Information
-
Patent Grant
-
6432218
-
Patent Number
6,432,218
-
Date Filed
Tuesday, December 7, 199925 years ago
-
Date Issued
Tuesday, August 13, 200222 years ago
-
Inventors
-
Original Assignees
-
Examiners
- Gulakowski; Randy
- Smetana; J
Agents
-
CPC
-
US Classifications
Field of Search
US
- 134 2
- 134 10
- 134 18
- 134 221
- 134 24
- 134 34
- 134 902
- 137 50
- 137 51
- 137 54
- 137 111
- 137 112
- 137 11501
- 137 24717
- 137 813
- 137 814
- 137 816
- 137 818
- 137 821
- 137 825
- 137 829
- 137 830
- 137 831
- 137 832
-
International Classifications
-
Abstract
A multi-step flow cleaning method and a multi-step flow cleaning apparatus are provided which effectively clean workpieces with a stream of a cleaning solution and to suppress an increase of foreign matters adhering to the surfaces of the workpieces. A cleaning tank 10 for holding workpieces is provided, a supply line 14 for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank is provided, and a valve 12 for adjusting the flow of the cleaning solution is disposed in the middle of the supply line 14. The valve 12 is equipped with a switching section 12a for controlling the outflow of the cleaning solution by opening or closing the supply line 14, and a bypass 12b for supplying the cleaning solution, bypassing the switching section 12a. The valve 12 is provided such that it is able to adjust in two steps the supply flow of the cleaning solution supplied to the cleaning tank 10 by using the supply flow fed through the bypass 12b and the supply flow fed through the switching section 12a.
Description
FIELD OF THE INVENTION
The present invention relates to a multi-step flow cleaning method and a multi-step flow cleaning apparatus and, more particularly, to a multi-step flow cleaning method and a multi-step flow cleaning apparatus adapted to clean an workpiece by placing the workpiece, which has been treated with a chemical, in a cleaning tank and by supplying a cleaning solution thereby to clean the workpiece with the stream of the cleaning solution.
BACKGROUND ART
Hitherto, workpieces to be cleaned including semiconductor wafers, glass substrates, and electronic substrates are required to be subjected to a cleaning process for cleaning with a cleaning solution such as pure water to remove a chemical from the surfaces of the workpieces that have been subjected to a chemical treatment (etching). In this cleaning process, a cleaning apparatus is extensively used in which workpieces that have been subjected to the chemical treatment are placed, and a cleaning solution such as pure water is supplied from the bottom surface of the cleaning tank thereby to clean the workpieces by the stream of the cleaning solution.
FIG. 11
is a piping diagram showing the structure of a conventional cleaning apparatus adapted to clean workpieces with the stream of a cleaning solution by supplying the cleaning solution into the cleaning tank as described above.
As shown in
FIG. 11
, the conventional cleaning apparatus is provided with a cleaning tank
20
for holding workpieces (not shown) that have been treated with a chemical, a supply line
24
for supplying a cleaning solution such as pure water from the bottom surface of the cleaning tank
20
, and a valve
22
connected at the middle of the supply line
24
to control the supply of the cleaning solution.
The valve
22
has a structure for opening or closing the supply line by electrically turning it ON or OFF. This enables the valve
22
to supply or interrupt the supply of the cleaning solution, which flows out through the supply line
24
, to the cleaning tank
20
.
When using the conventional cleaning apparatus, first, a plurality of workpieces, which have been subjected to a chemical treatment such as etching in a predetermined process, are placed in a cleaning cassette (not shown), and the cleaning cassette (not shown) is carried into the cleaning tank
20
. When the cleaning cassette (not shown) has been carried into the cleaning tank
20
, a cleaning solution such as pure water, which has been supplied through the supply line
24
, is let flow into the cleaning tank
20
by opening the valve
22
.
FIG. 12
is a graph showing changes in the flow of the cleaning solution supplied while the conventional cleaning apparatus shown in
FIG. 11
is in the cleaning operation. As shown in
FIG. 11
, a constant flow of the cleaning solution is supplied into the cleaning tank
20
at all times until the cleaning is finished after the valve
22
is opened. The cleaning solution supplied in the constant flow flows into the cleaning cassette (not shown) placed in the cleaning tank
20
to clean the surfaces of the workpieces by the stream of the cleaning solution.
