Patent Application
20240088565
The present application claims priority to Japanese Patent Application No. 2022-145551, filed Sep. 13, 2022, and Japanese Patent Application No. 2023-097403, filed Jun. 14, 2023, the entire contents of each of which are incorporated herein by reference.
The present disclosure relates to a multilayer board and an antenna module that include radiation conductor layers.
An antenna module described in Japanese Unexamined Patent Application Publication No. 2021-83121 is known as an invention related to a conventional multilayer board. The antenna module includes a radiation conductor layer, a first power supply point, and a second power supply point. A first high-frequency signal is input to the radiation conductor layer through the first power supply point. The radiation conductor layer radiates the first high-frequency signal. A second high-frequency signal is input to the radiation conductor layer through the second power supply point. The radiation conductor layer radiates the second high-frequency signal. The direction of polarized waves of the first high-frequency signal is different from the direction of polarized waves of the second high-frequency signal.
As recognized by the inventor, in the field of the antenna module described in Japanese Unexamined Patent Application Publication No. 2021-83121, it is required to reduce the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of the radiation conductor layer.
Thus, the present disclosure is intended to provide a multilayer board and an antenna module that are capable of reducing the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and preventing tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of the radiation conductor layer.
A multilayer board according to an embodiment of the present disclosure includes: a multilayer body having a structure in which a plurality of insulator layers are laminated in a Z-axis direction; a first radiation conductor layer provided in the multilayer body and having a first outer edge in a view along the Z-axis direction, the first outer edge including a first straight line and a second straight line; a ground conductor layer provided in the multilayer body, positioned on a negative side of the first radiation conductor layer along a Z axis, and overlapping the first radiation conductor layer in a view along the Z-axis direction; a first wiring layer provided in the multilayer body, positioned on the negative side of the first radiation conductor layer along the Z axis and on a positive side of the ground conductor layer along the Z axis, electrically connected to the first radiation conductor layer at a first power supply point, and intersecting but not orthogonal to the first straight line in a view along the Z-axis direction, the first power supply point being positioned closest to the first straight line in the first outer edge; and a second wiring layer provided in the multilayer body, positioned on the negative side of the first radiation conductor layer along the Z axis and on the positive side of the ground conductor layer along the Z axis, electrically connected to the first radiation conductor layer at a second power supply point, and intersecting but not orthogonal to the second straight line in a view along the Z-axis direction, the second power supply point being positioned closest to the second straight line in the first outer edge.
An antenna module according to an embodiment of the present disclosure includes: a first substrate; and a second substrate that is flexible, in which the first substrate includes a first multilayer body having a structure in which a plurality of insulator layers are laminated in a Z-axis direction, a first radiation conductor layer provided in the first multilayer body and having a first outer edge in a view along the Z-axis direction, the first outer edge including a first straight line and a second straight line, a first wiring layer provided in the first multilayer body, positioned on a negative side of the first radiation conductor layer along a Z axis, electrically connected to the first radiation conductor layer at a first power supply point, and intersecting but not orthogonal to the first straight line in a view along the Z-axis direction, the first power supply point being positioned closest to the first straight line in the first outer edge, and a second wiring layer provided in the first multilayer body, positioned on the negative side of the first radiation conductor layer along the Z axis, electrically connected to the first radiation conductor layer at a second power supply point, and intersecting but not orthogonal to the second straight line in a view along the Z-axis direction, the second power supply point being positioned closest to the second straight line in the first outer edge, the second substrate includes a second multilayer body having a structure in which a plurality of insulator layers are laminated in the Z-axis direction, a seventh wiring layer provided in the second multilayer body and electrically connected to the first wiring layer, an eighth wiring layer provided in the second multilayer body and electrically connected to the second wiring layer, and a ground conductor layer provided in the second multilayer body, positioned on a negative side of the seventh wiring layer and the eighth wiring layer along the Z axis, and overlapping the first radiation conductor layer, the seventh wiring layer, and the eighth wiring layer in a view along the Z-axis direction, a length of the second substrate in the Z-axis direction is shorter than a length of the first substrate in the Z-axis direction, and the second substrate is positioned on a negative side of the first substrate along the Z axis and has a region not overlapping the first substrate in a view along the Z-axis direction.
According to the present disclosure, it is possible to decrease the difference between the radiation pattern of a first high-frequency signal and the radiation pattern of a second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of the radiation conductor layer.
Structure of Multilayer Board 10
The structure of a multilayer board 10 according to an embodiment of the present disclosure will be described below with reference to the accompanying drawings.
In the following description, an up-down direction is defined to be the lamination direction of a multilayer body 12. The up-down direction matches with a Z-axis direction. The up direction is the positive direction of the Z axis. The down direction is the negative direction of the Z axis. A right-left direction and a front-back direction are defined to be two respective directions in which sides of the multilayer body 12 when the multilayer body 12 is viewed in the up-down direction extend. The right-left direction is orthogonal to the up-down direction. The front-back direction is orthogonal to the up-down direction and the right-left direction. The right-left direction matches with an X-axis direction. The right direction is the positive direction of the X axis. The left direction is the negative direction of the X axis. The front-back direction matches with a Y-axis direction. The front direction is the positive direction of the Y axis. The back direction is the negative direction of the Y axis. Accordingly, the X axis, the Y axis, and the Z axis are orthogonal to one another. The definitions of the directions in the present specification are exemplary. Thus, the directions in the present specification do not necessarily need to match with directions when the multilayer board 10 is actually used. The up-down direction may be inverted in the drawings. Similarly, the right-left direction may be inverted in the drawings. The front-back direction may be inverted in the drawings.
