1. Field of the Invention
The present disclosure relates to solar cells and the fabrication of solar cells, and more particularly the design and specification of the middle cell in multijunction solar cells based on III-V semiconductor compounds.
2. Description of the Related Art
Solar power from photovoltaic cells, also called solar cells, has been predominantly provided by silicon semiconductor technology. In the past several years, however, high-volume manufacturing of III-V compound semiconductor multijunction solar cells for space applications has accelerated the development of such technology not only for use in space but also for terrestrial solar power applications. Compared to silicon, III-V compound semiconductor multijunction devices have greater energy conversion efficiencies and generally more radiation resistance, although they tend to be more complex to manufacture. Typical commercial III-V compound semiconductor multijunction solar cells have energy efficiencies that exceed 27% under one sun, air mass 0 (AM0), illumination, whereas even the most efficient silicon technologies generally reach only about 18% efficiency under comparable conditions. Under high solar concentration (e.g., 500×), commercially available III-V compound semiconductor multijunction solar cells in terrestrial applications (at AM1.5D) have energy efficiencies that exceed 37%. The higher conversion efficiency of III-V compound semiconductor solar cells compared to silicon solar cells is in part based on the ability to achieve spectral splitting of the incident radiation through the use of a plurality of photovoltaic regions with different band gap energies, and accumulating the current from each of the regions.
In satellite and other space related applications, the size, mass and cost of a satellite power system are dependent on the power and energy conversion efficiency of the solar cells used. Putting it another way, the size of the payload and the availability of on-board services are proportional to the amount of power provided. Thus, as payloads become more sophisticated, the power-to-weight ratio of a solar cell becomes increasingly more important, and there is increasing interest in lighter weight, “thin film” type solar cells having both high efficiency and low mass.
The efficiency of energy conversion, which converts solar energy (or photons) to electrical energy, depends on various factors such as the design of solar cell structures, the choice of semiconductor materials, and the thickness of each cell. In short, the energy conversion efficiency for each solar cell is dependent on the optimum utilization of the available sunlight across the solar spectrum. As such, the characteristic of sunlight absorption in semiconductor material, also known as photovoltaic properties, is critical to determine the most efficient semiconductor to achieve the optimum energy conversion.
Multijunction solar cells are formed by a vertical or stacked sequence of solar subcells, each subcell formed with appropriate semiconductor layers and including a p-n photoactive junction. Each subcell is designed to convert photons over different spectral or wavelength bands to electrical current. After the sunlight impinges on the front of the solar cell, and photons pass through the subcells, the photons in a wavelength band that are not absorbed and converted to electrical energy in the region of one subcell propagate to the next subcell, where such photons are intended to be captured and converted to electrical energy, assuming the downstream subcell is designed for the photon's particular wavelength or energy band.
The energy conversion efficiency of multijunction solar cells is affected by such factors as the number of subcells, the thickness of each subcell, and the band structure, electron energy levels, conduction, and absorption of each subcell. Factors such as the short circuit current density (Jsc), the open circuit voltage (Voc), and the fill factor are also important.
One of the important mechanical or structural considerations in the choice of semiconductor layers for a solar cell is the desirability of the adjacent layers of semiconductor materials in the solar cell, i.e. each layer of crystalline semiconductor material that is deposited and grown to form a solar subcell, have similar crystal lattice constants or parameters.
Many III-V devices, including solar cells, are fabricated by thin epitaxial growth of III-V compound semi conductors upon a relatively thick substrate. The substrate, typically of Ge, GaAs, InP, or other bulk material, acts as a template for the formation of the deposited epitaxial layers. The atomic spacing or lattice constant in the epitaxial layers will generally conform to that of the substrate, so the choice of epitaxial materials will be limited to those having a lattice constant similar to that of the substrate material.
Assuming a Ge or GaAs substrate, the amount of lattice mismatch associated with an epitaxial layer with a predetermined atomic spacing is set forth in Table 1 below.
