MULTI-SENSOR PLATFORM FOR A BUILDING

Abstract

A sensing assembly includes a baseboard and a daughterboard operatively coupled to the baseboard. The baseboard includes a microcontroller unit (MCU) mounted to the baseboard, the MCU executing a Real Time Operating System (RTOS) and embedded Artificial Intelligence (AI) code, and two or more sensors that are mounted to the baseboard and operatively coupled to the MCU. The daughterboard includes two or more sensors that are mounted to the daughterboard. The MCU is configured to receive an output signal from each of the two or more sensors mounted to the daughterboard and the two or more sensors mounted to the baseboard and to process two or more of the output signals using the embedded AI code to produce one or more output parameters. The baseboard includes communication circuitry for communicating one or more of the output parameters to a remote device such as a remote server.

Description

TECHNICAL FIELD

The present disclosure pertains generally to sensing assemblies and more particularly to multiple sensor sensing assemblies for a building.

BACKGROUND

Sensors are used to sense a variety of different conditions in a variety of different applications. In building management system (BMS) applications, for example, sensors may be used to sense environmental conditions such as temperature, humidity and various measures of indoor air quality. Alternatively, or in addition, sensors may be used to sense, for example, occupancy of a building space, security events occurring in or around a building space, and/or other abnormal events such as equipment failure occurring in a building space. A need remains for improved sensor assemblies that can be used to support the operation of building management systems.

SUMMARY

This disclosure relates generally to sensing assemblies and more particularly to multiple sensor sensing assemblies. In an example, a multiple sensor sensing assembly provides the opportunity to mix and match particular sensors for particular applications or use-cases, including some universal sensors on a baseboard and additional application specific sensors as desired on one or more daughterboards. In some cases, the multiple sensor sensing assembly may efficiently use artificial intelligence (AI) to locally synthesize or fuse outputs from various ones of the sensors to produce one or more output parameters that can be reported to a remote device such as a remote server.

A particular example may be found in a sensing assembly having a housing with mounting features for mounting the housing to a mounting surface of a building. This example sensing assembly includes a baseboard that is housed by the housing as well as a daughterboard that is housed by the housing and is operably coupled with the baseboard. The baseboard includes a microcontroller unit (MCU) that is mounted to the baseboard and two or more sensors that are mounted to the baseboard. The MCU includes a packaged integrated circuit die that has a central processing unit (CPU) and a non-volatile memory that is operably coupled to the CPU and that stores a Real Time Operating System (RTOS) and an embedded Artificial Intelligence (AI) code for execution by the CPU. The integrated circuit die also includes an I/O port. The two or more sensors mounted to the baseboard are operatively coupled to the I/O port of the MCU and include two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone.

The daughterboard includes two or more sensors that are mounted to the daughterboard, including an IR sensor and a time of flight (TOF) sensor. The housing defines a window that exposes the IR sensor and the TOF sensor to a space in the building that is external of the housing. The MCU of the baseboard is configured to receive an output signal from each of the two or more sensors mounted to the daughterboard and the two or more sensors mounted to the baseboard, process two or more of the output signals using the embedded AI code to produce one or more output parameters and output the one or more output parameters via the I/O port of the MCU to the baseboard.

Another example may be found in a sensing assembly that includes a baseboard and a daughterboard that is operatively coupled to the baseboard. In this example, the baseboard includes a microcontroller unit (MCU) mounted to the baseboard, the MCU executing a Real Time Operating System (RTOS) and embedded Artificial Intelligence (AI) code, and two or more sensors that are mounted to the baseboard and operatively coupled to the MCU, the two or more sensors including two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone. The daughterboard includes two or more sensors that are mounted to the daughterboard. The MCU of the baseboard is configured to receive an output signal from each of the two or more sensors mounted to the daughterboard and the two or more sensors mounted to the baseboard and to process two or more of the output signals using the embedded AI code to produce one or more output parameters. The baseboard includes communication circuitry for communicating one or more of the output parameters to a remote device such as a remote server.

