MULTI-STAGE COOLING SYSTEM

Abstract

A multi-stage cooling system includes a pressure-resistant container and a parallel-mode cooling device that is at least partially arranged in the pressure-resistant container. The pressure-resistant container can store a dry gas therein that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm. The parallel-mode cooling device includes two heat exchangers immersed in the dry gas. The two heat exchangers respectively have a first cooling critical value and a second cooling critical value that is less than the first cooling critical value. The parallel-mode cooling device is configured to reduce a temperature of the dry gas to the first cooling critical value through one of the two heat exchangers having a lower operation power, and then further to reduce the temperature of the dry gas through another one of the two heat exchangers having a higher operation power.

Description

CROSS-REFERENCE TO RELATED PATENT APPLICATION

This application claims the benefit of priority to Taiwan Patent Application No. 112138210, filed on Oct. 5, 2023. The entire content of the above identified application is incorporated herein by reference.

Some references, which may include patents, patent applications and various publications, may be cited and discussed in the description of this disclosure. The citation and/or discussion of such references is provided merely to clarify the description of the present disclosure and is not an admission that any such reference is “prior art” to the disclosure described herein. All references cited and discussed in this specification are incorporated herein by reference in their entireties and to the same extent as if each reference was individually incorporated by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to a cooling system, and more particularly to a multi-stage cooling system.

BACKGROUND OF THE DISCLOSURE

Most conventional cooling device use nitrogen to meet demands for rapid cooling. However, this cooling manner of the conventional cooling device is too energy-consuming and costly, and is gradually decreasing in compatibility with ever-changing trends in the relevant industry.

SUMMARY OF THE DISCLOSURE

In response to the above-referenced technical inadequacies, the present disclosure provides a multi-stage cooling system for effectively improving on the issues associated with conventional cooling devices.

In order to solve the above-mentioned problems, one of the technical aspects adopted by the present disclosure is to provide a multi-stage cooling system, which includes a pressure-resistant container, a parallel-mode cooling device, and a plurality of contactless test devices. The pressure-resistant container includes a gap storage room and a control valve that is in spatial communication with the gas storage room. The gap storage room is configured to store a dry gas that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm. The parallel-mode cooling device includes a first heat exchanger and a second heat exchanger. The first heat exchanger is at least partially arranged in the gas storage room and immersed in the dry gas. The first heat exchanger has a first cooling critical value. The second heat exchanger is at least partially arranged in the gas storage room and is immersed in the dry gas. Moreover, an operation power of the second heat exchanger is higher than an operation power of the first heat exchanger, and the second heat exchanger has a second cooling critical value that is less than the first cooling critical value. The parallel-mode cooling device is configured to reduce a temperature of the dry gas in the gas storage room to the first cooling critical value through the first heat exchanger, and then further to reduce the temperature of the dry gas from the first cooling critical value to a predetermined temperature through the second heat exchanger, the predetermined temperature being greater than or equal to the second cooling critical value. The contactless test devices are connected to the control valve of the pressure-resistant container. The control valve of the pressure-resistant container is configured to output the dry gas having the predetermined temperature from the gas storage room to a N number of the contactless test devices, selectively, for establishing a predetermined test environment in each of the N number of the contactless test devices. Moreover, N is a positive integer. At least one of the contactless test devices includes a single test socket and a gas pressure module. The single test socket is configured to perform an electrical test to a single device under test (DUT) and includes a lower chamber and an upper chamber. The lower chamber includes a signal transmitting board arranged on a bottom portion thereof. The lower chamber is configured to allow the DUT to be tightly fitted with an inner wall thereof and to be disposed on the signal transmitting board. The upper chamber is detachably assembled onto the lower chamber so as to jointly define a gas mixing room. The single test socket has a gas input channel and a gas output channel that are in spatial communication with the gas mixing room, and the gas mixing room is in spatial communication with an external space only through the gas input channel and the gas output channel. The gas pressure module is connected to the gas input channel and the gas output channel. The gas pressure module is connected to the control valve of the pressure-resistant container for allowing the dry gas to be injected into the gas mixing room from the pressure-resistant container, whereby the gas mixing room has the predetermined test environment for allowing the electrical test to be performed to the DUT.

In order to solve the above-mentioned problems, another one of the technical aspects adopted by the present disclosure is to provide a multi-stage cooling system, which includes a pressure-resistant container, a parallel-mode cooling device, and a plurality of contactless test devices. The pressure-resistant container includes a gap storage room and a control valve that is in spatial communication with the gas storage room. The gap storage room is configured to store a dry gas that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm. The parallel-mode cooling device includes a first heat exchanger and a second heat exchanger. The first heat exchanger is at least partially arranged in the gas storage room and is immersed in the dry gas. The first heat exchanger has a first cooling critical value. The second heat exchanger is at least partially arranged in the gas storage room and is immersed in the dry gas. Moreover, an operation power of the second heat exchanger is higher than an operation power of the first heat exchanger, and the second heat exchanger has a second cooling critical value that is less than the first cooling critical value. The parallel-mode cooling device is configured to reduce a temperature of the dry gas in the gas storage room to the first cooling critical value through the first heat exchanger, and then further to reduce the temperature of the dry gas from the first cooling critical value to a predetermined temperature through the second heat exchanger, the predetermined temperature being greater than or equal to the second cooling critical value. The contactless test devices are connected to the control valve of the pressure-resistant container. The control valve of the pressure-resistant container is configured to output the dry gas having the predetermined temperature from the gas storage room to a N number of the contactless test devices, selectively, for establishing a predetermined test environment in each of the N number of the contactless test devices. Moreover, N is a positive integer. At least one of the contactless test devices includes a machine, a test module, and a temperature adjustment module. The test module is assembled to the machine and includes a first test chamber, a second test chamber, and a test carrier. The first test chamber and the second test chamber are assembled to the machine. The second test chamber and the first test chamber are movable relative to each other along a first direction for jointly forming a test space. Moreover, a top portion of the first test chamber has an opening that is in spatial communication with the test space. The test carrier is disposed on the second test chamber and is configured to provide a device under test (DUT) to be disposed thereon. The temperature adjustment module is assembled to the first test chamber and is partially arranged in the test space, and the temperature adjustment module includes a temperature control mechanism and a fan mechanism. The temperature control mechanism includes a guiding shield and a temperature control unit. The guiding shield is arranged in the test space and is located above the test carrier. The temperature control unit is disposed in the guiding shield and is arranged adjacent to the opening. The fan mechanism is assembled into the opening of the first test chamber and faces toward the temperature control unit. The guiding shield and the fan mechanism jointly define an inner circulation path in the test space, and the inner circulation path travels along the temperature control unit and circulates through an inner side and an outer side of the guiding shield. The fan mechanism is operable to form a circulation airflow along the inner circulation path, and the circulation airflow maintains the predetermined temperature by traveling through the temperature control unit.

Therefore, in the multi-stage cooling system of the present disclosure, the dry gas in the pressure-resistant container is reserved in advance, so that the first heat exchanger and the second heat exchanger having different operation powers can be selectively used at different periods in time, thereby effectively saving energy.

