This disclosure relates generally to systems and methods for generating and managing the supply of direct current (DC) power for electronic components. The generation and distribution of DC power for integrated circuits chips and electronic components on a package substrate or printed circuit board, etc., can be challenging. For example, it can be difficult to implement a DC power supply system that delivers the required power to electronic components in instances where different electronic components require a different operating DC supply voltages and where the power requirement of a given electronic system or device can dynamically vary over time. In addition, certain electronic devices, such as high-performance central processing unit (CPU) devices and field programmable gate array (FPGA) may require a point-of-load DC-DC converter to be placed in close proximity to such devices to achieve proximity to power and thereby improve voltage accuracy, efficiency, and the dynamic response (e.g., dynamic changes in DC current draw over time) of the DC voltage rail which supplies DC power to such devices. Indeed, many digital systems operate at high current and low voltages, increasing the need to minimize the distance from power supply to load to reduce the effect of trace-induced voltage drops and parasitic inductance.
Exemplary embodiments of the disclosure include systems and methods for generating and managing regulated direct current (DC) power and, in particular, systems and methods for direct conversion of alternating current (AC) power into multiple regulated DC voltages and for enabling a programmatic control and adjustment of the DC regulated voltage levels and power output.
An exemplary embodiment includes a system which comprises a power converter circuit, a plurality of DC-DC converter circuits, and a controller. The power converter circuit is configured to convert an AC voltage to a DC voltage. The DC-DC converter circuits are configured to convert the DC voltage output from the power converter circuit into respective regulated DC voltages. The controller is configured to control and program operations of the DC-DC converter circuits.
Other embodiments will be described in the following detailed description of exemplary embodiments, which is to be read in conjunction with the accompanying figures.
Embodiments of the disclosure will now be described in further detail with regard to multi-output programmable power management systems and methods which are configured to generate multiple DC regulated voltages directly from alternating current (AC) power and for programmatically adjusting the DC regulated voltage levels and power output. It is to be understood that the various features shown in the accompanying drawings are schematic illustrations that are not drawn to scale. Moreover, the same or similar reference numbers are used throughout the drawings to denote the same or similar features, elements, or structures, and thus, a detailed explanation of the same or similar features, elements, or structures will not be repeated for each of the drawings. Further, the term “exemplary” as used herein means “serving as an example, instance, or illustration.” Any embodiment or design described herein as “exemplary” is not to be construed as preferred or advantageous over other embodiments or designs.
Further, it is to be understood that the phrase “configured to” as used in conjunction with a circuit, structure, element, component, or the like, performing one or more functions or otherwise providing some functionality, is intended to encompass embodiments wherein the circuit, structure, element, component, or the like, is implemented in hardware, software, and/or combinations thereof, and in implementations that comprise hardware, wherein the hardware may comprise discrete circuit elements (e.g., transistors, inverters, etc.), programmable elements (e.g., application specific integrated circuit (ASIC) chips, field-programmable gate array (FPGA) chips, etc.), processing devices (e.g., central processing units (CPUs), graphics processing units (GPUs), etc.), one or more integrated circuits, and/or combinations thereof. Thus, by way of example only, when a circuit, structure, element, component, etc., is defined to be configured to provide a specific functionality, it is intended to cover, but not be limited to, embodiments where the circuit, structure, element, component, etc., is comprised of elements, processing devices, and/or integrated circuits that enable it to perform the specific functionality when in an operational state (e.g., connected or otherwise deployed in a system, powered on, receiving an input, and/or producing an output), as well as cover embodiments when the circuit, structure, element, component, etc., is in a non-operational state (e.g., not connected nor otherwise deployed in a system, not powered on, not receiving an input, and/or not producing an output) or in a partial operational state.
The power converter circuit 110 comprises an AC-to-DC converter circuit which is configured to convert AC power-supplied from an AC power source 105 into a DC voltage (VDC). The power converter circuit 110 comprises AC input nodes AC+ and AC−, and a DC output node DCOUT which outputs the DC voltage, VDC, that is applied to an input node of each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N via a DC voltage distribution bus 112. In an exemplary non-limiting embodiment, the AC power source 106 comprises an AC mains which provides utility AC power, e.g., 120 Vrms (with a positive peak voltage of about 170V and a negative peak voltage of about −170V) at a frequency of 60 Hz. The AC input node AC+ is coupled to a hot line (L) of the AC mains supply 105, and the AC input node AC− is coupled to a neutral line (N), which is a grounded conductor of the AC mains supply 105. In some embodiments, the power converter circuit 110 is configured, for example, to generate the DC voltage VDC=12 V or greater, wherein VDC is distributed to an input of each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N over the DC voltage buss 112. It is to be understood that the power converter circuit 110 (and other power converter circuits as discussed below) can be implemented using any solid-state AC-to-DC converter circuit topology which is suitable for the given application.