Another example may be found in a method of assembling a sensing assembly. In this example, a housing is selected from a first housing and a second housing, wherein the first housing includes a sensor window that is orientated in a first orientation relative to a mounting surface, and the second housing includes a sensor window that is orientated in a second orientation relative to the mounting surface. A baseboard is installed in the selected housing. The baseboard includes a microcontroller unit (MCU) mounted to the baseboard, the MCU including a packaged integrated circuit die, wherein the integrated circuit die includes a central processing unit (CPU), an I/O port and a non-volatile memory operatively coupled to the CPU. The non-volatile memory stores a Real Time Operating System (RTOS) and an embedded Artificial Intelligence (AI) code for execution by the CPU. Two or more sensors are mounted to the baseboard and are operatively coupled to the I/O port of the MCU, the two or more sensors including two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone.

A daughterboard is installed in the selected housing and operatively coupling the daughterboard to the baseboard, wherein the daughterboard includes two or more sensors mounted to the daughterboard. The first housing, when selected, supports the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the first housing. The second housing, when selected, supports the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the second housing.

The preceding summary is provided to facilitate an understanding of some of the features of the present disclosure and is not intended to be a full description. A full appreciation of the disclosure can be gained by taking the entire specification, claims, drawings, and abstract as a whole.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more completely understood in consideration of the following description of various illustrative embodiments of the disclosure in connection with the accompanying drawings, in which:

FIG. 1 is a schematic block diagram of an illustrative sensing assembly;

FIG. 2 is a schematic block diagram of an illustrative sensing assembly;

FIG. 3 is a schematic block diagram of an illustrative microcontroller unit (MCU) usable in the illustrative sensing assembly of FIG. 1 or the illustrative sensing assembly of FIG. 2;

FIG. 4A is a top perspective view of an illustrative housing usable in the illustrative sensing assembly of FIG. 1 or the illustrative sensing assembly of FIG. 2;

FIG. 4B is a bottom perspective view of the illustrative housing shown in FIG. 4A;

FIG. 5 is a flow diagram showing an illustrative method of assembling a sensing assembly such as the illustrative sensing assembly of FIG. 1 or the illustrative sensing assembly of FIG. 2;

FIG. 6 is a flow diagram showing an illustrative method of assembling a sensing assembly such as the illustrative sensing assembly of FIG. 1 or the illustrative sensing assembly of FIG. 2;

FIG. 7 is a schematic diagram showing an illustrative method of occupancy sensing;

FIG. 8 is a schematic diagram showing an illustrative method of balancing energy efficiency and indoor air quality; and

FIG. 9 is a schematic diagram showing an illustrative method of detecting inappropriate behavior.

While the disclosure is amenable to various modifications and alternative forms, specifics thereof have been shown by way of example in the drawings and will be described in detail. It should be understood, however, that the intention is not to limit aspects of the disclosure to the particular illustrative embodiments described. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure.

DESCRIPTION

The following description should be read with reference to the drawings wherein like reference numerals indicate like elements. The drawings, which are not necessarily to scale, are not intended to limit the scope of the disclosure. In some of the figures, elements not believed necessary to an understanding of relationships among illustrated components may have been omitted for clarity.

All numbers are herein assumed to be modified by the term “about”, unless the content clearly dictates otherwise. The recitation of numerical ranges by endpoints includes all numbers subsumed within that range (e.g., 1 to 5 includes 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5).

As used in this specification and the appended claims, the singular forms “a”, “an”, and “the” include the plural referents unless the content clearly dictates otherwise. As used in this specification and the appended claims, the term “or” is generally employed in its sense including “and/or” unless the content clearly dictates otherwise.

It is noted that references in the specification to “an embodiment”, “some embodiments”, “other embodiments”, etc., indicate that the embodiment described may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is contemplated that the feature, structure, or characteristic may be applied to other embodiments whether or not explicitly described unless clearly stated to the contrary.

