MULTI-PHOTODETECTOR CIRCUITS AND OPTICAL RECEIVER INCORPORATING A MULTI-PHOTODETECTOR CIRCUIT

Information

  • Patent Application
  • 20240364428
  • Publication Number
    20240364428
  • Date Filed
    April 27, 2023
    a year ago
  • Date Published
    October 31, 2024
    3 months ago
Abstract
Disclosed are a multi-photodetector circuit and an optical receiver incorporating the circuit. The circuit includes parallel-connected photodiodes. In some embodiments, photodiodes are connected, in a same direction, between a positive power supply line and an output line. They receive equal power optical signals or a series of 1:2 optical dividers is employed so each photodiode receives a progressively lower power signal until the last two photodiodes, which receive equal power optical signals. In other embodiments, first photodiodes are connected, in one direction, between a positive power supply line and an output line and second photodiodes are connected, in an opposite direction, between a negative power supply line and the output line. First photodiodes receive equal power optical signals from an optical divider in response to an optical input signal and second photodiodes receive equal power optical signals from another optical divider in response to an inverted optical input signal.
Description
BACKGROUND

The present disclosure relates to optical receivers and, particularly, to embodiments of a photodetector circuit and an optical receiver incorporating a photodetector circuit.


An optical receiver front end typically includes, among other components, a photodetector and a transimpedance amplifier (TIA), where an output of the photodetector is an input to the TIA. Thus, the bandwidth of the optical receiver depends on the bandwidths of both the photodetector and the TIA. Circuit modifications can be employed to improve the TIA bandwidth. Unfortunately, the photodetector bandwidth is limited by various technology parameters such as intrinsic width, diffusion constant, recombination time, etc. As a result, the overall bandwidth of an optical receiver is effectively limited by the photodetector bandwidth. Furthermore, during photodetector design, there is typically a trade-off between bandwidth improvement and performance. For example, an increase in the gain-bandwidth product of a photodetector can lead to increased delay.


SUMMARY

Disclosed herein are embodiments of a photodetector circuit. In each of the embodiments, the photodetector circuit can include an output line having an output node, a power supply line, and multiple photodiodes electrically connected in parallel between the power supply line and the output line. The photodiodes can generate an electrical output signal at the output node in response to an optical input signal.


In some embodiments, the photodetector circuit can include an output line having an output node and two power supply lines (i.e., a first power supply line and a second power supply line). In these embodiments, the photodetector circuit can include multiple photodiodes. The photodiodes can include both first photodiodes, which are electrically connected in parallel between the first power supply line and the output line, and second photodiodes, which are electrically connected in parallel between the second power supply line and the output line. Again, the photodiodes (in this case including the first and second photodiodes) generate an electrical output signal at the output node in response to an optical input signal.


Also disclosed herein are embodiments of an optical receiver that incorporates any of the disclosed multi-photodetector circuit embodiments. For example, the optical receiver can include a transimpedance amplifier and a multi-photodetector circuit. The multi-photodetector circuit can further include a power supply line, an output line with an output node connected to the transimpedance amplifier, and at least two photodiodes electrically connected in parallel between the power supply line and the output line.





BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be better understood from the following detailed description with reference to the drawings, which are not necessarily drawn to scale and in which:



FIGS. 1A-1B are schematic diagrams illustrating alternative embodiments of a multi-photodetector circuit;



FIGS. 2A-2B are schematic diagrams illustrating alternative embodiments of another multi-photodetector circuit;



FIGS. 3A-3B are schematic diagrams illustrating alternative embodiments of a balanced multi-photodetector circuit;



FIG. 4 is a schematic diagram illustrating embodiments of an optical receiver front end incorporating any of the disclosed multi-photodetector circuits embodiments of FIGS. 1A-3B, an optical receiver incorporating the optical receiver front end, and a radio frequency integrated circuit (RFIC) chip incorporating the optical receiver; and



FIG. 5 is illustrative of an eye diagram generated from the output signal of a single photodiode;



FIG. 6 is illustrative of an eye diagram generated from the output signal of a multi-photodetector circuit; and



FIG. 7 is illustrative of an eye diagram generated from the output signal of a balanced multi-photodetector circuit.





DETAILED DESCRIPTION

As mentioned above, the overall bandwidth of an optical receiver is effectively limited by the photodetector bandwidth. Furthermore, during photodetector design, there is typically a trade-off between bandwidth improvement and performance. For example, an increase in the gain-bandwidth product of a photodetector can lead to increased delay.


