The present disclosure relates to optical receivers and, particularly, to embodiments of a photodetector circuit and an optical receiver incorporating a photodetector circuit.
An optical receiver front end typically includes, among other components, a photodetector and a transimpedance amplifier (TIA), where an output of the photodetector is an input to the TIA. Thus, the bandwidth of the optical receiver depends on the bandwidths of both the photodetector and the TIA. Circuit modifications can be employed to improve the TIA bandwidth. Unfortunately, the photodetector bandwidth is limited by various technology parameters such as intrinsic width, diffusion constant, recombination time, etc. As a result, the overall bandwidth of an optical receiver is effectively limited by the photodetector bandwidth. Furthermore, during photodetector design, there is typically a trade-off between bandwidth improvement and performance. For example, an increase in the gain-bandwidth product of a photodetector can lead to increased delay.
Disclosed herein are embodiments of a photodetector circuit. In each of the embodiments, the photodetector circuit can include an output line having an output node, a power supply line, and multiple photodiodes electrically connected in parallel between the power supply line and the output line. The photodiodes can generate an electrical output signal at the output node in response to an optical input signal.
In some embodiments, the photodetector circuit can include an output line having an output node and two power supply lines (i.e., a first power supply line and a second power supply line). In these embodiments, the photodetector circuit can include multiple photodiodes. The photodiodes can include both first photodiodes, which are electrically connected in parallel between the first power supply line and the output line, and second photodiodes, which are electrically connected in parallel between the second power supply line and the output line. Again, the photodiodes (in this case including the first and second photodiodes) generate an electrical output signal at the output node in response to an optical input signal.
Also disclosed herein are embodiments of an optical receiver that incorporates any of the disclosed multi-photodetector circuit embodiments. For example, the optical receiver can include a transimpedance amplifier and a multi-photodetector circuit. The multi-photodetector circuit can further include a power supply line, an output line with an output node connected to the transimpedance amplifier, and at least two photodiodes electrically connected in parallel between the power supply line and the output line.
The present disclosure will be better understood from the following detailed description with reference to the drawings, which are not necessarily drawn to scale and in which:
As mentioned above, the overall bandwidth of an optical receiver is effectively limited by the photodetector bandwidth. Furthermore, during photodetector design, there is typically a trade-off between bandwidth improvement and performance. For example, an increase in the gain-bandwidth product of a photodetector can lead to increased delay.
Disclosed herein are embodiments of a multi-photodetector circuit (also referred to herein as a multi-photodiode circuit) configured to improve bandwidth and to improve performance (e.g., improve signal-to-noise ratio (SNR) and, in some embodiments, also reduce dark current (Idark) and, thereby jitter). In each of the embodiments, the multi-photodetector circuit can include multiple photodiodes connected in parallel to an output line. In some embodiments, all of the photodiodes can be connected, in a same direction, between a positive power supply line and the output line. All photodiodes can receive optical signals at the same power level (e.g., from an optical divider that receives an optical input signal and outputs equally divided optical signals to each photodiode). Alternatively, a series of 1:2 optical dividers can be employed so each photodiode receives a progressively lower power signal until the last two photodiodes, which receive optical signals at the same power level from the same optical divider. In other embodiments, the multi-photodetector circuit can include first photodiodes connected in a first direction between a positive power supply line and an output line and second photodiodes connected in a second direction between a negative power supply line and the output line. In these embodiments, the first photodiodes can receive equally divided optical signals from an optical divider in response to an optical input signal and the second photodiodes can similarly receive equally divided optical signals from another optical divider in response to an inverted version of the same optical input signal. In all of these embodiments, the bandwidth is increased as compared to a single photodiode and SNR is improved. Additionally, due to the balanced configuration of the latter embodiments of the multi-photodetector circuit, Idark is reduced and, thus, jitter is also reduced. Also disclosed herein are embodiments of optical receivers incorporating such multi-photodetector circuits. Such an optical receiver can, for example, be monolithically integrated (i.e., contained entirely on a single radio frequency integrated circuit (RFIC) chip).
Referring specifically to the embodiment shown in
The multi-photodetector circuit 100 can further include multiple stages (S1-Sn), each including a corresponding photodiode 1301-130n. The photodiodes from an initial photodiode 1301 in an initial stage S1 to a last photodiode 130n in a last stage Sn can be electrically connected in parallel between the positive power supply line 160 and the output line 150. Specifically, each photodiode 1301-130n can have a cathode terminal connected to the positive power supply line 160 and an anode terminal connected to the output line 150, as illustrated.
