BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates generally to a heat dissipation structure, and more particularly to a multi-outlet-inlet liquid-cooling heat dissipation structure.
2. Description of the Related Art
Currently, liquid-cooling heat dissipation devices are widely applied to communication, electrical implements, vehicle industry, instruction, etc.
for manufacturing various parts and products. With the fields of communication and electrical implements taken as an example, when a computer operates, many internal components of the computer will generate high heat. Therefore, a good heat dissipation system is a critical factor determining the operation performance and reliability of the computer. Among all the heat generation components, the central processing unit (CPU) and the graphics processing unit (GPU) generally have higher working loads and the heat dissipation issue of these two components is the most knotty problem. Especially, the pictures of various current computer games have become finer and finer and the function of the computer-assistant graphics software has become stronger and stronger. In operation, such software often makes the central processing unit and the graphics processing unit in a highly loaded state. As a result, the central processing unit and the graphics processing unit will generate high heat. The heat must be effectively dissipated. Otherwise, in a minor case, the performance of the central processing unit and the graphics processing unit will be deteriorated, while in a serious case, the central processing unit and the graphics processing unit may be damaged or the lifetime of the central processing unit and the graphics processing unit will be shortened.
Please refer to FIG. 1. In order to lower the working temperature of the heat generation electronic component, a common commercially available water-cooling device includes a water-cooling radiator 1, two water conduits 51, a water-cooling head 5 in contact with a heat generation component (such as central processing unit) and a pump 6. The water conduits 51 are connected between the water-cooling radiator 1 and the water-cooling head 5. The pump 6 serves to drive the water-cooling liquid (or so-called working fluid) to flow to the water-cooling radiator 1 to dissipate the heat and continuously circulate the working fluid to cool the heat generation component and quickly dissipate the heat. The conventional water-cooling radiator 1 is composed of multiple radiating fins 11, multiple flat tubes 12 and two lateral water tanks 13. The radiating fins 11 are disposed between the straight flat tubes 12. The two lateral water tanks 13, the radiating fins 11 and two sides of the straight flat tubes 12 are soldered with each other so that the two lateral water tanks 13, the radiating fins 11 and the straight flat tubes 12 are connected to form the water-cooling radiator 1. A water inlet 131 and a water outlet 132 are disposed on one of the lateral water tanks 13. The water inlet 131 and the water outlet 132 are respectively connected with the two water conduits 51.
After the working fluid flows from the water inlet 13 into one of the lateral water tanks 13, the working fluid quickly flows through the straight flat tubes 12 into the other lateral water tank 13. Then, the working fluid is exhausted from the water outlet 132. Therefore, the flowing time of the working fluid carrying the heat within the water-cooling radiator 1 is quite short so that the heat exchange time of the working fluid carrying the heat with the water-cooling radiator 1 is not long. As a result, the heat dissipation effect of the conventional water-cooling radiator for the working fluid carrying the heat is poor. This leads to poor heat dissipation efficiency. Moreover, the entire structure of the conventional water-cooling radiator cannot be adjusted or changed in adaptation to the internal space of an electronic device. Therefore, when installed in an electronic device (such as a computer or a server), the conventional water-cooling radiator necessitates an independent space inside the electronic device for placing the conventional water-cooling radiator.
It is therefore tried by the applicant to provide a multi-outlet-inlet liquid-cooling heat dissipation structure to solve the above problems existing in the conventional water-cooling device.
SUMMARY OF THE INVENTION
It is therefore a primary object of the present invention to provide a multi-outlet-inlet liquid-cooling heat dissipation structure, which has better heat dissipation performance.
It is a further object of the present invention to provide the above multi-outlet-inlet liquid-cooling heat dissipation structure, in which two liquid-containing plate bodies are stacked at an interval. Each of the liquid-containing plate bodies has a liquid chamber in which a flow way is disposed. Accordingly, the flowing time of a working fluid within the multi-outlet-inlet liquid-cooling heat dissipation structure is effectively increased (or prolonged). Therefore, the heat dissipation efficiency is effectively enhanced.