The multilayer board 10 is used for a wireless communication terminal such as a smartphone. As illustrated in
The multilayer body 12 has a plate shape. As illustrated in
The first radiation conductor layer 16 radiates and/or receives a first high-frequency signal. In the present embodiment, the first radiation conductor layer 16 is positioned on the upper principal surfaces of the insulator layer 14a. As illustrated in
Specifically, as illustrated in
The first straight line E1 and the straight line E102 are parallel to each other. The second straight line E2 and the straight line E101 are parallel to each other. The second straight line E2 is orthogonal to the first straight line E1 in a view along the up-down direction (Z-axis direction). The straight line E101 is orthogonal to the straight line E102 in a view along the up-down direction (Z-axis direction). The right rear end of the first straight line E1 (its end on the positive side along the X axis) is connected to the right front end of the second straight line E2 (its end on the positive side along the X axis). The left front end of the first straight line E1 is connected to the right front end of the straight line E101. The left back end of the second straight line E2 is connected to the right back end of the straight line E102. The left back end of the straight line E101 is connected to the left front end of the straight line E102.
The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are equal to one another. The lengths of the first straight line E1, the second straight line E2, and the straight lines E101 and E102 are, for example, ½ of the wavelength of the first high-frequency signal.
As illustrated in
As illustrated in
The annular ground conductor layer 30 has an annular shape surrounding the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction). Outer and inner edges of the annular ground conductor layer 30 each have a rectangular shape having two sides extending in the front-back direction and two sides extending in the right-left direction. The annular ground conductor layer 30 is connected to the ground potential.
Distances L1 to L4 illustrated in
As illustrated in
As illustrated in
The second wiring layer 22 is positioned on the lower side of the first radiation conductor layer 16 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). In the present embodiment, the second wiring layer 22 is positioned on the upper principal surface of the insulator layer 14d. The second wiring layer 22 is positioned on the back side of the first wiring layer 20 in a view along the up-down direction. The second wiring layer 22 has a linear shape extending in the right-left direction in a view along the up-down direction. Accordingly, the second wiring layer 22 is parallel to the first wiring layer 20. The left end of the second wiring layer 22 overlaps the first radiation conductor layer 16 in a view along the up-down direction. The right end of the second wiring layer 22 does not overlap the first radiation conductor layer 16 in a view along the up-down direction. Accordingly, the second wiring layer 22 intersects but is not orthogonal to the second straight line E2 in a view along the up-down direction (Z-axis direction). In the present embodiment, an angle θ2 between the second wiring layer 22 and the second straight line E2 is 45°. However, the angle θ2 is not limited to 45° but may be 0° to 90°. The angle θ2 is, for example, 45°±22.5°.
As illustrated in
As illustrated in
The outer electrode 24 overlaps a right end portion of the first wiring layer 20 in a view along the up-down direction. The outer electrode 26 overlaps a right end portion of the second wiring layer 22 in a view along the up-down direction. The first high-frequency signal is input to or output from the outer electrode 24. A second high-frequency signal is input to or output from the outer electrode 26.
The interlayer connection conductor v1 electrically connects the first radiation conductor layer 16 and the first wiring layer 20. More specifically, the interlayer connection conductor v1 penetrates through the insulator layers 14a to 14c in the up-down direction. The upper end of the interlayer connection conductor v1 contacts the first radiation conductor layer 16 at a first power supply point P1. The first power supply point P1 is positioned closest to the first straight line E1 in the first outer edge EE1. In the present embodiment, the first power supply point P1 is positioned closest to the middle point of the first straight line E1 in the first straight line E1. The lower end of the interlayer connection conductor v1 contacts a left end portion of the first wiring layer 20. Accordingly, the first wiring layer 20 is electrically connected to the first radiation conductor layer 16 at the first power supply point P1.
The interlayer connection conductor v2 electrically connects the first radiation conductor layer 16 and the second wiring layer 22. More specifically, the interlayer connection conductor v2 penetrates through the insulator layers 14a to 14c in the up-down direction. The upper end of the interlayer connection conductor v2 contacts the first radiation conductor layer 16 at a second power supply point P2. The second power supply point P2 is positioned closest to the second straight line E2 in the first outer edge EE1. In the present embodiment, the second power supply point P2 is positioned closest to the middle point of the second straight line E2 in the second straight line E2. The lower end of the interlayer connection conductor v2 contacts a left end portion of the second wiring layer 22. Accordingly, the second wiring layer 22 is electrically connected to the first radiation conductor layer 16 at the second power supply point P2.
The interlayer connection conductor v3 electrically connects the first wiring layer 20 and the outer electrode 24. More specifically, the interlayer connection conductor v3 penetrates through the insulator layers 14d and 14e in the up-down direction. The upper end of the interlayer connection conductor v3 contacts the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v3 contacts the outer electrode 24.
The interlayer connection conductor v4 electrically connects the second wiring layer 22 and the outer electrode 26. More specifically, the interlayer connection conductor v4 penetrates through the insulator layers 14d and 14e in the up-down direction. The upper end of the interlayer connection conductor v4 contacts the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v4 contacts the outer electrode 26.
The interlayer connection conductors v5 to v8 electrically connect the ground conductor layer 28 and the annular ground conductor layer 30. More specifically, the interlayer connection conductors v5 to v8 penetrate through the insulator layers 14a to 14e in the up-down direction. Upper ends of the interlayer connection conductors v5 to v8 contact the annular ground conductor layer 30. Lower ends of the interlayer connection conductors v5 to v8 contact the ground conductor layer 28.