FIG. 1 is a schematic block diagram of an illustrative sensing assembly 10. The illustrative sensing assembly 10 includes a baseboard 12 and a daughterboard 14 that is operatively coupled with the baseboard 12. While a single daughterboard 14 is shown, it will be appreciated that in some instances there may be two, three or more daughterboards 14 operatively coupled with the baseboard 12. In some instances, the baseboard 12 may be considered as being a motherboard. The baseboard 12 and the daughterboard 14 are both disposed within a housing 16 and are operatively coupled via a flexible ribbon connector 18 that extends between the baseboard 12 and the daughterboard 14. While not shown, the baseboard 12 and the daughterboard 14 may each include a connector port to which the flexible ribbon connector may be electrically and mechanically coupled in order to operatively couple the baseboard 12 and the daughterboard 14.

In the example shown, the baseboard 12 includes an MCU 20, which is a microcontroller unit. The baseboard 12 also includes two or more sensors 22, individually labeled as 22a and 22b, that are operatively coupled with the MCU 20. While two sensors 22 are shown, in some instances the baseboard 12 may include any number of sensors, including one sensor 22, three sensors 22, four sensors 22, or any greater number of sensors 22. At least some of the two or more sensors 22 may include MEMS sensors, for example. The two or more sensors 22 may include any variety of sensors, including but not limited to a temperature sensor, a humidity sensor, an ambient light sensor, an accelerometer, and a microphone. In some cases, the baseboard 12 may additionally or alternatively include sensors such as a vibration sensor or another surface mountable IMU (Inertia Measurement Unit) sensor. An IMU is an electronic device that measures and reports a body's specific force, angular rate, and sometimes the orientation of the body, using a combination of accelerometers, gyroscopes and optionally magnetometers. It will be appreciated that the two or more sensors 22, in combination with the MCU 20, will give the baseboard 12 a certain level of sensing ability and functionality. In some cases, the two or more sensors 22 on the baseboard may be considered to be universal sensors that have application across multiple use cases.

The daughterboard 14 may be considered as providing additional sensing ability and functionality to that provided by the baseboard 12. In some cases, the daughterboard 14 may include application specific sensors that are directed at one or more specific use-cases, but this is not required. In some cases, various different daughterboard 14 each having different sensor combinations may be made available, and a particular one of the different daughterboards may be selected and installed in the sensing assembly 10 depending on the specific use-case at hand.

In the example shown, the daughterboard 14 may include two or more sensors 24, individually labeled as 24a, 24b and 24c. While three sensors 24 are shown, in some instances the daughterboard 14 may include any number of sensors 24, including one sensor 24, two sensors 24, four sensors 24 or any greater number of sensors 24. At least some of the two or more sensors 24 may include MEMS sensors, for example. The two or more sensors 24 may include any variety of sensors including, for example, occupancy sensors and environmental sensors.

Examples of suitable occupancy sensors include but are not limited to IR sensors (such as passive infrared (PIR) sensors) and time of flight (TOF) sensors. Examples of suitable environmental sensors include but are not limited to a temperature sensor, a humidity sensor, a carbon dioxide (CO₂) sensor, a carbon monoxide (CO) sensor, a total Volatile Organic Compound (VOC) sensor and a particulate matter (PM) sensor. In some cases, a carbon monoxide (CO) sensor may be used in a standalone daughterboard for use in areas that may be prone to accumulation of hazardous gases such as CO. An underground parking structure is an example of where a CO sensor may be beneficial.

In some instances, a first daughterboard 14 may be equipped as an occupancy card, and thus may include occupancy sensors (e.g. PIR, TOF, micro-LIDAR, mmWave Indoor Radar). A second daughterboard 14 may be equipped as an environmental card, and thus may include environmental sensors. A person assembling the sensing assembly 10 may use the first daughterboard 14 in order to give the sensing assembly 10 occupancy sensing capabilities. Alternatively, or in addition, a person assembling the sensing assembly 10 may use the second daughterboard 14 in order to give the sensing assembly 10 environmental sensing capabilities. If the housing 16 and the baseboard 12 will accommodate more than one daughterboard 14, the person assembling the sensing assembly 10 could include both the first daughterboard 14 and the second daughterboard 14 in order to give the sensing assembly 10 both occupancy sensing capability and environmental sensing capability. These are just examples.