Disclosed herein are embodiments of a multi-photodetector circuit (also referred to herein as a multi-photodiode circuit) configured to improve bandwidth and to improve performance (e.g., improve signal-to-noise ratio (SNR) and, in some embodiments, also reduce dark current (Idark) and, thereby jitter). In each of the embodiments, the multi-photodetector circuit can include multiple photodiodes connected in parallel to an output line. In some embodiments, all of the photodiodes can be connected, in a same direction, between a positive power supply line and the output line. All photodiodes can receive optical signals at the same power level (e.g., from an optical divider that receives an optical input signal and outputs equally divided optical signals to each photodiode). Alternatively, a series of 1:2 optical dividers can be employed so each photodiode receives a progressively lower power signal until the last two photodiodes, which receive optical signals at the same power level from the same optical divider. In other embodiments, the multi-photodetector circuit can include first photodiodes connected in a first direction between a positive power supply line and an output line and second photodiodes connected in a second direction between a negative power supply line and the output line. In these embodiments, the first photodiodes can receive equally divided optical signals from an optical divider in response to an optical input signal and the second photodiodes can similarly receive equally divided optical signals from another optical divider in response to an inverted version of the same optical input signal. In all of these embodiments, the bandwidth is increased as compared to a single photodiode and SNR is improved. Additionally, due to the balanced configuration of the latter embodiments of the multi-photodetector circuit, Idark is reduced and, thus, jitter is also reduced. Also disclosed herein are embodiments of optical receivers incorporating such multi-photodetector circuits. Such an optical receiver can, for example, be monolithically integrated (i.e., contained entirely on a single radio frequency integrated circuit (RFIC) chip).



FIG. 1A is a schematic diagram illustrating, generally, a disclosed embodiment of a multi-photodetector circuit 100 (also referred to herein as a multi-photodiode circuit) with some number n of photodiodes 1301-130n and FIG. 1B is a schematic diagram illustrating, more specifically, the multi-photodetector circuit 100 with two photodiodes 1301-1302. FIG. 2A is a schematic diagram illustrating, generally, another disclosed embodiment of a multi-photodetector circuit 200 (also referred to herein as a multi-photodiode circuit) with some number n of photodiodes 2301-230n and FIG. 2B is a schematic diagram illustrating, more specifically, the multi-photodetector circuit 200 with four photodiodes 2301-2304. FIG. 3A is a schematic diagram illustrating, generally, a disclosed embodiment of a balanced multi-photodetector circuit 300 (also referred to herein as a balanced multi-photodiode circuit) with some specifically even number n of photodiodes including n/2 first photodiodes 3311-331n/2 and the same number (i.e., n/2) of second photodiodes 3321-332n/2 FIG. 3B is a schematic diagram illustrating, more specifically, the balanced multi-photodetector circuit 300 with four photodiodes 3301-3304.


Referring specifically to the embodiment shown in FIGS. 1A-1B, the multi-photodetector circuit 100 can include an output line 150 having an output node 155. The multi-photodetector circuit 100 can further include a power supply line 160 and, particularly, a positive power supply line electrically connected to a positive power supply voltage rail 199 (e.g., a +V rail, such as a VDD rail) for receiving a positive power supply voltage (e.g., +V, such as VDD).


The multi-photodetector circuit 100 can further include multiple stages (S1-Sn), each including a corresponding photodiode 1301-130n. The photodiodes from an initial photodiode 1301 in an initial stage S1 to a last photodiode 130n in a last stage Sn can be electrically connected in parallel between the positive power supply line 160 and the output line 150. Specifically, each photodiode 1301-130n can have a cathode terminal connected to the positive power supply line 160 and an anode terminal connected to the output line 150, as illustrated.


The multi-photodetector circuit 100 can further include an optical divider 105. The optical divider 105 can be a 1:n optical divider coupled to one input waveguide 101 (i.e., a single waveguide) and n output waveguides 1111-111n. This optical divider 105 can be configured to receive an optical input signal (Oin) via the input waveguide 101, to divide Oin into n equal power optical signals (Od), and to transmit the n equal power optical signals along the n output waveguides 1111-111n toward the n photodiodes 1301-130n, respectively, such that the light absorbing layers of the n photodiodes 1301-130n are exposed to optical signals at the same power level. For example, in the embodiment shown in FIG. 1B, the optical divider 105 can be a 1:2 optical divider coupled to one input waveguide 101 (i.e., a single input waveguide) and two output waveguides 1111-1112. This 1:2 optical divider can be configured to receive Oin via the input waveguide 101, to divide Oin into two optical signals Od having half the power of Oin, and to transmit these two equal power optical signals along the two output waveguides 1111-1112 toward the photodiodes 1301-1302, respectively.


