Cross-reference is hereby made to the following commonly assigned related U.S. Applications: application Ser. No. 10/646,545 to Douglas Hine et al., filed concurrently herewith, entitled MULTI-POLAR ELECTRICAL MEDICAL LEAD CONNECTOR SYSTEM.
Embodiments of the present invention relate to implantable medical device connectors and more particularly to a connection system adapted to allow selection of one or more electrodes from a plurality of electrodes included on a medical electrical lead for permanent connection with the medical device.
Implantable medical electrical stimulation and/or sensing leads are well known in the fields of cardiac stimulation and monitoring, including cardiac pacing and cardioversion/defibrillation, and in other fields of electrical stimulation or monitoring of electrical signals or other physiologic parameters. In the field of cardiac stimulation and monitoring, endocardial leads are placed through a transvenous route to locate one or more stimulation and/or sense electrodes, along or at the distal end of the lead body, in a desired location within a chamber of the heart or within a blood vessel of the heart. Epicardial leads are routed from a subcutaneous site to dispose one or more stimulation and/or sense electrodes, along or at the distal end of the lead body, at an epicardial site on the heart. A pacemaker implantable pulse generator (IPG) or implantable cardioverter/defibrillator (ICD) or monitor, referred to herein generically as an implantable medical device (IMD) is coupled to the heart through one or more of such endocardial or epicardial leads forming medical system. Means for implanting such cardiac leads are known to those skilled in the art of pacing and defibrillation therapy.
Proximal ends of such cardiac leads typically are formed with a lead connector assembly that is inserted into a connector bore of a connector block of the IPG or monitor. The lead body extending distally from the connector assembly typically includes one or more insulated conductors surrounded by an outer insulative sheath. Each conductor couples a lead connector contact of the lead connector assembly with a distal stimulation and/or sense electrode.
More recently, medical electrical leads have been constructed with an array of pacing and/or sensing electrodes from which one or more electrodes may be selected to optimize electrical stimulation therapy and/or monitoring. One example of such a lead is a coronary vein lead implanted to stimulate a left atrium or left ventricle; other examples include a right atrial or ventricular lead implanted to stimulate an endocardial portion of the right atrium or ventricle or leads implanted to stimulate directly a portion of the cardiac conduction system. A connection system for these types of leads needs to be adapted for the selection of one or more electrodes included in the array.
Embodiments of the present invention will be more readily understood from the following detailed description when considered in conjunction with the drawings, in which like reference numerals indicate identical structures throughout the several views, and wherein:
In the following detailed description, references are made to illustrative embodiments of the invention. The embodiments are described in the context of a pacing system incorporated in an implantable pacemaker or ICD comprising an ICD or pacemaker IPG (herein collectively referred to as an IMD) and at least one cardiac lead. It will be understood that more than one cardiac lead can be coupled to the IMD connector and extend to the heart in a manner well known in the art. It will be understood that the present invention can be incorporated into other medical electrical leads coupled to other IMD's through adaptors incorporating the principles of the present invention for delivering electrical stimulation elsewhere in the body. It is therefore understood that other embodiments can be utilized without departing from the scope of the invention.
Moreover, adaptors according to the present invention, when assembled with a lead connector may conform to an industry standard for IMD lead connectors; however, it is not necessary to the practice of the invention that the assembly conform to an existing industry standard. Moreover, the degree to which an adaptor of the present invention “up-sizes” the lead connector can range from a negligible up-sizing to a significant up-sizing without departing from the practice of the invention.
As further illustrated in
According to one embodiment, inwardly extending key 82 is resilient and formed like a force beam, which “gives” in the outward direction when force is applied by insertion of connector 40. The inwardly extending key 82 can be elongated axially, as shown, ball-shaped like a detent ball, or elongated circumferentially, a form dictated only by that of mating surfaces of connector pads formed on a lead connector, for example pads 34, 36, 38, in order to facilitate stable electrical contact between key 83 and connector pads. Furthermore, a mechanical interlock between key 83 and the selected pad of pads 34, 36, 38 may be formed, for example with surface depressions 64, 66, 68, which may create either a permanent or reversible junction between adaptor 20 and connector 40 when connector 40 is fully engaged within lumen 80 of adaptor 20.