In the example shown, the MCU 20 is configured to receive an output signal from each of the two or more sensors 24 of the daughterboard 14 and to receive an output signal from each of the sensors 22 of the baseboard 12. The MCU 20 is configured to process two or more of the output signals using embedded artificial intelligence (AI) code to produce one or more output parameters. The baseboard 12 includes communication circuitry 26 that is operably coupled with the MCU 20. The MCU 20 is able to communicate one or more of the output parameters to a remote device 28 via the communication circuitry 26. The remote device 28 may be a computer such as a desktop or a laptop, or perhaps a cloud-based server. The remote device 28 may be a mobile device such as a tablet or a smartphone, for example.

In some instances, the one or more output parameters may include one or more occupancy parameters. Examples of occupancy parameters include but are not limited to human presence, people count, people flow and people tracking. The one or more output parameters may include one or more environmental parameters. Examples of environmental parameters include but are not limited to noise, illuminance (light level) and Indoor Air Quality (IAQ). In some instances, the one or more output parameters may include one or more anomaly detection parameters. Examples of anomaly detection parameters may include but are not limited to an anomalous audio, an anomalous pressure, an anomalous temperature, an anomalous humidity, an anomalous ambient light, an anomalous vibration, an anomalous people presence, an anomalous people count, and an anomalous people flow.

In some cases, the MCU 20 is configured to identify one or more events and/or faults based at least in part on the one or more anomaly detection parameters. The embedded AI may be configured to learn to detect anomalies based at least in part on one or more of the processed output signals from the various sensors. In some cases, the embedded AI may be configured to learn over-time what is considered “anomalous” in the particular building to which the sensing assembly 10 is installed. In some cases, anomalous parameters may be communicated to the remote device 28 and not all sensor data, thereby reducing the amount of sensor data that is transmitted to the remote device 28. This can significantly reduce the bandwidth required for the communication channel to the remote device 28.

FIG. 2 is a schematic block diagram of an illustrative sensing assembly 30 that includes the same baseboard 12 as the sensing assembly 10, but includes a daughterboard 32 that has an IR sensor 34 and a TOF sensor 36. The sensing assembly 30 may include components discussed with respect to the sensing assembly 10 and the sensing assembly 10 may include components discussed with respect to the sensing assembly 30. In some cases, the IR sensor 34 may consume a low level of electrical power while the TOF sensor 36 may consume a relatively greater level of electrical power that could prevent the sensing assembly 30 from being battery powered with a reasonable lifetime if the TOF sensor 36 was always enabled, for example. In some cases, the IR sensor 34 may be configured to be powered on all of the time while the TOF sensor 36 is only powered on when the IR sensor 34 indicates movement or the possible presence of a person, for example.

In some cases, the IR sensor 34 may have a field of view (FOV) that overlaps a FOV of the TOF sensor 36. The TOF sensor 36 may have a FOV that is smaller than the FOV of the IR sensor 34, and thus when activated, can be considered to “zoom in” to a particular region of the FOV of the IR sensor 34. In some cases, the TOF sensor 36 has a power savings mode and a sensing mode, wherein after a period of no activity the MCU 20 may set the TOF sensor 36 to the power savings mode, and in response to the IR sensor detecting activity, the MCU 20 may set the TOF sensor 36 to the sensing mode.

In the example shown, the sensing assembly 30 may include a power storage device 38 that may be used to power the sensing assembly 30. The power storage device 38 may be a battery such as a rechargeable battery or a single-charge battery. The power storage device 38 may be a capacitor, for example. In some cases, the sensing assembly 30 may include a power harvesting device 40 that allows the sensing assembly 30 to capture at least some the power necessary to recharge the power storage device 38 and/or operate the sensing assembly 30 from its environment. As an example, the power harvesting device may be or otherwise include a solar cell that can generate electrical power from incident light. The sensing assembly 10 (FIG. 1) may include one or both of the power storage device 38 and the power harvesting device 40. In some cases, the sensing assembly 10 and/or sensing assembly 29 may be powered by line-power, with or without a backup power source. The sensing assembly 30 (FIG. 2) may include the communication circuitry 26. These are just examples.