Mismatching of the lattice constant between adjacent semiconductor layers in the solar cells results in defects or dislocations in the crystal, which in turn causes degradation of photovoltaic efficiency by undesirable phenomena known as open-circuit voltage, short circuit current, and fill factor.
The energy conversion efficiency, i.e. the amount of electrical power produced by a given quantity or flux of incident photons on the solar cell, is measured by the resulting current and voltage referred to as the photocurrent and photovoltage. The aggregate photocurrent flow can be improved if each solar cell junction of the semiconductor device is current matched, in other words, the electrical characteristics of each solar subcell in the multijunction device is such that the electric current produced by each subcell is the same.
Current matching among the subcells is critical to the overall efficiency of the solar cell since in a multijunction solar cell device, the individual subcells in the device are electrically connected in series. In a series electrical circuit, the overall current flows though the circuit is limited to the smallest current capability of any one of the individual cells in the circuit. Current matching is essentially equalizing the current capability of each cell, by specifying and controlling (by control of the fabrication processes) both (i) the relative band gap energy absorption capabilities of the various semiconductor materials used to form the cell junctions, and (ii) the thicknesses of each semiconductor cell in the multijunction device.
In contrast to photocurrent, the photovoltages produced by each semiconductor cell are additive, and preferably each semiconductor cell within a multi-cell solar cell is selected to provide small increments of power absorption (e.g., a series of gradually reducing band gap energies) to improve the total power, and specifically the voltage, output of the solar cell.
The control of these parameters during fabrication is the appropriate selection, out of a large number of materials and material compounds, of the most suitable material structures. However, these prior art solar cell layers have often been lattice mismatched, which may lead to photovoltaic quality degradation and reduced efficiency, even for slight mismatching, such as less than one percent. Further, even when lattice-matching is achieved, these prior art solar cells often fail to obtain desired photovoltage outputs. This low efficiency is caused, at least in part, by the difficulty of lattice-matching each semiconductor cell to commonly used and preferred materials for the substrate, such as germanium (Ge) or gallium-arsenide (GaAs) substrates.
As discussed above, it is preferable that each sequential junction absorb energy with a slightly smaller band gap to more efficiently convert the full spectrum of solar energy. In this regard, solar cells are stacked in descending order of band gap energy. However, the limited selection of known semiconductor materials, and corresponding band gaps, that have the same lattice constant as the above preferred substrate materials has continued to make it a challenge to design and fabricate multijunction solar cells with high conversion efficiency and reasonable manufacturing yields.
Physical or structural design of solar cells can also enhance the performance and conversion efficiency of solar cells, especially in multijunction structures that increase the coverage of the solar spectrum. Solar cells are normally fabricated by forming a homojunction between an n-type and a p-type layer. The thin, topmost layer of the junction on the sunward side of the device is referred to as the emitter. The relatively thick bottom layer is referred to as the base. However, one problem associated with the conventional multijunction solar cell structure is the relatively low performance relating to the homojunction middle solar cells in the multijunction solar cell structures. The performance of a homojunction solar cell is typically limited by the material quality of the emitter, which is low in homojunction devices. Low material quality usually includes such factors as poor surface passivation, lattice mismatch between layers and/or narrow band gaps of the selected material.
A multijunction solar cell structures that include multiple subcells vertically stacked one above the other absorb an increased range of the solar spectrum. Increasing device efficiency of multijunction solar cell structures through band-gap engineering and lattice matching alone, however, has proven increasingly challenging.
Conventional III-V solar cells typically use a variety of compound semiconductor materials such as indium gallium phosphide (InGaP), gallium arsenic (GaAs), germanium (Ge) and so forth, to increase coverage of the absorption spectrum from UV to 890 nm. For instance, use of a germanium (Ge) junction to the cell structure extends the absorption range (i.e. to 1800 nm). Thus, the appropriate selection of semiconductor compound materials can enhance the performance of the solar cell.
The present invention is directed to improvements in multijunction solar cell structures to improve photoconversion efficiency and current matching.
It is an object of the present invention to provide increased photoconversion efficiency in a multijunction solar cell.
