Often the success of a restaurant depends, at least in part, on how quickly customers can be served with ordered food items and also on the quality of the food items when served. If the rate of food preparation equals the rate at which the food is ordered and sold, a restaurant can theoretically have freshly-prepared foods ready to serve for customers as they arrive. Since it is not always possible to match food production with customer ordering rates, and since certain fast food restaurant customers expect to receive their ordered food items quickly, many fast food restaurants prepare various food items in advance and keep them ready for sale until a customer arrives and purchases a pre-cooked food item.
To facilitate the food holding process, holding bins or holding ovens are often used to keep the food warm. Known holding bins can allow a cooked food item to be inserted from one side and taken from the opposite side whereby food preparers add food to the holding bin on one side and food servers on the opposite side take food from the holding bin. Food holding bins in which the cooked food item is inserted and removed from the same side are also known. The food items in the holding bins are kept warm by heating elements. However, food holding time in known holding bins or ovens is somewhat limited, generally less than 15 or 20 minutes before the food item must be discarded. As a result, restaurants can only keep a limited amount of pre-cooked food items on hand and often a significant amount of the pre-cooked food items must be discarded before they are sold, resulting in additional costs.
Turning now to
food holding zone 57a and a second food product, which may be the same as the first food product or different from the first food product as long as both food products have substantially the same temperature requirements, can be held in the second food holding bay 51b of the first food holding zone 57a. Both the first food holding bay 51a and the second food holding bay 51b are held at a first temperature by independently controllable upper and lower heating elements.
A third food product can be held in the third food holding bay 51c of the second food holding zone 57b and a fourth food product, which may be the same as the third food product or different from the third food product as long as both food products have substantially the same temperature requirements, may be held in the fourth food holding bay 51d of the second food holding zone 57b. Both the third food holding bay 51c and the fourth food holding bay 51d are held at a second temperature by independently controllable upper and lower heating elements.
Because the heating elements used to heat the second food holding zone 57b are different from those used to heat the first food holding zone 57a, the second temperature of the second food holding zone 57b is capable of being independently set to be different from the first temperature of the first food holding zone 57a. Suitable heating elements are illustrated with respect to the embodiment shown in
In one embodiment of the bin 10, all of the compartments 50 are heated. In another embodiment, some compartments 50 may be refrigerated while other compartments 50 are heated. In yet another embodiment, one or more compartments 50 can be selectively heated or refrigerated.
The bin 10 includes a chassis 15. As illustrated, the chassis 15 includes a top panel 20, a bottom panel 25, a left-side panel 30, a right side panel 35, an open front face 40 and an open rear face 45. When the rear face 45 is open and uncovered, food items can be inserted by a first operator responsible for initial food preparation into one of the faces 40, 45 and passed through to and removed from the other of the faces 40, 45 by a second operator responsible for final food preparation, for example, a second operator responsible for packaging and customization of a food product for serving to the ultimate customer. In another embodiment, the rear face 45 may be “closed” and provided by a rear panel such that access into the bin 10 is only provided by the open front face 40. The panels may be insulated to reduce heat transfer between the interior of the bin 10 and the atmosphere surrounding the bin 10.
The bin 10 illustrated in
In the embodiment illustrated in
Compartment “B” is defined by the two sidewalls 30 and 35, the first or upper-most shelf 52, and the chassis bottom panel 25. In bin embodiments having only one compartment 50, the single compartment is defined by opposing, left and right sidewalls 30 and 35, a chassis top panel 20 and a chassis bottom panel 25. For brevity, bin construction and operation is described with regard to a bin 10 having two compartments 50 in
The shelf 52, which partially defines the compartments 50, is planar or at least substantially planar and supported in the chassis 15 at opposing side ends by the two chassis side walls 30 and 35. The shelf 52 includes a planar and continuous top surface, which forms a planar and continuous bottom surface 53 of the upper compartment 50. The planar and continuous bottom surface 53 of the upper compartment 50 is configured to support food items (as used herein, the term “food item” includes but is not limited to containers or trays containing food products such as cooked protein patties, fried foods, and the like). In the illustrated embodiment, food items can be placed onto the planar and continuous bottom surface 53 and removed from the planar and continuous bottom surface 53 through the open front face 40 or through the open rear face 45. Because the bottom surface 53 is planar and continuous and substantially free of any dividing walls or other structure between the holding zones 57a, 57b, and more particularly between the food holding bays 51a, 51b, 51c, and 51d, cleaning of the bottom surface 53 can be easily accomplished.