Thus, the conventional cleaning apparatus has been cleaning the surfaces of the workpieces held in the cleaning cassette (not shown) with the constant flow by supplying the constant stream of the cleaning solution through the supply line
24
connected to the bottom surface of the cleaning tank
20
.
The conventional cleaning apparatus is capable of removing some foreign matters, which have adhered to the surfaces of the workpieces during the chemical treatment, by the stream of the cleaning solution supplied to the cleaning tank; however, the stream of the cleaning solution supplied in the constant flow is not good enough to remove some persistent foreign matters on the workpieces. Hence, it has been difficult for the conventional cleaning apparatus to remove the foreign matters, which have adhered during the chemical treatment process, to a satisfactory level.
Further, the conventional cleaning apparatus requires a large quantity of a cleaning solution and a long cleaning time in order to fully remove persistent foreign matters, which have adhered to the surfaces of workpieces during a chemical treatment process. Hence, it has been difficult to reduce a cleaning solution or shorten the cleaning time in implementing satisfactory cleaning of workpieces.
It is an object of the present invention to solve the problems described above and to provide a multi-step flow cleaning method and a multi-step flow cleaning apparatus that are capable of cleaning workpieces more effectively with the stream of a cleaning solution and also capable of suppressing an increase in foreign matters adhering to the surfaces of the workpieces.
DISCLOSURE OF THE INVENTION
To this end, according to one aspect of the present invention, there is provided a cleaning method by placing workpieces in a cleaning tank and by supplying a cleaning solution so as to clean the workpieces with a flow of the cleaning solution, wherein the flow of the cleaning solution supplied to the cleaning tank is adjusted to change the stream during a cleaning operation, thus cleaning the workpieces with the changing stream of the cleaning solution. In this case, the flow of the cleaning solution supplied to the cleaning tank is either changed from a small flow to a large flow in steps or continuously changed from a small flow to a large flow. Further, the supply flow of the cleaning solution is held small at least until the workpieces are fully immersed in the cleaning solution supplied to the cleaning tank.
According to another aspect of the present invention, there is provided a cleaning apparatus for cleaning workpieces by placing the workpieces in a cleaning tank and by providing the cleaning tank with a supply line to supply a cleaning solution so as to clean the workpieces with the stream of the cleaning solution, the cleaning apparatus being provided with a supply line for supplying the cleaning solution to the cleaning tank, and a flow adjusting means which is provided on the supply line and which adjusts the flow of the cleaning solution supplied to the cleaning tank, wherein the flow of the cleaning solution supplied to the cleaning tank is adjusted by the flow adjusting means to change the stream so as to clean the workpieces by the changing stream of the cleaning solution.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
is a piping diagram showing the structure of a first embodiment of a multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 2
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 1
is in a cleaning operation.
FIG. 3
is a piping diagram showing the structure of a second embodiment of a multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 4
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 3
is in a cleaning operation.
FIG. 5
is a piping diagram showing the structure of a third embodiment of a multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 6
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 5
is in a cleaning operation.
FIG. 7
is a piping diagram showing the structure of a fourth embodiment of a multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 8
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 7
is in a cleaning operation.
FIG. 9
is a graph showing an increase in the number of foreign matters observed when a cleaning experiment has been carried out with a conventional cleaning apparatus shown in FIG.
11
.
FIG. 10
is a graph showing an increase in the number of foreign matters observed when a cleaning experiment has been carried out with the multi-step flow cleaning apparatus in accordance with the present invention shown in FIG.
1
.
FIG. 11
is a piping diagram showing the structure of the conventional cleaning apparatus.
FIG. 12
is a graph illustrating the changes in the flow of a cleaning solution supplied while the conventional cleaning apparatus shown in
FIG. 11
is in a cleaning operation.
BEST MODE FOR CARRYING OUT THE INVENTION
The following will describe in detail the embodiments of a multi-step flow cleaning method and a multi-step flow cleaning apparatus in accordance with the present invention with reference to the accompanying drawings.
FIG. 1
is a piping diagram showing the structure of a first embodiment of a multi-step flow cleaning apparatus in accordance with the present invention. Further,
FIG. 2
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 1
is in a cleaning operation.
As shown in
FIG. 1
, the first embodiment of the multi-step flow cleaning apparatus in accordance with the present invention is provided with a cleaning tank
10
for holding workpieces (not shown) that have undergone a chemical treatment, a supply line
14
connected to the bottom surface of the cleaning tank
10
to supply a cleaning solution such as pure water from outside, and an adjusting valve
12
disposed in the middle of the supply line
14
to adjust the flow of the cleaning solution such as pure water.