It is another object of the present invention to provide increased current in a multijunction solar cell by utilizing lattice mismatched layers in the middle cell and a distributed Bragg reflector layer below the base of the middle cell.
It is still another object of the present invention to provide a strain-balanced quantum well structure in the middle cell of a multijunction solar cell and a distributed Bragg reflector layer below the base of the middle cell.
It is still another object of the present invention to provide a quantum dot structure in the middle cell of a multijunction solar cell.
It is still another object of the present invention to provide a quantum dot structure in the middle cell of a multijunction solar cell, coupled with a distributed Bragg reflector layer beneath the middle cell.
Briefly, and in general terms, the present invention provides a multijunction photovoltaic cell, comprising a top subcell composed of indium gallium phosphide; a second subcell disposed immediately adjacent to and lattice matched to said top subcell, including an emitter layer composed of indium gallium phosphide; a base layer composed of indium gallium arsenide lattice matched to the emitter layer; and a sequence of first and second different semiconductor layers with different lattice constant forming a lower band gap layer disposed between the emitter layer and the base layer (i.e., the “lower band gap layer” has a band gap lower than the band gap of the emitter and base layers); said second subcell producing a first photo-generated current; a distributed Bragg reflector (DBR) layer disposed below and adjacent the base layer of second subcell wherein the distributed Bragg reflector layer is composed of a plurality of alternating layers of lattice matched materials with discontinuities in their respective indices of refraction, wherein the difference in refractive indices between alternating layers is maximized in order to minimize the number of periods required to achieve a given reflectivity; and a lower subcell lattice matched to said second subcell and composed of germanium, said lower subcell disposed adjacent to said distributed Bragg reflector (DBR) layer, and producing a second photo-generated current substantially equal in amount to the first photo-generated current.
In another aspect, the DBR layer includes a first DBR layer composed of a p type InGaAlP layer, and a second DBR layer disposed over the first DBR layer composed of a p type InAlP layer.
In another aspect, the DBR layer includes a first DBR layer composed of a p type AlxGa1−xAs layer, and a second DBR layer disposed over the first DBR layer and p type Aly Ga1−yAs layers, where 0<x<1, 0<y<1, and y is greater than x, that is, 0<x<y<1.
In another aspect, the thickness of the alternating layers of the DBR layer is designed so that the center of the DBR reflectivity peak is resonant with the absorption wavelength of the low bandgap layers formed in the intrinsic layer of the middle subcell of the device.
In another aspect, the number of periods in the DBR layer determines the amplitude of the reflectivity peak, and is chosen to optimize the current generation in the low band gap layers.
In another aspect, the number of periods in the DBR layer is in the range of 5 to 50 periods of the alternating material pairs.
In another aspect, the average lattice constant of the sequence of alternating first and second semiconductor layers is approximately equal to a lattice constant of the substrate.
In another aspect, the sequence of first and second different semiconductor layers forms an intrinsic region with a plurality of quantum wells or quantum dots therein.
In another aspect, the sequence of first and second different semiconductor layers comprises compressively strained and tensionally strained layers, respectively.
In another aspect, an average strain of the sequence of first and second different semiconductor layers is approximately equal to zero.
In another aspect, each of the first and second semiconductor layers is approximately 100 to 300 angstroms thick.
In another aspect, the first semiconductor layer in the lower band gap layer comprises InGaAs and the second semiconductor layer in the lower band gap layer comprises GaAsP.
In another aspect, a percentage of indium in each InGaAs layer in the low band gap layer is in in the range of 10 to 30% for QWs and up to 100% for QDs.
In another aspect, the top subcell has a thickness so that it generates approximately 4% to 5% less current than said first current.
Additional objects, advantages, and novel features of the present invention will become apparent to those skilled in the art from this disclosure, including the following detailed description as well as by practice of the invention. While the invention is described below with reference to preferred embodiments, it should be understood that the invention is not limited thereto. Those of ordinary skill in the art having access to the teachings herein will recognize additional applications, modifications and embodiments in other fields, which are within the scope of the invention as disclosed and claimed herein and with respect to which the invention could be of utility.