A face plate or bezel 92 is generally attached to the front of the chassis 15. For example, the bezel can be attached to the sidewalls 30 and 35 of the chassis 15 so as to be disposed underneath a top surface of the shelf 52. In bin embodiments having only one compartment 50, the bezel 92 may be attached to either of the chassis top or bottom panels 20, 25 of the bin 10. In the illustrated embodiment of
The bezels 92 may include information displays and/or controls, which are collectively identified by reference numeral 93. Although the chassis 15 can include panels concealing the heat generating devices located within a shelf, the bezel 92 also can conceal heating elements, which are located within the shelf 52, such that a separate panel is not present.
Each food holding bay 51a, 51b, 51c, 51d may include a dedicated display and/or control 93a, 93b, 93c, 93d, respectively. While each dedicated display and/or control 93a, 93b, 93c, 93d may display and/or control the temperature within individual food holding bays 51a, 51b, 51c, 51d, the food holding bays within a particular food holding zone (51a and 51b within 57a; 51c and 51d within 57b) have the same temperature setting. The dedicated display and/or controls 93a, 93b, 93c, 93d, may also display additional information about the food item stored in the food holding bay 51a, 51b, 51c, 51d. For example, while the temperature in the first food holding bay 51a and the second food holding bay 51b is the same (because both food holding bays 51a, 51b are located within a single food holding zone 57a), the display and/or control 93a, 93b may indicate that the first food holding bay 51a has a first food item (such as sausage) while the second food holding bay 51b has a second food item (such as eggs). In the embodiment illustrated in
Each food holding bay 51a, 51b, 51c, 51d may be sized to receive an individual food holding tray 27 and lid 21 (see
Adjacent to each lid holding shelf 31 is one or more latches 23 having an open center portion. In the embodiment illustrated in
The round body 29 may be oriented substantially parallel to a front face of the chassis 15 or the bezel 92 in a locked or default position, as illustrated by reference numeral 23a, which prevents inadvertent removal of a lid 21 from the lid holding shelf 31 when a tray 27 is withdrawn. The latch 23 is in its default or locked position simply because of gravity, thus re-positioning the latch to an unlocked state advantageously requires simply overcoming the weight of the latch 23 by translational and/or rotational movement. The round body 29 may be rotated and/or translated upwards relative to the bezel 92 or lid holding shelf 31 from the locked or default position to an unlocked position, as illustrated by the dotted lines referencing latch 23 between food holding bay 51a and food holding bay 51b in
continuous bottom surface 52, typically by fixedly attaching a base of the shelf to a top surface of the food holding compartment 50 at one or more positions. Such continuous planar and continuous bottom surfaces 52 are much easier to clean than compartmentalized or divided heating chambers. Furthermore, the round body 29 of the latch 23 and the translation/rotation movement of the latch allow easy removal of the lids 27 from the lid holding tray 31 with one hand while positioning the latch 23 to the unlocked position with another hand.
From a purely functional standpoint, a preferred latch 23 might simply include a locking portion that is able to prevent inadvertent displacement of the lid 21 when the tray 27 is purposefully removed. Thus, a number of different configurations and shapes can be used for the latch 23. The latch 23 illustrated here with the round body 29, on the other hand, has an alternative, ornamental arrangement for the round body 29 in which the edges of the round body 29 include an arc-shaped, curved surface. This illustrated arrangement may add to the cost of manufacture, so the illustrated latch does not provide all of the possible economic advantages that might be derived from the invention. On the other hand, this arrangement is believed to be aesthetically pleasing and is likely to be recognized and relied upon by purchasers to identify the source of the food holding bin.
Similar to the embodiment of
The bin 10 illustrated in
In
The shelves 52, which partially define the compartments 50, are planar or at least substantially planar and supported in the chassis 15 at their opposing side ends by the two chassis side walls 30 and 35. Each shelf 52 forms a planar and continuous top surface, which defines a planar and continuous bottom surface 53 of the compartment 50. The planar and continuous bottom surface 53 of the compartment is configured to support food items (as mentioned above, the term “food item” includes but is not limited to containers or trays containing food products such as cooked protein patties, fried foods, and the like). Food items can be placed onto the planar bottom surface 53 and removed from the planar bottom surface 53 through the open front face 40 or through the open rear face 45.