The first radiation conductor layer 16, the first wiring layer 20, the second wiring layer 22, the outer electrodes 24 and 26, the ground conductor layer 28, and the annular ground conductor layer 30 as described above are formed by patterning metal foil attached to the upper and lower principal surfaces of the insulator layers 14a to 14e. The metal foil is, for example, copper foil. The interlayer connection conductors v1 to v8 are formed by filling, with conductive paste, through-holes penetrating through the insulator layers 14a to 14e in the up-down direction and solidifying the conductive paste through heating and pressurization.
The protective layers 15a and 15b have dielectric constants larger than the dielectric constants of the insulator layers 14a to 14e. The protective layer 15a covers the upper principal surface of the insulator layer 14a. Accordingly, the protective layer 15a protects the first radiation conductor layer 16 and the annular ground conductor layer 30. The protective layer 15b covers the lower principal surface of the insulator layer 14e. Accordingly, the protective layer 15b protects the ground conductor layer 28. However, an opening H is provided through the protective layer 15b. Accordingly, the outer electrodes 24 and 26 are exposed to the outside of the multilayer board 10 through the opening H.
In the multilayer board 10 as described above, the first radiation conductor layer 16 and the ground conductor layer 28 function as a patch antenna that radiates or receives the first high-frequency signal and the second high-frequency signal. However, the polarization direction of the first high-frequency signal is different from the polarization direction of the second high-frequency signal. Specifically, the first power supply point P1 is positioned near the first straight line E1. The second power supply point P2 is positioned near the second straight line E2. The first straight line E1 is orthogonal to the second straight line E2. Accordingly, the polarization direction of the first high-frequency signal is orthogonal to the polarization direction of the second high-frequency signal. The polarization directions of the first high-frequency signal and the second high-frequency signal at reception are the same as the polarization directions of the first high-frequency signal and the second high-frequency signal at transmission.
According to the multilayer board 10, it is possible to decrease the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of each radiation conductor layer. Hereinafter, a multilayer board 110 according to a comparative example will be described as an example.
The multilayer board 110 illustrated in
Similarly, the second high-frequency signal is supplied to the first radiation conductor layer 16 through the second power supply point P2. Accordingly, a standing wave occurs at the second straight line E2 and the second high-frequency signal is radiated. In this case, an electric force line e12 occurs from the second straight line E2 to the ground conductor layer 28. The electric force line e12 extends in the direction orthogonal to the second straight line E2 and in the down direction.
The first wiring layer 20 is orthogonal to the first straight line E1. Thus, the first wiring layer 20 extends long in a direction orthogonal to the first straight line E1. Accordingly, the electric force line e11 is likely to be interrupted by the first wiring layer 20 as illustrated in
Furthermore, the second wiring layer 22 is not orthogonal to the second straight line E2. Thus, the second wiring layer 22 does not extend long in a direction orthogonal to the second straight line E2. Accordingly, the electric force line e12 is unlikely to be interrupted by the second wiring layer 22 as illustrated in
In addition, in the multilayer board 10, the reception direction of the first high-frequency signal and the reception direction of the second high-frequency signal are prevented from tilting with respect to the up-down direction for the same reason as described above, and thus the difference between the reception pattern of the first high-frequency signal and the reception pattern of the second high-frequency signal decreases.
According to the multilayer board 10, for a reason described below as well, it is possible to decrease the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of a radiation electrode. More specifically, the electric force line e1 is likely to occur in the first region A1. The electric force line e2 is likely to occur in the second region A2. Thus, in the multilayer board 10, the first wiring layer 20 is disposed in both the first region A1 and the region outside the first region A1 in a view along the up-down direction. Moreover, the second wiring layer 22 is disposed in both the second region A2 and the region outside the second region A2 in a view along the up-down direction. With this configuration, the length of a part of the first wiring layer 20 positioned in the first region A1 is short. The length of a part of the second wiring layer 22 positioned in the second region A2 is short. Accordingly, the electric force line e1 is unlikely to be interrupted by the first wiring layer 20. The electric force line e2 is unlikely to be interrupted by the second wiring layer 22. As a result, according to the multilayer board 10, it is possible to decrease the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of a radiation electrode.
According to the multilayer board 10, the distance L1, the distance L2, the distance L3, and the distance L4 are equal to one another. Accordingly, the magnitude of capacitance generated between the first straight line E1 and the annular ground conductor layer 30, the magnitude of capacitance generated between the second straight line E2 and the annular ground conductor layer 30, the magnitude of capacitance generated between the straight line E101 and the annular ground conductor layer 30, and the magnitude of capacitance generated between the straight line E102 and the annular ground conductor layer 30 are close to one another. As a result, it is possible to decrease the difference between the radiation pattern of the first high-frequency signal and the radiation pattern of the second high-frequency signal and prevent tilt of the radiation direction of the first high-frequency signal and the radiation direction of the second high-frequency signal with respect to the normal direction of the principal surfaces of a radiation electrode.
A multilayer board 10a according to a first modification will be described below.
The multilayer board 10a is different from the multilayer board 10 in that the multilayer board 10a further includes a second radiation conductor layer 216, a third wiring layer 220, and a fourth wiring layer 222.
The second radiation conductor layer 216, the third wiring layer 220, and the fourth wiring layer 222 have the same structures as the first radiation conductor layer 16, the first wiring layer 20, and the second wiring layer 22, respectively. Specifically, the second radiation conductor layer 216 is provided in the multilayer body 12. The second radiation conductor layer 216 has a second outer edge EE2 including a third straight line E3, a fourth straight line E4, a straight line E103, and a straight line E104 in a view along the up-down direction (Z-axis direction). The fourth straight line E4 intersects the third straight line E3 in a view along the up-down direction (Z-axis direction). The fourth straight line E4 is orthogonal to the third straight line E3 in a view along the up-down direction (Z-axis direction). The ground conductor layer 28 overlaps the second radiation conductor layer 216 in a view along the up-down direction (Z-axis direction).