To achieve the above and other objects, the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention includes a liquid-containing plate body assembly. The liquid-containing plate body assembly has an upper liquid-containing plate body having an upper liquid chamber, a lower liquid-containing plate body having a lower liquid chamber, a first communication tube communicating with the upper and lower liquid chambers for a working fluid to flow between the upper and lower liquid chambers and multiple communication passages. The upper and lower liquid-containing plate bodies are disposed at an interval. Each communication passage has a communication opening respectively in communication with the upper and lower liquid chambers as an inlet or an outlet of the working fluid.
BRIEF DESCRIPTION OF THE DRAWINGS
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
FIG. 1 is a perspective view of a conventional water-cooling device;
FIG. 2A is a perspective exploded view of a first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 2B is a perspective exploded view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention, seen from another angle;
FIG. 2C is a perspective assembled view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 2D is a partially sectional view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3A is a perspective exploded view of a modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3B is a perspective exploded view of another modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3C is a partially sectional view of a modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3D is a perspective exploded view of another modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3E is a perspective exploded view of another modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 3F is a sectional view of another modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 4A is a perspective exploded view of a modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 4B is a perspective assembled view of another modified embodiment of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 5A is a perspective exploded view of a second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 5B is a perspective assembled view of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 5C is a partially sectional view of a modified embodiment of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 5D is a perspective exploded view of another modified embodiment of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 5E is a perspective exploded view of another modified embodiment of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 6A is a perspective exploded view of a third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 6B is a perspective assembled view of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 6C is a partially sectional view of a modified embodiment of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 6D is a perspective exploded view of another modified embodiment of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 6E is a perspective exploded view of another modified embodiment of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 7A is a perspective exploded view of a fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 7B is a perspective assembled view of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 7C is a partially sectional view of a modified embodiment of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention;
FIG. 7D is a perspective exploded view of another modified embodiment of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention; and
FIG. 7E is a perspective exploded view of another modified embodiment of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
Please refer to FIGS. 2A to 2D. FIG. 2A is a perspective exploded view of a first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 2B is a perspective exploded view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention, seen from another angle. FIG. 2C is a perspective assembled view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 2D is a partially sectional view of the first embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. The multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention includes a liquid-containing plate body assembly 2. The liquid-containing plate body assembly 2 has an upper liquid-containing plate body 21, a lower liquid-containing plate body 23, a first communication tube 251 and multiple communication passages 27. In this embodiment, the liquid-containing plate body assembly 2 has, but not limited to, two liquid-containing plate bodies (the upper and lower liquid-containing plate bodies 21, 23), which are stacked at an interval. In a modified embodiment, the liquid-containing plate body assembly 2 can have three liquid-containing plate bodies, which are stacked at intervals. The number of the stacked liquid-containing plate bodies is not limited.
The lower liquid-containing plate body 23 has a first top plate 231 and a first bottom plate 232. The first top plate 231 is mated with the first bottom plate 232 to define a lower liquid chamber 233. The upper liquid-containing plate body 21 has a second top plate 211 and a second bottom plate 212. The second top plate 211 is mated with the second bottom plate 212 to define an upper liquid chamber 213. The upper and lower liquid-containing plate bodies 21, 23 are stacked at an interval. The first communication tube 251 communicates the upper liquid chamber 213 with the lower liquid chamber 233. One end of the first communication tube 251 penetrates through the first top plate 231 to communicate with the lower liquid chamber 233. The other end of the first communication tube 251 penetrates through the second bottom plate 212 to communicate with the upper liquid chamber 213. A working fluid flows between the upper and lower liquid chambers 213, 233 through the first communication tube 251.
In this embodiment, the communication passages 27 include a first communication passage 271 with a first communication opening 271a and a second communication passage 272 with a second communication opening 272a respectively in communication with the lower liquid chamber 233. The first and second communication openings 271a, 272a are the inlets of the working fluid. In addition, the communication passages 27 are a third communication opening 273a of a third communication passage 273 in communication with the upper liquid chamber 213. The third communication opening 273a is the outlet of the working fluid. Reversely, alternatively, the first and second communication openings 271a, 272a are the outlets of the working fluid, while the third communication opening 273a is the inlet of the working fluid.