These and other aspects of the present disclosure will become apparent from the following description of the embodiment taken in conjunction with the following drawings and their captions, although variations and modifications therein may be affected without departing from the spirit and scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The described embodiments may be better understood by reference to the following description and the accompanying drawings, in which:

FIG. 1 is a schematic view of a multi-stage cooling system according to a first embodiment of the present disclosure;

FIG. 2 is a schematic perspective view of a contactless test device of FIG. 1;

FIG. 3 is a schematic top view of FIG. 2;

FIG. 4 is a schematic exploded view of FIG. 2;

FIG. 5 is a schematic exploded view of a single test socket of FIG. 4;

FIG. 6 is a schematic exploded view of a single test socket of FIG. 4 from another angle of view;

FIG. 7 is a schematic cross-sectional view taken along line VII-VII of FIG. 3;

FIG. 8 is a schematic cross-sectional view showing a follow-up step of the single test socket in FIG. 7;

FIG. 9 is a schematic view of the multi-stage cooling system according to a second embodiment of the present disclosure;

FIG. 10 is a schematic view of the multi-stage cooling system in another configuration according to the second embodiment of the present disclosure;

FIG. 11 is a schematic perspective view of the contactless test device according to a third embodiment of the present disclosure;

FIG. 12 is a schematic perspective view showing a follow-up step of the contactless test device in FIG. 11;

FIG. 13 is a schematic planar cross-sectional view of FIG. 12;

FIG. 14 is a schematic perspective cross-sectional view showing a follow-up step of the contactless test device in FIG. 12;

FIG. 15 is a schematic perspective cross-sectional view showing a follow-up step of the contactless test device in FIG. 14;

FIG. 16 is a schematic perspective cross-sectional view showing a follow-up step of the contactless test device in FIG. 15, in which the contactless test device is ready to perform a test process;

FIG. 17 is a schematic planar cross-sectional view showing the contactless test device when a fan mechanism is in a first operation mode according to the third embodiment of the present disclosure;

FIG. 18 is a schematic planar cross-sectional view showing the contactless test device when the fan mechanism is in a second operation mode according to the third embodiment of the present disclosure; and

FIG. 19 is a schematic perspective view of the fan mechanism according to the third embodiment of the present disclosure.

DETAILED DESCRIPTION OF THE EXEMPLARY EMBODIMENTS

The present disclosure is more particularly described in the following examples that are intended as illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. Like numbers in the drawings indicate like components throughout the views. As used in the description herein and throughout the claims that follow, unless the context clearly dictates otherwise, the meaning of “a,” “an” and “the” includes plural reference, and the meaning of “in” includes “in” and “on.” Titles or subtitles can be used herein for the convenience of a reader, which shall have no influence on the scope of the present disclosure.

The terms used herein generally have their ordinary meanings in the art. In the case of conflict, the present document, including any definitions given herein, will prevail. The same thing can be expressed in more than one way. Alternative language and synonyms can be used for any term(s) discussed herein, and no special significance is to be placed upon whether a term is elaborated or discussed herein. A recital of one or more synonyms does not exclude the use of other synonyms. The use of examples anywhere in this specification including examples of any terms is illustrative only, and in no way limits the scope and meaning of the present disclosure or of any exemplified term. Likewise, the present disclosure is not limited to various embodiments given herein. Numbering terms such as “first,” “second” or “third” can be used to describe various components, signals or the like, which are for distinguishing one component/signal from another one only, and are not intended to, nor should be construed to impose any substantive limitations on the components, signals or the like.

First Embodiment

Referring to FIG. 1 to FIG. 8, a first embodiment of the present disclosure is provided. As shown in FIG. 1, the present embodiment provides a multi-stage cooling system 100, which includes a pressure-resistant container 1, a parallel-mode cooling device 2 assembled to the pressure-resistant container 1, a plurality of contactless test devices 4 connected to the pressure-resistant container 1, and a pressurizing and drying mechanism 3 that is connected in-between the pressure-resistant container 1 and the contactless test devices 4, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the pressurizing and drying mechanism 3 can be omitted or can be replaced by other components.

The pressure-resistant container 1 in the present embodiment includes a first pressure-resistant tank 11, a control valve 12, a first output pipe connecting the first pressure-resistant tank 11 and the control valve 12, and a temperature sensor 14 that is arranged in the first pressure-resistant tank 11. An interior space of the first pressure-resistant tank 11 is defined as a gas storage room R that is in spatial communication with the control valve 12 through the first output pipe 13. The gap storage room R is configured to store a dry gas that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm.

Specifically, the gap storage room R in the present embodiment is connected to the pressurizing and drying mechanism 3, and the pressurizing and drying mechanism 3 is configured to provide the gas storage room R with the dry gas that has the dew point temperature being within a range from −30° C. to −100° C. and that has the pressure being within a range from 1.5 atm to 6 atm. Accordingly, the dry gas stored in the gap storage room R can have a high density of gas molecule, so that a heat exchange efficiency of the pressure-resistant container 1 can be effectively increased, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the dew point temperature or the pressure of the dry gas provided by the pressurizing and drying mechanism 3 can be adjusted or changed according to design requirements.

In the present embodiment, the parallel-mode cooling device 2 includes a first heat exchanger 21, a second heat exchanger 22, a heater 23, and a rapid cooler 24. Each of the first heat exchanger 21, a second heat exchanger 22 is at least partially arranged in the first pressure-resistant tank 11 (or the gap storage room R) and is immersed in the dry gas for reducing a temperature of the dry gas in the first pressure-resistant tank 11.

Specifically, an operation power of the second heat exchanger 22 is higher than an operation power of the first heat exchanger 21, the first heat exchanger 21 has a first cooling critical value, and the second heat exchanger 22 has a second cooling critical value that is less than the first cooling critical value. For example, a difference between the first cooling critical value of the first heat exchanger 21 and the second cooling critical value of the second heat exchanger 22 is preferably at least 20° C.

Moreover, the parallel-mode cooling device 2 is configured to reduce a temperature of the dry gas in the gas storage room R to the first cooling critical value through the first heat exchanger 21, and then further to reduce the temperature of the dry gas from the first cooling critical value through the second heat exchanger 22. For example, the second heat exchanger 22 is operated to reduce the temperature of the dry gas from the first cooling critical value to a predetermined temperature that is greater than or equal to the second cooling critical value.

Accordingly, in the multi-stage cooling system 100 of the present embodiment, the dry gas in the pressure-resistant container 1 is reserved in advance, the first heat exchanger 21 and the second heat exchanger 22 having different operation powers can be selectively used at different periods in time, thereby effectively saving energy.

It should be noted that the specific structures of the first heat exchanger 21 and the second heat exchanger 22 can be adjusted or changed according to design requirements and are not limited by the present embodiment. In order to clearly realize the present embodiment, the following description describes a preferred one of structures of each of the first heat exchanger 21 and the second heat exchanger 22.

In the present embodiment, the first heat exchanger 21 includes an evaporator 211, a condenser 212, an expansion valve 213, and a compressor 214. The evaporator 211 is arranged in the first pressure-resistant tank 11 for reducing the temperature of the dry gas in the first pressure-resistant tank 11. The condenser 212, the expansion valve 213, and the compressor 214 are arranged outside of the first pressure-resistant tank 11, the expansion valve 213 is connected in-between an inlet of the evaporator 211 and an outlet of the condenser 212, and the compressor 214 is connected in-between an outlet of the evaporator 211 and an inlet of the condenser 212, but the present disclosure is not limited thereto. In addition, the second heat exchanger 22 of the present embodiment can be a liquid nitrogen heat exchanger or a liquid helium heat exchanger, but the present disclosure is not limited thereto.

Moreover, the heater 23 is arranged in the first pressure-resistant tank 11 for adjusting the temperature of the dry gas in the first pressure-resistant tank 11. In other words, when the temperature of the dry gas is less than the predetermined temperature, the heater 23 can be used to slightly increase the temperature of the dry gas to the predetermined temperature. In addition, the rapid cooler 24 is arranged outside of the gas storage room R and is connected to the gas storage room R, and the rapid cooler 24 is configured to selectively inject a liquid nitrogen into the gas storage room R, thereby quickly reducing the temperature of the gas storage room R. However, since the rapid cooler 24 has a high operation power, the rapid cooler 24 is usually used when the schedule is urgent for reducing energy consumption.