The multi-photodetector circuit 100 can further include an optical divider 105. The optical divider 105 can be a 1:n optical divider coupled to one input waveguide 101 (i.e., a single waveguide) and n output waveguides 1111-111n. This optical divider 105 can be configured to receive an optical input signal (Oin) via the input waveguide 101, to divide Oin into n equal power optical signals (Od), and to transmit the n equal power optical signals along the n output waveguides 1111-111n toward the n photodiodes 1301-130n, respectively, such that the light absorbing layers of the n photodiodes 1301-130n are exposed to optical signals at the same power level. For example, in the embodiment shown in
The multi-photodetector circuit 100 can further include RF transmission link(s) 140 integrated into the output line 150 at each stage. For example, the anode terminals of the photodiodes 1301-130n can be connected to intermediate nodes 154 on the output line 150 and each RF transmission link 140 can connect a pair of adjacent intermediate nodes 154, respectively. Such RF transmission link(s) 140 provide stage-to-stage RF impedance matching within the multi-photodetector circuit 100.
In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 1301-130n to the optical signals 111 can trigger current flow through the photodiodes 1301-130n and output line 150. The amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, the photodiodes 1301-130n can generate an electrical output signal (Eout) (e.g., an output current (Iout) or an output voltage (Vout)) at the output node 155 in response to Oin.
Referring specifically to the embodiment shown in
The multi-photodetector circuit 200 can further include multiple stages (S1-Sn), each including a corresponding photodiode 2301-230n. The photodiodes from an initial photodiode 2301 in an initial stage S1 to a last photodiode 230n in a last stage Sn can be electrically connected in parallel between the positive power supply line 260 and the output line 250. Specifically, each photodiode 2301-230n can have a cathode terminal connected to the positive power supply line 260 and an anode terminal connected to the output line 250, as illustrated.
At least two of the photodiodes 2301-230n in the multi-photodetector circuit 200 can be coupled to receive optical signals with progressively decreasing levels of power, while the last two photodiodes 230n-1 and 230n are coupled to receive optical signals at the same power level. Specifically, the multi-photodetector circuit 200 can include a series of multiple optical dividers. The number of optical dividers in the series can specifically be on less than the number of photodiodes. That is, if the multi-photodetector circuit 200 has n photodiodes, it will also include a series of n-1 optical dividers 2051-205n-1. Each optical divider 2051-205n-1 can be a 1:2 optical divider coupled to one input waveguide and two output waveguides and configured to equally divide a received optical signal and to output two equally divided optical signals. More specifically, in the series of optical dividers 2051-205n-1, the initial optical divider 2051 can be configured to receive an optical input signal (Oin) via an input waveguide 201, to divide Oin into two equal power optical signals (Od1), and to transmit the two equal power optical signals Od1 along waveguides 211a and 211b, respectively, toward the first photodiode 2301 and an adjacent downstream optical divider 2052. Each downstream optical divider can be configured to receive a previously equally divided optical signal from an adjacent upstream optical divider via one waveguide, to further divide that signal into two equal power optical signals, and to transmit the two equal power optical signals out two additional waveguides. Output waveguides from each optical divider, except for the last optical divider 205n-1 in the series, will extend toward a corresponding one of the photodiodes and to an adjacent downstream optical divider, respectively; whereas the output waveguides from the last optical divider 205n-1 in the series will extend toward the last two photodiodes 230n-1 and 230n, respectively.
For example, in the multi-photodetector circuit 200 of
The multi-photodetector circuit 200 can further include RF transmission link(s) 240 integrated into the output line 250 at each stage. For example, the anode terminals of the photodiodes 2301-230n can be connected to intermediate nodes 254 on the output line 250 and each RF transmission link 240 can connect a pair of adjacent intermediate nodes 254, respectively. Such RF transmission link(s) 240 provide stage-to-stage RF impedance matching within the circuit 200.
In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 2301-230n to the optical signals output from the optical dividers 2051-205n-1 can trigger current flow through the photodiodes 2301-230n and output line 250. The amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, the photodiodes 2301-230n can generate an Eout (e.g., Iout or Vout) at the output node 155 in response to Oin.