Although the above-described embodiments depict the key 82 extending inwardly from the adaptor connector ring for engagement within of the depressions 64, 66, and 68, it will be understood that the relative configuration can be reversed as illustrated in
It should be understood that, while specific embodiments have been presented in the foregoing detailed description of the invention, a vast number of variations exist. It should also be appreciated that the exemplary embodiments are only examples, and are not intended to limit the scope, applicability, or configuration of the invention in any way. For example, four connector pads can be disposed circumferentially around the lead body circumferentially spaced at about 90° from one another; six arcuate connector pads can be disposed circumferentially around the lead body circumferentially spaced at about 60° from one another, etc.
Moreover, it will be understood that the IMD connector bore can be configured to accept a tripolar lead as disclosed in the above-referenced '042 patent. In that instance, electrical medical lead 30 may have first and second connector pad arrays positioned along and each extending circumferentially around connector 40. A bipolar adaptor would include first and second spaced apart adaptor connector rings adapted to make contact with selected ones of the connector pads of the respective first and second connector pad arrays. Still further, it will be understood that further adaptors may be devised that select more than one of the distal electrodes coupled to the lead connector pads.
It will be understood that certain of the above-described structures, functions and operations of the above-described embodiments are not necessary to practice the present invention and are included in the description simply for completeness of an exemplary embodiment or embodiments.
In addition, it will be understood that specifically described structures, functions and operations set forth in the above-referenced patents can be practiced in conjunction with the present invention, but they are not essential to its practice.
It is therefore to be understood, that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described without actually departing from the spirit and scope of the present invention.
This is a continuation of patent application Ser. No. 10/646,899, filed Aug. 21, 2003, pending, which is incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
4142532 | Ware | Mar 1979 | A |
4182345 | Grose | Jan 1980 | A |
4469104 | Peers-Trevarton | Sep 1984 | A |
4583543 | Peers-Trevarton | Apr 1986 | A |
4628934 | Pohndorf et al. | Dec 1986 | A |
5000177 | Hoffmann et al. | Mar 1991 | A |
5007864 | Stutz, Jr. | Apr 1991 | A |
5050602 | Osypka | Sep 1991 | A |
5060649 | Hocherl et al. | Oct 1991 | A |
5070605 | Daglow et al. | Dec 1991 | A |
5174288 | Bardy et al. | Dec 1992 | A |
5235978 | Hirschberg et al. | Aug 1993 | A |
5325584 | Jasch | Jul 1994 | A |
5328442 | Levine | Jul 1994 | A |
5341812 | Allaire et al. | Aug 1994 | A |
5374279 | Duffin, Jr. et al. | Dec 1994 | A |
5423873 | Neubauer et al. | Jun 1995 | A |
5613858 | Estes et al. | Mar 1997 | A |
5679026 | Fain et al. | Oct 1997 | A |
5766042 | Ries et al. | Jun 1998 | A |
5843141 | Bischoff et al. | Dec 1998 | A |
6044302 | Persuitti et al. | Mar 2000 | A |
6295475 | Morgan | Sep 2001 | B1 |
6705900 | Sommer et al. | Mar 2004 | B2 |
6755694 | Ries et al. | Jun 2004 | B2 |
6854994 | Stein et al. | Feb 2005 | B2 |
6921295 | Sommer et al. | Jul 2005 | B2 |
8019420 | Hine et al. | Sep 2011 | B2 |
8065008 | Sommer et al. | Nov 2011 | B2 |
20020115343 | Sommer et al. | Aug 2002 | A1 |
20030050549 | Sochor | Mar 2003 | A1 |
20030073348 | Ries et al. | Apr 2003 | A1 |
20030077943 | Osypka | Apr 2003 | A1 |
20040260355 | Holleman et al. | Dec 2004 | A1 |
20050033371 | Sommer et al. | Feb 2005 | A1 |
20050043770 | Hine et al. | Feb 2005 | A1 |
20050043771 | Sommer et al. | Feb 2005 | A1 |
Entry |
---|
U.S. Appl. No. 13/230,604, filed Sep. 12, 2011, Hine et al. |
Number | Date | Country | |
---|---|---|---|
20120130466 A1 | May 2012 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10646899 | Aug 2003 | US |
Child | 13301587 | US |