The invention relates generally to multi-slab multichannel heat exchangers.
Heat exchangers are used in heating, ventilation, air conditioning, and refrigeration (HVAC&R) systems. Multichannel heat exchangers generally include multichannel tubes for flowing refrigerant through the heat exchanger. Each multichannel tube may contain several individual flow channels. Fins may be positioned between the tubes to facilitate heat transfer between refrigerant contained within the tube flow channels and external air passing over the tubes. Multichannel heat exchangers may be used in small tonnage systems, such as residential systems, or in large tonnage systems, such as industrial chiller systems.
In general, heat exchangers transfer heat by circulating a refrigerant through a cycle of evaporation and condensation. The rate of heat transfer may be affected by the location of a multichannel tube within a heat exchanger. For example, in a heat exchanger containing horizontal tubes, the bottom tubes may receive less airflow than the top tubes, resulting in a lower rate of heat transfer between the bottom tubes and the environment. In a heat exchanger containing vertical tubes, the outer tubes may receive less airflow based on proximity to other equipment or an outer wall. Further, multichannel heat exchangers may be placed in multi-slab configurations to provide increased capacity within a small equipment footprint. For example, two slabs of heat exchanger tubes may be placed side-by-side. In a multi-slab configuration, the outer heat exchanger coils may receive more airflow, resulting in a higher rate of heat transfer between these tubes and the environment.
The present invention relates to a multi-slab heat exchanger with a first slab of multichannel tubes arranged generally in a first plane and a second slab of multichannel tubes arranged generally in a second plane parallel and adjacent to the first plane. The first slab is subdivided into a first group of tubes and a second group of tubes, and the second slab is subdivided into a third group of tubes aligned generally with the first group of tubes and a fourth group of tubes aligned generally with the second group of tubes. The heat exchanger also includes a fluid connection for transmitting fluid from the first group to the third group.
The present invention also relates to a multi-slab heat exchanger with a first manifold arranged generally in a first plane, a second manifold adjacent to the first manifold and arranged generally in a second plane parallel to the first plane, and a plurality of multichannel tubes in fluid communication with the first and second manifolds. Each of the multichannel tubes include a plurality of flow paths that have a first portion disposed in the first plane and a second portion disposed in the second plane. At least one of the multichannel tubes has a portion extending between the first and second planes.
The present invention further relates to systems and methods employing the multi-slab heat exchangers.
When the system shown in
Outdoor unit 16 draws in environmental air through its sides as indicated by the arrows directed to the sides of the unit, forces the air through the outer unit coil by a means of a fan (not shown), and expels the air as indicated by the arrows above the outdoor unit. When operating as an air conditioner, the air is heated by the condenser coil within the outdoor unit and exits the top of the unit at a temperature higher than when it entered the sides. Air is blown over indoor coil 18 and is then circulated through residence 10 by means of ductwork 20, as indicated by the arrows entering and exiting ductwork 20. The overall system operates to maintain a desired temperature as set by a thermostat 22. When the temperature sensed inside the residence is higher than the set point on the thermostat (plus a small amount), the air conditioner will become operative to refrigerate additional air for circulation through the residence. When the temperature reaches the set point (minus a small amount), the unit will stop the refrigeration cycle temporarily.
When the unit in
Chiller 30, which includes heat exchangers for both evaporating and condensing a refrigerant as described above, cools water that is circulated to the air handlers. Air blown over additional coils that receive the water in the air handlers causes the water to increase in temperature and the circulated air to decrease in temperature. The cooled air is then routed to various locations in the building via additional ductwork. Ultimately, distribution of the air is routed to diffusers that deliver the cooled air to offices, apartments, hallways, and any other interior spaces within the building. In many applications, thermostats or other command devices (not shown in
System 40 cools an environment by cycling refrigerant within closed refrigeration loop 42 through a condenser 46, a compressor 48, an expansion device 50, and an evaporator 52. The refrigerant enters condenser 46 as a high pressure and temperature vapor and flows through the multichannel tubes of the condenser. A fan 54, which is driven by a motor 56, draws air across the multichannel tubes. The fan may push or pull air across the tubes. As the air flows across the tubes, heat transfers from the refrigerant vapor to the air, producing heated air 58 and causing the refrigerant vapor to condense into a liquid. The liquid refrigerant then flows into an expansion device 50 where the refrigerant expands to become a low pressure and temperature liquid. Typically, expansion device 50 will be a thermal expansion valve (TXV); however, according to other exemplary embodiments, the expansion device may be an orifice or a capillary tube. After the refrigerant exits the expansion device, some vapor refrigerant may be present in addition to the liquid refrigerant.
