The present disclosure generally relates to matching networks and multiband antenna assemblies including the same that are operable with high gain and broad bandwidth coverage.
This section provides background information related to the present disclosure which is not necessarily prior art.
Multiband antennas typically include multiple antennas to cover and operate multiple frequency ranges. A printed circuit board (PCB) having a radiating antenna element thereon is a typical component of a multiband antenna assembly. Another typical component of a multiband antenna assembly is an external antenna, such as an aerial whip antenna rod. The multiband antenna assembly may be mounted to an antenna mount, which, in turn, is installed or mounted on a vehicle surface, such as the roof, trunk, or hood of the vehicle. The antenna mount may be interconnected (e.g., via a coaxial cable, etc.) to one or more electronic devices (e.g., a radio device, etc.), such that the multiband antenna is then operable for transmitting and/or receiving radio frequency signals to/from the radio device via the antenna mount.
This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.
According to various aspects, exemplary embodiments are disclosed of base assemblies that include matching networks and multiband antenna assemblies including the same. For example, an exemplary embodiment of a base assembly includes a printed circuit board and a balun coupled to the printed circuit. The printed circuit board and balun are configured to be operable for providing impedance matching via a matching network that includes a first inductor, a second inductor, and a concentric capacitance. The base assembly is operable for providing a multiband antenna assembly with impedance matching simultaneously with more than one frequency band.
Another exemplary embodiment includes a multiband antenna assembly operable in at least a very high frequency (VHF) band from 136 Megahertz (MHz) to 174 MHz, an ultra high frequency (UHF) band from 380 MHz to 520 MHz, and a 700/800 MHz frequency band from 760 MHz to 870 MHz. The multiband antenna assembly includes a base assembly operable for providing impedance matching simultaneously with the VHF band, the UHF band, and the 700/800 MHz frequency band. An aerial whip antenna assembly is mounted to the base assembly. The base assembly includes a printed circuit board and a balun coupled to the printed circuit. The base assembly also includes a base ring portion configured for mounting the base assembly to an antenna mount. A contact pin is configured for providing an electrical connection between a contact of the antenna mount and the printed circuit board when the base assembly is mounted to the antenna mount.
Further areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Example embodiments will now be described more fully with reference to the accompanying drawings.
Disclosed herein are exemplary embodiments of spring contact assemblies suitable for providing a solderless connection between a printed circuit board (PCB) and a contact. In an exemplary embodiment, a spring contact assembly may be used to provide a solderless connection between a center contact (e.g., pin, etc.) of an external antenna mount and an internal antenna element on a PCB of a multiband antenna assembly. In such exemplary embodiment, the spring contact assembly thus may be used as a connecting device to physically interconnect (without soldering) the center contact from the external antenna mount to the internal antenna element, such that radio frequency (RF) signals, electrical current, and/or modulated RF signals may be transferred (transmitted, or received) via the spring contact assembly between the multiband antenna assembly and a radio device coupled to the antenna mount, such as via a coaxial cable. Additional aspects of the present disclosure also include methods of connecting a center contact from an external antenna mount to an internal antenna element of a printed circuit board without soldering.
In addition to the spring contact assemblies disclosed herein, there are also disclosed exemplary embodiments of sealed antenna base assemblies. The sealed antenna base assemblies may be used individually or in conjunction with a spring contact assembly, or either may be used individually. Accordingly, an antenna assembly may include either or both of a sealed antenna base assembly and/or a spring contact assembly according to aspects of the present disclosure.
Multiband antenna structures commonly include PCBs, which require electrical ground sources. Typically, the ground sources are fed at deferent locations at the base of the PCB. Conventionally, grounding sources have been made available but the inventors hereof have recognized that such conventional methods breached the base of the antenna sacrificing the moisture and water seals. Accordingly, the inventors hereof have disclosed antenna base assemblies that provide the ground sources for the PCB while also maintaining a sealed base (e.g., a moisture, water, and/or dust sealed base, etc.). In an exemplary embodiment, there is an internal radiating element sealed foundation inside an antenna structure, which functions as an adaptor to mate an external antenna mount into the feeding point of a radiating element. This exemplary embodiment provides satisfactory multiple electrical grounding sources while preserving the sealing features. Additional aspects of the present disclosure also include methods of providing multiple electrical grounding sources for a printed circuit board without breaching the seal(s) of an antenna base assembly, thereby preserving the sealed interior of the antenna base assembly in which the printed circuit board is housed.