The adjusting valve
12
is provided with a switching section
12
a
for opening/closing the supply line
14
by being electrically turned ON/OFF, and a bypass
12
b
provided so that it bypasses the switching section
12
a
. Hence, unlike in the case of a conventional cleaning apparatus, the adjusting valve
12
is able to adjust the flow of a cleaning solution in two steps as time passes according to the supply flow through the switching section
12
a
and the supply flow through the bypass
12
b.
When using the multi-step flow cleaning apparatus configured as described above, first, a plurality of workpieces are taken from a predetermined process and placed in a cleaning cassette (not shown), and the cleaning cassette (not shown) is carried into the cleaning tank
10
. When the cleaning cassette (not shown) has been carried into the cleaning tank
10
, a cleaning solution such as pure water is flown into the cleaning tank
10
through the supply line
14
.
At this time, the switching section
12
a
of the adjusting valve
12
is held closed thereby to cause the cleaning solution, which has been supplied to the supply line
14
, to flow into the cleaning tank
10
through the bypass
12
b
. The cleaning solution flown into the cleaning tank
10
moves from the bottom to top of the cleaning cassette (not shown) to clean the surfaces of the contained workpieces with the stream thereof.
After the workpieces have been cleaned for a given time by the cleaning solution supplied through the bypass
12
b
, the adjusting valve
12
opens the switching section
12
a
to supply the cleaning solution also through the switching section
12
a
in addition to the bypass
12
b
.
Thus, in the first embodiment, as shown in
FIG. 2
, the workpieces are cleaned with the stream of the cleaning solution supplied in a small flow through the bypass
12
b
, with the valve
12
closed in a first step. Then, after the cleaning operation of the workpieces in the first step has been carried out for a given time, the switching section
12
a
of the adjusting valve
12
is opened in a second step to supply the cleaning solution through the bypass
12
b
and the switching section
12
a
at the same time so as to clean the workpieces with a larger flow. Thus, the cleaning solution supplied into the cleaning tank
10
performs the cleaning operation of the workpieces, which have been placed in the cleaning tank
10
, with the stream of the cleaning solution that is changed in two steps.
According to the first embodiment, therefore, the workpieces are cleaned with pure water flow in two steps based on lapse of time; hence, the foreign matters on the surfaces of the workpieces can be effectively removed, allowing a shortened cleaning time and a reduced quantity of cleaning solution to be achieved.
Referring now to FIG.
3
and
FIG. 4
, a second embodiment of the multi-step flow cleaning method and the multi-step flow cleaning apparatus in accordance with the present invention will be described in detail.
FIG. 3
is a piping diagram showing the structure of the second embodiment of the multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 4
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 3
is in a cleaning operation. In the second embodiment, a plurality of the adjusting valves
12
in the first embodiment have been installed, and the same components will be assigned the same reference numerals, and the explanation thereof will not be repeated.
As shown in
FIG. 3
, the second embodiment of the multi-step flow cleaning apparatus in accordance with the present invention is provided with a cleaning tank
10
for holding workpieces, a supply line
14
for supplying a cleaning solution such as pure water, and a plurality of adjusting valves
12
-
1
and
12
-
2
disposed in series in the supply line
14
, and a valve
16
.
The valve
16
is provided so that it is electrically turned ON and OFF to open and close the supply line. The adjusting valves
12
-
1
and
12
-
2
are provided with a switching section
12
a
for opening and closing the supply line
14
by electrically turning it ON and OFF and a bypass
12
b
provided so that it bypasses the switching section
12
a
. Hence, the second embodiment is able to change the flow of a cleaning solution in a plurality of steps as time passes by the adjusting valves
12
-
1
and
12
-
2
, and the valve
16
.
When using the multi-step flow cleaning apparatus configured as described above, first, a plurality of workpieces are taken from a predetermined process and placed in a cleaning cassette (not shown), and the cleaning cassette (not shown) is carried into the cleaning tank
10
. When the cleaning cassette (not shown) has been carried into the cleaning tank
10
, a cleaning solution such as pure water is flown into the cleaning tank
10
through the supply line
14
.
At this time, the adjusting valves
12
-
1
and
12
-
2
hold the switching sections
12
a
-
1
and
12
a
-
2
in a closed state. Under this condition, the valve
16
is opened to supply the cleaning solution into the cleaning tank
10
through the bypasses
12
b
-
1
and
12
b
-
2
of the adjusting valves
12
-
1
and
122
to clean the workpieces.