The contactless test devices 4 are connected to the control valve 12 of the pressure-resistant container 1. The control valve 12 of the pressure-resistant container 1 is configured to output the dry gas having the predetermined temperature from the gas storage room R to a N number of the contactless test devices 4, selectively, for establishing a predetermined test environment in each of the N number of the contactless test devices 4. Moreover, N is a positive integer, and is less than or equal to a quantity of the contactless test devices 4.

In other words, the control valve 12 of the pressure-resistant container 1 can selectively output the dry gas to the N number of the contactless test devices 4 and a M number of contactless test devices 4 by different flowing amounts, thereby establishing different predetermined test environments. Specifically, M is a positive integer, and a sum of M and N is less than or equal to the quantity of the contactless test devices 4.

Accordingly, the multi-stage cooling system 100 in the present embodiment can be provided with the pressure-resistant container 1 for pre-storing the dry gas having the predetermined temperature, so that the control valve 12 can input the dry gas into any one of the contactless test devices 4 for quickly establishing the predetermined test environment, thereby effectively increasing an overall test efficiency.

Specifically, structures of the contactless test devices 4 may significantly influence the test efficiency, so that the following description describes the contactless test device 4 having a preferred test efficiency. As the contactless test devices 4 in the present embodiment are of substantially the same structure, the following description discloses the structure of just one of the contactless test devices 4 for the sake of brevity, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the contactless test devices 4 can be of different structures according to design requirements.

As shown in FIG. 2 to FIG. 4, the contactless test device 4 in the present embodiment includes a circuit board 4-2, a single test socket 4-1 assembled onto the circuit board 4-2, and a gas pressure module 4-3 that is connected to the single test socket 4-1. The gas pressure module 4-3 is connected in-between the control valve 12 and the pressurizing and drying mechanism 3, so that the gas pressure module 4-3 allows the dry gas to be injected into the single test socket 4-1 from the pressure-resistant container 1, and the pressurizing and drying mechanism 3 can recycle gas outputted from the single test socket 4-1, but the present disclosure is not limited thereto.

For example, in other embodiments of the present disclosure not shown in the drawings, the circuit board 4-2 of the contactless test device 4 can be omitted or can be replaced by other components; or, the gas pressure module 4-3 is not connected to the pressurizing and drying mechanism 3. The following description describes the structure of the single test socket 4-1, and then describes connection relationships between the single test socket 4-1 and any one of the circuit board 4-2 and the gas pressure module 4-3.

As shown in FIG. 5 to FIG. 8, the single test socket 4-1 in the present embodiment is configured to perform an electrical test to a single device under test DUT, and the device under test DUT can be a high-power electronic component (e.g., a system-in-package component). In other words, the single test socket 4-1 in the present embodiment cannot be used to simultaneously test more than one electronic component.

The single test socket 4-1 includes a lower chamber 41 and an upper chamber 42 that is detachably assembled to the lower chamber 41, and the upper chamber 42 can cover onto the lower chamber 41 so as to jointly define a gas mixing room 43. The single test socket 4-1 (e.g., at least one of the lower chamber 41 and the upper chamber 42) has a gas input channel 431 and a gas output channel 432 that are in spatial communication with the gas mixing room 43, and the gas pressure module 4-3 is connected to the gas input channel 431 and the gas output channel 432.

Moreover, the gas mixing room 43 is in spatial communication with an external space only through the gas input channel 431 and the gas output channel 432, so that an interior environment of the gas mixing room 43 is only controlled by the gas pressure module 4-3 (e.g., a connection interface between the lower chamber 41 and the upper chamber 42 being sealed). In other words, the gas pressure module 4-3 is connected to the control valve 12 of the pressure-resistant container 1 for allowing the dry gas to be injected into the gas mixing room 43 from the pressure-resistant container 1, whereby the gas mixing room 43 has the predetermined test environment for allowing the electrical test to be performed to the device under test DUT.

Specifically, the lower chamber 41 includes a signal transmitting board 415 arranged on a bottom portion thereof, and the single test socket 4-1 is assembled onto the circuit board 4-2 through the signal transmitting board 415 of the lower chamber 41 (e.g., the signal transmitting board 415 and the circuit board 4-2 being electrically coupled to each other). Moreover, the lower chamber 41 is configured to allow the device under test DUT to be tightly fitted with an inner wall 4111 thereof and to be disposed on the signal transmitting board 415, such that the device under test DUT is electrically coupled to the circuit board 4-2 through the signal transmitting board 415.

In summary, the gas mixing room 43 formed in the contactless test device 4 (or the single test socket 4-1) provided by the present embodiment has a volume being only suitable for a single one of the device under tests DUT, so that the gas mixing room 43 can be used to quickly establish the predetermined test environment and to quickly dissipate heat generated from the device under test DUT, thereby effectively saving energy used in test and increasing the overall test efficiency.

In addition, the contactless test device 4 can achieve the above technical effect by being formed of different structures, and the following description describes the contactless test device 4 of one of the different structures having a preferred test efficiency, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the contactless test device 4 can have a part of the following features.

In the present embodiment, the gas input channel 431 is formed in the lower chamber 41, the gas output channel 432 is formed in the upper chamber 42, and the volume of the gas mixing room 43 is preferably within a range from 2 times to 10 times of a volume of the device under test DUT. Moreover, any one of the lower chamber 41 and the upper chamber 42 in the present embodiment is provided by assembling multiple pieces, and can be adjusted to be a single one-piece structure according to design requirements.

The lower chamber 41 in the present embodiment includes a first frame 411, a second frame 412 assembled to the first frame 411, an inner elastic gasket 413 sandwiched between the first frame 411 and the second frame 412, and an outer elastic gasket 414 that is sandwiched between the second frame 412 and the upper chamber 42. Each of the first frame 411, the second frame 412, the inner elastic gasket 413, and the outer elastic gasket 414 has a rectangular shape or a square shape, and surrounds at an outer side of the gas mixing room 43.

Moreover, the signal transmitting board 415 is assembled to a bottom of the first frame 411 for being jointly disposed on the circuit board 4-2. In other words, a lower-half portion of the first frame 411 adjacent to the signal transmitting board 415 has the inner wall 4111 that is tightly fitted with the device under test DUT, and the first frame 411 further has a guiding slanting surface 4112 connected to the inner wall 4111 for guiding the device under test DUT into the inner wall 4111.

Specifically, the gas input channel 431 is formed in the first frame 411 and has a gas inlet 4311 that is arranged at the gas mixing room 43 and that is higher than the device under test DUT (or the inner wall 4111) with respect to the signal transmitting board 415. In the present embodiment, the gas inlet 4311 is formed on the guiding slanting surface 4112, and a specific length and a structure of the gas input channel 431 can be changed or adjusted according to design requirements, but the present disclosure is not limited thereto.

The second frame 412 has an inner ring-shaped groove 4121 recessed in a bottom surface thereof and an outer ring-shaped groove 4122 that is recessed in a top surface thereof. The inner elastic gasket 413 is disposed in the inner ring-shaped groove 4121 and partially protrudes from the inner ring-shaped groove 4121. The outer elastic gasket 414 is disposed in the outer ring-shaped groove 4122 and partially protrudes from the outer ring-shaped groove 4122.

Moreover, the second frame 412 is threaded to the first frame 411, and the bottom surface of the second frame 412 compresses the inner elastic gasket 413 and further abuts against the first frame 411, so that the connection interface between the first frame 411 and the second frame 412 is sealed through the inner elastic gasket 413 being elastically deformed. An inner wall of the second frame 412 is located outside of the guiding slanting surface 4112 of the first frame 411, and an outer lateral edge of the second frame 412 is flush with an outer lateral edge of the first frame 411.