In some embodiments, some or all of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N comprise a DC-DC step-down voltage switching regulator circuit (e.g., a Buck switching regulator) to convert the input DC voltage, VDC, into respective regulated output voltages VOUT1, VOUT2, . . . . VOUTN. In some embodiments, the regulated output voltages VOUT1, VOUT2, . . . VOUTN comprises different voltage levels. In some embodiments, some or all of the regulated output voltages output voltages VOUT1, VOUT2, . . . VOUT−N are the same voltage level to, e.g., provide redundant DC power to certain critical electronic systems.
The central controller 120 is configured to perform various control tasks to provide centralized management and control of the operations of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N. In particular, the central controller 120 is configured to generate various control signals that are transmitted over the control buses 122-1, 122-2, . . . , 122-N to the respective DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N. As explained in further detail below, each control bus 122-1, 122-2, . . . , 122-N comprises multiple control lines to send control signals such as clock signals, enable signals, reset signals, programming signals, etc.
In some embodiments, each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N comprises a programmable circuit architecture which enables the central controller 120 to independently program each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N to convert the input DC voltage VDC into, e.g., any one of industry standard DC voltages including, but not limited to 12V, 5V, 3.3 V, 2.5V, 1.8V, etc. In addition, the maximum current output of each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N can be programmatically adjusted to set a maximum output power level provided by each DC-DC voltage converter and regulator circuit 130-1, 130-2, . . . , 130-N. In some embodiments, the power management system 100 provides a maximum DC output power (e.g., 5 watts) wherein the central controller 120 is configured to distribute the maximum output DC power over the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N (which are actively operating) so that the sum total of the maximum DC power outputs of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N does not exceed the maximum output DC power of the power management system 100.
In some embodiments, the central controller 120 is configured to control power-up sequencing and power-down sequencing of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N to comply with the, e.g., the requisite power-up and power-down sequencings of various system components of a given electronic system, which are powered using the DC output voltages VOUT1, VOUT2, . . . . VOUT−N that are generated by the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N. In addition, in some embodiments, the central controller 120 implements a voltage rail monitoring function which is configured to monitor the regulated output voltage levels which are output from the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N to support the power-up and power-down sequencing operations, as well as to provide support for monitoring and protecting against fault conditions such as over voltage protection, over temperature protection, short circuit protection, etc.
Moreover, for systems or applications requiring a high-level DC power supply reliability, the power management system 100 can configure the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N to provide redundant DC power supply for certain system components. For example, assume a given electronic system requires a 5V power supply for a critical system component. The power management system 100 can configure at least two of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N to provide a 5V DC power supply output, wherein the DC power supply outputs can be connected in parallel to enable the switching to one 5V power supply in the event of failure of the other. In this regard, for a given DC power supply that is needed by a given system, the power management system 100 can configure the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N into a parallel output architecture with N+1 redundancy.
In some embodiments, the power management system 100 can be pre-programmed (and remain fixed) for a given application which requires multiple DC power supplies. In some embodiments, the power management system 100 is field programmable by a given user for a given application (and possibly remain fixed for a given application, until reprogrammed by a user). In some embodiments, the power management system 100 is dynamically programmable via control signals that are transmitted over the control bus 122-1 to the control bus interface 122 of the central controller 120 to enable programmatic control of the power management system 100.
In some embodiments, the central controller 120 is configured to operate in response to program control signals that are transmitted from an electronic system or device which receives DC power supply from the power management system 100. Such programmatic control enables on demand control and adjustment of the output voltages and maximum power output of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N to comply with power requirements of the electronic system and devices that are powered by the DC supply voltages provided by the power management system 100. For example, computerized systems or electronics which utilize the power management system 100 for multiple DC power supplies can provide control signals or feedback to the central processing unit 120 via the control bus 122-1 and control bus interface 122 to change the voltage level output and/or max power output of one or more of the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N, as needed.