The multi-photodetector circuit 100 can further include RF transmission link(s) 140 integrated into the output line 150 at each stage. For example, the anode terminals of the photodiodes 1301-130n can be connected to intermediate nodes 154 on the output line 150 and each RF transmission link 140 can connect a pair of adjacent intermediate nodes 154, respectively. Such RF transmission link(s) 140 provide stage-to-stage RF impedance matching within the multi-photodetector circuit 100.


In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 1301-130n to the optical signals 111 can trigger current flow through the photodiodes 1301-130n and output line 150. The amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, the photodiodes 1301-130n can generate an electrical output signal (Eout) (e.g., an output current (Iout) or an output voltage (Vout)) at the output node 155 in response to Oin.


Referring specifically to the embodiment shown in FIGS. 2A-2B, the multi-photodetector circuit 200 can include an output line 250 having an output node 255. The multi-photodetector circuit 200 can further include a power supply line 260 and, particularly, a positive power supply line electrically connected to a positive power supply voltage rail 299 (e.g., a +V rail, such as a VDD rail) for receiving a positive power supply voltage (e.g., a +V, such as VDD).


The multi-photodetector circuit 200 can further include multiple stages (S1-Sn), each including a corresponding photodiode 2301-230n. The photodiodes from an initial photodiode 2301 in an initial stage S1 to a last photodiode 230n in a last stage Sn can be electrically connected in parallel between the positive power supply line 260 and the output line 250. Specifically, each photodiode 2301-230n can have a cathode terminal connected to the positive power supply line 260 and an anode terminal connected to the output line 250, as illustrated.


At least two of the photodiodes 2301-230n in the multi-photodetector circuit 200 can be coupled to receive optical signals with progressively decreasing levels of power, while the last two photodiodes 230n-1 and 230n are coupled to receive optical signals at the same power level. Specifically, the multi-photodetector circuit 200 can include a series of multiple optical dividers. The number of optical dividers in the series can specifically be on less than the number of photodiodes. That is, if the multi-photodetector circuit 200 has n photodiodes, it will also include a series of n-1 optical dividers 2051-205n-1. Each optical divider 2051-205n-1 can be a 1:2 optical divider coupled to one input waveguide and two output waveguides and configured to equally divide a received optical signal and to output two equally divided optical signals. More specifically, in the series of optical dividers 2051-205n-1, the initial optical divider 2051 can be configured to receive an optical input signal (Oin) via an input waveguide 201, to divide Oin into two equal power optical signals (Od1), and to transmit the two equal power optical signals Od1 along waveguides 211a and 211b, respectively, toward the first photodiode 2301 and an adjacent downstream optical divider 2052. Each downstream optical divider can be configured to receive a previously equally divided optical signal from an adjacent upstream optical divider via one waveguide, to further divide that signal into two equal power optical signals, and to transmit the two equal power optical signals out two additional waveguides. Output waveguides from each optical divider, except for the last optical divider 205n-1 in the series, will extend toward a corresponding one of the photodiodes and to an adjacent downstream optical divider, respectively; whereas the output waveguides from the last optical divider 205n-1 in the series will extend toward the last two photodiodes 230n-1 and 230n, respectively.


For example, in the multi-photodetector circuit 200 of FIG. 2A, which includes four photodiodes 2301-2304 and three optical dividers 2051-2053, the initial optical divider 2051 can be configured to receive Oin via an input waveguide 201, to divide Oin into two equal power optical signals (Od1), and to transmit the two equal power optical signals Od1 along waveguides 211a and 211b, respectively, toward the first photodiode 2301 and the second optical divider 2052 in the series. The second optical divider 2052 can be configured to receive Od1 from the initial optical divider 2051 via waveguide 211b, to further divide that signal into two equal power optical signals (Od2) and to transmit the two equal power optical signals Od2 out along waveguides 212a and 212b to the photodiode 2302 and the third optical divider 2053. The third optical divider 2053 can be configured to receive Od2 from the second optical divider 2052 via waveguide 212b, to further divide that signal into two equal power optical signals (Od3) and to transmit the two equal power optical signals Od3 out along waveguides 213a and 213b to the third photodiode 2303 (the next-to-last photodiode) and the fourth photodiode 2304 (the last photodiode), respectively.


The multi-photodetector circuit 200 can further include RF transmission link(s) 240 integrated into the output line 250 at each stage. For example, the anode terminals of the photodiodes 2301-230n can be connected to intermediate nodes 254 on the output line 250 and each RF transmission link 240 can connect a pair of adjacent intermediate nodes 254, respectively. Such RF transmission link(s) 240 provide stage-to-stage RF impedance matching within the circuit 200.