FIG. 3 is a schematic block diagram showing the MCU 20. In some instances, the MCU 20 is a packaged integrated circuit die that includes a central processing unit (CPU) 50 and a non-volatile memory 52 that is operatively coupled to the CPU 50. The non-volatile memory 52 stores for execution by the CPU 50 a Real Time Operating System (RTOS) 54 and an embedded Artificial Intelligence (AI) code 56. The example MCU 20 also includes an I/O port 58. The I/O port 58 allows the MCU 20 to communicate with the sensors 22 that are mounted on the baseboard 12 as well as with the sensors 24 that are mounted on the daughterboard 14. The I/O port 58 may also allow the MCU 20 to communicate with the remote device 28 sometimes through a communication circuitry 26 on the baseboard 12.

In some instances, the baseboard 12 may be configured to receive an update or replacement to the embedded Artificial Intelligence (AI) code 56 via the communication circuitry 26 and to update or replace the embedded Artificial Intelligence (AI) code 56 that is stored in the non-volatile memory 52 with the updated or replacement embedded Artificial Intelligence (AI) code. The non-volatile memory 52 may further store one or more drivers for communicating with one or more of the sensors 24. The baseboard 12 may be configured to receive an update or replacement of one or more of the drivers via the communication circuitry 26 and update or replace one or more of the drivers stored in the non-volatile memory 52 with one or more of the updated or replacement drivers. The embedded Artificial Intelligence (AI) code 56 and/or the one or more drivers may be updated automatically or by an installer, depending on the sensors that are on the baseboard 12 and/or daughterboard 14 and the particular use-case of the sensing assembly 10 in the field. Such an update may be pushed to the sensing assembly 10 from, for example, a mobile device such as an installer's mobile phone, from a remote server such as a remote cloud server, and/or in any other suitable manner.

FIG. 4A is a top perspective view of an illustrative housing 16, and FIG. 4B is a bottom perspective view thereof. While the housing 16 is shown as being rectilinear, this is merely illustrative. The housing 16 may be circular, for example. In some cases, the housing 16 may be largely rectilinear, but may have rounded over corners and edges, for example. The housing 16 is sized to accommodate both the baseboard 12 and the daughterboard 14, 32 therein. The housing 16 may include one or more windows 60 formed within the housing 16. For example, the housing 16 may include a window 60a that is formed in a side wall 62 of the housing 16. In another example, the housing 16 may include a window 60b that is formed in a front surface 64 of the housing 16. It is contemplated that a particular housing may be selected for the sensing assembly dependent on the expected mounting orientation of the sensing assembly (e.g. on a wall surface, a ceiling surface or a door frame). In another example, the housing 16 may include a window 60a that is formed in a side wall 62 of the housing 16 and another window 60b that is formed in a front surface 64 of the housing 16. The size, shape and location of the window(s) may be dependent on the particular daughterboard(s) that is selected for inclusion in the housing 16. These are just examples.

It is contemplated that the windows 60 may or may not include an aperture or slot that extends through the material forming the housing 16. In some cases, the windows 60 may include a transparent or substantially transparent to whatever ranges of electromagnetic radiation are used by the sensors 24 of the housed baseboard and/or daughterboard. The windows 60 may be formed of a different material than the rest of the housing 16, for example, or may be open slots or apertures that extend through the housing wall to expose the underlying sensors directly to the environment outside of the housing 16.

The illustrative housing 16 also includes mounting features 66 that are disposed relative to a back surface 68 of the housing 16. The back surface 68 may be considered as the surface that is intended to contact a mounting surface of the building. The mounting surface may be a wall surface, a ceiling surface or even a door frame, for example. The mounting features 66 are generically shown, and may include any of a variety of different mounting technologies. In some cases, the mounting features 66 may be tapered holes that are meant to fit over a screw head and then slide down. Other mounting techniques are also contemplated.

FIG. 5 is a flow diagram showing an illustrative method 70 of assembling a sensing assembly (such as the sensing assembly 10 or the sensing assembly 30). A housing is selected from a first housing and a second housing, as indicated at block 72. The first housing includes a sensor window that is orientated in a first orientation relative to a mounting surface, as indicated at block 72a. The second housing includes a sensor window that is orientated in a second direction (different from the first direction) relative to the mounting surface, as indicated at block 72b.

