoto et al. Jun 1993 A
5230934 Sakano et al. Jul 1993 A
5230935 Delimoy et al. Jul 1993 A
5232754 Waugh Aug 1993 A
5234731 Ferguson Aug 1993 A
5234903 Nho et al. Aug 1993 A
5238997 Bauer et al. Aug 1993 A
5244971 Dekoninck Sep 1993 A
5258230 LaFleur et al. Nov 1993 A
5272235 Wakatsuru et al. Dec 1993 A
5278231 Chundury Jan 1994 A
RE34537 Deyrup Feb 1994 E
RE34546 Deyrup Feb 1994 E
5283128 Wilhoit Feb 1994 A
5288531 Falla et al. Feb 1994 A
5288560 Sudo et al. Feb 1994 A
5288799 Schmid et al. Feb 1994 A
5290856 Okamoto et al. Mar 1994 A
5292590 Lin et al. Mar 1994 A
5300354 Harita et al. Apr 1994 A
5306542 Bayer Apr 1994 A
5312867 Mitsuno et al. May 1994 A
5317059 Chundury et al. May 1994 A
5318829 Tada et al. Jun 1994 A
5331057 Brekner et al. Jul 1994 A
5342886 Glotin et al. Aug 1994 A
5346732 Lai et al. Sep 1994 A
5348771 Lee et al. Sep 1994 A
5348794 Takahashi et al. Sep 1994 A
5352773 Kandler et al. Oct 1994 A
5356676 von Widdern et al. Oct 1994 A
5356709 Woo et al. Oct 1994 A
5360670 Yonezu et al. Nov 1994 A
5362532 Famili et al. Nov 1994 A
5370937 Lee et al. Dec 1994 A
5371141 Gelles et al. Dec 1994 A
5372669 Freedman Dec 1994 A
5372880 Lee et al. Dec 1994 A
5374459 Mumpower et al. Dec 1994 A
5378543 Murata et al. Jan 1995 A
5378800 Mok et al. Jan 1995 A
5380586 Knoerzer et al. Jan 1995 A
5382631 Stehling et al. Jan 1995 A
5387645 Montag et al. Feb 1995 A
5389448 Schirmer et al. Feb 1995 A
5407713 Wilfong et al. Apr 1995 A
5422409 Brekner et al. Jun 1995 A
5434007 Yeh Jul 1995 A
5434010 Smith et al. Jul 1995 A
5457249 Toshihiro et al. Oct 1995 A
5462807 Halle et al. Oct 1995 A
5463375 Bauer Oct 1995 A
5464691 Gardiner et al. Nov 1995 A
5466498 Forloni et al. Nov 1995 A
5472792 Tsurutani et al. Dec 1995 A
5475060 Brekner et al. Dec 1995 A
5482770 Bekele Jan 1996 A
5482771 Shah Jan 1996 A
5487940 Bianchini et al. Jan 1996 A
5489478 Audry et al. Feb 1996 A
5491009 Bekele Feb 1996 A
5491011 Pezzoli et al. Feb 1996 A
5498677 Weller et al. Mar 1996 A
RE35285 Quacquarella et al. Jun 1996 E
5534351 Pearson et al. Jul 1996 A
5534606 Bennett et al. Jul 1996 A
5547764 Blais et al. Aug 1996 A
5547765 Degrassi et al. Aug 1996 A
5552002 Farrell et al. Sep 1996 A
5552212 Knoerzer Sep 1996 A
5552504 Bennett et al. Sep 1996 A
5558930 DiPoto Sep 1996 A
5559176 Namba et al. Sep 1996 A
5562996 Kuriu et al. Oct 1996 A
5583192 Bennett et al. Dec 1996 A
5601889 Chundury et al. Feb 1997 A
5604042 Bianchini et al. Feb 1997 A
5604043 Ahlgren Feb 1997 A
5610253 Hatke et al. Mar 1997 A
5618599 Nulman et al. Apr 1997 A
5620425 Hefferman et al. Apr 1997 A
5620758 Babrowicz Apr 1997 A
5628629 Mitani et al. May 1997 A
5629059 Desai et al. May 1997 A
5629398 Okamoto et al. May 1997 A
5637100 Sudo Jun 1997 A
5637400 Brekner et al. Jun 1997 A
5645906 Park et al. Jul 1997 A
5650471 Abe et al. Jul 1997 A
5686527 Laurin et al. Nov 1997 A
5693728 Okamoto et al. Dec 1997 A