After the workpieces have been cleaned for a given time under such a condition, the switching section
12
a
-
2
of the adjusting valve
12
-
2
is changed over from the closed state to an open state. This causes a large flow of the cleaning solution to flow into the cleaning tank
10
through the bypass
12
b
-
2
and the switching section
12
a
-
2
via the bypass
12
b
-
1
of the adjusting valve
12
-
1
, thereby cleaning the surfaces of the workpieces.
Further, after cleaning with the large flow for a given time, the switching section
12
a
-
1
of the adjusting valve
12
-
1
is changed over from the closed state to the open state. This causes a further large flow of cleaning solution to be supplied into the cleaning tank
10
through the adjusting valves
12
-
1
and
12
-
2
to clean the surfaces of the workpieces.
Thus, in the second embodiment, the workpieces are cleaned with the cleaning solution that is supplied by opening the valve
16
in a first step as shown in FIG.
4
. After the cleaning operation of the workpieces has been implemented for the given time in the first step, the switching section
12
a
-
2
of the adjusting valves
12
-
2
is opened in a second step to clean the workpieces. Further, after the cleaning operation of the workpieces has been implemented for a given time in the second step, the switching section
12
a
-
1
of the adjusting valves
12
-
1
is opened in a third step to clean the workpieces. In this manner, the workpieces placed in the cleaning tank
10
can be cleaned with the stream of the cleaning solution which is supplied to the cleaning tank
10
such that it is changed in three steps.
According to the second embodiment, therefore, the workpieces are cleaned with pure water flow in three steps based on lapse of time; hence, the foreign matters on the surfaces of the workpieces can be effectively removed, allowing a shortened cleaning time and a reduced quantity of cleaning solution to be achieved. The second embodiment makes it possible to implement more effective cleaning than that achieved by the first embodiment.
Referring now to FIG.
5
and
FIG. 6
, a third embodiment of the multi-step flow cleaning method and the multi-step flow cleaning apparatus in accordance with the present invention will be described in detail.
FIG. 5
is a piping diagram showing the structure of the third embodiment of the multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 6
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 5
is in a cleaning operation. The third embodiment has the same components except for the adjusting valve
12
in the first embodiment, and the same components will be assigned the same reference numerals, and the explanation thereof will not be repeated.
As shown in
FIG. 5
, the third embodiment of the multi-step flow cleaning apparatus in accordance with the present invention is provided with a cleaning tank
10
for holding workpieces, supply lines
14
-
1
and
14
-
2
branched into two in parallel from the bottom of the cleaning tank
10
to respectively supply a cleaning solution such as pure water, and valves
16
-
1
and
16
-
2
disposed in the supply lines
14
-
1
and
14
-
2
, respectively, which are arranged in parallel. The valves
16
-
1
and
16
-
2
are provided so that they are electrically turned ON and OFF to open and close the supply lines. The valve
16
-
2
is provided such that it is able to supply a large flow of the cleaning solution than the valve
16
-
1
is. Hence, the third embodiment is able to change the flow of the cleaning solution in three steps as time passes by means of the flow supplied through the valve
16
-
1
, the flow supplied through the valve
16
-
2
, and the flow supplied through both valves
16
-
1
and
16
-
2
at the same time.
When using the multi-step flow cleaning apparatus in accordance with the present invention configured as described above, first, a plurality of workpieces are taken from a predetermined process and placed in a cleaning cassette (not shown), and the cleaning cassette (not shown) is carried into the cleaning tank
10
. When the cleaning cassette (not shown) containing the workpieces therein has been carried into the cleaning tank
10
, a cleaning solution such as pure water is flown into the cleaning tank
10
.
At this time, the valve
16
-
2
is held in a closed state. The valve
16
-
1
is gradually opened from the closed state. This causes the cleaning solution to be supplied into the cleaning tank
10
through the valve
16
-
1
to clean the workpieces.
After the workpieces have been cleaned for a given time under such a condition, the valve
16
-
1
is closed, whereas the valve
16
-
2
is opened from the closed state. This causes the cleaning solution to be supplied into the cleaning tank
10
through the valve
16
-
2
to clean the workpieces.
Further, after performing the cleaning operation for the given time under such a condition, the valves
16
-
1
and
16
-
2
are opened at the same time. This causes a larger flow of the cleaning solution to be supplied into the cleaning tank
10
through the valves
16
-
1
and
16
-
2
to clean the workpieces.