Each food holding bay 51a, 51b may include a dedicated display and/or control 93a, 93b, respectively. Each display and/or control 93a, 93b may display the temperature setpoint of a respective food holding bay 51a, 51b, and in the embodiment illustrated in
Bin 10 control and control of the food holding zone 51 temperature is effectuated in part by using one or more microcontrollers or microprocessors 97 in combination with temperature sensors 99. US 2011-0114624 A1 entitled “Food Holding Cabinet Power Supplies with Downloadable Software,” the entirety of which is hereby incorporated by reference herein, discloses among other things, apparatuses and methods by which compartments of a food holding bin can be controlled using microprocessors having downloadable software.
Compartment temperature control is preferably effectuated using a semiconductor temperature sensor, thermally coupled to each food holding zone 51 and electrically connected to a processor, such as those disclosed in US 2011-0114624 A1.
A semiconductor apparatus and method for measuring temperature of a plate or shelf in a food holding bin is disclosed in U.S. Pat. No. 8,247,745, which is entitled “Temperature Sensor for a Food Holding Cabinet” the entirety of which is hereby incorporated by reference herein.
The shelf 52 includes a lower heating element 67 for the first food holding zone 57a in a first or top food holding compartment 50, and an upper heating element 65 for a second food holding zone 57b in a second or lower food holding compartment 50, directly below the first food holding compartment 50. While the first heating element 67 is illustrated as providing heat to the upper first food holding zone 57a (from below) and the second heating element 65 is illustrated as providing heat to the lower first food holding zone 57a (from above), heating elements that are not shown include at least a heating element that provides heat to the upper first food holding zone 57a from above and another heating element that provides heat to the lower first food holding zone 57a from below. Additionally, the second food holding zones 57b, which are adjacent to the first food holding zones 57a, are heated in the same way as the first food holding zones 57a, but with independent heating elements. The heating elements of the second food holding zones 57b are independently controllable from the heating elements of the first food holding zones 57a. Referring to the inset
The continuous planar bottom surface 53 of the top food holding compartment 50 and the continuous planar upper surface 54 of the bottom food holding compartment are preferably made of aluminum, between about one-eighth and about one-quarter inch-thick. Alternate embodiments of the shelf 52 may use a thermally-conductive panel made of glass-ceramic or an ultra-low expansion glass for one or both of the lower surface 53 and the upper surface 54.
Glass-ceramics and ultra-low expansion glass are considered herein to be “good” thermal conductors in that their conduction of heat energy is localized. Such materials also make excellent shelves for a heated, multi-zone food holding bin because they permit localized areas of a shelf to be heated to a first temperature, without having the entire shelf reach the same temperature.
The first heating element 67 is disposed between the planar bottom surface 53 and the planar upper surface 54 and the first heating element 67 is in thermal communication with the planar bottom surface 53. The first heating element 67 may be mechanically attached to the planar bottom surface 53 by a thermally-conductive adhesive, in one embodiment. The first heating element 67 may also be attached to the planar bottom surface 53 by brackets or clamps.
The second heating element 65 is disposed between the planar bottom surface 53 and the planar upper surface 54 and the second heating element 65 is in thermal communication with the planar upper surface 54. The second heating element 65 may be mechanically attached to the planar upper surface 54 by a thermally-conductive adhesive, in one embodiment. The second heating element 65 may also be attached to the planar upper surface 54 by brackets or clamps.
In the embodiment illustrated in
In some embodiments, the second heating element 65 may comprise a radiant heating source that projects radiant heat through the planar upper surface 54 and into the first food holding zone 57a of the lower food holding compartment 50. In other words, in one embodiment, the first heating element 67 provides heat energy into the first food holding zone 57a of the upper food holding compartment 50 through conduction, while the second heating element 65 provides heat energy into the first food holding zone 57a of the lower food holding compartment through radiation. Similarly, a radiant heating element may be provided at a top interior surface of the first or top food holding compartment 50 beneath the chassis top panel 20. In this manner, the top and bottom of a food product placed into the first food holding zone 57a may absorb different amounts of heat energy, customized depending on the type of food product. Thus, the heat profile in the first food holding zone 57a may be customized vertically as well as differentiated from the heat profile in the second food holding zone 57b. As a result, a single food holding compartment 50 (e.g., the upper compartment in
Because of this flexibility, it has been found that a food holding bin constructed in accordance with the disclosure can extend the palatability time of a food item by a factor of two or more.