As shown in FIG. 2D, the working fluid carrying heat flows from the first and second communication openings 271a, 272a into the lower liquid chamber 233. After the lower liquid chamber 233 is filled up with the working fluid, the working fluid passes through the first communication tube 251 to flow into the upper liquid chamber 213. The heat carried by the working fluid is conducted to the upper liquid-containing plate body 21 and the lower liquid-containing plate body 23 to dissipate the heat by way of radiation.
Referring to FIGS. 3A and 2B, in a modified embodiment, a lower flow way 233a is disposed in the lower liquid chamber 233. In this embodiment, the lower flow way 233a is, but not limited to, windingly formed on one face of the first top plate 231 proximal to the lower liquid chamber 233. In another modified embodiment, the lower flow way 233a is windingly formed on one face of the first bottom plate 232 proximal to the lower liquid chamber 233. The lower flow way 233a serves as a flow path for guiding the working fluid. The working fluid is a liquid with high specific heat coefficient such as water or pure water. In still another modified embodiment, as shown in FIGS. 3B and 2A, an upper flow way 213a is disposed in the upper liquid chamber 213. In this embodiment, the upper flow way 213a is, but not limited to, windingly formed on one face of the second bottom plate 212 proximal to the upper liquid chamber 213 as a flow path for guiding the working fluid. In another modified embodiment, the upper flow way 213a is selectively windingly formed on one face of the second top plate 211 proximal to the upper liquid chamber 213 as a flow path for guiding the working fluid. As shown in FIG. 3C, by means of the upper and lower flow ways 213a, 233a, the flowing time of the working fluid within the upper and lower liquid chambers 213, 233 is prolonged so as to prolong the heat exchange time of the working fluid with the upper and lower liquid-containing plate bodies 21, 23. In this case, the heat carried by the working fluid can be fully conducted to the upper and lower liquid-containing plate bodies 21, 23 to dissipate the heat.
In addition, as shown in FIGS. 3D and 3E, in another modified embodiment, a pump 26 is, but not limited to, disposed in the lower liquid chamber 233. In still another modified embodiment, the pump 26 can be alternatively disposed in the upper liquid chamber 213. As shown in FIG. 3F, in still another modified embodiment, the pump 26 is, but not limited to, disposed near the second communication opening 272a of the second communication passage 272. In still another modified embodiment, the pump 26 can be alternatively disposed at the first communication opening 271a of the first communication passage 271 or the third communication opening 273a of the third communication passage 273. The pump 26 of the present invention can be selectively disposed in any chamber or flow way. For example, the pump 26 includes a fan impeller and a drive motor (such as submersible motor or waterproof water) for driving the fan impeller to rotate so as to drive the working fluid to flow.
As shown in FIGS. 4A, 4B as well as 2C, in another modified embodiment, an open place is defined between the upper and lower liquid-containing plate bodies 21, 23 as a first heat dissipation space 291. An open place is positioned on one face of the lower liquid-containing plate body 23 distal from the upper liquid-containing plate body 21 as a second heat dissipation space 292. An open place is positioned on one face of the upper liquid-containing plate body 21 distal from the lower liquid-containing plate body 23 as a third heat dissipation space 293. A first radiating fin assembly 2911 is disposed in the first heat dissipation space 291 between the upper and lower liquid-containing plate bodies 21, 23. A second radiating fin assembly 2921 is disposed in the second heat dissipation space 292 on one face of the lower liquid-containing plate body 23 distal from the upper liquid-containing plate body 21. A third radiating fin assembly 2931 is disposed in the third heat dissipation space 293 on one face of the upper liquid-containing plate body 21 distal from the lower liquid-containing plate body 23. The first, second and third radiating fin assemblies 2911, 2921, 2931 are respectively formed of multiple radiating fins to enlarge the heat exchange area and enhance heat dissipation efficiency.
The second radiating fin assembly 2921 disposed in the second heat dissipation space 292 is equipped with a first protection case 2922. The third radiating fin assembly 2931 disposed in the third heat dissipation space 293 is equipped with a second protection case 2932. The first and second protection cases 2922, 2932 serve to protect the radiating fins and prevent the radiating fins from being deformed due to external collision to affect the heat dissipation efficiency as a whole. The upper and lower liquid-containing plate bodies 21, 23 and the first, second and third radiating fin assemblies 2911, 2921, 2931 together define a lateral side 30.