In the multi-photodetector circuit 100 of
Due to the orientation of the photodiodes 1301-130n, 2301-230n in the multi-photodetector circuits 100 of
Referring specifically to the embodiment shown in
The balanced multi-photodetector circuit 300 can further include multiple stages (S1-Sn), each including a corresponding photodiode, but with alternating stages connected to different voltage rails. More specifically, the balanced multi-photodetector circuit 300 can include a number n of photodiodes. In this embodiment, n is specifically an even number (e.g., 2, 4, etc.). The photodiodes can include equal numbers (n/2) of first photodiodes 3311-331n/2 and second photodiodes 3321-332n/2. The first photodiodes from an initial first photodiode 3311 to a last first photodiode 331n/2 can be electrically connected in parallel between the positive power supply line 361 and the output line 350. Specifically, each first photodiode 3311-331n/2 can have a cathode terminal connected to the positive power supply line 361 and an anode terminal connected to the output line 350, as illustrated. The second photodiodes, from an initial second photodiode 3321 to a last second photodiode 332n/2, can be electrically connected in parallel between the negative power supply line 362 and the output line 350. Specifically, each second photodiode 3321-332n/2 can have an anode terminal connected to the negative power supply line 362 and a cathode terminal connected to the output line 350, as illustrated.
The balanced multi-photodetector circuit 300 can further include a pair of optical dividers 305a and 305b. The first optical divider 305a can be a 1:n/2 optical divider coupled to one input waveguide 301a (i.e., a single waveguide) and n/2 output waveguides 3111-331n/2. This first optical divider 305a can be configured to receive an optical input signal (Oin) via the input waveguide 301a, to divide Oin into n/2 equal power optical signals (Oda), and to transmit the n/2 equal power optical signals along the n/2 output waveguides 3111-331n/2 toward the n/2 first photodiodes 3311-331n/2, respectively, such that the light absorbing layers of the n/2 first photodiodes 3311-331n/2 are exposed to optical signals at the same power level. Similarly, the second optical divider 305b can be a 1:n/2 optical divider coupled to one input waveguide 301b (i.e., a single input waveguide) and n/2 output waveguides 3121-312n/2. This second optical divider 305b can be configured to receive another optical input signal, which is inverted as compared to Oin, via the input waveguide 301b, to divide the inverted optical input signal into n/2 equal power optical signals (Odb), and to transmit the n/2 equal power optical signals along the n/2 output waveguides 3121-312n/2 toward the n/2 second photodiodes 3321-332n/2, respectively, such that the light absorbing layers of the n/2 second photodiodes 3321-332n/2 are similarly exposed to optical signals at the same power level. For example, in the embodiment shown in
The balanced multi-photodetector circuit 300 can further include RF transmission links 340 integrated into the output line 350 at each stage. For example, the anode terminals of the first photodiodes 3311-331n/2 can be connected to first intermediate nodes 354a on the output line 350. The cathode terminals of the second photodiodes 3321-332n/2 can be connected to second intermediate nodes 354b on the output line 350. The first and second intermediate nodes 354a-354b alternate along the output line 350 and each RF transmission link 340 can connect a pair of adjacent first and second intermediate nodes 354a-354b, respectively. Such RF transmission links 340 provide stage-to-stage RF impedance matching within the circuit 300.
In any case, in these embodiments, exposure of the light absorbing layers of the photodiodes 3301-330n to the optical signals from the first and second optical dividers 305a or 305b can trigger current flow through the first photodiodes 3311-331n/2, the second photodiodes 3321-332n/2, and output line 350. As discussed above with regard to the previous embodiments, the amount of current flow through each photodiode will be proportional to the intensity of the sensed optical signal. Thus, in operation, Eout (e.g., an output current (Iout) or an output voltage (Vout)) will be generated at the output node 355 in response to Oin.