The third wiring layer 220 is provided in the multilayer body 12. The third wiring layer 220 is positioned on the lower side of the second radiation conductor layer 216 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The third wiring layer 220 is electrically connected to the second radiation conductor layer 216 at a third power supply point P3 positioned closest to the third straight line E3 in the second outer edge EE2. The third wiring layer 220 intersects but is not orthogonal to the third straight line E3 in a view along the up-down direction (Z-axis direction).
The fourth wiring layer 222 is provided in the multilayer body 12. The fourth wiring layer 222 is positioned on the lower side of the second radiation conductor layer 216 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The fourth wiring layer 222 is electrically connected to the second radiation conductor layer 216 at a fourth power supply point P4 positioned closest to the fourth straight line E4 in the second outer edge EE2. The fourth wiring layer 222 intersects but is not orthogonal to the fourth straight line E4 in a view along the up-down direction (Z-axis direction).
The second radiation conductor layer 216 is positioned on the right side of the first radiation conductor layer 16 (on the positive side thereof along the X axis). The first straight line E1 and the second straight line E2 is positioned on the right side of the first part EP1 of the first outer edge EE1 except for the first straight line E1 and the second straight line E2 (on the positive side thereof along the X axis). The third straight line E3 and the fourth straight line E4 are positioned on the left side of a second part EP2 of the second outer edge EE2 except for the third straight line E3 and the fourth straight line E4 (on the negative side thereof along the X axis). The other structure of the multilayer board 10a is the same as that of the multilayer board 10 and thus description thereof is omitted. The multilayer board 10a can achieve the same effects as the multilayer board 10.
According to the multilayer board 10a, mutual coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented, and thus gain decrease of the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented. More specifically, in the first radiation conductor layer 16, electric field strength is high at the straight lines E101 and E102. In the second radiation conductor layer 216, electric field strength is high at the straight lines E103 and E104. Thus, the straight lines E101 and E102 are likely to have electric field coupling with the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are likely to have electric field coupling with the first wiring layer 20 and the second wiring layer 22. Thus, in the multilayer board 10a, the first straight line E1 and the second straight line E2 are positioned on the right side of the first part EP1 of the first outer edge EE1 except for the first straight line E1 and the second straight line E2. The third straight line E3 and the fourth straight line E4 are positioned on the left side of the second part EP2 of the second outer edge EE2 except for the third straight line E3 and the fourth straight line E4. Accordingly, the straight lines E101 and E102 are positioned far from the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are positioned far from the first wiring layer 20 and the second wiring layer 22. With this configuration, mutual coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented, and thus gain decrease of the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented.
A multilayer board 10b according to a second modification will be described below.
The multilayer board 10b is different from the multilayer board 10a in that the multilayer board 10b further includes a third radiation conductor layer 316, a fifth wiring layer 320, and a sixth wiring layer 322.
The third radiation conductor layer 316 is provided in the multilayer body 12. The third radiation conductor layer 316 has a third outer edge EE3 including a fifth straight line E5, a sixth straight line E6, a straight line E105, and a straight line E106 in a view along the up-down direction (Z-axis direction). The sixth straight line E6 intersects the fifth straight line E5 in a view along the up-down direction (Z-axis direction). The sixth straight line E6 is orthogonal to the fifth straight line E5 in a view along the up-down direction (Z-axis direction). The ground conductor layer 28 overlaps the third radiation conductor layer 316 in a view along the up-down direction (Z-axis direction).
The fifth wiring layer 320 is provided in the multilayer body 12. The third wiring layer 220 is positioned on the lower side of the third radiation conductor layer 316 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The fifth wiring layer 320 is electrically connected to the third radiation conductor layer 316 at a fifth power supply point P5 positioned closest to the fifth straight line E5 in the third outer edge EE3. The fifth wiring layer 320 intersects but is not orthogonal to the fifth straight line E5 in a view along the up-down direction (Z-axis direction).
The sixth wiring layer 322 is provided in the multilayer body 12. The sixth wiring layer 322 is positioned on the lower side of the third radiation conductor layer 316 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The sixth wiring layer 322 is electrically connected to the third radiation conductor layer 316 at a sixth power supply point P6 positioned closest to the sixth straight line E6 in the third outer edge EE3. The sixth wiring layer 322 intersects but is not orthogonal to the sixth straight line E6 in a view along the up-down direction (Z-axis direction).
The third radiation conductor layer 316 is positioned on the right side of the second radiation conductor layer 216 (on the positive side thereof along the X axis). The fifth straight line E5 and the sixth straight line E6 are positioned on the right side of a third part EP3 of the third outer edge EE3 except for the fifth straight line E5 and the sixth straight line E6 (on the positive side thereof along the X axis). The other structure of the multilayer board 10b is the same as that of the multilayer board 10a and thus description thereof is omitted. The multilayer board 10b can achieve the same effects as the multilayer board 10a.
Moreover, according to the multilayer board 10b, the third wiring layer 220 and the fourth wiring layer 222 are separated from the fifth wiring layer 320 and the sixth wiring layer 322. As a result, coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 is prevented.
A multilayer board 10c according to a third modification will be described below.