5698645 Weller et al. Dec 1997 A
5723189 Sudo Mar 1998 A
5733619 Patel et al. Mar 1998 A
5733991 Rohrmann et al. Mar 1998 A
5744664 Brekner et al. Apr 1998 A
5756623 Kreuder et al. May 1998 A
5788670 Reinhard et al. Aug 1998 A
5792824 Natori Aug 1998 A
5795945 Natori Aug 1998 A
5849843 Laurin et al. Dec 1998 A
5854347 Laurin et al. Dec 1998 A
5854349 Abe et al. Dec 1998 A
5863986 Herrmann-Schonherr et al. Jan 1999 A
5872201 Cheung et al. Feb 1999 A
5929031 Kerwin et al. Jul 1999 A
5935847 Smith et al. Aug 1999 A
5980495 Heinz et al. Nov 1999 A
5990254 Weller et al. Nov 1999 A
5993949 Rosenbaum et al. Nov 1999 A
5998019 Rosenbaum et al. Dec 1999 A
6007520 Sudo Dec 1999 A
6020444 Riedel et al. Feb 2000 A
6060572 Gillis et al. May 2000 A
6065270 Reinhard et al. May 2000 A
6068936 Pfeiffer et al. May 2000 A
6083587 Smith et al. Jul 2000 A
6121394 Sugimoto et al. Sep 2000 A
6136744 Gillis et al. Oct 2000 A
6147025 Gillis et al. Nov 2000 A
6149997 Patel et al. Nov 2000 A
6168862 Rosenbaum et al. Jan 2001 B1
6169052 Brekner et al. Jan 2001 B1
6213996 Jepson et al. Apr 2001 B1
6217568 Jepson et al. Apr 2001 B1
6225426 Gillis et al. May 2001 B1
6225427 Burton et al. May 2001 B1
RE37208 Winter et al. Jun 2001 E
6255396 Ding et al. Jul 2001 B1
6261655 Rosenbaum et al. Jul 2001 B1
6271351 Gawryl et al. Aug 2001 B1
6288027 Gawryl et al. Sep 2001 B1
6344033 Jepson et al. Feb 2002 B1
6361843 Smith et al. Mar 2002 B1
6399704 Laurin et al. Jun 2002 B1
6461696 Ling et al. Oct 2002 B1
20020164492 Nebgen et al. Nov 2002 A1
Foreign Referenced Citations (46)
Number Date Country
0 251 904 Dec 1987 DE
41 42 271 Jun 1993 DE
0 092 897 Feb 1983 EP
0 156 464 Feb 1985 EP
0 158 035 Oct 1985 EP
0 230 344 Jul 1987 EP
0 283 164 Sep 1988 EP
0 291 208 Nov 1988 EP
0 291 208 Nov 1988 EP
0 092 897 Apr 1990 EP
0 158 035 Jan 1991 EP
0 216 509 Sep 1991 EP
0 446 505 Sep 1991 EP
0 451 977 Oct 1991 EP
0 465 428 Jan 1992 EP
0 465 681 Jan 1992 EP
0 497 567 May 1992 EP
0 504 808 Sep 1992 EP
0 524 802 Jan 1993 EP
0 561 428 Sep 1993 EP
0 709 105 Jun 1995 EP
0 492 982 Aug 1995 EP
0 430 585 Jan 1996 EP
0 698 487 Feb 1996 EP
0 156 464 May 1996 EP
0 582 355 May 1996 EP
0 203 799 Jul 1996 EP
0 384 694 Sep 1996 EP
0 291 208 Aug 1997 EP
0 790 063 Aug 1997 EP
0 680 401 Jan 1999 EP
0 709 105 Dec 2001 EP
2688511 Sep 1993 FR
2 131 739 Jun 1984 GB
2 177 974 Feb 1987 GB
03-095286 Apr 1991 JP
05-277154 Oct 1993 JP
11-071554 Mar 1999 JP
8300158 Jan 1983 WO
8607010 Jan 1986 WO
9323093 Nov 1993 WO
9708054 Mar 1997 WO
9827926 Jul 1998 WO
9844043 Oct 1998 WO
9915289 Apr 1999 WO
9948990 Sep 1999 WO
Related Publications (1)
Number Date Country
20020164492 A1 Nov 2002 US
Continuations (1)
Number Date Country
Parent 08153602 Nov 1993 US
Child 09334957 US
Continuation in Parts (2)
Number Date Country
Parent 09498674 Feb 2000 US
Child 10105559 US
Parent 09334957 Jun 1999 US
Child 09498674 US