Additionally, there are also disclosed exemplary embodiments of antenna base body assemblies for multiband antennas. For example, an exemplary embodiment of a base body assembly is configured to provide or have a unique matching network structure operable for providing impedance matching and that works simultaneously with a wide band frequency spectrum (e.g., VHF 136-174 MHz, UHF 380-520 MHz, and Cell/LTE 700/800 MHz), supplementing a single Aerial structure of broadband coverage. In pursuing a balance of antenna aesthetic look, performance, and low cost on the LMR (Land, Mobile, Radio) realm, the inventors hereof sought to develop and disclose herein an exemplary embodiment of a single full spectrum antenna operable with VHF 136-174 MHz, UHF 380-520 MHz, and Cell/LTE 700/800 MHz in an overall antenna package that may be less than 20 inches in height and that has a relatively small base as a mechanical support for mounting on a standard vehicle for public safety wireless applications. As disclosed herein, an exemplary embodiment of an antenna assembly includes a vertically mounted mobile aerial structure. A primary aerial whip assembly is coupled or mounted to a base body assembly. The base body assembly may include a hermetically sealed housing and a base cap. The base body assembly may be encompass or be configured so as to provide a unique matching network. The primary aerial whip assembly may include a shock absorbing spring mounted to or coupled to the base body assembly. The primary aerial whip assembly may also include two metal rods top mounted to the shock absorbing spring. A radio wave impedance matching helical spring (or phasing coil) electrically connects and linearly joins the two metal rods with a separation or spaced distance between the two rods. An aerial radio waves defusing metal ball is coupled (e.g., via a press fit, etc.) to an upper portion of the top linearly mounted rod. For example, the top linearly mounted rod may be pressed into an opening or hole in the aerial radio waves defusing metal ball.
With reference now to the figures,
As shown in
When the holes 130, 142 are aligned, the rivet 120 may be positioned through the aligned holes 128, 130 to thereby connect or lock the spring contact assembly 100 to the substrate, board or body of the PCB 124 as shown in
With the spring contact assembly 100 coupled to the PCB 124 via the rivet 120, the other end of the spring contact assembly 100 may be used to physically interconnect or electrically connect with a contact, such as a center contact of an external radio antenna mount (e.g., center contact 397 of antenna mount 396 shown in
With continued reference to
The spring 108 in this example embodiment is a helical metal compression coil spring made from a stainless steel alloy material. In operation, the spring 108 is operable for biasing or pressure loading the housing 112 and its end portion 113 into good electrical contact with a center contact of an external antenna mount. While this illustrated embodiment includes a coil spring, other suitable biasing members besides coil springs made from stainless steel alloy may be used in other embodiments.
The housing 112 includes a closed end portion 113 and open end portion 114 for receiving the spring 108 therein as shown in
While this illustrated embodiment includes a cup-shaped cold drawn housing 112 from brass sheet metal plated with gold, other embodiments may include housings with a different configuration, such as housings formed from other materials and/or other manufacturing processes.
Also in this illustrated embodiment, the ring or annular member 116 is a bearing that is inserted into the body 104 so as to provide a bearing surface for rotary and linear movement of the housing 112 relative to the bearing 116 and body 104. The annular member 116 also prevents or at least inhibits the housing 112 from being slid completely out of the body 104. The bearing 116 may be coupled to the inner walls of the body 104 via mechanical compression, interference/friction fit, or other suitable method. As shown in
In this example, the rivet 120 is used as a mechanical fastener that couples the spring contact assembly 100 to the PCB 124. The rivet 120 is a permanent or fixed mechanical fastener in this example that is not removable from the holes of the PCB 124 and body 104 after installation. Before being installed, the rivet 120 includes a smooth cylindrical shaft with a head 121 on one end (
Regarding the PCB 124, it may include a substrate or board body made of FR4 or other suitable material. The PCB 124 includes one or more antenna radiating elements (e.g., electrically-conductive traces, etc.) configured to be operable and resonant in one or more frequency ranges or bands, such as a very high frequency (VHF) band from 136 Megahertz (MHz) to 174 MHz, an ultra high frequency (UHF) band from 380 MHz to 520 MHz, and/or a 700/800 MHz band from 760 MHz to 870 MHz. These frequency bands are examples only as other exemplary embodiments may include a PCB with one or more antenna radiating elements configured to be operable and resonant at other frequencies and/or frequency bands.