The multilayer board 10c is different from the multilayer board 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. More specifically, the second radiation conductor layer 216 is positioned on the right side of the first radiation conductor layer 16 (on the positive side thereof along the X axis). The third radiation conductor layer 316 is positioned on the right side of the second radiation conductor layer 216 (on the positive side thereof along the X axis). The first straight line E1, the third straight line E3, and the fifth straight line E5 are parallel to the right-left direction (X axis). The second straight line E2, the fourth straight line E4, and the sixth straight line E6 overlap one another in a view along the right-left direction (X-axis direction). The right end of the first straight line E1 (its end on the positive side along the X axis) is connected to the front end of the second straight line E2 (its end on the positive side along the Y axis). The right end of the third straight line E3 (its end on the positive side along the X axis) is connected to the front end of the fourth straight line E4 (its end on the positive side along the Y axis). The right end of the fifth straight line E5 (its end on the positive side along the X axis) is connected to the front end of the sixth straight line E6 (its end on the positive side along the Y axis). The other structure of the multilayer board 10c is the same as that of the multilayer board 10b and thus description thereof is omitted.
According to the multilayer board 10c, the degree of coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 and the degree of coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 can be made close to each other. More specifically, in the first radiation conductor layer 16, electric field strength is high at the straight lines E101 and E102. In the second radiation conductor layer 216, electric field strength is high at the straight lines E103 and E104. In the third radiation conductor layer 316, electric field strength is high at the straight lines E105 and E106. The second straight line E2 and the straight line E103 face each other. The fourth straight line E4 and the straight line E105 face each other. Accordingly, the degree of coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 and the degree of coupling between the second radiation conductor layer 216 and the third radiation conductor layer 316 can be made close to each other. As a result, a high-frequency signal radiated from the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316 as a whole can be prevented from tilting with respect to the normal direction of the principal surfaces of each radiation conductor layer.
A multilayer board 10d according to a fourth modification will be described below.
The multilayer board 10d is different from the multilayer board 10b in the positions of the first radiation conductor layer 16, the second radiation conductor layer 216, and the third radiation conductor layer 316. More specifically, the second radiation conductor layer 216 is positioned on the right side of the first radiation conductor layer 16 (on the positive side thereof along the X axis). The third radiation conductor layer 316 is positioned on the right side of the second radiation conductor layer 216 (on the positive side thereof along the X axis).
The first straight line E1 and the second straight line E2 is positioned on the left side of the first part EP1 of the first outer edge EE1 except for the first straight line E1 and the second straight line E2 (on the negative side thereof along the X axis). The third straight line E3 and the fourth straight line E4 are positioned on the back side of the second part EP2 of the second outer edge EE2 except for the third straight line E3 and the fourth straight line E4 (on the negative side thereof along the Y axis). The fifth straight line E5 and the sixth straight line E6 are positioned on the left side of the third part EP3 of the third outer edge EE3 except for the fifth straight line E5 and the sixth straight line E6 (on the negative side thereof along the X axis). The other structure of the multilayer board 10d is the same as that of the multilayer board 10b and thus description thereof is omitted.
A multilayer board 10e according to a fifth modification will be described below.
The multilayer board 10e is different from the multilayer board 10 in that the multilayer board 10e further includes the second radiation conductor layer 216, the third wiring layer 220 and the fourth wiring layer 222. The second radiation conductor layer 216 is provided in the multilayer body 12. The second radiation conductor layer 216 is positioned on the lower side of the first radiation conductor layer 16 (on the negative side thereof along the Z axis). The second radiation conductor layer 216 overlaps the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction). The second radiation conductor layer 216 has the second outer edge EE2 including the third straight line E3 and the fourth straight line E4 in a view along the up-down direction (Z-axis direction).
The right end of the third straight line E3 (its end on the positive side along the X axis) is connected to the right end of the fourth straight line E4 (its end on the positive side along the X axis). The third straight line E3 is parallel to the first straight line E1. The fourth straight line E4 is parallel to the second straight line E2.
The third wiring layer 220 is provided in the multilayer body 12. The third wiring layer 220 is positioned on the lower side of the second radiation conductor layer 216 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The third wiring layer 220 is electrically connected to the second radiation conductor layer 216 at the third power supply point P3 positioned closest to the third straight line E3 in the second outer edge EE2. The third wiring layer 220 intersects but is not orthogonal to the third straight line E3 in a view along the up-down direction (Z-axis direction).
The fourth wiring layer 222 is provided in the multilayer body 12. The fourth wiring layer 222 is positioned on the lower side of the second radiation conductor layer 216 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). The fourth wiring layer 222 is electrically connected to the second radiation conductor layer 216 at the fourth power supply point P4 positioned closest to the fourth straight line E4 in the second outer edge EE2. The fourth wiring layer 222 intersects but is not orthogonal to the fourth straight line E4 in a view along the up-down direction (Z-axis direction).
The first wiring layer 20 intersects but is not orthogonal to the first straight line E1 and the third straight line E3 in a view along the up-down direction (Z-axis direction). The second wiring layer 22 intersects but is not orthogonal to the second straight line E2 and the fourth straight line E4 in a view along the up-down direction (Z-axis direction). The other structure of the multilayer board 10e is the same as that of the multilayer board 10 and thus description thereof is omitted. The multilayer board 10e can achieve the same effects as the multilayer board 10.
According to the multilayer board 10e, mutual coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented, and thus gain decrease of the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented. More specifically, in the first radiation conductor layer 16, electric field strength is high at the straight lines E101 and E102. In the second radiation conductor layer 216, electric field strength is high at the straight lines E103 and E104. Thus, the straight lines E101 and E102 are likely to have electric field coupling with the third wiring layer 220 and the fourth wiring layer 222. The straight lines E103 and E104 are likely to have electric field coupling with the first wiring layer 20 and the second wiring layer 22.