An alternate embodiment, as illustrated in
The thermoelectric effect is a direct conversion of a temperature difference into an electric voltage and vice versa. When a voltage is applied to a thermoelectric device, a temperature difference is created across the two sides of the device. The temperature difference created in response to an applied voltage is known as the Peltier effect. Devices that produce temperature differences in response to an applied voltage are considered herein to be Peltier devices. A Peltier device 80 is therefore considered herein to be a heat source or heating element.
Peltier devices have a “cold” side and a “hot” side. The cold side absorbs heat whereas the hot side emits heat. Heat emitted from the hot side includes at least some of the heat absorbed from the cold side. A Peltier device 80 is therefore considered herein to be a solid-state heat pump or heat-sinking device.
“Sandwiching” the Peltier devices in a shelf 52 as shown in
Temperature control of a thermoelectric, Peltier device 80 may be accomplished by controlling the electric energy provided to the device. Temperature control of one side of the Peltier device 80 can also be effectuated by controlling heat transferred into or out of the opposite side of the device, as described in US 2010-0307168 A1, entitled “Thermo Electric Cooler,” the disclosure of which is incorporated herein by reference in its entirety.
In another embodiment of a multi-zone food holding bin 10, multiple Peltier devices 80 are mounted between the bottom surface 53 and the upper surface 54 but have only their hot sides thermally coupled to the bottom surface 53 and to the upper surface 54. Air is then moved through the inter-plate space to heat the cool sides of the Peltier devices therein.
Peltier devices as disclosed herein and similar heat transfer devices are thermally coupled to the shelf 52, preferably by way of mechanical attachment to at least one of the plates that form the lower planar surface 53 and the upper planar surface 54. Mechanical attachment and the resultant thermal coupling is preferably accomplished by a thermally-conductive adhesive, however, clamps that are attached to a plate by screws driven into a plate can also be used.
The shelves are mechanically coupled to the side panels 30 and 35. The side panels are also preferably made from thermally-conductive material such as aluminum. Thermally coupling a heat transfer device to one or more plates that comprise a shelf therefore also thermally couples the heat transfer device to the side walls and thus to the compartment. Heat transfer devices coupled to a shelf are therefore also thermally coupled to the corresponding compartment.
While the temperature of a Peltier device can be controlled by controlling the heat dissipated from the hot side and/or the heat absorbed into the cold side, bin embodiments
disclosed herein preferably control compartment temperature using one or more semiconductor temperature sensors, thermally coupled to one or more of the thermally-conductive structures that comprise a compartment. Bin embodiments disclosed herein preferably use a semiconductor temperature sensor that is directly coupled and therefore thermally coupled to the heated surfaces 53 and/or 54 provided by the shelves 52.
Semiconductor temperature sensors used in preferred embodiments disclosed herein are disclosed in U.S. Pat. No. 8,247,745, which is entitled “Temperature Sensor for a Food Holding Cabinet” the entirety of which is hereby incorporated by reference herein, especially the teachings of the structure and use of a semiconductor temperature sensor.
Thus, suitable heating elements for use in accordance with the disclosure include electrically-resistive heating elements, such as heated coils, radiant heating elements that provide heat energy via radiation, and devices and ancillary equipment that provide heat to a working fluid. As described above, Peltier devices may also be used as heating elements in accordance with the disclosure.
The foregoing description is for purposes of illustration only and not for purposes of limitation. The true scope of the invention is set forth by the appended claims.
This application is a continuation of U.S. patent application Ser. No. 16/403,349, filed May 3, 2019, which is a continuation of U.S. patent application Ser. No. 15/984,760, filed May 21, 2018, which is a continuation of U.S. patent application Ser. No. 15/134,380, filed Apr. 20, 2016, which are incorporated herein by reference in their entirety and made a part hereof.