In some embodiments, the central controller 120 executes proprietary software with a unique “watch dog” function to monitor all DC voltage outputs within a given specification and provide self-diagnostics and reporting of power condition/quality, either manually or wirelessly. For example, as explained in further detail below, the central controller 120 is configured to communicate with one or more electronic systems or devices which are powered by the power management system 100 to obtain information regarding, e.g., operating characteristics of the electronic systems and devices, such as measured voltage levels, measured current levels, power usage, temperatures, etc., and other useful information to enable the power management system 100 to manage the DC power supplied to the DC power supply rails of the electronic system and devices. It is to be appreciated that the power management system 100 can be configured for use in a wide range of applications.
In some embodiments, the components 110, 120, and 130-1, . . . , 130-N of the power management system 100 comprises individual semiconductor integrated circuit (IC) dies (or semiconductor IC chips) that are packaged together with other electronic components (e.g., a processor, a system-on-chip (SoC), an ASIC, a FPGA, a digital signal processor, a memory chip, etc.) to form multi-chip modules using state of the art chip packaging techniques. In such instance, the DC-DC voltage converter and regulator circuits 130-1, 130-2, . . . , 130-N can be utilized as point-of-load DC-DC converters that are placed close to the respective loads to provide proximity to the DC supply power.
In some embodiments, for a SoC implementation, the power converter circuit 210, the central controller 220, and the plurality (N) of DC-DC voltage converter and regulator circuits 230-1, 230-2, . . . , 230-N are integrated circuits that are implemented on a single die, and the power management device 200 comprises package structure comprising, e.g., a lead frame comprising a plurality of surface-mount leads 202, 204, 206, and 208 which enable surface mounting of the power management device 200 to a substrate (e.g., printed circuit board). In other exemplary embodiments, for an SoC implementation, the power converter circuit 210, the central controller 220, and the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 can be implemented on individual dies that are mounted (e.g., flip chip mounted) to a package substrate having wire traces which connect all the dies together to implement a functional system. For a SIP implementation, instead of surface-mount leads, the power management device 200 can have an array of solder ball connections (e.g., BOA connections) on a bottom surface of the package substrate to enable direct chip bonding (e.g., flip chip bonding) of the power management device 200 to a second-level package substrate (e.g., printed circuit board or interposer).
The power converter circuit 210 comprises an AC-to-DC converter which comprises AC input nodes AC+ and AC−, and a DC output node DCOUT. The AC input nodes AC+ and AC− are coupled to the package leads 202. The power converter circuit 210 is configured to convert AC power, which is applied to the package leads 202 (and the AC input nodes AC+ and AC−), into a DC voltage, VDC (e.g., VDC=12 V or greater) which is distributed to an voltage input port VIN of each DC-DC voltage converter and regulator circuit 230-1, 230-2, 230-3, and 230-4.
In some embodiments, as shown in
For example, the control ports 226 comprise enable output ports EN_1, EN_2, EN_3, and EN_4 which are coupled to respective enable input ports EN of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4. In addition, the control ports 226 comprise clock signal output ports CLK_1, CLK_2, CLK_3, and CLK_4 which are coupled to respective clock signal input ports CLK of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4. Moreover, the control ports 226 comprise reset signal output ports RESET_1, RESET_2, RESET_3, and RESET_4 which are coupled to respective reset signal input ports RESET of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4.
As further shown in
The DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 can implement any suitable DC-DC step-down voltage switching regulator circuit architecture which is suitable for the given application. In some embodiments, the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 have the same or substantially the same circuit architecture, such as shown in
The reset input ports RESET of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 are configured to receive respective reset signals RESET_1, RESET_2, RESET_3, and RESET_4, which allows the central controller 220 to hold one or more of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 in a reset state, as needed, when performing certain functions such as power-up sequencing, etc. Furthermore, the clock signal input ports CLK of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 are configured to receive respective clock signals CLK_1, CLK_2, CLK_3, and CLK_4, which allows the central controller 220 to programmatically control and adjust the level of regulated DC voltage and/or output power of the DC-DC voltage converter and regulator circuits 230-1, 230-2, 230-3, and 230-4 using known techniques. For example, the level of regulated DC voltage and/or output power of a given DC-DC voltage converter and regulator circuit can be adjusted by varying the clock frequency and/or duty cycle of the clock signal CLK, which modulates the on/off time of one or more internal switches of the DC-DC voltage converter and regulator circuit, and which, allows the regulated output to be adjusted to a target voltage level within a given range.