From expansion device 50, the refrigerant enters evaporator 52 and flows through the evaporator multichannel tubes. A fan 60, which is driven by a motor 62, draws air across the multichannel tubes. As the air flows across the tubes, heat transfers from the air to the refrigerant liquid, producing cooled air 64 and causing the refrigerant liquid to boil into a vapor. According to certain embodiments, the fan may be replaced by a pump that draws fluid through the evaporator. The evaporator may be a shell-and-tube heat exchanger, brazed plate heat exchanger, or other suitable heat exchanger.
The refrigerant then flows to compressor 48 as a low pressure and temperature vapor. Compressor 48 reduces the volume available for the refrigerant vapor, consequently, increasing the pressure and temperature of the vapor refrigerant. The compressor may be any suitable compressor such as a screw compressor, reciprocating compressor, rotary compressor, swing link compressor, scroll compressor, or turbine compressor. Compressor 48 is driven by a motor 66 that receives power from a variable speed drive (VSD) or a direct AC or DC power source. According to an exemplary embodiment, motor 66 receives fixed line voltage and frequency from an AC power source although in certain applications the motor may be driven by a variable voltage or frequency drive. The motor may be a switched reluctance (SR) motor, an induction motor, an electronically commutated permanent magnet motor (ECM), or any other suitable motor type. The refrigerant exits compressor 48 as a high temperature and pressure vapor that is ready to enter the condenser and begin the refrigeration cycle again.
The control devices 44, which include control circuitry 68, an input device 70, and a temperature sensor 72, govern the operation of the refrigeration cycle. Control circuitry 68 is coupled to the motors 56, 62, and 66 that drive condenser fan 54, evaporator fan 60, and compressor 48, respectively. Control circuitry 68 uses information received from input device 70 and sensor 72 to determine when to operate the motors 56, 62, and 66 that drive the air conditioning system. In certain applications, the input device may be a conventional thermostat. However, the input device is not limited to thermostats, and more generally, any source of a fixed or changing set point may be employed. These may include local or remote command devices, computer systems and processors, and mechanical, electrical and electromechanical devices that manually or automatically set a temperature-related signal that the system receives. For example, in a residential air conditioning system, the input device may be a programmable 24-volt thermostat that provides a temperature set point to the control circuitry. Sensor 72 determines the ambient air temperature and provides the temperature to control circuitry 68. Control circuitry 68 then compares the temperature received from the sensor to the temperature set point received from the input device. If the temperature is higher than the set point, control circuitry 68 may turn on motors 56, 62, and 66 to run air conditioning system 40. The control circuitry may execute hardware or software control algorithms to regulate the air conditioning system. According to exemplary embodiments, the control circuitry may include an analog to digital (A/D) converter, a microprocessor, a non-volatile memory, and an interface board. Other devices may, of course, be included in the system, such as additional pressure and/or temperature transducers or switches that sense temperatures and pressures of the refrigerant, the heat exchangers, the inlet and outlet air, and so forth.
Heat pump system 74 includes an outside coil 80 and an inside coil 82 that both operate as heat exchangers. The coils may function either as an evaporator or a condenser depending on the heat pump operation mode. For example, when heat pump system 74 is operating in cooling (or “AC”) mode, outside coil 80 functions as a condenser, releasing heat to the outside air, while inside coil 82 functions as an evaporator, absorbing heat from the inside air. When heat pump system 74 is operating in heating mode, outside coil 80 functions as an evaporator, absorbing heat from the outside air, while inside coil 82 functions as a condenser, releasing heat to the inside air. A reversing valve 84 is positioned on reversible loop 76 between the coils to control the direction of refrigerant flow and thereby to switch the heat pump between heating mode and cooling mode.