Number | Name | Date | Kind |
---|---|---|---|
D63818 | Curtiss | Jan 1924 | S |
2386919 | Tobey | Oct 1945 | A |
2900806 | Wurtz et al. | Aug 1959 | A |
2934913 | Haines et al. | May 1960 | A |
3042384 | Bauman | Jul 1962 | A |
3275393 | Stentz et al. | Sep 1966 | A |
3301618 | Feldser et al. | Jan 1967 | A |
3308633 | Kritzer, Jr. | Mar 1967 | A |
3393630 | Pickens | Jul 1968 | A |
3414709 | Tricault | Dec 1968 | A |
3696720 | Vinson | Oct 1972 | A |
3950632 | Rivelli | Apr 1976 | A |
3979056 | Barnes | Sep 1976 | A |
D243362 | Shumrak et al. | Feb 1977 | S |
4036995 | Koether et al. | Jul 1977 | A |
4077690 | Koether | Mar 1978 | A |
4093041 | Davis et al. | Jun 1978 | A |
4278872 | Koether et al. | Jul 1981 | A |
4306616 | Woods, Jr. et al. | Dec 1981 | A |
4355521 | Tsai | Oct 1982 | A |
4388689 | Hayman et al. | Jun 1983 | A |
4530067 | Dorr | Jul 1985 | A |
4569421 | Sandstedt | Feb 1986 | A |
4610238 | Veth | Sep 1986 | A |
4633230 | Tam | Dec 1986 | A |
4644931 | Veth | Feb 1987 | A |
4688475 | Witt et al. | Aug 1987 | A |
4740888 | Ceste, Sr. et al. | Apr 1988 | A |
4742455 | Schreyer | May 1988 | A |
4782445 | Pasquini | Nov 1988 | A |
4812625 | Ceste, Sr. | Mar 1989 | A |
4812963 | Albrecht et al. | Mar 1989 | A |
4864498 | Pasquini et al. | Sep 1989 | A |
4911068 | Koether et al. | Mar 1990 | A |
4922435 | Cahlander et al. | May 1990 | A |
5003472 | Perrill et al. | Mar 1991 | A |
5069273 | O'Hearne | Dec 1991 | A |
5093556 | Oelfke | Mar 1992 | A |
5128862 | Mueller | Jul 1992 | A |
5132914 | Cahlander et al. | Jul 1992 | A |
5172328 | Cahlander et al. | Dec 1992 | A |
5188020 | Buchnag | Feb 1993 | A |
5216918 | Landis et al. | Jun 1993 | A |
5218527 | Ishikawa et al. | Jun 1993 | A |
5247807 | Jarman et al. | Sep 1993 | A |
5253564 | Rosenbrock et al. | Oct 1993 | A |
D341054 | Maputol | Nov 1993 | S |
5357426 | Morita et al. | Oct 1994 | A |
D364530 | Robards, Jr. et al. | Nov 1995 | S |
5485780 | Koether et al. | Jan 1996 | A |
D369269 | Labadia Del Fresno | Apr 1996 | S |
5504589 | Montague et al. | Apr 1996 | A |
5510979 | Moderi et al. | Apr 1996 | A |
5539671 | Albrecht et al. | Jul 1996 | A |
5553312 | Gattey et al. | Sep 1996 | A |
5579952 | Fiedler et al. | Dec 1996 | A |
5590586 | Ulfig et al. | Jan 1997 | A |
5594222 | Caldwell | Jan 1997 | A |
5616269 | Fowler et al. | Apr 1997 | A |
5653906 | Fowler et al. | Aug 1997 | A |
5724886 | Ewald et al. | Mar 1998 | A |
5772072 | Prescott et al. | Jun 1998 | A |
5783803 | Robards, Jr. | Jul 1998 | A |
5812393 | Drucker | Sep 1998 | A |
5900173 | Robards, Jr. | May 1999 | A |
5921096 | Warren | Jul 1999 | A |
5931083 | Stanger et al. | Aug 1999 | A |
5939974 | Heagle et al. | Aug 1999 | A |
5944324 | Schultheis et al. | Aug 1999 | A |
5947012 | Ewald et al. | Sep 1999 | A |
6000622 | Tonner et al. | Dec 1999 | A |
6006996 | Bhatnagar | Dec 1999 | A |
6011243 | Arnold et al. | Jan 2000 | A |
6026372 | Savage | Feb 2000 | A |
6031208 | Witt et al. | Feb 2000 | A |
6052667 | Walker et al. | Apr 2000 | A |
D427008 | Wasner | Jun 2000 | S |
D427479 | Wasner | Jul 2000 | S |