In other embodiments of the present disclosure not shown in the drawings, the first frame 411 and the second frame 412 can be integrally formed as a single-one piece structure, such that the lower chamber 41 can be provided without the inner elastic gasket 413.

The upper chamber 42 is detachably assembled to the lower chamber 41 (e.g., the second frame 412), and the upper chamber 42 in the present embodiment includes a covering plate 421 and a positioning mechanism 422 that is assembled to the covering plate 421. The gas output channel 432 is formed in the covering plate 421 and has a gas outlet 4321 that is arranged at the gas mixing room 43 and that is higher than the device under test DUT (and the gas inlet 4311) with respect to the signal transmitting board 415.

The covering plate 421 has a thru-hole 4211 substantially arranged on a center portion thereof. The positioning mechanism 422 is assembled to the covering plate 421 in a manipulable manner and is arranged in the thru-hole 4211. The positioning mechanism 422 includes a manipulation portion 4221 arranged outside of the gas mixing room 43 and a pressing portion 4222 that is arranged in the gas mixing room 43. An interface between the positioning mechanism 422 and a wall defining the thru-hole 4211 is sealed, and the manipulation portion 4221 is rotatable to drive the pressing portion 4222 to be moved toward or away from the signal transmitting board 415.

In summary, the positioning mechanism 42 is configured to move the pressing portion 4222 toward the signal transmitting board 415 through the manipulation portion 4221, thereby allowing the pressing portion 4222 to abut against the device under test DUT and enabling the device under test DUT to be flatly disposed onto the signal transmitting board 415. In other words, the volume of the gas mixing room 43 is controlled to be a small value, so that a gas environment of the gas mixing room 43 is easily controlled, and a movement of the pressing portion 422 can be shortened, thereby increasing the test efficiency.

In addition, the covering plate 421 is detachably assembled to the lower chamber 41, one side of the covering plate 421 is pivotally connected to the lower chamber 41 (e.g., one side of the second frame 412), and another side of the covering plate 421 is detachably engaged with the lower chamber 41 (e.g., another side of the second frame 412), so that the covering plate 421 compresses the outer elastic gasket 414 and further abuts against the second frame 412. Accordingly, the connection interface between the covering plate 421 and the second frame 412 is sealed through the outer elastic gasket 414 being elastically deformed.

In summary, due to the structural design and cooperation of the upper chamber 42 and the lower chamber 41, the gas mixing room 43 defined by the upper chamber 42 and the lower chamber 41 is capable of bearing a pressure that is greater than 1 atm (e.g., the gas mixing room 43 being capable of bearing of a pressure within a range from 1.5 atm to 6 atm). Accordingly, the gas mixing room 43 can have a high density of gas molecule, thereby effectively increasing a heat exchange efficiency between the dry gas and the device under test DUT, and facilitating a quick adjustment of environment parameters of the gas mixing room 43.

In other embodiments of the present disclosure not shown in the drawings, the upper chamber 42 can only include the covering plate 421 having no thru-hole 4211 and is provided without the positioning mechanism 422; or, the covering plate 421 can be detachably assembled to the lower chamber 41 in a manner (e.g., a threaded manner) other than the pivotal connection manner and the engagement manner according to design requirements.

In addition, the gas pressure module 4-3 of the present embodiment includes a gas input valve 4-31 connected to the control valve 12, a gas input pipe 4-32 connecting the gas input valve 4-31 and the gas input channel 431, a gas output valve 4-33 connected to the pressurizing and drying mechanism 3, and a gas output pipe 4-34 that connects the gas output valve 4-33 and the gas output channel 432. The gas pressure module 4-3 can use the gas input valve 4-31 and the gas input valve 4-31 to input the dry gas into the gas mixing room 43 along the gas input channel 431, but the present disclosure is not limited thereto.

Moreover, the gas output valve 4-33 and the gas output pipe 4-34 of the gas pressure module 4-3 can be used to control the gas mixing room 43 to output the gas therein. In other words, the gas pressure module 4-3 can effectively control environment parameters of the gas mixing room 43 to form the predetermined test environment through the gas input valve 4-31 and the gas output valve 4-33.

Second Embodiment

Referring to FIG. 9 and FIG. 10, a second embodiment of the present disclosure, which is similar to the first embodiment of the present disclosure, is provided. For the sake of brevity, descriptions of the same components in the first and second embodiments of the present disclosure will be omitted herein, and the following description only discloses different features between the first and second embodiments.

In the present embodiment, the pressure-resistant container 1 further includes a second pressure-resistant tank 15 connected to the pressurizing and drying mechanism 3, a second output pipe 16 that connects the second pressure-resistant tank 15 and the control valve 12, and a connection pipe 17 that connects the first pressure-resistant tank 11 and the second pressure-resistant tank 15. Moreover, each of an interior space of the first pressure-resistant tank 11 and an interior space of the second pressure-resistant tank 15 is defined as a part of the gas storage room R. In other words, the gas storage room R in the present embodiment is jointly defined by the interior space of the first pressure-resistant tank 11 and the interior space of the second pressure-resistant tank 15.

Specifically, the first heat exchanger 21 is at least partially arranged in the first pressure-resistant tank 11, and the rapid cooler 24 is assembled to the first pressure-resistant tank 11. The structure and connection relationships of the rapid cooler 24, the first heat exchanger 21, the first pressure-resistant tank 11 in the present embodiment are substantially identical to those of the first embodiment, and are not described in the following description for the sake of brevity. Moreover, the second heat exchanger 22 is at least partially arranged in the second pressure-resistant tank 15, and the pressure-resistant tank 15 is configured to receive the dry gas in the first pressure-resistant tank 11 cooled by the first heat exchanger 21, and the second heat exchanger 22 is configured to further reduce the temperature of the dry gas transmitted from the first pressure-resistant tank 11.

In addition, the control valve 12 is configured to selectively output the dry gas from at least one of the first pressure-resistant tank 11 and the second pressure-resistant tank 15, but the present disclosure is not limited thereto. For example, as shown in FIG. 10, the pressure-resistant container 1 can be provided without the first output pipe 13, and the parallel-mode cooling device 2 can be provided without the rapid cooler 24. In other embodiments of the present disclosure not shown in the drawings, the rapid cooler 24 can be assembled to the second pressure-resistant tank 15.

Third Embodiment

Referring to FIG. 11 to FIG. 19, a third embodiment of the present disclosure, which is similar to the first and second embodiments of the present disclosure, is provided. For the sake of brevity, descriptions of the same components in the first to third embodiments of the present disclosure will be omitted herein, and the following description only discloses different features of the contactless test device 4 provided by the first to third embodiments.

In the present embodiment, the contactless test device 4 is connected to the pressurizing and drying mechanism 3 and the pressure-resistant container 1. The contactless test device 4 includes a machine 1a, a test module 2a assembled to the machine 1a, and a temperature adjustment module 4a that is assembled to the test module 2a, but the present disclosure is not limited thereto.

The test module 2a includes a first test chamber 21a, a second test chamber 22a corresponding in position to the first test chamber 21a, a test carrier 23a disposed on the second test chamber 22a, a sealing gasket 24a arranged between the first test chamber 21a and the second test chamber 22a, and a sealing mechanism 25a, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, at least one of the sealing gasket 24a and the sealing mechanism 25a of the contactless test device 4 can be omitted or can be replaced by other components according to design requirements.