Heat pump system 74 also includes two metering devices 86 and 88 for decreasing the pressure and temperature of the refrigerant before it enters the evaporator. The metering devices also regulate the refrigerant flow entering the evaporator so that the amount of refrigerant entering the evaporator equals, or approximately equals, the amount of refrigerant exiting the evaporator. The metering device used depends on the heat pump operation mode. For example, when heat pump system 74 is operating in cooling mode, refrigerant bypasses metering device 86 and flows through metering device 88 before entering inside coil 82, which acts as an evaporator. In another example, when heat pump system 74 is operating in heating mode, refrigerant bypasses metering device 88 and flows through metering device 86 before entering outside coil 80, which acts as an evaporator. According to other exemplary embodiments, a single metering device may be used for both heating mode and cooling mode. The metering devices typically are thermal expansion valves (TXV), but also may be orifices or capillary tubes.
The refrigerant enters the evaporator, which is outside coil 80 in heating mode and inside coil 82 in cooling mode, as a low temperature and pressure liquid. Some vapor refrigerant also may be present as a result of the expansion process that occurs in metering device 86 or 88. The refrigerant flows through multichannel tubes in the evaporator and absorbs heat from the air changing the refrigerant into a vapor. In cooling mode, the indoor air flowing across the multichannel tubes also may be dehumidified. The moisture from the air may condense on the outer surface of the multichannel tubes and consequently be removed from the air.
After exiting the evaporator, the refrigerant passes through reversing valve 84 and into a compressor 90. Compressor 90 decreases the volume of the refrigerant vapor, thereby, increasing the temperature and pressure of the vapor. The compressor may be any suitable compressor such as a screw compressor, reciprocating compressor, rotary compressor, swing link compressor, scroll compressor, or turbine compressor.
From compressor 90, the increased temperature and pressure vapor refrigerant flows into a condenser, the location of which is determined by the heat pump mode. In cooling mode, the refrigerant flows into outside coil 80 (acting as a condenser). A fan 92, which is powered by a motor 94, draws air across the multichannel tubes containing refrigerant vapor. According to certain exemplary embodiments, the fan may be replaced by a pump that draws fluid across the multichannel tubes. The heat from the refrigerant is transferred to the outside air causing the refrigerant to condense into a liquid. In heating mode, the refrigerant flows into inside coil 82 (acting as a condenser). A fan 96, which is powered by a motor 98, draws air across the multichannel tubes containing refrigerant vapor. The heat from the refrigerant is transferred to the inside air causing the refrigerant to condense into a liquid.
After exiting the condenser, the refrigerant flows through the metering device (86 in heating mode and 88 in cooling mode) and returns to the evaporator (outside coil 80 in heating mode and inside coil 82 in cooling mode) where the process begins again.
In both heating and cooling modes, a motor 100 drives compressor 90 and circulates refrigerant through reversible refrigeration/heating loop 76. The motor may receive power either directly from an AC or DC power source or from a variable speed drive (VSD). The motor may be a switched reluctance (SR) motor, an induction motor, an electronically commutated permanent magnet motor (ECM), or any other suitable motor type.
The operation of motor 100 is controlled by control circuitry 102. Control circuitry 102 receives information from an input device 104 and sensors 106, 108, and 110 and uses the information to control the operation of heat pump system 74 in both cooling mode and heating mode. For example, in cooling mode, input device 104 provides a temperature set point to control circuitry 102. Sensor 110 measures the ambient indoor air temperature and provides it to control circuitry 102. Control circuitry 102 then compares the air temperature to the temperature set point and engages compressor motor 100 and fan motors 94 and 98 to run the cooling system if the air temperature is above the temperature set point. In heating mode, control circuitry 102 compares the air temperature from sensor 110 to the temperature set point from input device 104 and engages motors 94, 98, and 100 to run the heating system if the air temperature is below the temperature set point.