6088681 | Coleman et al. | Jul 2000 | A |
6114659 | Finck et al. | Sep 2000 | A |
6116154 | Vaseloff | Sep 2000 | A |
6119587 | Ewald et al. | Sep 2000 | A |
D434265 | Tatlow | Nov 2000 | S |
6153244 | Stanger et al. | Nov 2000 | A |
6158885 | Landis | Dec 2000 | A |
6175099 | Shei et al. | Jan 2001 | B1 |
6200944 | Dovey et al. | Mar 2001 | B1 |
6209447 | Ewald et al. | Apr 2001 | B1 |
6257010 | Shei et al. | Jul 2001 | B1 |
6261621 | Stanger et al. | Jul 2001 | B1 |
6262394 | Shei et al. | Jul 2001 | B1 |
6412403 | Veltrop | Jul 2002 | B1 |
6434961 | Richmond et al. | Aug 2002 | B2 |
6502411 | Okamoto | Jan 2003 | B2 |
6541739 | Shei et al. | Apr 2003 | B2 |
D480260 | Domi et al. | Oct 2003 | S |
6637322 | Veltrop | Oct 2003 | B2 |
6658994 | McMillan | Dec 2003 | B1 |
6825447 | Kim et al. | Nov 2004 | B2 |
6834276 | Jensen et al. | Dec 2004 | B1 |
6878391 | Veltrop | Apr 2005 | B2 |
6884451 | Veltrop | Apr 2005 | B2 |
7028498 | Monroe et al. | Apr 2006 | B2 |
7105779 | Shei | Sep 2006 | B2 |
7132926 | Vaseloff et al. | Nov 2006 | B2 |
7227102 | Shei | Jun 2007 | B2 |
7235762 | Gagas et al. | Jun 2007 | B2 |
7238654 | Hodge et al. | Jul 2007 | B2 |
7258064 | Vaseloff et al. | Aug 2007 | B2 |
7279659 | Gagas et al. | Oct 2007 | B2 |
7328654 | Shei | Feb 2008 | B2 |
RE40151 | Shei et al. | Mar 2008 | E |
RE40290 | Shei et al. | May 2008 | E |
7376485 | Salerno | May 2008 | B2 |
D570715 | Di Federico | Jun 2008 | S |
7381927 | Agnello | Jun 2008 | B1 |
7385160 | Jones | Jun 2008 | B2 |
7446282 | Shei et al. | Nov 2008 | B2 |
7628107 | Vaseloff et al. | Dec 2009 | B2 |
7762636 | Veeser et al. | Jul 2010 | B2 |
7858906 | Veltrop et al. | Dec 2010 | B2 |
7905173 | Sus et al. | Mar 2011 | B2 |
7971523 | Hartfelder et al. | Jul 2011 | B2 |
8091472 | Maciejewski et al. | Jan 2012 | B2 |
8096231 | Veltrop et al. | Jan 2012 | B2 |
8134101 | Majchrzak | Mar 2012 | B2 |
8247745 | Chung et al. | Aug 2012 | B2 |
8404292 | Veltrop et al. | Mar 2013 | B2 |
8522675 | Veltrop | Sep 2013 | B2 |
8558142 | Theodos et al. | Oct 2013 | B2 |
8607587 | Veltrop | Dec 2013 | B2 |
8667807 | Veltrop | Mar 2014 | B2 |
D704982 | Gates | May 2014 | S |
D716095 | Veltrop et al. | Oct 2014 | S |
D725429 | Veltrop et al. | Mar 2015 | S |
8997636 | Kirby et al. | Apr 2015 | B2 |
9003820 | Veltrop | Apr 2015 | B2 |
9068768 | Veltrop | Jun 2015 | B2 |
9140484 | Veltrop | Sep 2015 | B2 |
9140485 | Veltrop | Sep 2015 | B2 |
9854943 | Betzold et al. | Jan 2018 | B2 |
9976750 | Kestner | May 2018 | B1 |
9980322 | Kestner et al. | May 2018 | B1 |
10492641 | Kestner | Dec 2019 | B2 |
10512363 | Kestner | Dec 2019 | B2 |
10841981 | Kestner | Nov 2020 | B1 |
10852002 | Kestner | Dec 2020 | B1 |
20010007322 | Shei et al. | Jul 2001 | A1 |
20010053963 | Kim et al. | Dec 2001 | A1 |
20020172742 | Veltrop | Nov 2002 | A1 |
20030118706 | Veltrop | Jun 2003 | A1 |
20040000162 | Song | Jan 2004 | A1 |
20040016242 | Song et al. | Jan 2004 | A1 |
20040019534 | Callahan et al. | Jan 2004 | A1 |
20040020915 | Shei | Feb 2004 | A1 |
20040060320 | Roh et al. | Apr 2004 | A1 |
20040069155 | Shei | Apr 2004 | A1 |