As in the multi-photodetector circuits 100 or 200 described above, in the balanced multi-photodetector circuit 300 of
Additionally, due to the opposite orientations of the first photodiodes 3311-331n/2 and second photodiodes 3321-332n/2, due to their connections to positive and negative power supply voltage rails, respectively, and further due to the fact that the optical signals received by the second photodiodes 3311-332n/2 are generated based on an inverted optical signal as compared to the optical signals received by the first photodiodes 3311-331n/2, Idark through each photodiode will be essentially the same but Idark through each first photodiode 3311-331n/2 will flow in one direction toward the output line 350, whereas Idark through each through each second photodiode 3321-332n/2 will flow the opposite direction away from the output line 350. As result of equal amounts of Idark flowing in opposite directions, all Idark is effectively cancelled out along the output line 350, thereby minimizing jitter that would otherwise result, as discussed in greater detail below with regard to the eye diagrams of
It should be noted that in each of the multi-photodetector circuits 100, 200, 300 illustrated in
Additionally, in each of the multi-photodetector circuits 100, 200, 300 illustrated in
It should be understood that in the structures and method described above, a semiconductor material refers to a material whose conducting properties can be altered by doping with an impurity. Such semiconductor materials include, for example, silicon-based semiconductor materials (e.g., silicon, silicon germanium, silicon germanium carbide, silicon carbide, etc.) and III-V compound semiconductors (i.e., compounds obtained by combining group III elements, such as aluminum (Al), gallium (Ga), or indium (In), with group V elements, such as nitrogen (N), phosphorous (P), arsenic (As) or antimony (Sb)) (e.g., GaN, InP, GaAs, or GaP). A pure semiconductor material and, more particularly, a semiconductor material that is not doped with an impurity for the purposes of increasing conductivity (i.e., an undoped semiconductor material) is referred to in the art as an intrinsic semiconductor. A semiconductor material that is doped with an impurity for the purposes of increasing conductivity (i.e., a doped semiconductor material) is referred to in the art as an extrinsic semiconductor and will be more conductive than an intrinsic semiconductor made of the same base material. That is, extrinsic silicon will be more conductive than intrinsic silicon; extrinsic silicon germanium will be more conductive than intrinsic silicon germanium; and so on. Furthermore, it should be understood that different impurities (i.e., different dopants) can be used to achieve different conductivity types (e.g., P-type conductivity and N-type conductivity) and that the dopants may vary depending upon the different semiconductor materials used. For example, a silicon-based semiconductor material (e.g., silicon, silicon germanium, etc.) is typically doped with a Group III dopant, such as boron (B) or indium (In), to achieve P-type conductivity, whereas a silicon-based semiconductor material is typically doped a Group V dopant, such as arsenic (As), phosphorous (P) or antimony (Sb), to achieve N-type conductivity. A gallium nitride (GaN)-based semiconductor material is typically doped with magnesium (Mg) to achieve P-type conductivity and with silicon (Si) or oxygen to achieve N-type conductivity. Those skilled in the art will also recognize that different conductivity levels will depend upon the relative concentration levels of the dopant(s) in a given semiconductor region. Furthermore, when a semiconductor region or layer is described as being at a higher conductivity level than another semiconductor region or layer, it is more conductive (less resistive) than the other semiconductor region or layer; whereas, when a semiconductor region or layer is described as being at a lower conductivity level than another semiconductor region or layer, it is less conductive (more resistive) than that other semiconductor region or layer.
It should be understood that the terminology used herein is for the purpose of describing the disclosed structures and methods and is not intended to be limiting. For example, as used herein, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Additionally, as used herein, the terms “comprises,” “comprising,” “includes” and/or “including” specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Furthermore, as used herein, terms such as “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” “upper,” “lower,” “under,” “below,” “underlying,” “over,” “overlying,” “parallel,” “perpendicular,” etc., are intended to describe relative locations as they are oriented and illustrated in the drawings (unless otherwise indicated) and terms such as “touching,” “in direct contact,” “abutting,” “directly adjacent to,” “immediately adjacent to,” etc., are intended to indicate that at least one element physically contacts another element (without other elements separating the described elements). The term “laterally” is used herein to describe the relative locations of elements and, more particularly, to indicate that an element is positioned to the side of another element as opposed to above or below the other element, as those elements are oriented and illustrated in the drawings. For example, an element that is positioned laterally adjacent to another element will be beside the other element, an element that is positioned laterally immediately adjacent to another element will be directly beside the other element, and an element that laterally surrounds another element will be adjacent to and border the outer sidewalls of the other element. The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed.
The descriptions of the various disclosed embodiments have been presented for purposes of illustration but are not intended to be exhaustive or limiting. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the disclosed embodiments. The terminology used herein was chosen to best explain the principles of the embodiments, the practical application or technical improvement over technologies found in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.