Control circuitry 102 also uses information received from input device 104 to switch heat pump system 74 between heating mode and cooling mode. For example, if input device 104 is set to cooling mode, control circuitry 102 will send a signal to a solenoid 112 to place reversing valve 84 in an air conditioning position 114. Consequently, the refrigerant will flow through reversible loop 76 as follows: the refrigerant exits compressor 90, is condensed in outside coil 80, is expanded by metering device 88, and is evaporated by inside coil 82. If the input device is set to heating mode, control circuitry 102 will send a signal to solenoid 112 to place reversing valve 84 in a heat pump position 116. Consequently, the refrigerant will flow through the reversible loop 76 as follows: the refrigerant exits compressor 90, is condensed in inside coil 82, is expanded by metering device 86, and is evaporated by outside coil 80.
The control circuitry may execute hardware or software control algorithms to regulate heat pump system 74. According to exemplary embodiments, the control circuitry may include an analog to digital (A/D) converter, a microprocessor, a non-volatile memory, and an interface board.
The control circuitry also may initiate a defrost cycle when the system is operating in heating mode. When the outdoor temperature approaches freezing, moisture in the outside air that is directed over outside coil 80 may condense and freeze on the coil. Sensor 106 measures the outside air temperature, and sensor 108 measures the temperature of outside coil 80. These sensors provide the temperature information to the control circuitry which determines when to initiate a defrost cycle. For example, if either sensor 106 or 108 provides a temperature below freezing to the control circuitry, system 74 may be placed in defrost mode. In defrost mode, solenoid 112 is actuated to place reversing valve 84 in air conditioning position 114, and motor 94 is shut off to discontinue air flow over the multichannel tubes. System 74 then operates in cooling mode until the increased temperature and pressure refrigerant flowing through outside coil 80 defrosts the coil. Once sensor 108 detects that coil 80 is defrosted, control circuitry 102 returns the reversing valve 84 to heat pump position 116. As will be appreciated by those skilled in the art, the defrost cycle can be set to occur at many different time and temperature combinations.
Each slab 120 and 122 includes manifolds 124, 126, 128, and 130 that are connected by multichannel tubes 132. Specifically, slab 122 includes manifolds 124 and 126, and slab 120 includes manifolds 128 and 130. The manifolds and tubes may be constructed of aluminum or any other material that promotes good heat transfer.
Refrigerant enters heat exchanger 118 through an inlet 134 and exits heat exchanger 118 through an outlet 136. Within heat exchanger 118, refrigerant flows from manifold 124 through the multichannel tubes of slab 122 to manifold 126. The refrigerant then enters slab 120 thorough manifold 130, flows thorough the multichannel tubes of slab 120 to manifold 128, and exists through outlet 136. Although thirty tubes are shown in each slab in
Baffles 138 divide the top manifolds 126 and 130 into sections, thereby subdividing the multichannel tubes 132 of slabs 120 and 122 into eight groups of tubes in this embodiment. Baffles subdivide slab 122 into four tube groups that provide refrigerant to four sections 140, 142, 144, and 146 of manifold 126. Baffles 138 subdivide slab 120 into four tube groups that receive fluid from four sections 148, 150, 152, and 154 of manifold 130. The sections 140, 142, 144, and 146 of slab 122 are adjacent to and align with corresponding sections 148, 150, 152, and 154 of slab 120. According to certain exemplary embodiments, the number of tubes within each tube group may vary, as may the number of groups in each slab (i.e., fewer groups may be included, but typically each slab will include at least two groups).
Fluid connections 156, 158, 160, and 162 transmit refrigerant from slab 122 to slab 120 by connecting sections of manifold 126 to sections of manifold 130. The fluid connections may be constructed of aluminum, stainless steel flexible hosing, or other suitable material and are generally tubular members that may be brazed or otherwise joined to manifolds 126 and 130. The connections fluidly connect tube groups of slab 122 with tube groups of slab 120. The corresponding tube groups connected by the fluid connections may be aligned with and adjacent to each other. For example, connection 156 transmits refrigerant from section 140 of slab 122 to section 148 of slab 120. Connection 162 transmits refrigerant from section 146 of slab 122 to section 154 of slab 120.