In the multilayer board 10e, the first straight line E1 is parallel to the third straight line E3. The second straight line E2 is parallel to the fourth straight line E4. The right end of the first straight line E1 is connected to the right end of the second straight line E2. The right end of the third straight line E3 is connected to the right end of the fourth straight line E4. Accordingly, the first wiring layer 20 and the second wiring layer 22 are not positioned near the straight lines E103 and E104. The third wiring layer 220 and the fourth wiring layer 222 are not positioned near the straight lines E101 and E102. Accordingly, mutual coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented, and thus gain decrease of the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented.
The first wiring layer 20 and the second wiring layer 22 of the second radiation conductor layer 216 are extended away from the straight lines E101 and E102 at which the strength of an electric field generated by the first radiation conductor layer 16 is high. Accordingly, coupling between the first radiation conductor layer 16 and the second radiation conductor layer 216 is prevented, and gain decrease of the first radiation conductor layer 16 and the second radiation conductor layer 216 is reduced.
A multilayer board 10f according to a sixth modification will be described below.
The multilayer board 10f is different from the multilayer board 10c in disposition of the second radiation conductor layer 216. More specifically, the back end of the third straight line E3 (its end on the negative side along the Y axis) is connected to the left end of the fourth straight line E4 (its end on the negative side along the X axis). The other structure of the multilayer board 10f is the same as that of the multilayer board 10c and thus description thereof is omitted.
A multilayer board 10g according to a seventh modification will be described below.
The multilayer board 10g is different from the multilayer board 10 in that the multilayer board 10g includes a rigid portion A3 and a flexible portion A4 and further includes a first ground conductor layer 128 and interlayer connection conductors v9 to v12.
The rigid portion A3 is a part the length of which in the up-down direction (Z-axis direction) is longer than the length of the flexible portion A4 in the up-down direction (Z-axis direction) as illustrated in
In the flexible portion A4, the multilayer body 12 has a structure in which the insulator layers 14c to 14e and protective layers 15b and 15c are laminated in the up-down direction (Z-axis direction). The protective layer 15c, the insulator layers 14c to 14e, and the protective layer 15b are arranged in the stated order from top.
The first ground conductor layer 128 is provided on the upper principal surface of the insulator layer 14c. The first ground conductor layer 128 has a rectangular shape in a view along the up-down direction. The long sides of the first ground conductor layer 128 extend in the right-left direction. The short sides of the first ground conductor layer 128 extend in the front-back direction. The first ground conductor layer 128 overlaps the first wiring layer 20 and the second wiring layer 22 in a view along the up-down direction. The first ground conductor layer 128 is connected to the ground potential.
The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the ground conductor layer 28. More specifically, the interlayer connection conductors v9 to v12 penetrate through the insulator layers 14c to 14e in the up-down direction. The upper end of the interlayer connection conductors v9 to v12 contacts the first ground conductor layer 128. The lower end of the interlayer connection conductors v9 to v12 contacts the ground conductor layer 28.
The first ground conductor layer 128 is formed by patterning metal foil attached to the upper principal surface of the insulator layer 14c. The metal foil is, for example, copper foil. The interlayer connection conductors v9 to v12 are formed by filling, with the conductive paste, through-holes penetrating through the insulator layers 14c to 14e in the up-down direction and solidifying the conductive paste through heating and pressurization.
The protective layer 15c has a dielectric constant larger than the dielectric constants of the insulator layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper principal surface of the insulator layer 14c. Accordingly, the protective layer 15c protects the first ground conductor layer 128.
The structures of the outer electrodes 24 and 26 and the opening H are the same as in the multilayer board 10 and thus description thereof is omitted. The other structure of the multilayer board 10g is the same as that of the multilayer board 10 and thus description thereof is omitted.
The multilayer board 10g can achieve the same effects as the multilayer board 10.
(a) According to the multilayer board 10g, bending fabrication of the multilayer board 10g is easy. More specifically, the multilayer board 10g includes the rigid portion A3 and the flexible portion A4. The length of the flexible portion A4 in the up-down direction (Z-axis direction) is shorter than the length of the rigid portion A3 in the up-down direction (Z-axis direction). Thus, the flexible portion A4 is more easily deformable than the rigid portion A3. In other words, the flexible portion A4 is easily bendable. Accordingly, the multilayer board 10g can be easily bend. As a result, bending fabrication of the multilayer board 10g is easy.
(b) According to the multilayer board 10g, the length of the rigid portion A3 in the up-down direction (Z-axis direction) can be shortened. More specifically, in the rigid portion A3, the first wiring layer 20, and the second wiring layer 22 are positioned on the lower side of the annular ground conductor layer 30 and on the upper side of the ground conductor layer 28. Thus, noise is prevented from entering into the first wiring layer 20 and the second wiring layer 22 by the annular ground conductor layer 30 and the ground conductor layer 28.
(c) According to the multilayer board 10g, capacitance can be prevented from being generated between the first radiation conductor layer 16 and a ground conductor unlike a configuration in which the ground conductor is provided between the annular ground conductor layer 30 and the ground conductor layer 28.
A multilayer board 10h according to an eighth modification will be described below.
The multilayer board 10h is different from the multilayer board 10 in that the multilayer board 10h includes the rigid portion A3 and the flexible portion A4, further includes a seventh wiring layer 120, an eighth wiring layer 122, the first ground conductor layer 128, and interlayer connection conductors v9 to v12, v15, and v16, includes an interlayer connection conductor v13, and includes an interlayer connection conductor v14.
