The process measurement and control industry employs process variable transmitters to remotely monitor process variables associated with fluids such as slurries, liquids, vapors, gases in chemical, pulp, petroleum, pharmaceuticals, food and other processing plants. Examples of process variables include pressure, temperature, flow, level, turbidity, concentration, chemical composition, pH, gas detection and/or quantification, and other properties.
Process measurement systems employ sensors designed to sense a particular variable, such as temperature and employ measurement circuitry to sense or determine an electrical parameter of the sensor that can be used to calculate the process variable. For example, an RTD has a resistance that varies with temperature. Measurement circuitry coupled to an RTD may be configured to drive a small current through the RTD and measure a voltage across the RTD. The measured voltage is indicative of the resistance of the RTD and thus the temperature.
In another example, a gas detection system may employ an electrochemical sensor that provides an electrical response to the presence of a particular gas, such as hydrogen sulfide (H2S). In such instances, the measurement circuitry provides a suitable electrical excitation to the gas detection sensor in order to measure or otherwise obtain a sensor response.
Thus, process measurement systems employ a wide variety of sensors coupled to suitable detection electronics. Further, in some instances, the sensor may also include sensor electronics, that may amplify, linearize, or otherwise process the sensor signal before providing it to higher order electronics of a process measurement system. Accordingly, in many process measurement systems, it is necessary to physically and electrically couple a sensor to sensor measurement electronics or higher order electronics of the process measurement system.
A multi-stage irreversible sensor coupling is provided. A sensor body includes a sensor and has a sensor body wall and at least one sensor body engagement feature. A clip barrel is configured to slidably engage the sensor body and has at least one clip barrel engagement feature. A wedge clip is configured to slidably engage the clip barrel and has at least one wedge clip engagement feature that is configured to urge the at least one sensor body engagement feature into cooperative engagement with the at least one clip barrel engagement feature when the wedge clip, clip barrel, and sensor body are fully engaged together.
Some process measurement and control systems require a sensor body or module to be attached, both physically and electrically, to an electronics housing or module. While assembling the sensor body, it is often necessary to use an adhesive to permanently bond the final portions of the assembly. This permanent bond requires a controlled manufacturing process to ensure the quality of the adhesive joint. Oftentimes, this adds additional hour(s) and/or day(s) to the system build lead times. Additionally, the sensor is sometimes required to be tested on the final assembly line prior to application of the permanent adhesive and there is the possibility of the internal electrical connections between the sensor body and the electronics housing becoming damaged or otherwise corrupted due to operator handling of the adhesive process.
Embodiments described below generally provide a mechanical permanent coupling between a sensor body and an electronics housing that does not use permanent adhesive. Embodiments allow for partial assembly of the electrical end of the sensor body so that the electrical/signal connector that is being attached to the sensor can be wired and tested before finally coupling the connector into the sensor body at final assembly.
Electronics housing 101 may also contain power module 104 which is coupled to various subcomponents within system 100 as indicated by the arrow labeled “to all”. In examples where the system is battery powered, power module 104 may include one or more batteries, either rechargeable or non-rechargeable, as well suitable power conditioning circuitry.
Controller 102 is coupled to communication circuitry 106, which may include any suitable circuitry that is able to convey information regarding the process variable output(s). Communication circuitry 106 allows controller 102 to communicate process variable information to the remote device, as indicated above, but also may allow the controller 102 to receive information from one or more remote devices. Suitable examples of such process communication include the 4-20 mA protocol, Highway Addressable Remote Transducer (HART®) Protocol, FOUNDATION™ Fieldbus Protocol, and the WirelessHART Protocol (IEC62591).
Measurement circuitry 108 includes any suitable circuitry for determining an electrical response of sensor 110. For example, measurement circuitry 108 may include voltage or current source and a suitable amplifier and analog-to-digital converter to read or otherwise interrogate an analog signal from sensor 110 and provide a digital indication thereof to controller 102.