In operation, the PCB 124 is operable for transmitting and receiving electrical current through a contact port physically attached to an edge of the PCB 124. Also in this illustrated embodiment, the PCB 124 is configured with a specific or predetermined shape to accommodate the installation of the spring contact assembly 100. As shown in
With continued reference to
The antenna base assembly 250 may be used in conjunction with a spring contact assembly, such as the spring contact assembly 100 shown in
As shown in
With continued reference to
In this illustrated example of
The fasteners 262, 266 may be screws made from solderable material, such as brass, nickel-plated metal, gold-plated metal, tin-plated metal, etc. As shown by
The fasteners 262 are also deployed as electrical grounding taps for the PCB 224 in this example. The fasteners 262 are configured for establishing at least a portion of an electrically-conductive grounding pathway from outside of or external to the interior enclosure of the antenna base assembly 250 and which extends into the interior enclosure. As shown by
The fasteners 262 may be soldered directly to one or more electrically-conductive portions on the PCB 224 and/or by extending wire leads from the PCB 224 and soldering the wire leads to the ground taps/fasteners 262. In either case, an electrically-conductive grounding pathway is thus established from the PCB 224 through the fasteners 262 to the bushing 254 and then to the threaded portion of the antenna mount on which the bushing 254 is mounted.
The base 258 may be formed from various dielectric materials. By way of example, the base 258 may be an injection molded plastic part configured (e.g., shaped, sized, etc.) to accept the mating of the bushing 254 and the PCB 224. As shown in
The upper or top portion of the base 258 is shaped to mate with the PCB 224 aligned vertically. When the PCB 224 is positioned on the base 258 as shown in
The PCB 224 also includes clearances or cutout areas 233 to accommodate and provide sufficient space for the heads of the fasteners 262 as shown in
In addition, the PCB 224 also includes holes or openings 230 and notches or cutout areas 232. These PCB holes 230 and notches 232 may be used similar to that described above for the PCB 124 and spring contact assembly 100. Accordingly, the spring contact assembly 200 shown in
With continued reference to
In addition to the sealing function in this example, positioning the end portion 246 of the spring contact assembly 200 through the opening 271 also allows it to electrically connect with a center contact or pin (e.g., center contact 397 shown in FIG. 12, etc.) of an antenna mount when the base assembly 250 is installed onto the antenna mount. In turn, the center contact of the antenna mount may be connected to an inner conductor of a coaxial cable (e.g., coaxial cable 399 also shown in
In addition to the seal 273 formed between the contact pin 246 and base 258, the antenna base assembly 250 also includes the sealing member or seal 270. In this example, the seal 270 is an elastomeric (e.g., rubber, silicone, foam, etc.) O-ring, gasket, or washer configured so as to seal an interface between the housing 274 and base 258. As shown by
The antenna housing 274 may be coupled to the base 258 by various suitable means, such as mechanical fasteners (e.g., screws, other fastening devices, etc.), a snap-fit connection, ultrasonic welding, solvent welding, heat staking, adhesives, latching, bayonet connections, hook connections, integrated fastening features, etc. within the scope of the present disclosure. When the housing 274 is coupled to the base 258, the seals 270 and 273 may thus help protect components against ingress of contaminants (e.g., dust, moisture, etc.) into an interior enclosure defined between the housing or cover 274 and the base 258. In this illustrated example, the antenna housing 274 is a generally bell shaped or dome shaped plastic housing. Alternative embodiments may include a differently configured housing having a different shape (e.g., aerodynamic configuration, etc.), formed from different materials, etc.
The antenna base assembly 250 may be threadedly coupled via the threaded portion of the bushing 254 to an external antenna mount. In turn, the external antenna mount may be mounted to a surface of an automobile such as the roof, trunk, hood, etc. In the illustrated example, there is shown a sealing member 278 (e.g., a weather resistant rubber or foam gasket, etc.) on the bottom of the antenna assembly 250. In some embodiment, the sealing member 278 may be adhesively attached, etc. to the bottom of the base 258 and/or housing 274.