These and other features and advantages of this invention will be better understood and more fully appreciated by reference to the following detailed description when considered in conjunction with the accompanying drawings, wherein:
Additional objects, advantages, and novel features of the present invention will become apparent to those skilled in the art from this disclosure, including the following detailed description as well as by practice of the invention. While the invention is described below with reference to preferred embodiments, it should be understood that the invention is not limited thereto. Those of ordinary skill in the art having access to the teachings herein will recognize additional applications, modifications and embodiments in other fields, which are within the scope of the invention as disclosed and claimed herein and with respect to which the invention could be of utility.
Details of the present invention will now be described including exemplary aspects and embodiments thereof. Referring to the drawings and the following description, like reference numbers are used to identify like or functionally similar elements, and are intended to illustrate major features of exemplary embodiments in a highly simplified diagrammatic manner. Moreover, the drawings are not intended to depict every feature of the actual embodiment nor the relative dimensions of the depicted elements, and are not drawn to scale.
The active regions in each subcell do not generate equal amounts of current. Typically, the middle subcell B generates the least amount of photocurrent. In space (AM0) applications, radiation damage is a concern, and since the middle subcell is more susceptible to radiation damage than the top subcell, the top subcell C is designed for such applications to generate about 4-5% less current than the middle subcell B and approximately 30% less current than the bottom subcell A. Subsequently, over the course of fifteen to twenty years of use in high-radiation environments, radiation damage sustained by the middle subcell B can degrade the device performance such that the middle subcell B and top subcell C provide approximately equal current generation. Accordingly, for much of the device's lifetime, the top subcell C serves to limit the maximum amount of current generated by middle subcell B and bottom subcell A.
However, for terrestrial applications (at sea level, AM1), solar cells are not subject to radiation damage, and it may not be necessary to design the top cell with lower current.
As shown in the illustrated example of
In the illustrated example of
In one embodiment of the prior art, an intrinsic layer constituted by a strain-balanced multi-quantum well structure 323 is formed between base layer 322 and emitter layer 324 of middle subcell B. The strain-balanced quantum well structure 323 includes a sequence of quantum well layers formed from alternating layers of compressively strained InGaAs and tensionally strained gallium arsenide phosphide (“GaAsP”). Strain-balanced quantum well structures are known from the paper of Chao-Gang Lou et al., Current-Enhanced Quantum Well Solar Cells, Chinese Physics Letters, Vol. 23, No. 1 (2006), and M. Mazzer et al., Progress in Quantum Well Solar Cells, Thin Solid Films, Volumes 511-512 (26 Jul. 2006).
In an alternative example, the strain-balanced quantum well structure 323, comprising compressively strained InGaAs and tensionally strained gallium arsenide, may be provided as either the base layer 322 or the emitter layer 324.
In addition to a strain-balanced structure, metamorphic structures may be used as well.
The BSF layer 320 is provided to reduce the recombination loss in the middle subcell 307. The BSF layer 320 drives minority carriers from a highly doped region near the back surface to minimize the effect of recombination loss. Thus, the BSF layer 320 reduces recombination loss at the backside of the solar cell and thereby reduces recombination at the base layer/BSF layer interface. The window layer 326 is deposited on the emitter layer 324 of the middle subcell B after the emitter layer is deposited on the strain-balanced quantum well structure 323. The window layer 326 in the middle subcell B also helps reduce the recombination loss and improves passivation of the cell surface of the underlying junctions. Before depositing the layers of the top cell C, heavily doped n-type InAlP2 and p-type InGaP2 tunneling junction layers 327, 328 may be deposited over the middle subcell B.