In some cases, the first housing includes two opposing major surfaces (such as the front surface 64 and the back surface 68) with sidewalls (such as the side wall 62) extending between the two opposing major surfaces, and wherein the sensor window of the first housing extends along one of the two opposing major surfaces. The second housing may include two opposing major surfaces (such as the front surface 64 and the back surface 68) with sidewalls (such as the side wall 62) extending between the two opposing major surfaces, and wherein the sensor window of the second housing extends along one of the sidewalls.

A baseboard (such as the baseboard 12) is installed in the selected housing, as indicated at block 74. A daughterboard (such as the daughterboard 14, 32) is installed in the selected housing and is operatively coupled to the baseboard, wherein the daughterboard includes two or more sensors mounted to the daughterboard, as indicated at block 76. The first housing, when selected, supports the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the first housing, as indicated at block 76a. The second housing, when selected, supports the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the second housing, as indicated at block 76b.

FIG. 6 is a flow diagram showing an illustrative method 80 of assembling a sensing assembly (such as the sensing assembly 10 or the sensing assembly 30). A housing is selected from a first housing and a second housing, as indicated at block 82. The first housing and the second housing may be similar to those described with respect to FIG. 6. A baseboard (such as the baseboard 12) is installed in the selected housing, as indicated at block 84. The baseboard includes an MCU (such as the MCU 20) that is a packaged integrated circuit die, as indicated at block 86. The MCU includes a central processing unit (CPU), as indicated at block 86a. The MCU includes a non-volatile memory (such as the memory 52) that is operably coupled to the CPU (such as the CPU 50). The non-volatile memory stores for execution by the CPU a Real Time Operating System and an embedded Artificial Intelligence (AI) code, as indicated at block 86b. The MCU includes an I/O port (such as the I/O port 58), as indicated at block 86c.

The baseboard includes two or more sensors that are mounted to the baseboard and that are operatively coupled to the I/O port of the MCU. The two or more sensors include two or more of a temperature sensor, a humidity sensor, an ambient light sensor and a microphone, as indicated at block 88. A daughterboard is installed in the selected housing and is operatively coupled to the baseboard, the daughterboard including two or more sensors that are mounted to the daughterboard, as indicated at block 90.

FIG. 7 is a schematic diagram showing an illustrative method 100 of occupancy sensing using both an ultra-low power sensor 102 that is always powered on and a low power sensor 104 that is only active when needed. This may be considered as an example of the sensing assembly 10 or the sensing assembly 30. The ultra-low power sensor 102, which may include an infrared (IR) sensor 102a and an ambient light sensor 102b. The low-power sensor 104 may include a TOF sensor such as a micro-LIDAR sensor 104a. In some cases, the micro-LIDAR sensor 104a may include a people counting algorithm 104b. If the IR sensor 102a detects a person, as indicated at block 106, control passes to block 108 and the low power sensor 104 is turned on. If the IR sensor 102a does not detect a person, as indicated at block 110, a switch off timer is started, as indicated at block 112, and then the low power sensor 104 is eventually disabled or otherwise put into a sleep or other low power mode, as indicated at block 114.

If the ambient light sensor 102b detects an illumination level that meets or exceeds a threshold, as indicated at block 116, control passes to block 118 and the low power sensor 104 is activated. However, if the illumination level is below the threshold, control passes to block 112 and the switch off timer is started.

FIG. 8 is a schematic diagram showing an illustrative method 130 of balancing energy efficiency and indoor air quality. This may be considered as an example of the sensing assembly 10 or the sensing assembly 30. An IR sensor 132 detects people, as indicated at block 134. A MEMS microphone 136 detects sounds, and the embedded AI learns what the sound levels should be when a building space is occupied by people and when the building space is not occupied, as indicated at block 138. At block 140, sensor fusion provides for improved occupancy detection accuracy. Control passes both to block 142, which pertains to lighting control, and to block 144, which pertains to dynamic heating, ventilating and air conditioning (HVAC) control. A Micro-LIDAR/TOF sensor 146 counts people within a room or zone, as indicated at block 148. Environmental sensors provide an indication of the indoor environment and perhaps the air quality within the indoor environment, as indicated at block 152. Both block 148 and block 152 pass control to the dynamic HVAC control block 144. Dynamic HVAC control block 144 the controls the HVAC system based on the various inputs.