In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 2301-230n to the optical signals output from the optical dividers 2051-205n-1 can trigger current flow through the photodiodes 2301-230n and output line 250. The amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, the photodiodes 2301-230n can generate an Eout (e.g., Iout or Vout) at the output node 155 in response to Oin.


In the multi-photodetector circuit 100 of FIGS. 1A-1B and the multi-photodetector circuit 200 of FIGS. 2A-2B, by employing some predetermined optimal number of photodiodes, the overall bandwidth of the multi-photodetector circuit as compared to a single photodetector can be significantly increased. The optimal number of photodiodes will very as a function of the technology node. Specifically, a single photodiode will have a known bandwidth (e.g., of less than 60 GHz). A multi-photodetector circuit with multiple instances of the same photodiode will have an overall bandwidth that is dependent upon the number of photodiodes. During design, the overall bandwidth increases with each added photodiode up to some optimal number of photodiodes. For example, an exemplary multi-photodetector circuit could be designed to include an optimal number of four photodiodes that result in an increase in the bandwidth by over two times, such as by 2.6 times or approximately 150GHs, as compared to the bandwidth of a single photodiode. It should be noted that after this optimal number of photodiodes is reached, the overall bandwidth will begin to decrease with each added photodiode. The optimal number can, for example, be readily determined through simulation.


Due to the orientation of the photodiodes 1301-130n, 2301-230n in the multi-photodetector circuits 100 of FIGS. 1A-1B and 200 of FIGS. 2A-2B, dark current (Idark) will flow in the same direction through the devices into the output line 150, 250. Those skilled in the art will recognize that Idark is the result of random process variations, and it is a relatively small amount of electric current that flows through such photosensitive devices, such as photodiodes, when they are not exposed to light. Idark is a leading source of jitter in optical receivers, as discussed in greater detail below with regard to the eye diagrams of FIGS. 5-7.


Referring specifically to the embodiment shown in FIGS. 3A-3B, the balanced multi-photodetector circuit 300 is configured to reduce or even eliminate the effects of Idark. For example, this balanced multi-photodetector circuit 300 can include an output line 350 having an output node 355. The balanced multi-photodetector circuit 300 can further include a first power supply line 361 and, particularly, a positive power supply line electrically connected to a positive power supply voltage rail 399 (e.g., a +V rail, such as a VDD rail) for receiving a positive power supply voltage (e.g., +V, such as VDD). The balanced multi-photodetector circuit 300 can further include a second power supply line 362 and, particularly, a negative power supply line electrically connected to a negative power supply voltage rail 398 (e.g., −V rail) for receiving a negative power supply voltage (e.g., −V). It should be noted that the positive and negative voltage levels on the positive and negative power supply voltage rails should have the same absolute value (e.g., if +V=VDD, then −V=−VDD).


The balanced multi-photodetector circuit 300 can further include multiple stages (S1-Sn), each including a corresponding photodiode, but with alternating stages connected to different voltage rails. More specifically, the balanced multi-photodetector circuit 300 can include a number n of photodiodes. In this embodiment, n is specifically an even number (e.g., 2, 4, etc.). The photodiodes can include equal numbers (n/2) of first photodiodes 3311-331n/2 and second photodiodes 3321-332n/2. The first photodiodes from an initial first photodiode 3311 to a last first photodiode 331n/2 can be electrically connected in parallel between the positive power supply line 361 and the output line 350. Specifically, each first photodiode 3311-331n/2 can have a cathode terminal connected to the positive power supply line 361 and an anode terminal connected to the output line 350, as illustrated. The second photodiodes, from an initial second photodiode 3321 to a last second photodiode 332n/2, can be electrically connected in parallel between the negative power supply line 362 and the output line 350. Specifically, each second photodiode 3321-332n/2 can have an anode terminal connected to the negative power supply line 362 and a cathode terminal connected to the output line 350, as illustrated.