In some embodiments, the control bus and control bus interface of the central controller 220 can be implemented using a serial peripheral interface (SPI) communication interface to enable communication between the central processing unit 220 and other components of a given system which is coupled to the power management system 200 to control the power management device 200 or and/or which utilizes the DC supply voltages that are generated and managed by the power management device 200. As is known in the art, SPI is a synchronous, full duplex master-slave-based interface. Both master and slave can transmit data at the same time. The SPI interface comprises a 4-wire interface. 4-wire SPI devices have four signals: Clock (CLK), Chip select (CS) Master out, slave in (MOSI), and Master in, slave out (MISO), the details of which are known to those of ordinary skill in the art. In such instance, the number of control bus ports 222 and associated package leads 204 will be at least 4 for the SPI communication protocol. In other embodiments, the control bus and control bus interface of the central controller 220 can be implemented using the Power Management Bus (PMBus) communication protocol As is known in the art, PMBus is an open-standard digital power management protocol which enables communication between components of a power system such as CPUs, power supplies, power converters, etc. In some embodiments, the other I/O ports 224 are utilized to receive input signals to support other functions of the central controller 220, as needed.
The central controller 320 is configured to perform various control tasks to provide centralized management and control of the operations of the DC-DC voltage converter and regulator circuits 330-1, 330-2, . . . , 330-N. The central controller 320 comprises a control bus interface 322 coupled to a control bus 322-1, a voltage rail monitoring system 423, and a voltage rail sequencing control module 326. The non-volatile memory 340 stores program code that is executed by the central controller 320 to implement various functions such as the monitoring and sequencing functions of the modules 324 and 326. The central controller 320 is configured to generate various control signals that are transmitted over control buses 322-1, 322-2, . . . , 322-N to the respective DC-DC voltage converter and regulator circuits 330-1, 330-2, . . . , 330-N.
The electronic system 350 comprises a plurality of integrated circuit systems 350-1, 350-2, . . . , 350-N, which receive respective regulated voltages VOUT1, VOUT2, . . . , VOUTN from the respective DC-DC voltage converter and regulator circuits 330-1, 330-2, . . . , 330-N. In some embodiments, the electronic system 350 may comprise a CPU, DSP, ASIC, or a DSP device wherein the integrated circuit systems 350-1, 350-2, . . . , 350-N comprise different circuit components of such devices (e.g., processing cores, I/O circuitry, etc.). In other embodiments, the electronic system 350 may comprise an electronic device or system such as computer, display device, etc., wherein the integrated circuit systems 350-1, 350-2, . . . , 350-N comprise different integrated circuit chips or system components of the electronic system 350. In some embodiments, the electronic system 350 comprises a power control and monitoring system 360 which is configured to monitor power usage of the integrated circuit systems 350-1, 350-2, . . . , 350-N and send commands to the central controller 320 via a local control bus interface 352 to request adjustment of voltage levels or power levels of the respective regulated voltages VOUT1, VOUT2, . . . , VOUTN that are supplied to the power the integrated circuit systems 350-1, 350-2, . . . , 350-N, as needed.
In some embodiments, the voltage rail monitoring system 324 is configured to monitor the voltage levels of the respective regulated voltages VOUT1, VOUT2, . . . , VOUTN that are output from the respective DC-DC voltage converter and regulator circuits 330-1, 330-2, . . . , 330-N to ensure that the voltage levels are at the expected levels. As schematically shown in
The voltage rail sequencing control module 326 is configured to control power-up sequencing and power-down sequencing of the DC-DC voltage converter and regulator circuits 330-1, 330-2, . . . , 330-N to comply with the, e.g., the requisite power-up and power-down sequencing of the integrated circuit systems 350-1, 350-2, . . . , 350-N of the electronic system. For example, a FGPA may require that a core supply voltage must be applied a certain amount of time prior to applying supply voltage to I/O circuitry to avoid damaging the device upon power up.
The descriptions of the various embodiments of the present disclosure have been presented for purposes of illustration, but are not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
This application claims the benefit of U.S. Provisional Application Ser. No. 63/270,728, filed on Oct. 22, 2021, the disclosure of which is fully incorporated herein by reference.
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| Number | Date | Country | |
|---|---|---|---|
| 20230127078 A1 | Apr 2023 | US |
| Number | Date | Country | |
|---|---|---|---|
| 63270728 | Oct 2021 | US |