The rigid portion A3 is a part the length of which in the up-down direction (Z-axis direction) is longer than the length of the flexible portion A4 in the up-down direction (Z-axis direction) as illustrated in
In the rigid portion A3, the multilayer body 12 has a structure in which insulator layers 14a to 14f and the protective layers 15a and 15b are laminated in the up-down direction (Z-axis direction). The protective layer 15a, the insulator layers 14a to 14f, and the protective layer 15b are arranged in the stated order from top. The material of the insulator layer 14f is thermoplastic resin such as polyimide or liquid crystal polymer. The multilayer body 12 is flexible.
In the present modification, the first wiring layer 20 and the second wiring layer 22 are positioned on the upper principal surface of the insulator layer 14b. The interlayer connection conductors v1 and v2 penetrate through the insulator layer 14a in the up-down direction. The ground conductor layer 28 is provided on the lower principal surface of the insulator layer 14f. The protective layer 15b covers the lower principal surface of the insulator layer 14f. Accordingly, the protective layer 15b protects the ground conductor layer 28.
The seventh wiring layer 120 is provided in the multilayer body 12. The seventh wiring layer 120 is positioned on the lower side of the first wiring layer 20 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). In the present modification, the seventh wiring layer 120 is positioned on the upper principal surface of the insulator layer 14e. The seventh wiring layer 120 has a linear shape extending in the right-left direction in a view along the up-down direction. The seventh wiring layer 120 is disposed in both the rigid portion A3 and the flexible portion A4. The seventh wiring layer 120 does not overlap the first radiation conductor layer 16 in a view along the up-down direction.
The eighth wiring layer 122 is provided in the multilayer body 12. The eighth wiring layer 122 is positioned on the lower side of the second wiring layer 22 (on the negative side thereof along the Z axis) and on the upper side of the ground conductor layer 28 (on the positive side thereof along the Z axis). In the present modification, the eighth wiring layer 122 is positioned on the upper principal surface of the insulator layer 14e. The eighth wiring layer 122 is positioned on the back side of the seventh wiring layer 120 in a view along the up-down direction. The eighth wiring layer 122 has a linear shape extending in the right-left direction in a view along the up-down direction. The eighth wiring layer 122 is disposed in both the rigid portion A3 and the flexible portion A4. The eighth wiring layer 122 does not overlap the first radiation conductor layer 16 in a view along the up-down direction.
The interlayer connection conductor v13 electrically connects the first wiring layer 20 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v13 penetrates through the insulator layers 14b to 14d in the up-down direction. The upper end of the interlayer connection conductor v13 contacts the right end portion of the first wiring layer 20. The lower end of the interlayer connection conductor v13 contacts a left end portion of the seventh wiring layer 120. Accordingly, the seventh wiring layer 120 is electrically connected to the first wiring layer 20.
The interlayer connection conductor v14 electrically connects the second wiring layer 22 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v14 penetrates through the insulator layers 14b to 14d in the up-down direction. The upper end of the interlayer connection conductor v14 contacts the right end portion of the second wiring layer 22. The lower end of the interlayer connection conductor v14 contacts a left end portion of the eighth wiring layer 122. Accordingly, the eighth wiring layer 122 is electrically connected to the second wiring layer 22.
The interlayer connection conductors v13 and v14 are formed by filling, with conductive paste, through-holes penetrating through the insulator layers 14b to 14d in the up-down direction and solidifying the conductive paste through heating and pressurization.
The ground conductor layer 28 is disposed in both the rigid portion A3 and the flexible portion A4. The outer electrodes 24 and 26 and the opening H are provided in the flexible portion A4. The other structure of the rigid portion A3 is the same as that of the multilayer board 10 and thus description thereof is omitted. The structure of the flexible portion A4 will be described below in detail.
In the flexible portion A4, the multilayer body 12 has a structure in which the insulator layers 14d to 14f and the protective layers 15b and 15c are laminated in the up-down direction (Z-axis direction). The protective layer 15c, the insulator layers 14d to 14f, and the protective layer 15b are arranged in the stated order from top.
In the flexible portion A4, the first ground conductor layer 128 is provided on the upper principal surface of the insulator layer 14d. The first ground conductor layer 128 overlaps the seventh wiring layer 120 and the eighth wiring layer 122 in a view along the up-down direction. The other structure of the first ground conductor layer 128 is the same as that of the multilayer board 10g and thus description thereof is omitted.
In the flexible portion A4, the interlayer connection conductors v9 to v12 penetrate through the insulator layers 14d to 14f in the up-down direction. The other structures of the interlayer connection conductors v9 to v12 are the same as in the multilayer board 10g and thus description thereof is omitted.
The interlayer connection conductor v15 electrically connects the seventh wiring layer 120 and the outer electrode 24. More specifically, the interlayer connection conductor v15 penetrates through the insulator layers 14e and 14f in the up-down direction. The upper end of the interlayer connection conductor v15 contacts a right end portion of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 contacts the outer electrode 24.
The interlayer connection conductor v16 electrically connects the eighth wiring layer 122 and the outer electrode 26. More specifically, the interlayer connection conductor v16 penetrates through the insulator layers 14e and 14f in the up-down direction. The upper end of the interlayer connection conductor v16 contacts a right end portion of the eighth wiring layer 122. The lower end of the interlayer connection conductor v16 contacts the outer electrode 26.
The interlayer connection conductors v15 and v16 are formed by filling, with conductive paste, through-holes penetrating through the insulator layers 14e and 14f in the up-down direction and solidifying the conductive paste through heating and pressurization.