At least one fan 31 is disposed on the lateral side. In this embodiment, there are three fans 31. Please refer to FIGS. 4A and 4B again. The heat carried by the working fluid is conducted to the upper and lower liquid-containing plate bodies 21, 23. Then, the heat passes through the first, second and third radiating fin assemblies 2911, 2921, 2931. The at least one fan 31 serves to enhance the heat dissipation effect of the first, second and third radiating fin assemblies 2911, 2921, 2931.
In the first embodiment, the upper and lower liquid-containing plate bodies 21, 23, the first communication tube 251 and the communication passages 27 are, but not limited to, made of titanium material. Alternatively, the upper and lower liquid-containing plate bodies 21, 23, the first communication tube 251 and the communication passages 27 can be made of gold, silver, copper, iron, aluminum, aluminum alloy or copper alloy material.
By means of the design of the upper and lower liquid-containing plate bodies 21, 23 and the first communication tube 251 of the present invention, the upper and lower liquid-containing plate bodies 21, 23 themselves have larger heat absorption area on the inner sides for directly contacting and conducting the heat carried by the flowing working fluid. Also, the upper and lower liquid-containing plate bodies 21, 23 themselves have larger heat dissipation area on the outer sides for quickly outward dissipating the heat by way of radiation. Accordingly, the present invention has better heat dissipation performance and enlarged heat dissipation area. Furthermore, the upper and lower flow ways 213a, 233a are disposed in the upper and lower liquid chambers 213, 233 to additionally increase (or prolong) the flowing time of the working fluid. This can effectively prolong the heat exchange time of the working fluid with the upper and lower liquid-containing plate bodies 21, 23. Moreover, the first, second and third radiating fin assemblies 2911, 2921, 2931 and the at least one fan 31 serve to enhance the heat dissipation effect. In addition, the first and second protection cases 2922, 2932 serve to protect the second and third radiating fin assemblies 2921, 2931 from being deformed when impacted.
Please further refer to FIGS. 5A, 5B, 5C. FIG. 5A is a perspective exploded view of a second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 5B is a perspective assembled view of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 5C is a partially sectional view of a modified embodiment of the second embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. As shown in FIGS. 5A and 5B as well as FIGS. 2A to 2D, the second embodiment is substantially identical to the first embodiment in structure, connection relationship and effect and thus will not be redundantly described hereinafter. The second embodiment is different from the first embodiment in that a first partitioning member 233b is disposed in the lower liquid chamber 233 to partition the lower liquid chamber 233 into a first liquid chamber 2331 and a second liquid chamber 2332, which are independent from each other without interfering with each other. A second partitioning member 213b is disposed in the upper liquid chamber 213 to partition the upper liquid chamber 213 into a third liquid chamber 2131 and a fourth liquid chamber 2132, which are independent from each other without interfering with each other. In this embodiment, the liquid-containing plate body assembly 2 further includes a second communication tube 252. One end of the second communication tube 252 penetrates through the first top plate 231 to communicate with the lower liquid chamber 233. The other end of the second communication tube 252 penetrates through the second bottom plate 212 to communicate with the upper liquid chamber 213. In this embodiment, the first communication tube 251 communicates with the first and third liquid chambers 2331, 2131 and the second communication tube 252 communicates with the second and fourth liquid chambers 2332, 2132.
In addition, in this embodiment, the communication passages 27 include a first communication passage 271, a second communication passage 272, a third communication passage 273 and a fourth communication passage 274. A first communication opening 271a of the first communication passage 271 communicates with the first liquid chamber 2331. A second communication opening 272a of the second communication passage 272 communicates with the second liquid chamber 2332. A third communication opening 273a of the third communication passage 273 communicates with the third liquid chamber 2131. A fourth communication opening 274a of the fourth communication passage 274 communicates with the fourth liquid chamber 2132.
