Patent Grant
11799185
Motor vehicles typically contain a number of parts made of metal because metal provides various advantages such as strength and durability. Motor vehicles also include electronic components that generate heat when in operation. It is desirable to dissipate the generated heat because heat can be detrimental to electronic components. Conventional solutions for heat dissipation include the use of metal heat sinks and heat radiating fins. Metal heat sinks and heat radiating fins may be inadequate to cool some types of electronic components, thereby necessitating the use of more expensive liquid-based cooling structures. It is therefore desirable to replace or supplement metal heat sinks, heat radiating fins, and liquid-based cooling structures in vehicles with alternative elements that may offer various advantages.
A detailed description is set forth below with reference to the accompanying drawings. The use of the same reference numerals may indicate similar or identical items. Various embodiments may utilize elements and/or components other than those illustrated in the drawings, and some elements and/or components may not be present in various embodiments. Elements and/or components in the figures are not necessarily drawn to scale. Throughout this disclosure, depending on the context, singular and plural terminology may be used interchangeably.
Overview
In terms of a general overview, embodiments described in this disclosure are generally directed to a metal foam element configured to provide a multi-purpose functionality to an electrical device in a vehicle. An example apparatus in a vehicle includes a module that houses an electrical device. A metal foam element is attached to the module in a configuration whereby the metal foam element provides a multi-purpose functionality that includes a heat dissipation functionality and an antenna functionality. In an example implementation, the metal foam element is attached to the module in the form of a sheet that is dimensioned to operate as a patch antenna for transmitting and/or receiving a wireless signal associated with the electrical device and to provide a heat dissipation functionality for dissipating heat produced by the electrical device.
The disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which example embodiments of the disclosure are shown. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the example embodiments set forth herein. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made to various embodiments without departing from the spirit and scope of the present disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described example embodiments but should be defined only in accordance with the following claims and their equivalents. The description below has been presented for the purposes of illustration and is not intended to be exhaustive or to be limited to the precise form disclosed. It should be understood that alternate implementations may be used in any combination desired to form additional hybrid implementations of the present disclosure. For example, any of the functionality described with respect to a particular device or component may be performed by another device or component. Furthermore, while specific device characteristics have been described, embodiments of the disclosure may relate to numerous other device characteristics. Further, although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the disclosure is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the embodiments.
Certain words and phrases are used herein solely for convenience and such words and terms should be interpreted as referring to various objects and actions that are generally understood in various forms and equivalencies by persons of ordinary skill in the art. For example, it must be understood that the phrase “electrical device” as used herein can refer to any of various types of electrical gadgets, devices, components, electrical parts, etc. (such as for example a solid-state switch, a power transistor, and a relay, each of which may operate by use of vehicle battery voltage of 12 volts), modules that include electrical devices (such as, for example, an engine control unit (ECU) a brake control module), and also “electronic” components. As used herein an “electronic” component, “electronic” device, and/or “electronic” circuit generally refers to components that are operated at voltage levels below 12 volts (5 volts or 3.3 volts, for example). At least some of these components can be “wireless” components. Wireless components can perform operations involving wireless signals that are transmitted/received via an antenna. A few examples of wireless components include a radio-frequency (RF) transmitter chip/circuit, an RF receiver chip/circuit, an RF transceiver chip/circuit. The phrase “electrically coupled” indicates that an electrical signal is propagated through a transmission medium. In some cases, the electrical signal may be propagated through a wire. In some other cases, the electrical signal may be propagated wirelessly. The word “attached” as used herein pertains to one object that is placed in contact with another object, either directly or via an intermediary material. For example, in one case, a metal foam element that is used as a heat sink may be placed in direct contact with a metal object (a metal enclosure, for example). In another case, a heat sink compound may be applied between a metal foam element and a surface of a metal object. In yet another case, an adhesive material may be used to affix a metal foam element upon a metal object. The word “enclosure” may be interchangeably used herein in some contexts with the word “module.”
The word “vehicle” as used in this disclosure can pertain to any one of various types of vehicles such as cars, vans, sports utility vehicles, trucks, electric vehicles, gasoline vehicles, hybrid vehicles, driver-operated vehicles, and autonomous vehicles. More generally, the systems and methods disclosed herein are applicable to various types of vehicles that are defined by the Society of Automotive Engineers (SAE) as incorporating six levels of driving automation ranging from Level 0 (fully manual) to Level 5 (fully autonomous).
It must be understood that words such as “implementation,” “application,” “scenario,” “case,” and “situation” as used herein are an abbreviated version of the phrase “In an example (“implementation,” “application,” “scenario,” “case,” “approach,” and “situation”) in accordance with the disclosure.” It must also be understood that the word “example” as used herein is intended to be non-exclusionary and non-limiting in nature.
In some cases, the electrical device 145 can include an enclosure that houses any of the various example mechanical, electrical, and/or electronic components such as those described above. The enclosure may be made of any of various types of materials such as, for example, plastics, composites, metals, and metal alloys (aluminum, magnesium, etc.). The selection of the material may be based on various factors such as, for example, weight, ruggedness, space availability, and heat dissipation.