The first test chamber 21a and the second test chamber 22a are assembled to the machine 1a, and the second test chamber 22a and the first test chamber 21a are movable relative to each other along a first direction D1 (e.g., a vertical direction) for jointly forming an enclosed test space S. It should be noted that the specific structures of the first test chamber 21a and the second test chamber 22a can be adjusted or changed according to design requirements, and the following description describes a possible one of the specific structures of each of the first test chamber 21a and the second test chamber 22a.

The first test chamber 21a includes a first accommodating portion 211a, a first sealing portion 212a connected to a peripheral edge of the first accommodating portion 211a, and a plurality of first reinforced ribs 213a that are formed on an outer surface of the first accommodating portion 211a and an outer surface of the first sealing portion 212a. In the present embodiment, the first accommodating portion 211a is substantially a rectangular slot having a slot opening arranged on a bottom part thereof, and has an opening 2111a that is formed on a top part thereof and that is in spatial communication with the test space S. The first sealing portion 212a is connected to and surrounds the slot opening of the first accommodating portion 211a so as to have a rectangular ring-shape.

In addition, the first accommodating portion 211a of the first test chamber 21a has at least one outer hole 2112a that is in spatial communication with the test space S. In the present embodiment, a quantity of the at least one outer hole 2112a is multiple, and the pressurizing and drying mechanism 3 and the pressure-resistant container 1 are connected to the outer holes 2112a for being in spatial communication with the test space S, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the pressurizing and drying mechanism 3 and/or the pressure-resistant container 1 can be in spatial communication with the test space S by being connected to holes formed on the second test chamber 22a (e.g., the second accommodating portion 221a) according to design requirements.

Moreover, the first accommodating portion 211a, the first sealing portion 212a, and the first reinforced ribs 213 jointly define a plurality of first open-type partitions 214a. Four of the first open-type partitions 214a are respectively arranged on four corners of the first test chamber 21a, and the first test chamber 21a is fixed to the machine 1a through the four of the first open-type partitions 214a (e.g., such that the first test chamber 21a of the present embodiment cannot be moved relative to the machine 1a).

The second test chamber 22a includes a second accommodating portion 221a, a second sealing portion 222a connected to a peripheral edge of the second accommodating portion 221a, and a plurality of second reinforced ribs 223a that are formed on an outer surface of the second accommodating portion 221a and an outer surface of the second sealing portion 222a. In the present embodiment, the second accommodating portion 221a is substantially a rectangular structure, and the test carrier 23a is disposed on the second accommodating portion 221a and is configured to provide the at least one device under test DUT to be disposed thereon and to have an electrical test. The second sealing portion 222a has a rectangular ring-shape, and the second sealing portion 222a has a plurality of elongated thru-holes 2221a and a ring-shaped groove 2222a that is arranged between the test carrier 23a and the elongated thru-holes 2221a. The sealing gasket 24a is engaged in the ring-shaped groove 2222a.

Moreover, the second sealing portion 222a faces toward the first sealing portion 212a along the first direction D1, the sealing gasket 24a is located between the first sealing portion 212a and the second sealing portion 222a, and the second reinforced ribs 223a respectively correspond in position to the first reinforced ribs 213a along the first direction D1. The second accommodating portion 221a, the second sealing portion 222a, and the second reinforced ribs 223a jointly define a plurality of second open-type partitions 224a. The second open-type partitions 224a respectively correspond in position to the first open-type partitions 214a along the first direction D1, and each of the elongated thru-holes 2221a is in spatial communication with one of the second open-type partitions 224a.

In summary, the first test chamber 21a and the second test chamber 22a are movable relative to each other for jointly forming the test space, so that the first accommodating portion 211a and the second accommodating portion 221a jointly define the test space S, and the sealing gasket 24a is sandwiched between the first sealing portion 212a and the second sealing portion 222a, thereby achieving a pre-closed process (as shown in FIG. 14).

Specifically, the relative movement of the first test chamber 21a and the second test chamber 22a in the present embodiment is implemented by the machine 1a, and the following description describes the machine 1a in a possible configuration, but the present disclosure is not limited thereto. As shown in FIG. 11 to FIG. 13, the machine 1a includes a track mechanism 11a (e.g., a linear guideway) and a raising mechanism 12a (e.g., a pneumatic cylinder or a hydraulic cylinder) that corresponds in position to the track mechanism 11a. The second test chamber 22a is assembled to the track mechanism 11a, so that the second test chamber 22a is movable between a placing position (as shown in FIG. 11) and a processing position (as shown in FIG. 12 and FIG. 13) along a second direction D2 perpendicular to the first direction D1 through the track mechanism 11a.

For example, as shown in FIG. 11, when the second test chamber 22a is at the placing position, the second test chamber 22a is staggered with the first test chamber 21a, such that the test carrier 23a on the second test chamber 22a can provide the at least one device under test DUT to be disposed thereon.

As shown in FIG. 12 and FIG. 13, when the second test chamber 22a is at the processing position, the second sealing portion 222a faces toward the first sealing portion 121a along the first direction D1, the raising mechanism 12a corresponds in position to the second test chamber 22a and drives the second test chamber 22a to be moved along the first direction D1 for achieving the pre-closed process.

As shown in FIG. 13 to FIG. 16, the sealing mechanism 25a includes a driver 251a, a plurality of locking members 252a, and a transmission member 253a that is configured to transmit power from the driver 251a to the locking members 252a. The driver 251a is assembled to the machine 1a and is arranged adjacent to the first test chamber 21a, and the driver 251a in the present embodiment is a driving motor having a gear portion 2511a for outputting power.

Moreover, each of the locking members 252a has an interconnection end portion 2521a and a locking end portion 2522a that is opposite to the interconnection end portion 2521a, and the locking members 252a are rotatably disposed on the first sealing portion 212a of the first test chamber 21a. In the present embodiment, each of the locking members 252a is arranged in one of the first open-type partitions 214a and is erectly assembled to the first sealing portion 212a (e.g., central axes of the interconnection end portions 2521a being parallel to each other), and the interconnection end portion 2521a and the locking end portion 2522a of each of the locking members 252a are respectively located at two opposite sides of the first sealing portion 212a.

Specifically, the interconnected end portion 2521a of each of the locking members 252a is a gear, and the gear portion 2511a and the interconnected end portions 2521a are arranged in a plane that is higher than the first test chamber 21a with respect to the machine 1a. In other words, the gear portion 2511a and the interconnected end portions 2521a are arranged at one side of the first test chamber 21a away from the second test chamber 22a. In addition, the transmission member 253a is connected to the driver 251a and the interconnection end portions 2521a of the locking members 252a. In the present embodiment, the transmission member 253a is a transmission chain that is engaged with the gear portion 2511a and the interconnected end portions 2521a, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the cooperation of the transmission member 253a and the interconnected end portions 2521a can be replaced by a cooperation of a belt and friction pulleys; or, the driver 251a can be replaced by a pneumatic cylinder, a hydraulic cylinder, or other components.

Moreover, positions and shapes of the locking end portions 2522a respectively correspond to those of the elongated thru-holes 2221a. Accordingly, after the pre-closed process is achieved, the driver 251a is configured to drive the locking members 252a to be synchronously rotated to achieve a locking process (as shown in FIG. 15 and FIG. 16) through the transmission member 253a, so that two opposites of the second sealing portion 222a are sandwiched between the first sealing portion 212a and the locking end portion 2522a of each of the locking members 252a. In other words, the locking end portion 2522a of each of the locking members 252a passes through the corresponding elongated thru-hole 2221a during the pre-closed process and is rotated to be staggered with the corresponding elongated thru-hole 2221a during the locking process.