In the illustrated example, the top subcell 309 includes a highly doped p-type indium gallium aluminum phosphide (“InGaAlP”) BSF layer 330, a p-type InGaP2 base layer 332, a highly doped n-type InGaP2 emitter layer 334 and a highly doped n-type InAlP2 window layer 336. The base layer 332 of the top subcell 309 is deposited over the BSF layer 330 after the BSF layer 330 is formed over the tunneling junction layers 328 of the middle subcell 307. The window layer 336 is deposited over the emitter layer 334 of the top subcell after the emitter layer 334 is formed over the base layer 332. A cap layer 338 may be deposited and patterned into separate contact regions over the window layer 336 of the top subcell 308. The cap layer 338 serves as an electrical contact from the top subcell 309 to metal grid layer 340. The doped cap layer 338 can be a semiconductor layer such as, for example, a GaAs or InGaAs layer. An anti-reflection coating 342 can also be provided on the surface of window layer 336 in between the contact regions of cap layer 338.
In the illustrated example, the strain-balanced quantum well structure 323 is formed in the depletion region of the middle subcell 307 and has a total thickness of about 3 microns (mm). Different thicknesses may be used as well. Alternatively, the middle subcell 307 can incorporate the strain-balanced quantum well structure 323 as either the base layer 322 or the emitter layer 324 without an intervening layer between the base layer 322 and emitter layer 324. A strain-balanced quantum well structure can include one or more quantum wells. As shown in the example of
The quantum well structure 323 may also be lattice matched to the substrate 312. In other words, the quantum well structure may possess an average lattice constant that is approximately equal to a lattice constant of the substrate 312. Lattice matching the quantum well structure 323 to the substrate 312 may further reduce the formation of dislocations and improve device performance. Alternatively, the average lattice constant of the quantum well structure 323 may be designed so that it maintains the lattice constant of the parent material in the middle subcell 307. For example, the quantum well structure 323 may be fabricated to have an average lattice constant that maintains the lattice constant of the AlGaAs BSF layer 320. In this way, dislocations are not introduced relative to the middle cell 307. However, the overall device 303 may remain lattice mismatched if the lattice constant of the middle cell is not matched to the substrate 312. The thickness and composition of each individual InGaAs or GaAsP layer within the quantum well structure 323 may be adjusted to achieve strain-balance and minimize the formation of crystal dislocations. For example, the InGaAs and GaAsP layers may be formed having respective thicknesses about 100-300 angstroms (D). Between 100 and 300 total InGaAs/GaAsP quantum wells may be formed in the strain-balanced quantum well structure 323. More or fewer quantum wells may be used as well. Additionally, the concentration of indium in the InGaAs layers may vary between 10-30%.
Furthermore, the quantum well structure 323 can extend the range of wavelengths absorbed by the middle subcell 307. An example of approximate quantum efficiency curves for the multijunction solar cell of
The overall current produced by the multijunction cell solar cell then may be raised by increasing the current produced by top subcell 309. Additional current can be produced by top subcell 309 by increasing the thickness of the p-type InGaP2 base layer 332 in that cell. The increase in thickness allows additional photons to be absorbed, which results in additional current generation. Preferably, for space or AM0 applications, the increase in thickness of the top subcell 309 maintains the approximately 4-5% difference in current generation between the top subcell 309 and middle subcell 307. For AM1 or terrestrial applications, the current generation of the top cell and the middle cell may choose to be mated.
As a result, both the introduction of strain-balanced quantum wells in the middle subcell 307 and the increase in thickness of top subcell 309 provide an increase in overall multijunction solar cell current generation and enable an improvement in overall photon conversion efficiency. Furthermore, the increase in current may be achieved without significantly reducing the voltage across the multijunction solar cell.
Low band gap regions consisting of quantum dot (QDs) or quantum well (QWs) layers have proposed to modify and optimize the absorption spectrum of subcells in multi-junction III-V solar cells. The QDs and QWs consist of this semiconductor layers having a lower bandgap than the surrounding matrix, which provide traps for electrons and holes that provide one dimensional (in the case of QWs) or three dimensional (in the case of QDs) confinement of the carriers. These layers extend the absorption spectrum of the subcell into which they are incorporated and thereby increase the short circuit current density (Jsc) of that subcell.