The balanced multi-photodetector circuit 300 can further include a pair of optical dividers 305a and 305b. The first optical divider 305a can be a 1:n/2 optical divider coupled to one input waveguide 301a (i.e., a single waveguide) and n/2 output waveguides 3111-331n/2. This first optical divider 305a can be configured to receive an optical input signal (Oin) via the input waveguide 301a, to divide Oin into n/2 equal power optical signals (Oda), and to transmit the n/2 equal power optical signals along the n/2 output waveguides 3111-331n/2 toward the n/2 first photodiodes 3311-331n/2, respectively, such that the light absorbing layers of the n/2 first photodiodes 3311-331n/2 are exposed to optical signals at the same power level. Similarly, the second optical divider 305b can be a 1:n/2 optical divider coupled to one input waveguide 301b (i.e., a single input waveguide) and n/2 output waveguides 3121-312n/2. This second optical divider 305b can be configured to receive another optical input signal, which is inverted as compared to Oin, via the input waveguide 301b, to divide the inverted optical input signal into n/2 equal power optical signals (Odb), and to transmit the n/2 equal power optical signals along the n/2 output waveguides 3121-312n/2 toward the n/2 second photodiodes 3321-332n/2, respectively, such that the light absorbing layers of the n/2 second photodiodes 3321-332n/2 are similarly exposed to optical signals at the same power level. For example, in the embodiment shown in FIG. 3B, the optical divider 305b can be a 1:2 optical divider coupled to one input waveguide 301a (i.e., a single input waveguide) and two output waveguides 3111-3112. This 1:2 optical divider can be configured to receive Oin via the input waveguide 301a, to divide Oin into two optical signals Oda having half the power of Oin, and to transmit these two equal power optical signals along the two output waveguides 3111-3112 toward the first photodiodes 3311-3312, respectively. The optical divider 305b can similarly be a 1:2 optical divider coupled to a one input waveguide 301b (i.e., a single input waveguide) and two output waveguides 3121-3122. This 1:2 optical divider can be configured to receive the inverted optical input signal via the input waveguide 301b, to divide it into two optical signals Odb having half the power of the inverted optical input signal, and to transmit these two equal power optical signals along the two output waveguides 3121-3122 toward the first photodiodes 3311-3312, respectively.


The balanced multi-photodetector circuit 300 can further include RF transmission links 340 integrated into the output line 350 at each stage. For example, the anode terminals of the first photodiodes 3311-331n/2 can be connected to first intermediate nodes 354a on the output line 350. The cathode terminals of the second photodiodes 3321-332n/2 can be connected to second intermediate nodes 354b on the output line 350. The first and second intermediate nodes 354a-354b alternate along the output line 350 and each RF transmission link 340 can connect a pair of adjacent first and second intermediate nodes 354a-354b, respectively. Such RF transmission links 340 provide stage-to-stage RF impedance matching within the circuit 300.


In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 3301-330n to the optical signals from the first and second optical dividers 305a or 305b can trigger current flow through the first photodiodes 3311-331n/2, the second photodiodes 3321-332n/2, and output line 350. As discussed above with regard to the previous embodiments, the amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, Eout (e.g., an output current (Iout) or an output voltage (Vout)) will be generated at the output node 355 in response to Oin.


As in the multi-photodetector circuits 100 or 200 described above, in the balanced multi-photodetector circuit 300 of FIGS. 3A-3B by employing some predetermined optimal number of photodiodes, the overall bandwidth of the multi-photodetector circuit as compared to a single photodetector can be significantly increased. Again, the optimal number of photodiodes will very as a function of the technology node. Specifically, a single photodiode will have a known bandwidth (e.g., of less than 60 GHz). A balanced multi-photodetector circuit with multiple instances of the same photodetector will have an overall bandwidth that depends on the number of photodiodes. During design, the overall bandwidth can be increased with each pair of added photodiodes up to some optimal even number of photodiodes. For example, an exemplary balanced multi-photodetector circuit could be designed to include an optimal number of four photodiodes that result in an increase in the bandwidth by over two times, such as by 2.2 times or approximately 125GHs, as compared to the bandwidth of a single photodiode. It should be noted that after this optimal number of photodiodes is reached, the overall bandwidth will begin to decrease with each added photodiode. The optimal number can, for example, be readily determined through simulation.


Additionally, due to the opposite orientations of the first photodiodes 3311-331n/2 and second photodiodes 3321-332n/2, due to their connections to positive and negative power supply voltage rails, respectively, and further due to the fact that the optical signals received by the second photodiodes 3311-332n/2 are generated based on an inverted optical signal as compared to the optical signals received by the first photodiodes 3311-331n/2, Idark through each photodiode will be essentially the same but Idark through each first photodiode 3311-331n/2 will flow in one direction toward the output line 350, whereas Idark through each through each second photodiode 3321-332n/2 will flow the opposite direction away from the output line 350. As result of equal amounts of Idark flowing in opposite directions, all Idark is effectively cancelled out along the output line 350, thereby minimizing jitter that would otherwise result, as discussed in greater detail below with regard to the eye diagrams of FIGS. 5-7.