The fluid connections also may join nonadjacent tube groups allowing refrigerant to flow through different portions of each slab. For example, connection 158 transmits fluid from section 142 to non-adjacent section 152. Connection 160 transmits fluid from section 144 to non adjacent section 150. As those skilled in the art will appreciate, any configuration of fluid connections may be used to transmit refrigerant between the slabs. For example, according to other exemplary embodiments, a fluid connection may connect section 146 to section 150. Furthermore, in certain embodiments, fluid connections may be used to transmit refrigerant to multiple sections. For example, a fluid connection may be used to transmit fluid from section 144 to sections 150 and 148. In certain exemplary embodiments, fluid connections may connect tube groups within the same slab. Furthermore, the number of connections and tube groups within each coil slab may vary.
An external fluid 164, such as air may flow through coil slabs 120 and 122. As air 164 flows through the slabs, heat may be transferred to and from multichannel tubes. Air 164 first contacts slab 120 and flows through fins 165 located between multichannel tubes 132 to promote the transfer of heat between the tubes and the environment. According to exemplary embodiments, the fins are constructed of aluminum, brazed or otherwise joined to the tubes, and disposed generally perpendicular to the flow of refrigerant. However, according to other exemplary embodiments, the fins may be made of other materials that facilitate heat transfer and may extend parallel or at various angles with respect to the flow of the refrigerant. The fins may be louvered fins, corrugated fins, or any other suitable type of fin.
After flowing through slab 120, the air flows within the gap between the slabs. The gap may promote mixing and/or circulation of the air 154, which may function to reduce frost growth on multichannel tubes 132, particularly in outdoor heat pump applications. The gap also may promote an even air distribution across second slab 122. After flowing through the gap, the air flows through fins 165 of slab 122, transferring heat between the tubes in the environment.
The rate of air flow may vary across each slab 120 and 122. For example depending on environmental conditions, such as location of the heat exchanger and proximity of other equipment, the air flow through the fins in sections 154 and 146 may be lower than the air flow through the fins in sections 144 and 152. It is intended that the fluid connections be configured to maximize the heat transfer by directing the flow of refrigerant to various air flow sections, thereby promoting a balanced heat load across each slab. For example, as shown in
Slabs 120 and 122 each also have a set of lower tubes 194. The lower tubes of slab 120 are nonadjacent to the lower tubes of slab 122. Lower tubes 194 extend into manifold 184 at a height B that is smaller than height F. The smaller height B allows these tubes to extend and open into lower volume 190. Consequently, fluid may transfer from the lower tubes of slab 122 to the lower tubes of slab 120 within lower volume 190, as generally shown by reference numeral 198.
The flow paths 212 and 214 change positions between sections 202 and 204 with respect to the leading and trailing edges. Specifically, within tube section 204, flow path 212, indicated generally by the dashed line, is located near leading edge 216. In tube section 202, the same flow path 212 is located near trailing edge 222. Similarly, within tube section 204, flow path 214, indicated generally by the dotted and dashed line, is located near trailing edge 218. In tube section 202, the same flow path 214 is located near leading edge 220. The change in positions of flow paths 212 and 214 with respect to air flow 164 is intended to promote improved heat transfer by exposing each flow path to air flow near a leading edge and trailing edge. According to certain exemplary embodiments, the air flow rates and heat transfer rates may vary between the leading and trailing edges of a tube. For example, the air flow rate may be greater at the leading edge of a tube where the air has not encountered resistance as the air flows across the tube. Furthermore, the heat transfer may be greater at the leading edge of a tube where the temperature difference between the air and the refrigerant flowing within the tube may be the greatest.
As shown in
Fluid connections also may be used to connect sections within the same slab. Coil slabs 238 and 240 are divided into sections 242, 244, 246, and 248. Fluid connections 250 and 252 connect sections within the same slab. Specifically, connection 250 connects sections 242 and 244 of slab 240, while connection 252 connects sections 246 and 248 of slab 238. The fluid connections may be generally tubular members formed from aluminum, stainless steel flexible hosing, or other suitable materials and may be brazed or otherwise joined to the slabs. According to exemplary embodiments, fluid connections also may be used to connect multi-slab heat exchangers in a series to form larger closed loops providing additional heating and cooling capacity for the system.