As shown in FIG. 5C, the working fluid flows through the first and second communication openings 271a, 272a of the first and second communication passages 271, 272 respectively into the first and second liquid chambers 2331, 2332. The first partitioning member 233b isolates the first and second liquid chambers 2331, 2332 from each other so that the working fluid flowing into the first and second liquid chambers 2331, 2332 respectively passes through the first and second communication tubes 251, 252 into the third and fourth liquid chambers 2131, 2132. Finally, the working fluid respectively flows from the third and fourth communication openings 273a, 274a of the third and fourth communication passages 273, 274 out of the third and fourth liquid chambers 2131, 2132. Accordingly, in this embodiment, the heat carried by the working fluid can be also conducted to the upper and lower liquid-containing plate bodies 21, 23 and dissipated by way of radiation.
In addition, a first flow way 233c, a second flow way 233d, a third flow way 213c and a fourth flow way 213d are respectively disposed in the first, second, third and fourth liquid chambers 2331, 2332, 2131, 2132. The first and second flow ways 233c, 233d are selectively windingly formed on one face of the first top plate 231 and one face of the first bottom board 232 proximal to the lower liquid chamber 233. The third and fourth flow ways 213c, 213d are selectively windingly formed on one face of the second top plate 231 and one face of the second bottom board 212 proximal to the upper liquid chamber 213 as a flow path for guiding the working fluid.
By means of the first, second, third and fourth flow ways 233c, 233d, 213c, 213d, the flowing time of the working fluid within the first, second, third and fourth liquid chambers 2331, 2332, 2131, 2132 is prolonged so as to prolong the heat exchange time of the working fluid with the upper and lower liquid-containing plate bodies 21, 23.
As shown in FIGS. 5D and 5E, in another modified embodiment, a first pump 261 is, but not limited to, disposed in the first liquid chamber 2331. In still another modified embodiment, the first pump 261 can be alternatively disposed in the third liquid chamber 2131. In addition, a second pump 262 is, but not limited to, disposed in the second liquid chamber 2332. In still another modified embodiment, the second pump 262 can be alternatively disposed in the fourth liquid chamber 2132. The first and second pumps serve to drive the working fluid to flow.
Please further refer to FIGS. 6A, 6B and 6C. FIG. 6A is a perspective exploded view of a third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 6B is a perspective assembled view of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 6C is a partially sectional view of a modified embodiment of the third embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. As shown in FIGS. 6A and 6B as well as FIGS. 5A to 5G, the third embodiment is substantially identical to the second embodiment in structure, connection relationship and effect and thus will not be redundantly described hereinafter. The third embodiment is different from the second embodiment in that a third partitioning member 233e is further disposed in the lower liquid chamber 233 to partition the first and second liquid chambers 2331, 2332 to respectively form a fifth liquid chamber 2333 and a sixth liquid chamber 2334. In this embodiment, the liquid-containing plate body assembly 2 has a first communication tube 251, a second communication tube 252, a third communication tube 253 and a fourth communication tube 254. One end of the third and fourth communication tubes 253, 254 penetrates through the first top plate 231 to communicate with the lower liquid chamber 233. The other end of the third and fourth communication tubes 253, 254 penetrates through the second bottom plate 212 to communicate with the upper liquid chamber 213. The first communication tube 251 communicates with the first and third liquid chambers 2331, 2131. The second communication tube 252 communicates with the second and third liquid chambers 2332, 2131. The third communication tube 253 communicates with the fifth and fourth liquid chambers 2333, 2132. The fourth communication tube 254 communicates with the sixth and fourth liquid chambers 2334, 2132.
In this embodiment, the first communication opening 271a of the first communication passage 271 communicates with the first liquid chamber 2331. The first communication opening 271a is the inlet of the working fluid. The second communication opening 272a of the second communication passage 272 communicates with the second liquid chamber 2332. The second communication opening 272a is the outlet of the working fluid. The third communication opening 273a of the third communication passage 273 communicates with the fifth liquid chamber 2333. The third communication opening 273a is the inlet of the working fluid. The fourth communication opening 274a of the fourth communication passage 274 communicates with the sixth liquid chamber 2334. The fourth communication opening 274a is the outlet of the working fluid.