When the antenna base assembly 250 is mounted to the antenna mount, the sealing member 278 is disposed between the mounting surface and the bottom of the antenna base assembly 250. The sealing member 278 may help prevent damage to the vehicle roof (or other mounting surface). The sealing member 278 also provides further sealing features by helping to seal the mounting area against the ingress or migration of moisture, water, dust, etc. In other embodiments, the housing 274 and/or base seat 254 may be mounted to the antenna mount and/or mounting surface without any gasket 278 between the mounting surface and the antenna base assembly.
The multiband antenna assembly 390 may be configured to be operable and resonant in various frequency ranges or bands, including a very high frequency (VHF) band from 136 MHz to 174 MHz, an ultra high frequency (UHF) band from 380 MHz to 520 MHz, a cell/LTE 700/800 MHz band from 764 MHz to 870 MHz. These frequency bands are examples only as other exemplary embodiments of an antenna assembly that includes a spring contact assembly 100 and/or antenna base assembly 250 may be configured to be operable and resonant at other frequencies and/or frequency bands.
The base assembly 450 includes a printed circuit board (PCB) 424 and balun 482 configured so as to provide an impedance matching network structure as shown in
The base assembly 450 also includes upper and lower contact pins 400 and a base ring portion or bushing 454. The contact pins 400 may comprise metal pogo pin devices and/or the spring contact assemblies 100 disclosed herein. In operation, the contact pins 400 conduct the electrical current through the PCB 424 and balun structure 482 towards the aerial whip assembly 492. The base ring portion 454 comprises an electrically-conductive threaded nut (e.g., brass or other metal, etc.) threadedly attached to the base or housing cap 458 (e.g., thermoplastic cap, etc.). The base ring portion 454 may be used as a mounting part for mounting the antenna assembly 490 to an external mount port. In operation, the base ring portion 454 conducts the ground portion of the current flow into the antenna structure. The multiband band assembly 490 may be coupled to an antenna mount (e.g., NMO antenna mount, etc.) in a similar manner as the antenna assembly 390 is mounted to the mount 396 shown in
With continued reference to
In this example, the bulk circuit of the matching network represents an actual ¼ wave radiator for the upper 800 MHz frequency band, meanwhile the matching network serves the purpose of impedance matching for the middle and low frequency bands. The characteristics of the concentric capacitances C2 between both inductors L1 and L2 and the capacitance C1 from ground comprises the full matching circuit as shown in
During operation of the antenna assembly 490, the matching network (L1, L2, C1 and C2) together with L3 (bottom rod inductance) form a ½ wave radiator for 800 MHz and 5/16 wave radiator for UHF. A ¼ wave radiator for VHF is formed by the elements beginning with the source at the base ring portion 458 up to the metal ball 507 as shown in
The multiband antenna assembly 490 may also include various components and elements similar to that described above for the base assembly 250 and shown in
Also shown in
More specifically,
The multiband antenna 490 may include one or more spring contact assemblies 100 (
Accordingly, the inventors have disclosed exemplary embodiments of multiband antenna assemblies having matching networks that may provide one or more (but not necessarily any or all) of the following advantages. For example, disclosed exemplary embodiments make it possible to achieve high gain and broad bandwidth coverage in a relatively small and sleek overall package. In contrast, conventional multiband antenna matching networks restrict the achievement of both broad bandwidth and high gain due to a tradeoff of losing gain on some parts of the band coverage. Traditionally, much larger aerial structures and larger matching network assemblies have been used to attempt to obtain a fair combination of broad bandwidth and high gain.
In exemplary embodiments, the inventors have struck a balance of antenna aesthetic look and performance with a single full spectrum antenna operable across all of the most popular U.S. public safety frequencies such as the VHF frequencies from 136-174 MHz, the UHF frequencies from 380-520 MHz, and frequencies within the Cell/LTE 700/800 MHz in a package less than 20 inches in height and with a small base as a mechanical support on a standard vehicle for public safety wireless applications. In an exemplary embodiment, a unique impedance matching network is operable simultaneously with a wide band frequency spectrum including VHF 136-174 MHz, UHF 380-520 MHz, and Cell/LTE 700/800 MHz, which may supplement a single aerial structure for broadband coverage.