It should be noted that after the locking process is achieved by the sealing mechanism 25a, a high-pressure environment in the test space S of the test module 2 needs to be maintained for a long time, so that the locking process or the sealing mechanism 25a has a high sealing requirement (e.g., the driver 251a must output a great power to implement the locking process) and is not easily implemented by conventional means.

Accordingly, as shown in FIG. 12 to FIG. 16, after the pre-closed process of the present embodiment is achieved, the pressurizing and drying mechanism 3 (e.g., a pump) is further configured to perform a vacuuming process to the test space S of the contactless test device 4, so that the test space S is in a negative pressure state for enabling the first sealing portion 212a and the second sealing portion 222a to be tightly connected to each other (or to tightly clamp the sealing gasket 24a), thereby facilitating an implementation of the locking process by the sealing mechanism 25a (e.g., the driver 251a can output a smaller power to implement the locking process). Accordingly, the high-pressure environment in the test space S can be maintained for a long time through the sealing mechanism 25a.

Specifically, the pressurizing and drying mechanism 3 is connected to at least one of the first accommodating portion 211a and the second accommodating portion 221a (e.g., the pressurizing and drying mechanism 3 in the present embodiment being connected to the first accommodating portion 211a) for being in spatial communication with the test space S, thereby being capable of implementing the vacuuming process.

As shown in FIG. 16 to FIG. 19, the temperature adjustment module 4a is assembled to the first test chamber 21a and is partially arranged in the test space S. Specifically, the temperature adjustment module 4a includes a temperature control mechanism 41a, a fan mechanism 43a assembled to the first test chamber 21a (e.g., the opening 2111a), and a heating lamp 42a that is arranged in the test space S.

The temperature control mechanism 41a includes a guiding shield 411a and a temperature control unit 412a that is arranged in the guiding shield 411a. The guiding shield 411a is arranged in the test space S and is located above the test carrier 23a.

Specifically, the guiding shield 411a includes an arrangement tube 4111a arranged adjacent to the opening 2111a and a shield body 4112a that extends from a bottom edge of the arrangement tube 4111a toward the second test chamber 22a. The shield body 4112a is tapered in a direction from the second test chamber 22a towards the arrangement tube 4111a. In other words, the shield body 4112a has a shape of truncated cone and is preferably spaced apart from any one of the first test chamber 21a and the second test chamber 22a by a gap.

Moreover, the temperature control unit 412a is disposed in the guiding shield 411a (e.g., the arrangement tube 4111a) and is arranged adjacent to the opening 2111a. The temperature control unit 412a includes at least one of a heater 4121a (i.e., an electrical heater) and a cooler 4122a (e.g., and evaporator). In other words, a quantity of the heater 4121a and the cooler 4122a provided by the temperature control unit 412a of the present embodiment can be adjusted or changed according to design requirements.

The fan mechanism 43a is assembled into the opening 2111a of the first test chamber 21a and faces toward the temperature control unit 412a. The guiding shield 411a and the fan mechanism 43a jointly define an inner circulation path in the test space S, and the inner circulation path travels along the temperature control unit 412a and circulates through an inner side and an outer side of the guiding shield 411a. Furthermore, the fan mechanism 43a is operable to form a circulation airflow F along the inner circulation path, and the circulation airflow F maintains the predetermined temperature by traveling through the temperature control unit 412a. The heating lamp 42a in the test space S can be in cooperation with the temperature control unit 412a (e.g., the heater 4121a) for heating the circulation airflow F, thereby effectively increasing the heating efficiency.

Specifically, the structure of the fan mechanism 43a preferably prevents temperature and pressure of the circulation airflow F in the test space S from being affected thereby, and the following description describes the fan mechanism 43a having a preferred structure, but the present disclosure is not limited thereto.

In the present embodiment, the fan mechanism 43a includes a frame 431a, a motor 432a assembled to the frame 431a, an isolation layer 433a assembled in the frame 431a, a rotational shaft 434a rotatably passing through the isolation layer 433a, a blade 435a fixed to the rotational shaft 434a, a heat-isolation coupling 436a arranged in the frame 431a, and a housing 437a, but the present disclosure is not limited thereto. For example, in other embodiments of the present disclosure not shown in the drawings, the housing 437a can be omitted or can be replaced by other components.

Specifically, the frame 431a has a rectangular tube shape, one end of the frame 431a is assembled to the opening 2111a, the motor 432a is assembled to another end of the frame 431a, an output shaft 4321a of the motor 432a is arranged in the frame 431a, and a main body of the motor 432a is arranged outside of the frame 431a. Moreover, the isolation layer 433a is arranged adjacent to an interface between the frame 431a and the opening 2111a, such that temperature and pressure of an interior space of the frame 431a are isolated from those of the test space S through the isolation layer 433a.

Furthermore, one end of the rotational shaft 434a is arranged in the frame 431a, and another end of the rotational shaft 434a is arranged in the guiding shield 411a (e.g., the arrangement tube 4111a). The blade 435a is fixed to the another end of the rotational shaft 434a, and is arranged in the arrangement tube 4111a and located adjacent to the temperature control unit 412a. The output shaft 4321a and the rotational shaft 434a are arranged along a predetermined axis L, and the heat-isolation coupling 436a connects the output shaft 4321a and the one end of the rotational shaft 434a. Accordingly, the output shaft 4321a and the rotational shaft 434a can be synchronously rotated through the heat-isolation coupling 436a, and the heat-isolation coupling 436a is arranged to effectively prevent a heat energy from transmitting between the output shaft 4321a and the rotational shaft 434a.

It should be noted that the frame 431a preferably has an assembling hole 4311a corresponding in position to the heat-isolation coupling 436a, such that the heat-isolation coupling 436a can be assembled or detached in the frame 431a through the assembling hole 4311a. Moreover, the housing 437a is assembled to the top portion of the first test chamber 21a, and the housing 437a covers and encloses the frame 431a and the motor 432a (e.g., the main body) therein, such that the motor 432a and the heat-isolation coupling 436a can be separated from an external environment through the housing 437a.

In summary, the motor 432a is configured to drive the blade 435a to be rotated through the output shaft 4321a, the heat-isolation coupling 436a, and the rotational shaft 434a, thereby forming the circulation airflow F that travels in the test space S and that passes through the temperature control unit 412a. Accordingly, since the temperature adjustment module 4a in the present embodiment is provided with the heat-isolation coupling 436a and the isolation layer 433a, temperature of an airflow generated from the temperature adjustment module 4a can be precisely controlled and can avoid being affected by the motor 432a.

It should be noted that the blade 435a means a structure that can generate an airflow by rotation thereof, and a specific structure of the blade 435a can be adjusted or changed according to design requirements and is not limited by the drawings. For example, in other embodiments of the present disclosure not shown in the drawings, the blade 435a can be a turbine structure for providing a supercharging function.

In addition, the fan mechanism 43a in the present embodiment is operable in a first operation mode (as shown in FIG. 17) or a second operation mode (as shown in FIG. 18) according to practical requirements. Specifically, as shown in FIG. 17, when the fan mechanism 43a is in the first operation mode, the blade 435a of the fan mechanism 43a is rotated to form the circulation airflow F in the inner circulation path from the blade 435a toward the temperature control unit 412a (or the test carrier 23a), thereby enabling the circulation airflow F to quickly perform a heat exchange with the at least one device under test DUT. Or, as shown in FIG. 18, when the fan mechanism 43a is in the second operation mode, the blade 435a of the fan mechanism 43a is rotated to form the circulation airflow F in the circulation airflow along the inner circulation path from the temperature control unit 412a toward the blade 435a, thereby enabling a temperature distribution of the test space S to be more stable.