Plastics and composites offer some benefits in terms of weight but may not be optimal for dissipating heat generated by the electrical devices. Metals may offer some advantages in terms of ruggedness and heat dissipation but may suffer from weight related issues. In some cases, heat dissipation via a metal enclosure may be inadequate such as, for example, in the case of a power amplifier. The heat dissipation issue may be addressed to some degree by providing metal cooling fins, air circulation (fans), and liquid cooling (coolant). However, it is desirable to provide solutions that address certain shortcomings that are associated with these types of cooling elements.
Consequently, some of these shortcomings may be addressed by use of metal foam in accordance with disclosure. Metal foam can be generally described as a metal (such as aluminum, for example) that has a porous cellular structure. The porous cellular structure occupies most of the space in any given volume of metal foam, such as, for example, 75% to 95% of any given volume. The metal portion occupies the remaining 5% to 25% of the volume. The high porosity offers several benefits such as, for example, an ability to conduct heat via convection. The metal portion complements the convection heat property of the pores by providing an ability to conduct heat via conduction. The combination of heat transfer via convection and conduction may be exploited in accordance with the invention to dissipate heat present in a body portion of the electrical device 145 as a result of heat generated in the electrical device 145. The metal foam material offers additional advantages as a result of electrical conductivity characteristics of the metal portion of the metal foam. The various advantages provided by metal foam may be advantageously used in improving some aspects of the electrical device 145.
In one embodiment in accordance with the disclosure, the heat dissipation property of metal foam may be exploited for dissipating heat generated in the electrical device 145. This may be done by partially, or completely covering the electrical device 145 with metal foam material. The metal foam material can dissipate heat by conduction as well as convection and can be lighter in weight than a metal heat sink. Covering the electrical device 145 with metal foam can be carried out in several ways. In one approach, a sheet of a metal foam element is attached to an external surface of the electrical device 145. Additional sheets can be attached to one or more other external surfaces of the electrical device 145. The material of the body of the electrical device 145, which can be metal, remains unchanged, thereby providing an advantage in terms of offering an ability to retrofit some types of electrical devices that are already present in a manufactured vehicle.
In another embodiment in accordance with the disclosure, the electrical device 145 can be manufactured by replacing the metal material with metal foam. In this approach, the enclosure portion of the electrical device 145 is made of metal foam and no additional heat sinking may be needed in at least some applications. The weight of the electrical device 145 when made of metal foam is less than that of a similar module made of metal.
The metal foam structures described above offer not only advantages associated with heat dissipation and weight but other advantages that may be associated with the electrical conductivity properties of metal foam. Further details pertaining to this aspect are provided below.
The enclosure 235 can include a connector 210. A wire assembly 220 and a wire assembly 230 are electrically attached to the connector 210. The wire assembly 220 includes a connector 215 and the wire assembly 230 includes a connector 225. The electrical device 200 may be mounted upon a chassis of the vehicle 105 such as, for example, upon a wall portion inside an engine compartment of the vehicle 105. The connector 215 and connector 225 may be mated with other connectors (not shown) that may be a part of a vehicle wiring harness. Power from a battery of the vehicle 105 may be conveyed to the electrical device 200 via one or both of the wire assemblies. Various types of electrical signals may be propagated in one or both directions via the wire assembly 220 and/or the wire assembly 230.
The metal foam element 205 generally provides a multi-purpose functionality that can include a heat dissipation functionality, an antenna functionality, and a radio-frequency interference (RFI) shielding functionality. In this example implementation, the metal foam element 205 provides a heat dissipation functionality for dissipating heat generated by one or more components contained inside the enclosure 235. More particularly, the metal foam element 205 is provided in the form of a metal foam sheet that is attached to an external surface 211 of the electrical device 200. The external surface 211 is a planar surface in this example, but the metal foam sheet may be applied to other non-planar surfaces as well. The heat generated by a component (power transistor, power supply, etc.) located inside the enclosure 235 may be transferred to the external surface 211 in several ways such as, for example, via heat conduction (when the component is mounted upon an inner surface of the enclosure 235) or via heat radiation (when the component is a part of a PCBA contained inside the enclosure 235).
The heat that is transferred to the external surface 211 of the electrical device 200 can be dissipated by the metal foam sheet in two ways—via heat conduction through a metal content of the metal foam sheet and via heat convection through pores of the metal foam sheet.
In the illustrated example configuration, the metal foam element 305 is provided as a metal foam sheet that is attached to the external surface 211 of the electrical device 200 and dissipates heat in the manner described above with reference to the metal foam element 205. The additional functionality offered by the metal foam element 305 is provided by configuring the metal foam element 305 to operate as an antenna. More particularly, the metal foam element 305 is electrically coupled via an electrical conductor 315 (a wire, for example) to a wireless communications device located inside the enclosure 235 (RF receiver, RF transmitter, RF transceiver, etc.). In an example implementation, a size of the metal foam element 305 is selected to configure the metal foam element 305 as a patch antenna that is operable over a desired range of wireless frequencies. In the case of a patch antenna having a rectangular profile, the size can include parameters such as a width dimension and a length dimension. In the case of patch antenna having a square the size can include a surface area.