FIG. 9 is a schematic diagram showing an illustrative method of detecting inappropriate behavior. In this particular example, the inappropriate behavior centers around possible problems within a restroom in a building. A MEMS microphone 162 detects sounds within the space. If the sound exceeds a threshold, a determination may be made that there are more people in the space than are expected, as indicated at block 164. Obviously, the expected crowd within a bathroom is different than that expected in another type of space. The sounds detected by the MEMS microphone 162 are also analyzed for indications of problems, as indicated at block 166. This may include sounds of things being broken, or perhaps sounds of a person in distress (crying, yelling, etc.). At the same time, a Micro-LIDAR/TOF sensor 170 may count how many people are in the space, as indicated at block 172. This can serve as a back-up or confirmation of the crowd estimated using sound processing. The Micro-LIDAR/TOF sensor 170 can also detect a motionless person, which may be an indication of a drug overdose or other health problem. In each case, the information gleaned by processing sound information from the MEMS microphone 162 and the people detection from the Micro-LIDAR/TOF sensor 170 is passed to an alarm management block 168, which issues an alarm when appropriate.

Those skilled in the art will recognize that the present disclosure may be manifested in a variety of forms other than the specific embodiments described and contemplated herein. Accordingly, departure in form and detail may be made without departing from the scope and spirit of the present disclosure as described in the appended claims.

Claims

1. A sensing assembly comprising: a housing with mounting features for mounting the housing to a mounting surface of a building;a baseboard housed by the housing, the baseboard including: a microcontroller unit (MCU) mounted to the baseboard, the MCU including a packaged integrated circuit die, wherein the integrated circuit die includes: a central processing unit (CPU);a non-volatile memory operatively coupled to the CPU, wherein the non-volatile memory stores for execution by the CPU: a Real Time Operating System (RTOS); an embedded Artificial Intelligence (AI) code;an I/O port;two or more sensors mounted to the baseboard and operatively coupled to the I/O port of the MCU, the two or more sensors including two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone;a daughterboard housed by the housing and operatively coupled to the baseboard, the daughterboard including two or more sensors mounted to the daughterboard including: an IR sensor;a time of flight (TOF) sensor;the housing defining a window that exposes the IR sensor and the TOF sensor of the daughterboard to a space in the building that is external of the housing;the MCU of the baseboard is configured to: receive an output signal from each of the two or more sensors mounted to the daughterboard and the two or more sensors mounted to the baseboard;process two or more of the output signals using the embedded AI code to produce one or more output parameters; andoutput the one or more output parameters via the I/O port of the MCU to the baseboard.

2. The sensing assembly of claim 1, wherein the one or more output parameters comprises one or more occupancy parameters.

3. The sensing assembly of claim 2, wherein the one or more occupancy parameters comprises one or more of human presence, people count, people flow and people tracking.

4. The sensing assembly of claim 1, wherein the one or more output parameters comprises one or more environmental parameters.

5. The sensing assembly of claim 4, wherein the one or more environmental parameters comprises one or more of noise, illuminance and Indoor Air Quality (IAQ).

6. The sensing assembly of claim 1, wherein the one or more output parameters comprises one or more anomaly detection parameters.

7. The sensing assembly of claim 6, wherein the one or more the one or more anomaly detection parameters comprise one or more of an anomalous audio, an anomalous pressure, an anomalous temperature, an anomalous humidity, an anomalous ambient light, an anomalous vibration, an anomalous people presence, an anomalous people count, and an anomalous people flow.

8. The sensing assembly of claim 7, wherein the MCU is configured to identify one or more events and/or faults based at least in part on the one or more anomaly detection parameters.

9. The sensing assembly of claim 1, wherein the field of view (FOV) of the IR sensor overlaps the FOV of the TOF sensor and the FOV of the TOF sensor is smaller than the FOV of the IR sensor, and wherein the TOF sensor has a power savings mode and a sensing mode, wherein after a period of no activity the MCU sets the TOF sensor to the power savings mode, and in response to the IR sensor detecting activity, the MCU sets the TOF sensor to the sensing mode.