It should be noted that after the locking process is achieved, the test space S is substantially in a vacuum state, so that the contactless test device 4 can allow the pressure-resistant container 1 to input a predetermined gas into the test space S until the test space S arrives a predetermined pressure. Accordingly, a test process can be performed to the at least one device under test DUT on the test carrier 23a in the predetermined environment having the predetermined pressure and the predetermined temperature.

In summary, since the components of the contactless test device 4 in the present embodiment are in structural cooperation with each other, test parameters (e.g., the pressure and the temperature of the test space S) can be adjusted without contacting the at least one device under test DUT.

In addition, the predetermined gas outputted from the pressure-resistant container 1 can be changed according to design requirements. For example, the predetermined gas can be the dry gas or a gas (e.g., carbon oxide) having a molecular weight being greater than that of air, so that the circulation airflow F formed by the predetermined gas and having the predetermined temperature enables the test space S to quickly achieve the predetermined pressure.

BENEFICIAL EFFECTS OF THE EMBODIMENTS

In conclusion, in the multi-stage cooling system of the present disclosure, the dry gas in the pressure-resistant container is reserved in advance, so that the first heat exchanger and the second heat exchanger having different operation powers can be selectively used at different periods in time, thereby effectively saving energy.

Moreover, the multi-stage cooling system in the present disclosure can be provided with the pressure-resistant container for pre-storing the dry gas having the predetermined temperature, so that the control valve can input the dry gas into any one of the contactless test devices for quickly establishing the predetermined test environment, thereby effectively increasing an overall test efficiency.

In addition, the gas mixing room formed in the contactless test device provided by the present disclosure has a volume being only suitable for a single one of the device under test, so that the gas mixing room can be used to quickly establish the predetermined test environment and to quickly dissipate heat generated from the device under test, thereby effectively saving energy used in test and increasing the overall test efficiency.

The foregoing description of the exemplary embodiments of the disclosure has been presented only for the purposes of illustration and description and is not intended to be exhaustive or to limit the disclosure to the precise forms disclosed. Many modifications and variations are possible in light of the above teaching.

The embodiments were chosen and described in order to explain the principles of the disclosure and their practical application so as to enable others skilled in the art to utilize the disclosure and various embodiments and with various modifications as are suited to the particular use contemplated. Alternative embodiments will become apparent to those skilled in the art to which the present disclosure pertains without departing from its spirit and scope.

Claims

1. A multi-stage cooling system, comprising: a pressure-resistant container including a gap storage room and a control valve that is in spatial communication with the gas storage room, wherein the gap storage room is configured to store a dry gas that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm;a parallel-mode cooling device including: a first heat exchanger at least partially arranged in the gas storage room and immersed in the dry gas, wherein the first heat exchanger has a first cooling critical value; anda second heat exchanger at least partially arranged in the gas storage room and immersed in the dry gas, wherein an operation power of the second heat exchanger is higher than an operation power of the first heat exchanger, and the second heat exchanger has a second cooling critical value that is less than the first cooling critical value;wherein the parallel-mode cooling device is configured to reduce a temperature of the dry gas in the gas storage room to the first cooling critical value through the first heat exchanger, and then further to reduce the temperature of the dry gas from the first cooling critical value to a predetermined temperature through the second heat exchanger, the predetermined temperature being greater than or equal to the second cooling critical value; anda plurality of contactless test devices connected to the control valve of the pressure-resistant container, wherein the control valve of the pressure-resistant container is configured to output the dry gas having the predetermined temperature from the gas storage room to a N number of the contactless test devices, selectively, for establishing a predetermined test environment in each of the N number of the contactless test devices, and wherein N is a positive integer, and at least one of the contactless test devices includes: a single test socket configured to perform an electrical test to a single device under test (DUT) and including: a lower chamber including a signal transmitting board arranged on a bottom portion thereof, wherein the lower chamber is configured to allow the DUT to be tightly fitted with an inner wall thereof and to be disposed on the signal transmitting board; andan upper chamber that is detachably assembled onto the lower chamber so as to jointly define a gas mixing room;wherein the single test socket has a gas input channel and a gas output channel that are in spatial communication with the gas mixing room, and the gas mixing room is in spatial communication with an external space only through the gas input channel and the gas output channel; anda gas pressure module connected to the gas input channel and the gas output channel, wherein the gas pressure module is connected to the control valve of the pressure-resistant container for allowing the dry gas to be injected into the gas mixing room from the pressure-resistant container, whereby the gas mixing room has the predetermined test environment for allowing the electrical test to be performed to the DUT.

2. The multi-stage cooling system according to claim 1, further comprising a pressurizing and drying mechanism connected to the gas storage room, wherein the pressurizing and drying mechanism is configured to provide the gas storage room with the dry gas that has the dew point temperature being within a range from −30° C. to −100° C. and that has the pressure being within a range from 1.5 atm to 6 atm.

3. The multi-stage cooling system according to claim 1, wherein a difference between the first cooling critical value of the first heat exchanger and the second cooling critical value of the second heat exchanger is at least 20° C.

4. The multi-stage cooling system according to claim 1, wherein the parallel-mode cooling device includes a rapid cooler connected to the gas storage room, and the rapid cooler is configured to selectively inject a liquid nitrogen into the gas storage room.

5. The multi-stage cooling system according to claim 1, wherein the pressure-resistant container includes a first pressure-resistant tank and a first output pipe that connects the first pressure-resistant tank and the control valve, and an interior space of the first pressure-resistant tank is defined as at least part of the gas storage room, and wherein the first heat exchanger includes: an evaporator that is arranged in the first pressure-resistant tank;a condenser arranged outside of the first pressure-resistant tank;an expansion valve connected in-between an inlet of the evaporator and an outlet of the condenser; anda compressor connected in-between an outlet of the evaporator and an inlet of the condenser.

6. The multi-stage cooling system according to claim 5, wherein the pressure-resistant container includes a second pressure-resistant tank, a second output pipe that connects the second pressure-resistant tank and the control valve, and a connection pipe that connects the first pressure-resistant tank and the second pressure-resistant tank, wherein an interior space of the second pressure-resistant tank is defined as a part of the gas storage room, and wherein at least part of the second heat exchanger is arranged in the second pressure-resistant tank and is a liquid nitrogen heat exchanger or a liquid helium heat exchanger.

7. The multi-stage cooling system according to claim 1, wherein the lower chamber includes a first frame and a second frame that is assembled to the first frame, wherein the signal transmitting board is assembled to the first frame, and the gas input channel is formed in the first frame and has a gas inlet that is arranged at the gas mixing room and that is higher than the DUT with respect to the signal transmitting board, and wherein the upper chamber includes: a covering plate detachably assembled to the second frame and having the gas output channel and a thru-hole; anda positioning mechanism assembled to the covering plate and arranged in the thru-hole, wherein the positioning mechanism includes a manipulation portion arranged outside of the gas mixing room and a pressing portion that is arranged in the gas mixing room;wherein the positioning mechanism is configured to move the pressing portion toward the signal transmitting board through the manipulation portion for allowing the pressing portion to abut against the DUT so that the DUT is flatly disposed onto the signal transmitting board.