It should be noted that in each of the multi-photodetector circuits 100, 200, 300 illustrated in FIGS. 1A-1B, 2A-2B, and 3A-3B, respectively, the photodiodes 1301-130n, 2301-230n, 3311-331n/2 and 3321-332n/2 can all be manufacture according to a same design so as to be essentially identical in structure and, thereby have the same specifications (e.g., operate at same wavelengths, have same sensitivity, same junction capacitance, same leakage current, etc.). For example, such photodiodes can include a light absorbing layer of germanium (Ge), silicon germanium (SiGe), or some other suitable light absorbing material and they can be configured as a PN photodiode, a PIN photodiode, or avalanche photodiode. Such photodiodes are well known in the art and, thus, the details thereof have been omitted from this specification in order to allow the reader to focus on the salient aspects of the disclosed embodiments.


Additionally, in each of the multi-photodetector circuits 100, 200, 300 illustrated in FIGS. 1A-1B, 2A-2B, and 3A-3B, respectively, the optical divider(s) 105, 2051-205n-1, and 305a-305b can be any suitable optical divider (also referred to herein as an optical power splitter) configured to equally divide an incoming optical signal into some specific number of outgoing optical signals at equal power levels. For example, in some embodiments, the optical divider(s) can be multi-mode interferometer(s) (MMIs). As mentioned above, the number of outgoing signals from each optical divider is embodiment dependent. For example, in the multi-photodetector circuit 100 of FIGS. 1A-1B, the optical divider 105 should be configured to divide Oin into n different outgoing optical signals, where n is also equal to the number of photodiodes 1301-130n. In the multi-photodetector circuit 200 of FIGS. 2A-2B, each optical divider 2051-205n-1 is a 1:2 optical divider. In the balanced multi-photodetector circuit 300 of FIGS. 3A-3B, the optical divider 305a-305b should be configured to divide Oin into n/2 different outgoing optical signals, where n is equal to the number of photodiodes 3301-330n and where n/2 is the number of first photodiodes and the same number of second photodiodes. Examples of optical dividers that could be employed within each multi-photodetector circuit 100, 200, 300 can include, but are not limited to, multimode interferometer (MMI) based optical power splitters, evanescent coupling-based optical power splitters, or photonic crystal-based optical power splitters. These different types of optical power splitters are known in the art and, thus, the details thereof have been omitted from the specification in order to allow the reader to focus on the salient aspects of the disclosed embodiments.



FIG. 4 is a schematic diagram illustrating disclosed embodiments of an optical receiver front end 400 and an optical receiver 498 incorporating the optical receiver front end 400, The optical receiver front end 400 can include a transimpedance amplifier (TIA) 401 and, instead of a single photodetector, any one of the above-described multi-photodetector circuits 100 of FIGS. 1A-1B, 200 of FIGS. 2A-2B or 300 of FIGS. 3A-3B. Those skilled in the art will recognize that a TIA is a current-to-voltage converter. In this optical receiver front end 400, the TIA 401 can have a pair of inputs including a non-inverting input connected to ground and an inverting input connected to the output node 155, 255 or 355 of the multi-photodetector circuit 100, 200 or 300, respectively. The TIA 401 can further have an output 450 can be configured to amplify Iout from the multi-photodetector circuit 100, 200 or 300 and to convert it into an output voltage (Vout) generated at the output 450. The optical receiver front end 400 can be incorporated into an optical receiver 498. Various optical receiver stages (e.g., linear channel, data recovery, etc.) are well known in the art and are omitted from the specification and drawings in order to allow the reader to focus on the salient aspects of the disclosed embodiments. As further illustrated in FIG. 4, the optical receiver 498 can, optionally, be a monolithically integrated optical receiver. That is, the optical receiver 498 can be contained entirely on a single radio frequency integrated circuit (RFIC) chip 499.