As shown in FIG. 6C, the working fluid flows through the first communication opening 271a of the first communication passage 271 into the first liquid chamber 2331. The first partitioning member 233b isolates the first and second liquid chambers 2331, 2332 from each other so that the working fluid flowing into the first liquid chamber 2331 passes through the first communication tube 251 into the third liquid chamber 2131 and the working fluid flowing into the third liquid chamber 2131 thereafter passes through the second communication tube 252 into the second liquid chamber 2332 and flows out from the second communication opening 272a of the second communication passage 272. At the same time, another working fluid flows through the third communication opening 273a of the third communication passage 273 into the fifth liquid chamber 2333. The first partitioning member 233b isolates the fifth and sixth liquid chambers 2333, 2334 from each other so that the working fluid flowing into the fifth liquid chamber 2333 passes through the third communication tube 253 into the fourth liquid chamber 2132 and the working fluid flowing into the fourth liquid chamber 2132 thereafter passes through the fourth communication tube 254 into the sixth liquid chamber 2334 and flows out from the fourth communication opening 274a of the fourth communication passage 274. Accordingly, in this embodiment, the heat carried by the working fluid can be also conducted to the upper and lower liquid-containing plate bodies 21, 23 and dissipated by way of radiation.
In a modified embodiment, a first flow way 233c, a second flow way 233d, a third flow way 213c, a fourth flow way 213d, a fifth flow way 233f and a sixth flow way 233g are respectively disposed in the first, second, third, fourth, fifth and sixth liquid chambers 2331, 2332, 2131, 2132, 2333, 2334. The first, second, fifth and sixth flow ways 233c, 233d, 233f, 233g are selectively windingly formed on one face of the first top plate 231 and one face of the first bottom board 232 proximal to the lower liquid chamber 233. The third and fourth flow ways 213c, 213d are selectively windingly formed on one face of the second top plate 231 and one face of the second bottom board 212 proximal to the upper liquid chamber 213 as a flow path for guiding the working fluid.
By means of the first, second, third, fourth, fifth and sixth flow ways 233c, 233d, 213c, 213d, 233f, 233g, the flowing time of the working fluid within the first, second, third, fourth, fifth and sixth liquid chambers 2331, 2332, 2131, 2132, 2333, 2334 is prolonged so as to prolong the heat exchange time of the working fluid with the upper and lower liquid-containing plate bodies 21, 23.
As shown in FIGS. 6D and 6E, as the second embodiment, the first pump 261 can be disposed in any of the first, second and third liquid chambers 2331, 2332, 2131, while the second pump 262 can be disposed in any of the fourth, fifth and sixth liquid chambers 2132, 2333, 2334 to drive the working fluid to flow.
Please now refer to FIGS. 7A, 7B and 7C. FIG. 7A is a perspective exploded view of a fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 7B is a perspective assembled view of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. FIG. 7C is a partially sectional view of a modified embodiment of the fourth embodiment of the multi-outlet-inlet liquid-cooling heat dissipation structure of the present invention. As shown in FIGS. 7A and 7B as well as FIGS. 6A to 6E, the fourth embodiment is substantially identical to the third embodiment in structure, connection relationship and effect and thus will not be redundantly described hereinafter. The fourth embodiment is different from the third embodiment in that a fourth partitioning member 213e is further disposed in the upper liquid chamber 213 to partition the third and fourth liquid chambers 2131, 2132 to respectively form a seventh liquid chamber 2133 and an eighth liquid chamber 2134. In this embodiment, the liquid-containing plate body assembly 2 has a first communication tube 251, a second communication tube 252, a third communication tube 253 and a fourth communication tube 254. The first communication tube 251 communicates with the first and third liquid chambers 2331, 2131. The second communication tube 252 communicates with the second and fourth liquid chambers 2332, 2132. The third communication tube 253 communicates with the fifth and seventh liquid chambers 2333, 2133. The fourth communication tube 254 communicates with the sixth and eighth liquid chambers 2334, 2134.
In this embodiment, the first communication opening 271a of the first communication passage 271 communicates with the first liquid chamber 2331. The first communication opening 271a is the inlet of the working fluid. The second communication opening 272a of the second communication passage 272 communicates with the second liquid chamber 2332. The second communication opening 272a is the inlet of the working fluid. The third communication opening 273a of the third communication passage 273 communicates with the third liquid chamber 2131. The third communication opening 273a is the outlet of the working fluid. The fourth communication opening 274a of the fourth communication passage 274 communicates with the fourth liquid chamber 2132. The fourth communication opening 274a is the outlet of the working fluid.