Prior to the proposal of the present disclosure, various attempts have been made trying to improve the efficiency of solar cells using QDs or QWs, but no decisive efficiency improvement has been reported. The biggest obstacle to achieving an improved multi-junction device using QDs and QWs is that the lower-bandgap layers both introduce defects into the crystal due to strain effects and also reduce the overall bandgap of the subcell. Both of these effects lead to a decrease into the open-circuit voltage (Voc) of the devices, which offsets the improvement in Jsc, so that there is no net gain if efficiency, and often a decrease in efficiency compared to a solar cell without using QDs or QWs.
The present disclosure provides a Bragg reflector in conjunction with the QDs or QWs in order to potentially double the improvement in Jsc while keeping the Voc loss constant. A Bragg reflector is a well-understood in monolithic III-V semiconductor devices consisting of a superlattice of alternating material layers which selectively reflects light with some central wavelength and some bandwidth, both of which can be engineered during the design of the Bragg reflector. A Bragg reflector in the base of the subcell containing the QDs or QWs can be designed to reflect light in the wavelength region of interest back through that subcell for a second pass, thereby doubling the current generated by the QDs or QWs while neither increasing the defect density or lowering the overall bandgap of the subcell compared to a similar device with no Bragg reflector
In the illustrated example of
In the illustrated example of
An intrinsic layer constituted by a strain-balanced multiple quantum well or quantum dot layer structure 323 is formed between base layer 322 and emitter layer 324 of middle subcell B. The strain-balanced quantum well structure 323 includes a sequence of quantum well layers formed from alternating layers of compressively strained InGaAs and tensionally strained gallium arsenide phosphide (“GaAsP”). The strain-balanced quantum dot layer structure includes a sequence of quantum dot layers formed from alternating layers of compressively strained InAs or InGaAs and tensionally strained gallium phosphide (“GaP”) or GaAsP. Strain-balanced quantum well structures are known from the paper of Chao-Gang Lou, et al., Current-Enhanced Quantum Well Solar Cells, Chinese Physics Letters, Vol. 23, No. 1 (2006), and M. Mazzer, et al., Progress in Quantum Well Solar Cells, Thin Solid Films, Volumes 511-512 (23 Jul. 2006). Strain-balanced quantum dot structures are known from the paper of Seth Hubbard, et al., Nanostructured Photovoltaics for Space Power, J. Hanophoton. 3(1), 031880 (Oct. 30, 2009).
On top of the intrinsic layer 323 is deposited an n-type indium gallium phosphide (“InGaP2”) emitter layer 324, followed by an n-type indium aluminum phosphide (“AlInP2”) window layer 326. Other compositions may be used as well.
Similar to the structure of
In the illustrated example of
In the illustrated example of
As shown in
In the embodiment of
Heavily doped p-type aluminum gallium arsenide (“AlGaAs”) and heavily doped n-type gallium arsenide (“GaAs”) tunneling junction layers 318, 317 may be deposited over the DBR layer 319 to provide a low resistance pathway between the bottom and middle subcells.
In the illustrated example of
As shown in
In the illustrated implementation, particular III-V semiconductor compounds are used in the various layers of the solar cell structure. However, the multijunction solar cell structure can be formed by other combinations of group III to V elements listed in the periodic table, wherein the group III includes boron (B), aluminum (Al), gallium (Ga), indium (In), and thallium (Ti), the group IV includes carbon (C), silicon (Si), Ge, and tin (Sn), and the group V includes nitrogen (N), phosphorus (P), arsenic (As), antimony (Sb), and bismuth (Bi).
Although the foregoing discussion mentions particular examples of materials and thicknesses for various layers, other implementations may use different materials and thicknesses. Also, additional layers may be added or some layers deleted in the multijunction solar cell structure 303 without departing from the scope of the present invention. In some cases, an integrated device such as a bypass diode may be formed over the layers of the multijunction solar cell structure 303.
Various modifications may be made without departing from the spirit and scope of the invention. Accordingly, other implementations are within the scope of the claims.
This invention was made with government support under Contract No. NRO 000-10-C-0285. The Government has certain rights in the invention.