FIG. 5 is illustrative of an eye diagram generated from the output signal of a single photodiode (e.g., connected to the non-inverting input of a TIA in an optical receiver). FIG. 6 is illustrative of an eye diagram generated from the output signal of an unbalanced multi-photodetector circuit, such as the multi-photodetector circuit 100 of FIGS. 1A-1B or the multi-photodetector circuit 200 of FIGS. 2A-2B (e.g., connected to the non-inverting input of a TIA in an optical receiver). FIG. 7 is illustrative of an eye diagram generated from the output signal of a balanced multi-photodetector circuit, such as the balanced multi-photodetector circuit 300 of FIGS. 3A-3B (e.g., connected to the non-inverting input of a TIA in an optical receiver). Those skilled in the art will recognize that an eye diagram refers to an oscilloscope display in which an output signal from device or circuit is repeatedly sampled and applied to the vertical input, while the data rate is used to trigger the horizontal sweep. In eye patterns, high SNR is indicated by a relatively closed eye shape and jitter is indicated by the rising and falling edges that are offset (i.e., not tightly aligned). Thus, as illustrated, the eye diagram of FIG. 5 indicates that in such use of a single photodetector leads to both a high SNR and high jitter. As illustrated in the eye diagram of FIG. 6, use of the multi-photodetector circuit 100 or 200 not only results in an increase in bandwidth (as discussed above) but also a reduction in SNR. Additionally, as illustrated in the eye diagram of FIG. 7, use of the balanced multi-photodetector circuit 300 not only results in an increase in bandwidth (as discussed above) but also a reduction in both SNR and jitter (which is due to the balancing out of Idark).


It should be understood that in the structures and method described above, a semiconductor material refers to a material whose conducting properties can be altered by doping with an impurity. Such semiconductor materials include, for example, silicon-based semiconductor materials (e.g., silicon, silicon germanium, silicon germanium carbide, silicon carbide, etc.) and III-V compound semiconductors (i.e., compounds obtained by combining group III elements, such as aluminum (Al), gallium (Ga), or indium (In), with group V elements, such as nitrogen (N), phosphorous (P), arsenic (As) or antimony (Sb)) (e.g., GaN, InP, GaAs, or GaP). A pure semiconductor material and, more particularly, a semiconductor material that is not doped with an impurity for the purposes of increasing conductivity (i.e., an undoped semiconductor material) is referred to in the art as an intrinsic semiconductor. A semiconductor material that is doped with an impurity for the purposes of increasing conductivity (i.e., a doped semiconductor material) is referred to in the art as an extrinsic semiconductor and will be more conductive than an intrinsic semiconductor made of the same base material. That is, extrinsic silicon will be more conductive than intrinsic silicon; extrinsic silicon germanium will be more conductive than intrinsic silicon germanium; and so on. Furthermore, it should be understood that different impurities (i.e., different dopants) can be used to achieve different conductivity types (e.g., P-type conductivity and N-type conductivity) and that the dopants may vary depending upon the different semiconductor materials used. For example, a silicon-based semiconductor material (e.g., silicon, silicon germanium, etc.) is typically doped with a Group III dopant, such as boron (B) or indium (In), to achieve P-type conductivity, whereas a silicon-based semiconductor material is typically doped a Group V dopant, such as arsenic (As), phosphorous (P) or antimony (Sb), to achieve N-type conductivity. A gallium nitride (GaN)-based semiconductor material is typically doped with magnesium (Mg) to achieve P-type conductivity and with silicon (Si) or oxygen to achieve N-type conductivity. Those skilled in the art will also recognize that different conductivity levels will depend upon the relative concentration levels of the dopant(s) in a given semiconductor region. Furthermore, when a semiconductor region or layer is described as being at a higher conductivity level than another semiconductor region or layer, it is more conductive (less resistive) than the other semiconductor region or layer; whereas, when a semiconductor region or layer is described as being at a lower conductivity level than another semiconductor region or layer, it is less conductive (more resistive) than that other semiconductor region or layer.


It should be understood that the terminology used herein is for the purpose of describing the disclosed structures and methods and is not intended to be limiting. For example, as used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Additionally, as used herein, the terms “comprises,” “comprising,” “includes” and/or “including” specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, as used herein, terms such as “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” “upper,” “lower,” “under,” “below,” “underlying,” “over,” “overlying,” “parallel,” “perpendicular,” etc., are intended to describe relative locations as they are oriented and illustrated in the drawings (unless otherwise indicated) and terms such as “touching,” “in direct contact,” “abutting,” “directly adjacent to,” “immediately adjacent to,” etc., are intended to indicate that at least one element physically contacts another element (without other elements separating the described elements). The term “laterally” is used herein to describe the relative locations of elements and, more particularly, to indicate that an element is positioned to the side of another element as opposed to above or below the other element, as those elements are oriented and illustrated in the drawings. For example, an element that is positioned laterally adjacent to another element will be beside the other element, an element that is positioned laterally immediately adjacent to another element will be directly beside the other element, and an element that laterally surrounds another element will be adjacent to and border the outer sidewalls of the other element. The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed.


The descriptions of the various disclosed embodiments have been presented for purposes of illustration but are not intended to be exhaustive or limiting. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosed embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.