The fifth communication opening 275a of the fifth communication passage 275 communicates with the fifth liquid chamber 2333. The fifth communication opening 275a is the inlet of the working fluid. The sixth communication opening 276a of the sixth communication passage 276 communicates with the sixth liquid chamber 2334. The sixth communication opening 276a is the inlet of the working fluid. The seventh communication opening 277a of the seventh communication passage 277 communicates with the seventh liquid chamber 2133. The seventh communication opening 277a is the outlet of the working fluid.
The eighth communication opening 278a of the eighth communication passage 278 communicates with the eighth liquid chamber 2134. The eighth communication opening 278a is the outlet of the working fluid.
As shown in FIG. 7C, the working fluid respectively flows through the first, second, fifth and sixth communication openings 271a, 272a, 275a, 276a of the first, second, fifth and sixth communication passages 271, 272, 275, 276 into the first, second, fifth and sixth liquid chambers 2331, 2332, 2333, 2334. The working fluid flowing into the first liquid chamber 2331 passes through the first communication tube 251 into the third liquid chamber 2131. The working fluid flowing into the third liquid chamber 2131 thereafter flows out from the third communication opening 272a of the third communication passage 273. The working fluid flowing into the second liquid chamber 2332 passes through the second communication tube 252 into the fourth liquid chamber 2132. The working fluid flowing into the fourth liquid chamber 2132 thereafter passes through the fourth communication opening 274a of the fourth communication passage 274 and flows out.
The working fluid flowing into the fifth liquid chamber 2333 passes through the third communication tube 253 into the seventh liquid chamber 2133. The working fluid flowing into the seventh liquid chamber 2133 thereafter flows out from the seventh communication opening 277a of the seventh communication passage 277. The working fluid flowing into the sixth liquid chamber 2334 passes through the fourth communication tube 254 into the eighth liquid chamber 2134. The working fluid flowing into the eighth liquid chamber 2134 thereafter passes through the eighth communication opening 278a of the eighth communication passage 278 and flows out. Accordingly, in this embodiment, the heat carried by the working fluid can be also conducted to the upper and lower liquid-containing plate bodies 21, 23 and dissipated by way of radiation.
In a modified embodiment, a first flow way 233c, a second flow way 233d, a third flow way 213c, a fourth flow way 213d, a fifth flow way 233f, a sixth flow way 233g, a seventh flow way 213f and an eighth flow way 213g are respectively disposed in the first, second, third, fourth, fifth, sixth, seventh and eighth liquid chambers 2331, 2332, 2131, 2132, 2333, 2334, 2133, 2134. The first, second, fifth and sixth flow ways 233c, 233d, 233f, 233g are selectively windingly formed on one face of the first top plate 231 and one face of the first bottom board 232 proximal to the lower liquid chamber 233. The third, fourth, seventh and eighth flow ways 213c, 213d, 213f, 213g are selectively windingly formed on one face of the second top plate 231 and one face of the second bottom board 212 proximal to the upper liquid chamber 213 as a flow path for guiding the working fluid.
By means of the first, second, third, fourth, fifth, sixth, seventh and eighth flow ways 233c, 233d, 213c, 213d, 233f, 233g, 213f, 213g, the flowing time of the working fluid within the first, second, third, fourth, fifth, sixth, seventh and eighth liquid chambers 2331, 2332, 2131, 2132, 2333, 2334, 2133, 2134 is prolonged so as to prolong the heat exchange time of the working fluid with the upper and lower liquid-containing plate bodies 21, 23.
In a modified embodiment, the present invention further includes a third pump 263 and a fourth pump 264. The first pump 261 can be disposed in any of the first and third liquid chambers 2331, 2131. The second pump 262 can be disposed in any of the second and fourth liquid chambers 2332, 2132. The third pump 263 can be disposed in any of the fifth and sixth liquid chambers 2333, 2133. The fourth pump 264 can be disposed in any of the sixth and eighth liquid chambers 2334, 2134 to drive the working fluid to flow.
The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in such as the form or layout pattern or practicing step of the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
Patent Application
20190212076