The right V-shaped configuration shows the interconnection of multi-slab heat exchangers using fluid connections. Coil slabs 254 and 256 form a multi-slab heat exchanger inclined at the vertical with respect to coil slabs 258 and 260 that form another multi-slab heat exchanger. Baffles 138 divide each slab into sections and corresponding tube groups. Slab 254 is divided into sections 262 and 264; slab 265 is divided in sections 266 and 268; slab 258 is divided into sections 270 and 272; and slab 260 is divided in sections 274 and 276. Fluid connections 276, 278, 280, and 282 fluidly connect sections of one multi-slab heat exchanger to sections of the other multi-slab heat exchanger. Connection 276 connects upper section 262 of outer slab 254 to lower section 272 of outer slab 258. Connection 278 connects upper section 266 of inner slab 256 to lower section 276 of inner slab 260. The connection of sections within different locations of the multi-slab heat exchanger (for example, upper sections to lower sections) is intended to promote increased heat transfer by distributing refrigerant between sections receiving different air flow rates.
The connectors also may be used to connect sections of an outer slab to sections of an inner slab. Connection 280 connects lower section 268 of inner slab 256 to upper section 270 of outer slab 258. Connection 282 connects lower section 264 of outer slab 254 to upper section 274 of inner slab 260. As those skilled in the art will appreciate, any combination of connections may be used to distribute refrigerant between sections and corresponding tube groups. For example, a system may include connections that fluidly connect sections within a single multi-slab heat exchanger, as shown by connections 168 and 166. A system also may include connections that fluidly connect sections between two or more multi-slab heat exchangers, as shown by connections 276, 278, 280, and 282. Furthermore, single or double manifolds, such as those shown in
The fluid connections also may be employed to connect single slab heat exchangers disposed in a V-shaped configuration, as shown in
The fluid connections may be used to connect sections within the same slab or to connect sections between different slabs. For example, connection 304 connects sections 294 and 292 located within the same slab 284. The fluid connections also may be used to connect one section to multiple sections. For example, section 294 is connected to section 292 by connection 304 and is also connected to section 300 by connection 302. The connections also may connect sections positioned in different locations within the V-shaped configuration. For example, connection 316 connects upper section 310 to lower section 312. Connection 18 connects lower section 308 to upper section 314. The configurations of connections, sections, and heat exchangers are shown for illustrative purposes and are not intended to be limiting. Any combination of the connection types shown may be used to connect sections and corresponding tube groups of single and multi-slab heat exchangers.
It should be noted that the present discussion makes use of the term “multichannel” tubes or “multichannel heat exchanger” to refer to arrangements in which heat transfer tubes include a plurality of flow paths between manifolds that distribute flow to and collect flow from the tubes. A number of other terms may be used in the art for similar arrangements. Such alternative terms might include “microchannel” and “microport.” The term “microchannel” sometimes carries the connotation of tubes having fluid passages on the order of a micrometer and less. However, in the present context such terms are not intended to have any particular higher or lower dimensional threshold. Rather, the term “multichannel” used to describe and claim embodiments herein is intended to cover all such sizes. Other terms sometimes used in the art include “parallel flow” and “brazed aluminum”. However, all such arrangements and structures are intended to be included within the scope of the term “multichannel.” In general, such “multichannel” tubes will include flow paths disposed along the width or in a plane of a generally flat, planar tube, although, again, the invention is not intended to be limited to any particular geometry unless otherwise specified in the appended claims.
While only certain features and embodiments of the invention have been illustrated and described, many modifications and changes may occur to those skilled in the art (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the claimed invention). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.
This application claims priority from and the benefit of U.S. Provisional Application Ser. No. 60/952,280, entitled “MICROCHANNEL HEAT EXCHANGER APPLICATIONS”, filed Jul. 27, 2007, which is hereby incorporated by reference.
Number | Date | Country | |
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60952280 | Jul 2007 | US |
Number | Date | Country | |
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Parent | PCT/US08/71217 | Jul 2008 | US |
Child | 12200504 | US |