Claims
  • 1. A circuit comprising: an output line having an output node;a power supply line; andphotodiodes electrically connected in parallel between the power supply line and the output line, wherein the photodiodes generate an electrical output signal at the output node in response to an optical input signal.
  • 2. The circuit of claim 1, wherein the power supply line is connected to receive a positive power supply voltage,wherein the photodiodes have cathode terminals connected to the power supply line and anode terminals connected to intermediate nodes, respectively, on the output line, andwherein the circuit further includes: an optical divider coupled to receive the optical input signal and to output equally divided optical signals to the photodiodes, respectively; andat least one transmission link in the output line, wherein each transmission link is connected between two adjacent intermediate nodes.
  • 3. The circuit of claim 1, wherein the photodiodes have a same design.
  • 4. The circuit of claim 1, wherein the photodiodes include at least an initial photodiode, a next-to-last photodiode, and a last photodiode, andwherein the circuit further includes a series of optical dividers including at least an initial optical divider and a last optical divider, wherein a number of the optical dividers in the series is one less than a number of the photodiodes.
  • 5. The circuit of claim 4, wherein the initial optical divider is coupled to receive the optical input signal and to output two initial equally divided optical signals to the initial photodiode and to an adjacent downstream optical divider in the series,wherein each downstream optical divider in the series is coupled to receive a divided optical signal from an adjacent upstream optical divider in the series and to output two further equally divided output signals, andwherein the last optical divider in the series outputs two final equally divided optical signals to the next-to-last photodiode and the last photodiode, respectively.
  • 6. The circuit of claim 4, wherein the power supply line is connected to receive a positive power supply voltage,wherein the photodiodes have cathode terminals connected to the power supply line and anode terminals connected to intermediate nodes, respectively, on the output line, andwherein the circuit further includes transmission links in the output line connected between each pair of adjacent intermediate nodes.
  • 7. The circuit of claim 4, wherein the photodiodes include at least four photodiodes.
  • 8. The circuit of claim 4, wherein the optical dividers include multi-mode interferometers.
  • 9. A circuit comprising: an output line having an output node;a first power supply line;a second power supply line;multiple photodiodes including: first photodiodes electrically connected in parallel between the first power supply line and the output line; andsecond photodiodes electrically connected in parallel between the second power supply line and the output line,wherein the multiple photodiodes generate an electrical output signal at the output node in response to an optical input signal.
  • 10. The circuit of claim 9, wherein the multiple photodiodes include equal numbers of the first photodiodes and the second photodiodes.
  • 11. The circuit of claim 9, wherein the multiple photodiodes include two first photodiodes and two second photodiodes.
  • 12. The circuit of claim 9, wherein the multiple photodiodes have a same design.
  • 13. The circuit of claim 9, wherein the first power supply line is connected to receive a positive power supply voltage,wherein the first photodiodes have first cathode terminals connected to the first power supply line and first anode terminals connected to first intermediate nodes, respectively, on the output line, andwherein the circuit further includes a first optical divider coupled to receive the optical input signal and to output equally divided first optical signals to the first photodiodes, respectively.
  • 14. The circuit of claim 13, wherein the second power supply line is connected to receive a negative power supply voltage,wherein the second photodiodes have second anode terminals connected to the second power supply line and second cathode terminals connected to second intermediate nodes, respectively, on the output line, andwherein the circuit further includes a second optical divider coupled to receive a second optical input signal that is inverted as compared to the optical input signal and to output equally divided second optical signals to the second photodiodes, respectively.
  • 15. The circuit of claim 14, wherein the first intermediate nodes and the second intermediate nodes alternate across the output line, andwherein the circuit further includes transmission links in the output line, wherein each transmission link is connected between adjacent first and second intermediate nodes.
  • 16. The circuit of claim 14, wherein the first optical divider and the second optical divider include multi-mode interferometers.
  • 17. An optical receiver comprising: a transimpedance amplifier; anda multi-photodetector circuit including at least one power supply line, an output line, and at least two photodiodes electrically connected in parallel between the power supply line and the output line,wherein the output line has an output node connected to the transimpedance amplifier.
  • 18. The optical receiver of claim 17, wherein the power supply line is a positive power supply line, all the photodiodes have cathode terminals connected to the positive power supply line and anode terminals connected to the output line.
  • 19. The optical receiver of claim 17, wherein the multi-photodetector circuit includes: two power supply lines including a positive power supply line and a negative power supply line;first photodiodes electrically connected in parallel between the positive power supply line and the output line; andsecond photodiodes electrically connected in parallel between the negative power supply line and the output line.
  • 20. The optical receiver of claim 17, wherein the optical receiver is a monolithically integrated optical receiver on a radio frequency integrated circuit chip.