Thus, in the third embodiment, the workpieces are cleaned by opening the valve
16
-
1
in a first step as shown in FIG.
6
. After the cleaning operation of the workpieces has been implemented for the given time in the first step, the valve
16
-
1
is closed, whereas the valve
16
-
2
is opened in a second step to clean the workpieces. Further, after the cleaning operation of the workpieces has been implemented for a given time in the second step, the valves
16
-
1
and
16
-
2
are opened at the same time in a third step to clean the workpieces. In this manner, the workpieces placed in the cleaning tank
10
can be cleaned with the stream of the cleaning solution which is supplied to the cleaning tank
10
such that it is changed in three steps.
According to the third embodiment having the foregoing configuration, the workpieces are cleaned by changing the flow of the cleaning solution in three steps with the lapse of time; hence, the foreign matters on the surfaces of the workpieces can be effectively removed, allowing a shortened cleaning time and a reduced quantity of cleaning solution to be achieved. The third embodiment makes it possible to obtain the same advantage as that obtained by the second embodiment.
Referring now to FIG.
7
and
FIG. 8
, a fourth embodiment of the multi-step flow cleaning method and the multi-step flow cleaning apparatus in accordance with the present invention will be described in detail.
FIG. 7
is a piping diagram showing the structure of the fourth embodiment of the multi-step flow cleaning apparatus in accordance with the present invention.
FIG. 8
is a graph illustrating the changes in the flow of a cleaning solution supplied while the multi-step flow cleaning apparatus shown in
FIG. 7
is in a cleaning operation. The fourth embodiment has the same components except for the adjusting valve
12
in the first embodiment, and the same components will be assigned the same reference numerals, and the explanation thereof will not be repeated.
As shown in
FIG. 7
, the fourth embodiment of the multi-step flow cleaning apparatus in accordance with the present invention is provided with a cleaning tank
10
for holding workpieces, a supply line
14
for supplying a cleaning solution such as pure water from the bottom of the cleaning tank
10
, a valve
16
disposed in the supply line
14
, and a regulator
18
for adjusting the flow of the cleaning solution supplied through the valve
16
.
The valve
16
is provided so that it is electrically turned ON and OFF to open and close the supply line. The regulator
18
is provided so that it adjusts the flow of the cleaning solution supplied through the valve
16
by a voltage or pneumatic drive pressure. Therefore, in the fourth embodiment, the flow supplied through the valve
16
can be continuously changed by the regulator
18
as time passes.
When using the multi-step flow cleaning apparatus in accordance with the present invention configured as described above, first, a plurality of workpieces are taken from a predetermined process and placed in a cleaning cassette (not shown), and the cleaning cassette (not shown) is carried into the cleaning tank
10
. When the cleaning cassette (not shown) has been carried into the cleaning tank
10
, a cleaning solution such as pure water is flown into the cleaning tank
10
.
At this time, the valve
16
is held in an opened state, and the regulator
18
is driven to continuously change the flow of the cleaning solution supplied into the cleaning tank
10
. This causes the cleaning solution to be supplied into the cleaning tank
10
through the regulator
18
to clean the workpieces.
Thus, in the fourth embodiment, the regulator
18
continuously increases the flow of the cleaning solution when the valve
16
is opened as shown in FIG.
8
. The regulator
18
supplies the cleaning solution in a fixed flow after a predetermined time passes. Hence, the workpieces are cleaned with the cleaning solution supplied by the regulator
18
into the cleaning tank
10
in such a manner that they are first cleaned with the stream of the cleaning solution that continuously increases, then cleaned with the fixed flow of the cleaning solution after the predetermined time passes. According to the fourth embodiment having the foregoing configuration, the workpieces are cleaned with the pure water flow that continuously increases as time passes; hence, contaminants on the surfaces of the workpieces can be effectively removed, allowing a shortened cleaning time and a reduced quantity of cleaning solution to be achieved
The embodiments of the multi-step flow cleaning method and the multi-step flow cleaning apparatus in accordance with the present invention have been described above. The present invention will now be described in more detail by means of working examples.
Working Examples
FIG. 9
is a graph illustrating an increase in the number of foreign matters observed when a cleaning experiment was carried out with the conventional cleaning apparatus shown in FIG.
11
.
FIG. 10
is a graph illustrating an increase in the number of foreign matters observed when a cleaning experiment was carried out with the multi-step flow cleaning apparatus shown in FIG.