Exemplary embodiments may be operable on a four feet by four feet ground plane and/or with continuous power handling at 100 Watts for all frequency bands. Exemplary embodiments may provide multiple radio frequency broadband matching networks combined with no discrete components. Exemplary embodiments may include a low visible and stylish enclosed phasing coil and rod length with overall length maximum of 20 inches high. Exemplary embodiments may be omnidirectional, vertically polarized, and have simultaneous standard electrical lengths of ¼ wavelength for VHF, ⅝ wavelength for UHF, and ⅝ over ⅝ wavelength for Cell/LTE 700/800 MHz band. Exemplary embodiments may be operable with unity gain for VHF 136-174 MHz and with 3 dBi gain for UHF 380-520 MHz and Cell/LTE 700/800 MHz. Exemplary embodiments may provide multiple radio frequency broadband matching networks using open stub matching technique and in conjunction with a 0.125 inch thick Printed Circuit Board (PCB) with both approximately 3 inches in length and overall length of the antenna is approximately 20 inches tall. Exemplary embodiments may be configured to mount on a 4 feet by 4 feet ground plane and be attached with 17 feet of RG58A/U coaxial cable to achieve what a radio will see VSWR<2.5:1 on all frequency bands of VHF 136-174 MHz, UHF 380-520 MHz, and Cell/LTE 700/800 MHz.
Exemplary spring contact assemblies disclosed herein were developed by the inventors in an effort to an effective pressure electrical/mechanical connection point that deploys a minimal (or at least reduced) surface area variation, ease of manufacturing, electrical stability, and/or better (or at least satisfactory) structural strength as compared to some conventional contact assemblies. The inventors hereof recognized that some conventional contact assemblies were associated with one or more of the following drawbacks, such as an inability to handle high electrical current and power requirements, non-uniform contact area and path produced instable repeatability for electrical current flow, operator skill dependent, insufficient structural strength, production reproducibility issues eliminated the fixed tune options on higher frequency antenna models, time consuming assembly process, and/or very difficult to automate at a mass production level.
Accordingly, the inventors have disclosed exemplary embodiments of spring contact assemblies that may provide one or more (but not necessarily any) of the following advantages. For example, an exemplary embodiment of the inventors' spring contact assembly may provide good electrical contact via a rivet, may provide a strong connection to the PCB board material (e.g., FR4, etc.) without concern for cracking of non-existent solder, and/or may provide good repeatability in manufacture and a fixed tune design such that the antenna assemblies do not need to be tuned on the assembly floor during manufacture. By way of further example, an exemplary embodiment of the inventors' spring contact assembly may have a fixed shape that minimizes or reduces electrical RF current flow through the body of the conductive spring contact assembly and surface current flow variation/transformation when repeated in mass production levels. An exemplary embodiment of the inventors' spring contact assembly may provide a solderless interconnection that helps eliminate (or at least reduce) workmanship related variations. An exemplary embodiment of the inventors' spring contact assembly may have a stronger structure to minimize or reduce the possibility of disengagement from the PCB. An exemplary embodiment of the inventors' spring contact assembly may provide a two sided sandwich lock to minimize or reduce copper trace peeling effects due to vibrations. An exemplary embodiment of the inventors' spring contact assembly may be configured with a rivet fastened lock that constrains the structure to a stronger FR4 material of the board of the PCB and not to the copper trace. An exemplary embodiment of the inventors' spring contact assembly may be configured with a spring contact feature that can handle up to five hundred percent more impact and loading forces than a conventional soldered type pushpin. An exemplary embodiment of the inventors' spring contact assembly may contain a heavier section of materials allowing higher electrical current to run through, which, in turn would allow higher power handling. An exemplary embodiment of the inventors' spring contact assembly may not require any additional mechanical support from the hull body of the containing unit. An exemplary embodiment of the inventors' spring contact assembly may allow for a faster assembly and easier automation possibilities. It should be noted that the advantages disclosed herein are exemplary only and not limiting, as exemplary embodiments of the present disclosure may achieve all, some, or none of the advantages disclosed herein.