20050211696 | Adamski | Sep 2005 | A1 |
20050236947 | LeClear et al. | Oct 2005 | A1 |
20060150662 | Lee et al. | Jul 2006 | A1 |
20060185527 | Shei | Aug 2006 | A1 |
20070017245 | Song et al. | Jan 2007 | A1 |
20070144202 | Theodos et al. | Jun 2007 | A1 |
20070251397 | Dorsten et al. | Nov 2007 | A1 |
20080023462 | Shei et al. | Jan 2008 | A1 |
20080213449 | Wisner et al. | Sep 2008 | A1 |
20080302778 | Veltrop et al. | Dec 2008 | A1 |
20090045185 | Schroeder et al. | Feb 2009 | A1 |
20090126580 | Hartfelder et al. | May 2009 | A1 |
20090199723 | Veltrop et al. | Aug 2009 | A1 |
20090199725 | Veltrop et al. | Aug 2009 | A1 |
20090266244 | Maciejewski et al. | Oct 2009 | A1 |
20090309027 | Von Striver | Dec 2009 | A1 |
20100140251 | Shei | Jun 2010 | A1 |
20100205992 | Morris | Aug 2010 | A1 |
20110030565 | Shei | Feb 2011 | A1 |
20110114618 | Chung et al. | May 2011 | A1 |
20110114624 | Chung | May 2011 | A1 |
20110252813 | Veltrop | Oct 2011 | A1 |
20110252984 | Chung | Oct 2011 | A1 |
20110253698 | Theodos et al. | Oct 2011 | A1 |
20110253703 | Theodos et al. | Oct 2011 | A1 |
20110278278 | Emerich et al. | Nov 2011 | A1 |
20110283895 | Veltrop | Nov 2011 | A1 |
20120079699 | Veltrop et al. | Apr 2012 | A1 |
20120261426 | Tomczyk et al. | Oct 2012 | A1 |
20120285942 | Godecker et al. | Nov 2012 | A1 |
20130175253 | Shei et al. | Jul 2013 | A1 |
20140010937 | Stanger | Jan 2014 | A1 |
20140057031 | Ewald et al. | Feb 2014 | A1 |
20140083309 | Reese et al. | Mar 2014 | A1 |
20140130684 | Reese et al. | May 2014 | A1 |
20140150461 | Veltrop | Jun 2014 | A1 |
20140165644 | Veltrop | Jun 2014 | A1 |
20140174101 | Veltrop | Jun 2014 | A1 |
20140197177 | Veltrop et al. | Jul 2014 | A1 |
20140246966 | Nevarez | Sep 2014 | A1 |
20140263269 | Veltrop et al. | Sep 2014 | A1 |
20150201749 | Turner et al. | Jul 2015 | A1 |
20150201803 | Veltrop | Jul 2015 | A1 |
Number | Date | Country |
---|---|---|
8000414 | Jan 1996 | JP |
10079088 | Mar 1998 | JP |
11342061 | Dec 1999 | JP |
WO 200131533 | May 2001 | WO |
WO-2005034633 | Apr 2005 | WO |
Entry |
---|
“Modular Holding Cabinets”, Product Catalog, Carter-Hoffmann, Mundelein, Illinois (Jan. 2014). |
Frymaster HCP Installation and Operation Manual, Dec. 2006, pp. 1-1 to 10-4, title page and table of publisher, Enodis, Frymaster LLC, Shreveport, LA. |
Prince Castle LLC, Holding Bins (www.princecastle.com <http://www.princecastle.com>). |
Prince Castle LLC, Holding Panels (www.princecastle.com <http://www.princecastle.com>). |
Reider, How to Say What Stuff Looks Like, Ontario, Canada: Marcus Books, p. 62 (1995). |
Thermodyne Food Products, Inc., Counter Top Holding Oven Model 300 NDNL specification. |
Prince Castle LLC, Holding Bin DHB3PT-33DD, Jun. 2015. |
Prince Castle LLC, Original Instructions Operation Manual for Holding Bin DHB3PT-33DD, DHB3SS-33D, available prior to Apr. 19, 2016. |
Number | Date | Country | |
---|---|---|---|
Parent | 16403349 | May 2019 | US |
Child | 17089072 | US | |
Parent | 15984760 | May 2018 | US |
Child | 16403349 | US | |
Parent | 15134380 | Apr 2016 | US |
Child | 15984760 | US |