In an example application, the metal foam element 305 may be configured to operate as a patch antenna for a cellular-vehicle-to-everything (CV2X) transmitter operating at 5.9 GHz. More particularly, the metal foam element 305 may have a footprint (area-wise) that is substantially similar to an equivalent patch antenna made of metal and also offers electrical operating characteristics (antenna gain, return loss, etc.) that are comparable to those of the equivalent patch antenna made of metal. However, the metal foam element 305 provides better heat dissipation than the equivalent patch antenna made of metal. Improved heat dissipation allows the CV2X transmitter to operate more efficiently such as, for example, allows a power amplifier to provide a more linear predictable behavior with less drift over time.
In another example implementation, the metal foam element 305 may have a shape other than a rectangular or square shape such as, for example, a multi-linear shape, a multi-segmented shape, a curved shape, a helical shape, and/or a concentric shape. One or more of these shapes can include a microwave strip line and/or a microstrip whose dimensions are selected on the basis of propagating wireless signals having a desired frequency, a desired wavelength, and/or a desired bandwidth.
The metal foam element 405 provides a heat dissipation functionality similar to that described above with respect to the metal foam element 205 illustrated in
The multiple metal foam elements attached to the electrical device 200 that is illustrated in
In yet some other embodiments, at least one of the metal foam elements can be mounted on an internal surface of the electrical device 200. For example, the metal foam element 415 that provides an RFI shielding functionality may be attached to an internal surface of the enclosure 235 or may be attached to a surface of an electronic component located inside the enclosure 235.
The metal foam enclosure 505 operates as a Faraday cage that can be used to prevent radio-frequency interference from external sources from adversely affecting the electrical device 200. In some applications, the metal foam enclosure 505 operates as a Faraday cage that can be used to prevent or inhibit radio-frequency interference that may be generated by the electrical device 200 from adversely affecting other components located outside the electrical device 200.
The metal foam material of the metal foam enclosure 505 provides a multi-purpose functionality by operating as an RFI shield as well as a heat sink for dissipating heat generated by the electrical device 200. The metal foam material of the metal foam enclosure 505 further offers a weight reduction in comparison to a weight of a metal enclosure. The reduction in weight is desirable particularly in vehicle applications due to factors such as improved gas mileage and speed.
Insertion loss characteristics of the metal foam element configured as an isolator is indicated by a line 910. Insertion loss characteristics of the equivalent metal element configured as an isolator is indicated by a line 915. Line 905 indicates an insertion loss characteristic between the two electrically small dipole antennas when no isolator is used.
In the above disclosure, reference has been made to the accompanying drawings, which form a part hereof, which illustrate specific implementations in which the present disclosure may be practiced. It is understood that other implementations may be utilized, and structural changes may be made without departing from the scope of the present disclosure. References in the specification to “one embodiment,” “an embodiment,” “an example embodiment,” “an example embodiment,” etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, one skilled in the art will recognize such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
While various embodiments of the present disclosure have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the present disclosure. Thus, the breadth and scope of the present disclosure should not be limited by any of the above-described example embodiments but should be defined only in accordance with the following claims and their equivalents. The foregoing description has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the present disclosure to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. Further, it should be noted that any or all of the aforementioned alternate implementations may be used in any combination desired to form additional hybrid implementations of the present disclosure. For example, any of the functionality described with respect to a particular device or component may be performed by another device or component. Further, while specific device characteristics have been described, embodiments of the disclosure may relate to numerous other device characteristics. Further, although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that the disclosure is not necessarily limited to the specific features or acts described. Rather, the specific features and acts are disclosed as illustrative forms of implementing the embodiments. Conditional language, such as, among others, “can,” “could,” “might,” or “may,” unless specifically stated otherwise, or otherwise understood within the context as used, is generally intended to convey that certain embodiments could include, while other embodiments may not include, certain features, elements, and/or steps. Thus, such conditional language is not generally intended to imply that features, elements, and/or steps are in any way required for one or more embodiments.
| Number | Name | Date | Kind |
|---|---|---|---|
| 20220322516 | Kim | Oct 2022 | A1 |
| Number | Date | Country |
|---|---|---|
| 106540335 | Mar 2017 | CN |
| 109659703 | Apr 2019 | CN |
| 5967938 | Aug 2016 | JP |
| 20150056197 | May 2015 | KR |
| 200120722 | Mar 2001 | WO |
| 2020219060 | Oct 2020 | WO |
| Entry |
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| J. Anguera et al., Metallized Foams for Antenna Design: Application to Fractal-Shaped Sierpinski-Carpet Monopole, Progress in Electomagnetics Research, PIER 104, 2010, 239-251. |