The inventors hereof have also recognized conventional antenna base assemblies provide electrical grounding but suffered many problems associated with poor seals and/or breached seals, which made the antenna prone to failure. For example, some conventional antenna base assemblies are associated with a shorter life span on shelf or in the field, a degraded performance by time caused by internal component corrosion, an open antenna hull allowing moisture condensation inside the antenna associated with temperature variation, imminent failure if mounted high or poorly, allow water migration from rain hydro pressure to seep into the antenna, imminent failure if the base gasket fails, and/or allowed only one grounding tap to feed the PCB.
Accordingly, the inventors have disclosed exemplary embodiments of sealed antenna base assemblies that may provide one or more (but not necessarily any) of the following advantages. For example, an exemplary embodiment of the inventors' sealed antenna base assembly may provide more than one grounding tap, may maintain long term performance with minimized (or at least reduced) corrosion of internal components of an antenna unit, may provide a stronger uphold against moisture and water migration into the inside the antenna unit, may minimize or reduce moisture condensation due to thermal variation, may significantly reduce the chance for failures if mounted high or poorly, may double the sealing defense to insure no failures if the base gasket fails, may significantly increase storage shelf life and infield life span, and/or enabled the antenna structure to meet higher standards such as Ingress Protection ratings. It should be noted that the advantages disclosed herein are exemplary only and not limiting, as exemplary embodiments of the present disclosure may achieve all, some, or none of the advantages disclosed herein.
Numerical dimensions and values are provided herein for illustrative purposes only. The particular dimensions and values provided are not intended to limit the scope of the present disclosure.
Spatially relative terms, such as “inner,” “outer,” “beneath”, “below”, “lower”, “above”, “upper” and the like, may be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the example term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “including,” and “having,” are inclusive and therefore specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. It is also to be understood that additional or alternative steps may be employed.
When an element or layer is referred to as being “on”, “engaged to”, “connected to” or “coupled to” another element or layer, it may be directly on, engaged, connected or coupled to the other element or layer, or intervening elements or layers may be present. In contrast, when an element is referred to as being “directly on,” “directly engaged to”, “directly connected to” or “directly coupled to” another element or layer, there may be no intervening elements or layers present. Other words used to describe the relationship between elements should be interpreted in a like fashion (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. The term “about” when applied to values indicates that the calculation or the measurement allows some slight imprecision in the value (with some approach to exactness in the value; approximately or reasonably close to the value; nearly). If, for some reason, the imprecision provided by “about” is not otherwise understood in the art with this ordinary meaning, then “about” as used herein indicates at least variations that may arise from ordinary methods of measuring or using such parameters. For example, the terms “generally”, “about”, and “substantially” may be used herein to mean within manufacturing tolerances.
Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as “first,” “second,” and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
Example embodiments are provided so that this disclosure will be thorough, and will fully convey the scope to those who are skilled in the art. Numerous specific details are set forth such as examples of specific components, devices, and methods, to provide a thorough understanding of embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that example embodiments may be embodied in many different forms (e.g., different materials may be used, etc.) and that neither should be construed to limit the scope of the disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail.
The disclosure herein of particular values and particular ranges of values for given parameters (e.g., frequencies, bandwidths, etc.) are not exclusive of other values and ranges of values that may be useful in one or more of the examples disclosed herein. Moreover, it is envisioned that any two particular values for a specific parameter stated herein may define the endpoints of a range of values that may be suitable for the given parameter. The disclosure of a first value and a second value for a given parameter can be interpreted as disclosing that any value between the first and second values could also be employed for the given parameter. Similarly, it is envisioned that disclosure of two or more ranges of values for a parameter (whether such ranges are nested, overlapping or distinct) subsume all possible combination of ranges for the value that might be claimed using endpoints of the disclosed ranges.
The foregoing description of the embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but, where applicable, are interchangeable and can be used in a selected embodiment, even if not specifically shown or described. The same may also be varied in many ways. Such variations are not to be regarded as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.
This application is a continuation-in-part of U.S. patent application Ser. No. 13/236,382 filed Sep. 19, 2011. This application is also a nonprovisional of U.S. Provisional Patent Application No. 61/701,814 filed Sep. 17, 2012. The entire disclosures of the above applications are incorporated herein by reference.
Number | Date | Country | |
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61701814 | Sep 2012 | US |
Number | Date | Country | |
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Parent | 13236382 | Sep 2011 | US |
Child | 13657538 | US |