Sensor 110 is disposed within sensor body 103 and has an electrical characteristic that varies with the process variable for which it is selected. For example, sensor 110 may be a temperature sensor or a pressure sensor. In other examples, sensor 110 may be a gas sensor, a pH sensor, a conductivity sensor, etc. Sensor body 103 is coupled to electronics housing 101 via a permanent coupling 105. Sensor 110 is electrically coupled to measurement circuitry 108 via permanent coupling 105.
Clip barrel 158, in the illustrated example, includes one or more anti-rotation features 160, which will be described in greater detail below with respect to
During assembly, clip barrel 158 is first moved in the direction of arrow 180 with respect to sensor body 150. As this movement occurs, engagement feature 156 will be positioned near each other as illustrated in
The two-step assembly process generally provides a wedge type connection that snaps together in a two-piece assembly. As set forth above, the clip barrel 158 and wedge clip 170 are arranged in a pre-assembled orientation shown in
While embodiments described thus far have generally shown specific mechanical features that provide snap engagement and/or anti-rotation, it is expressly contemplated that various cooperation can be reversed and/or alternate mechanical features can be used. For example, in the embodiment shown in
While embodiments described herein are applicable to components that use any suitable materials, it is expressly contemplated that embodiments could be practiced where a single part is molded where one portion could be half stainless steel, and the other portion could be half molded plastic. Alternatively, the single part could be produced strictly in stainless steel or any other suitable metal, or in strictly molded plastic, or any other suitable polymer. Finally, the size of the coupling may vary depending on the application.
Although the present invention has been described with reference to preferred embodiments, workers skilled in the art will recognize that changes may be made in form and detail without departing from the spirit and scope of the invention.
Number | Name | Date | Kind |
---|---|---|---|
4046451 | Juds et al. | Sep 1977 | A |
4359255 | Gallusser et al. | Nov 1982 | A |
6252510 | Dungan | Jun 2001 | B1 |
6670887 | Dungan | Dec 2003 | B2 |
6794991 | Dungan | Sep 2004 | B2 |
7089778 | Rabenecker et al. | Aug 2006 | B2 |
7345590 | Nakano et al. | Mar 2008 | B2 |
7633963 | Anderson et al. | Dec 2009 | B1 |
8358105 | Barten et al. | Jan 2013 | B2 |
8578783 | Hedtke et al. | Nov 2013 | B2 |
8640560 | Burke | Feb 2014 | B2 |
20020013088 | Rodrigues et al. | Jan 2002 | A1 |
20020102884 | Pechstein et al. | Aug 2002 | A1 |
20040027912 | Bibbo et al. | Feb 2004 | A1 |
20040209507 | Starta et al. | Oct 2004 | A1 |
20060266097 | Eickhoff | Nov 2006 | A1 |
20070186630 | Skarpil | Aug 2007 | A1 |
20120240686 | Blomberg et al. | Sep 2012 | A1 |
20130319987 | Beistle et al. | Dec 2013 | A1 |
20150177206 | Basham et al. | Jun 2015 | A1 |
20150204830 | Arunachalam | Jul 2015 | A1 |
20180085696 | Morris et al. | Mar 2018 | A1 |
Number | Date | Country |
---|---|---|
103348057 | Oct 2013 | CN |
104067455 | Sep 2014 | CN |
104769651 | Jul 2015 | CN |
PCTEP2002000369 | Jul 2002 | EP |
10-2010-0096823 | Sep 2010 | KR |
20100096823 | Sep 2010 | KR |
2082956 | Jun 1997 | RU |
2016-030735 | Mar 2016 | WO |
2017205723 | Nov 2017 | WO |
Entry |
---|
Search Report and Written Opinion dated Dec. 15, 2021 for International Patent Application No. PCT/US2021/048645, 11 pages. |
Number | Date | Country | |
---|---|---|---|
20220091085 A1 | Mar 2022 | US |