10. The sensing assembly of claim 1, wherein the baseboard comprises communication circuitry for communicating one or more of the output parameters to a remote device.

11. The sensing assembly of claim 10, wherein the communication circuitry supports wireless communication.

12. The sensing assembly of claim 10, wherein the baseboard is configured to receive an update or replacement to the embedded Artificial Intelligence (AI) code via the communication circuitry and to update or replace the embedded Artificial Intelligence (AI) code stored in the non-volatile memory of the integrated circuit die of the MCU with the updated or replacement embedded Artificial Intelligence (AI) code.

13. The sensing assembly of claim 10, wherein the non-volatile memory of the integrated circuit die of the MCU further stores one or more drivers for communicating with one or more of the sensors mounted to the daughterboard, and wherein the baseboard is configured to receive an update or replacement of one or more of the drivers via the communication circuitry and update or replace one or more of the drivers stored in the non-volatile memory of the integrated circuit die of the MCU with one or more of the updated or replacement drivers.

14. A sensing assembly comprising: a baseboard including: a microcontroller unit (MCU) mounted to the baseboard, the MCU executing a Real Time Operating System (RTOS) and embedded Artificial Intelligence (AI) code;two or more sensors mounted to the baseboard and operatively coupled to the MCU, the two or more sensors including two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone;a daughterboard operatively coupled to the baseboard, the daughterboard including two or more sensors mounted to the daughterboard;the MCU of the baseboard is configured to: receive an output signal from each of the two or more sensors mounted to the daughterboard and the two or more sensors mounted to the baseboard;process two or more of the output signals using the embedded AI to produce one or more output parameters; andthe baseboard includes communication circuitry for communicating one or more of the output parameters to a remote device.

15. The sensing assembly of claim 14, wherein the daughterboard includes one or more of an IR sensor, a time of flight (TOF) sensor, a temperature sensor, a humidity sensor, a carbon dioxide (CO2) sensor, a carbon monoxide (CO) sensor, a total VOC sensor and a particulate matter (PM) sensor.

16. The sensing assembly of claim 14, wherein the embedded AI is configured to learn to detect anomalies based at least in part on one or more of the processed output signals.

17. The sensing assembly of claim 14, wherein the sensing assembly further comprises: a power storage device for powering the sensing assembly; anda power harvesting device for harvesting power from the ambient environment to recharge the power storage device.

18. A method of assembling a sensing assembly comprising: selecting a housing from a first housing and a second housing, wherein the first housing includes a sensor window that is orientated in a first orientation relative to a mounting surface, and the second housing includes a sensor window that is orientated in a second orientation relative to the mounting surface;installing a baseboard in the selected housing, wherein the baseboard includes: a microcontroller unit (MCU) mounted to the baseboard, the MCU including a packaged integrated circuit die, wherein the integrated circuit die includes: a central processing unit (CPU);a non-volatile memory operatively coupled to the CPU, wherein the non-volatile memory stores for execution by the CPU: a Real Time Operating System (RTOS); an embedded Artificial Intelligence (AI) code;an I/O port;two or more sensors mounted to the baseboard and operatively coupled to the I/O port of the MCU, the two or more sensors including two or more of a temperature sensor, a humidity sensor, an ambient light sensor, and a microphone;installing a daughterboard in the selected housing and operatively coupling the daughterboard to the baseboard, wherein the daughterboard includes two or more sensors mounted to the daughterboard;the first housing, when selected, supporting the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the first housing; andthe second housing, when selected, supporting the daughterboard in an orientation where at least one of the two or more sensors mounted to the daughterboard are orientated toward and aligned with the sensor window of the second housing.

19. The method of claim 18, wherein the first housing includes two opposing major surfaces with sidewalls extending between the two opposing major surfaces, and wherein the sensor window of the first housing extends along one of the two opposing major surfaces.

20. The method of claim 19, wherein the second housing includes two opposing major surfaces with sidewalls extending between the two opposing major surfaces, and wherein the sensor window of the second housing extends along one of the sidewalls.