1
.
As shown in
FIG. 9
, in the cleaning experiment with the conventional cleaning apparatus, workpieces were cleaned with pure water flows of 10 L/min and 30 L/min, respectively, for 10 min., 15 min., and 20 min., respectively.
As illustrated in
FIG. 10
, in order to compare the multi-step flow cleaning apparatus in accordance with the present invention with the conventional cleaning apparatus, the three different cleaning experiments were carried out with the cleaning apparatus in accordance with the present invention as follows: workpieces were cleaned with a small flow of 10 L/min for 1 min. and a large flow of 30 L/min for 10 min. totaling 11 min.; workpieces were cleaned with a small flow of 10 L/min for 3 min. and with a large flow of 30 L/min for 10 min., totaling 13 min.; and workpieces were cleaned with a small flow of 10 L/min for 10 min. and a large flow of 30 L/min for 10 min., totaling 20 min.
As the workpieces to be cleaned, substrates which are composed of bare silicon substrates sandwiched between silicon substrates coated with oxide silicon films and which are treated with fluorine acid were used. The number of increased foreign matters was calculated as follows: the number of foreign matters adhered to the surfaces of the workpieces was measured before the chemical treatment and after the cleaning process, respectively, and the number of the foreign matters before the chemical treatment was subtracted from the number of the foreign matters after the cleaning process. In the graphs provided in FIG.
9
and
FIG. 10
, the foreign matters measuring 0.13 to 0.3 μm are indicated by hatched bars, and the foreign matters measuring 0.3 μm or more are indicated by blank bars, respectively.
As shown in
FIG. 9
, it is seen that the conventional cleaning apparatus has a tendency in which the increase of the foreign matters reduces as the treatment time is prolonged in both cases wherein the pure water flows were 10 L/min and 30 L/min, whereas approximately 200 to 1000 pcs. of foreign matters are always left unremoved even after the cleaning was continued for 20 minutes.
On the other hand, in the case of the multi-step flow cleaning apparatus in accordance with the present invention shown in
FIG. 10
, it is seen that the increase in the number of the foreign matters was controlled to approximately 200 pcs. or less in comparison with the case of the conventional cleaning apparatus, when the cleaning operation was carried out at the small flow for 3 min. and at the large flow for 10 min., totaling 13 minutes.
Therefore, the use of the multi-step flow cleaning method and the multi-step flow cleaning apparatus in accordance with the present invention makes it possible to reduce an increase in the number of foreign matters, shorten the required cleaning time, and to effectively reduce the quantity of a cleaning solution consumed for cleaning.
The multi-step flow cleaning method and the multi-step flow cleaning apparatus made by the present invention have been described in detail. The present invention, however, is not limited to the embodiments discussed above; modifications can be made without departing from the spirit and scope of the present invention.
For instance, the number of the adjusting valves
12
described in the embodiments is not limited to the numbers mentioned in the embodiments; it may be increased as necessary.
Industrial Applicability
Thus, the multi-step flow cleaning method and the multi-step flow cleaning apparatus make it possible to reduce an increase in the number of foreign matters and to accomplish efficient cleaning process by changing intermittently or continuously the flow of pure water supplied during a cleaning process.
Claims
- 1. A multi-step flow cleaning method comprising:placing a workpiece in a cleaning tank; supplying a cleaning solution to the cleaning tank to clean the workpiece with a stream of the cleaning solution; and adjusting a flow of the cleaning solution to the cleaning tank during a cleaning operation in such a manner that a flow rate is stepwisely increased.
- 2. The multi-step flow cleaning method according to claim 1, wherein:the flow rate supplied to the cleaning tank is increased after the workpiece is fully immersed into the cleaning solution.
- 3. A multi-step flow cleaning method comprising:placing a workpiece in a cleaning tank; supplying a cleaning solution to the cleaning tank to clean the workpiece with a stream of the cleaning solution; and adjusting a flow of the cleaning solution supplied to the cleaning tank during a cleaning operation in such a manner that a flow rate is linearly increased and then held constant.
- 4. The multi-step flow cleaning method according to claim 3, wherein:the flow rate supplied to the cleaning tank is increased after the workpiece is fully immersed into the cleaning solution.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-036310 |
Feb 1998 |
JP |
|
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP98/05751 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO99/42227 |
8/26/1999 |
WO |
A |
US Referenced Citations (10)