8. A multi-stage cooling system, comprising: a pressure-resistant container including a gap storage room and a control valve that is in spatial communication with the gas storage room, wherein the gap storage room is configured to store a dry gas that has a dew point temperature being less than −10° C. and that has a pressure being greater than 1 atm;a parallel-mode cooling device including: a first heat exchanger at least partially arranged in the gas storage room and immersed in the dry gas, wherein the first heat exchanger has a first cooling critical value; anda second heat exchanger at least partially arranged in the gas storage room and immersed in the dry gas, wherein an operation power of the second heat exchanger is higher than an operation power of the first heat exchanger, and the second heat exchanger has a second cooling critical value that is less than the first cooling critical value;wherein the parallel-mode cooling device is configured to reduce a temperature of the dry gas in the gas storage room to the first cooling critical value through the first heat exchanger, and then further to reduce the temperature of the dry gas from the first cooling critical value to a predetermined temperature through the second heat exchanger, the predetermined temperature being greater than or equal to the second cooling critical value; anda plurality of contactless test devices connected to the control valve of the pressure-resistant container, wherein the control valve of the pressure-resistant container is configured to output the dry gas having the predetermined temperature from the gas storage room to a N number of the contactless test devices, selectively, for establishing a predetermined test environment in each of the N number of the contactless test devices, and wherein N is a positive integer, and at least one of the contactless test devices includes: a machine;a test module assembled to the machine and including: a first test chamber and a second test chamber both being assembled to the machine, wherein the second test chamber and the first test chamber are movable relative to each other along a first direction for jointly forming a test space, and wherein a top portion of the first test chamber has an opening that is in spatial communication with the test space; anda test carrier disposed on the second test chamber and configured to provide a device under test (DUT) to be disposed thereon; anda temperature adjustment module assembled to the first test chamber and partially arranged in the test space, wherein the temperature adjustment module includes: a temperature control mechanism including: a guiding shield arranged in the test space and located above the test carrier; anda temperature control unit disposed in the guiding shield and arranged adjacent to the opening; anda fan mechanism assembled into the opening of the first test chamber and facing toward the temperature control unit, wherein the guiding shield and the fan mechanism jointly define an inner circulation path in the test space, the inner circulation path traveling along the temperature control unit and circulating through an inner side and an outer side of the guiding shield, and wherein the fan mechanism is operable to form a circulation airflow along the inner circulation path, and the circulation airflow maintains the predetermined temperature by traveling through the temperature control unit.

9. The multi-stage cooling system according to claim 8, wherein, in any one of the contactless test devices, the temperature control unit includes at least one of a heater and a cooler that is arranged adjacent to a blade of the fan mechanism.

10. The multi-stage cooling system according to claim 8, wherein, in any one of the contactless test devices, the guiding shield includes: an arrangement tube arranged adjacent to the opening, wherein the temperature control unit and a blade of the fan mechanism are located in the arrangement tube; anda shield body extending from a bottom edge of the arrangement tube toward the second test chamber, wherein the shield body is tapered in a direction from the second test chamber towards the arrangement tube.

11. The multi-stage cooling system according to claim 8, wherein, in any one of the contactless test devices, the fan mechanism is operable in a first operation mode or a second operation mode, wherein, when the fan mechanism is in the first operation mode, a blade of the fan mechanism is rotated to form the circulation airflow in the inner circulation path from the blade toward the temperature control unit, and wherein, when the fan mechanism is in the second operation mode, the blade of the fan mechanism is rotated to form the circulation airflow in the circulation airflow along the inner circulation path from the temperature control unit toward the blade.

12. The multi-stage cooling system according to claim 8, wherein, in any one of the contactless test devices, the first test chamber includes a first accommodating portion and a first sealing portion that is connected to a peripheral edge of the first accommodating portion, and the second test chamber includes a second accommodating portion and a second sealing portion that is connected to a peripheral edge of the second accommodating portion and that faces toward the first sealing portion along the first direction, wherein the test module includes a sealing gasket arranged between the first sealing portion and the second sealing portion, and wherein the first test chamber and the second test chamber are movable relative to each other for being closed with each other, so that the first accommodating portion and the second accommodating portion jointly define the test space, and the sealing gasket is sandwiched between the first sealing portion and the second sealing portion to complete a pre-closed process.

13. The multi-stage cooling system according to claim 12, wherein, in any one of the contactless test devices, the test module further includes a sealing mechanism including: a driver assembled to the machine;a plurality of locking members rotatably disposed on the first sealing portion of the first test chamber, wherein each of the locking members has an interconnection end portion and a locking end portion that is opposite to the interconnection end portion; anda transmission member connected to the driver and the interconnection end portions of the locking members;wherein, after the pre-closed process is complete, the driver is configured to drive the locking members to be synchronously rotated to perform a locking process through the transmission member, so that two opposites of the second sealing portion are sandwiched between the first sealing portion and the locking end portion of each of the locking members.

14. The multi-stage cooling system according to claim 13, further comprising a pressurizing and drying mechanism that is connected to the gas storage room and that is connected to at least one of the first accommodating portion and the second accommodating portion of each of the contactless test devices, wherein, after the pre-closed process is complete, the pressurizing and drying mechanism is configured to perform a vacuuming process to the test space of each of the contactless test devices for implementing the locking process.

15. The multi-stage cooling system according to claim 14, wherein the pressurizing and drying mechanism is configured to provide the gas storage room with the dry gas that has the dew point temperature being within a range from −30° C. to −100° C. and that has the pressure being within a range from 1.5 atm to 6 atm.

16. The multi-stage cooling system according to claim 13, wherein, in any one of the contactless test devices, the driver includes a gear portion, the interconnected end portion of each of the locking members is a gear, the transmission member is a transmission chain that is engaged with the gear portion and the interconnected end portions, the gear portion and the interconnected end portions are arranged in a plane that is higher than the first test chamber with respect to the machine, and central axes of the interconnected end portions are parallel to each other.

17. The multi-stage cooling system according to claim 8, wherein, in any one of the contactless test devices, the fan mechanism includes: a frame having one end assembled to the opening;a motor assembled to another end of the frame and having an output shaft arranged in the frame;an isolation layer assembled in the frame, wherein a temperature and a pressure of an interior space of the frame are isolated from those of the test space through the isolation layer;a rotational shaft rotatably passing through the isolation layer, wherein one end of the rotational shaft is arranged in the frame, and another end of the rotational shaft is arranged in the guiding shield;a blade fixed to the another end of the rotational shaft and arranged adjacent to the temperature control unit; anda heat-isolation coupling that connects the output shaft and the one end of the rotational shaft;wherein the motor is configured to drive the blade to be rotated through the output shaft, the heat-isolation coupling, and the rotational shaft, so as to the circulation airflow that travels through the temperature control unit.

18. The multi-stage cooling system according to claim 17, wherein, in any one of the contactless test devices, the fan mechanism includes a housing that is assembled to the top portion of the first test chamber and that covers and encloses the frame and the motor therein, and wherein the frame has an assembling hole corresponding in position to the heat-isolation coupling, and the heat-isolation coupling is configured to be assembled or detached in the frame through the assembling hole.

19. The multi-stage cooling system according to claim 8, wherein the pressure-resistant container includes a first pressure-resistant tank and a first output pipe that connects the first pressure-resistant tank and the control valve, and an interior space of the first pressure-resistant tank is defined as at least part of the gas storage room, and wherein the first heat exchanger includes: an evaporator that is arranged in the first pressure-resistant tank;a condenser arranged outside of the first pressure-resistant tank;an expansion valve connected in-between an inlet of the evaporator and an outlet of the condenser; anda compressor connected in-between an outlet of the evaporator and an inlet of the condenser.

20. The multi-stage cooling system according to claim 19, wherein the pressure-resistant container includes a second pressure-resistant tank, a second output pipe that connects the second pressure-resistant tank and the control valve, and a connection pipe that connects the first pressure-resistant tank and the second pressure-resistant tank, wherein an interior space of the second pressure-resistant tank is defined as a part of the gas storage room, and wherein at least part of the second heat exchanger is arranged in the second pressure-resistant tank and is a liquid nitrogen heat exchanger or a liquid helium heat exchanger.