The protective layer 15c has a dielectric constant larger than the dielectric constants of the insulator layers 14a to 14e. In the flexible portion A4, the protective layer 15c covers the upper principal surface of the insulator layer 14d. Accordingly, the protective layer 15c protects the first ground conductor layer 128.
The outer electrodes 24 and 26 are provided on the lower principal surface of the insulator layer 14f. The other structures of the outer electrodes 24 and 26 are the same as in the multilayer board 10 and thus description thereof is omitted.
The structure of the opening H is the same as that of the multilayer board 10 and thus description thereof is omitted. The other structure of the multilayer board 10h is the same as that of the multilayer board 10 and thus description thereof is omitted.
The multilayer board 10h can achieve the same effects as the multilayer board 10. In addition, according to the multilayer board 10h, the effects (a) to (c) can be achieved.
(d) According to the multilayer board 10h, characteristic impedance can be matched at a position close to the first radiation conductor layer 16 by adjusting the lengths (widths) of the first wiring layer 20 and the second wiring layer 22 in a direction orthogonal to the up-down direction. Accordingly, it is possible to supply reflected waves to the first radiation conductor layer 16 with a reduced loss.
A multilayer board 10i according to a ninth modification will be described below.
The multilayer board 10i is different from the multilayer board 10 in that the first wiring layer 20 and the second wiring layer 22 each include a matching portion PMC. In the present modification, the length of the matching portion PMC of the first wiring layer 20 in the front-back direction is longer than the length of the other part of the first wiring layer 20 than the matching portion PMC in the front-back direction. The length of the matching portion PMC of the second wiring layer 22 in the front-back direction is longer than the length of the other part of the second wiring layer 22 than the matching portion PMC in the front-back direction. The matching portions PMC do not overlap the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction).
The multilayer board 10i can achieve the same effects as the multilayer board 10. In addition, according to the multilayer board 10i, coupling between each matching portion PMC and the first radiation conductor layer 16 is prevented. More specifically, it is possible to supply reflected waves to the first radiation conductor layer 16 with a reduced loss when the matching portions PMC are provided at positions close to the first radiation conductor layer 16, and thus the matching portions PMC are preferably provided at the first wiring layer 20 and the second wiring layer 22. The matching portions PMC do not overlap the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction). Accordingly, the matching portions PMC are positioned far from the first radiation conductor layer 16. As a result, according to the multilayer board 10i, coupling between each matching portion PMC and the first radiation conductor layer 16 is prevented.
A multilayer board 10j according to a tenth modification will be described below.
The multilayer board 10j is different from the multilayer board 10 in that the first wiring layer 20 and the second wiring layer 22 each include a stub portion ST. In the present modification, each stub portion ST is an open stub not connected to the ground potential. Each stub portion ST has a linear shape extending in the front-back direction in a view along the up-down direction. The stub portions ST do not overlap the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction).
The multilayer board 10j can achieve the same effects as the multilayer board 10. In addition, according to the multilayer board 10j, coupling between each stub portion ST and the first radiation conductor layer 16 is prevented. More specifically, it is possible to supply reflected waves to the first radiation conductor layer 16 with a reduced loss when the stub portions ST are provided at positions close to the first radiation conductor layer 16, the stub portions ST are provided at the first wiring layer 20 and the second wiring layer 22. The stub portions ST do not overlap the first radiation conductor layer 16 in a view along the up-down direction (Z-axis direction). Accordingly, the stub portions ST are positioned far from the first radiation conductor layer 16. As a result, according to the multilayer board 10i, coupling between each stub portion ST and the first radiation conductor layer 16 is prevented.
A multilayer board 10k according to an eleventh modification will be described below.
The multilayer board 10k is different from the multilayer board 10h in that the seventh wiring layer 120 is orthogonal to the first straight line E1 in a view along the up-down direction (Z-axis direction). The other structure of the multilayer board 10k is the same as that of the multilayer board 10h and thus description thereof is omitted.
The multilayer board 10k can achieve the same effects as the multilayer board 10h. In addition, according to the multilayer board 10k, the distance between the seventh wiring layer 120 and the first radiation conductor layer 16 is longer than the distance between the first wiring layer 20 and the first radiation conductor layer 16. Thus, the seventh wiring layer 120 may be orthogonal to the first straight line E1 in a view along the up-down direction (Z-axis direction) as long as the first wiring layer 20 intersects but is not orthogonal to the first straight line E1 in a view along the up-down direction (Z-axis direction) and the second wiring layer 22 intersects but is not orthogonal to the second straight line E2 in a view along the up-down direction (Z-axis direction).
(e) According to the multilayer board 10k, the freedom of wiring arrangement improves. More specifically, the seventh wiring layer 120 may be orthogonal to the first straight line E1 in a view along the up-down direction (Z-axis direction). The eighth wiring layer 122 may be orthogonal to the second straight line E2 in a view along the up-down direction (Z-axis direction).
An antenna module 100 according to a twelfth modification will be described below.
The antenna module 100 is used for a wireless communication terminal such as a smartphone. The antenna module 100 includes the multilayer board 10 and the multilayer board 210.
As illustrated in
The multilayer board 210 includes a multilayer body 112, the seventh wiring layer 120, the eighth wiring layer 122, outer electrodes 124 to 127, the first ground conductor layer 128, a second ground conductor layer 129, and interlayer connection conductors v9 to v12 and v15 to v18. The seventh wiring layer 120, the eighth wiring layer 122, the outer electrodes 124 to 127, the first ground conductor layer 128, the second ground conductor layer 129, and the interlayer connection conductors v9 to v12 and v15 to v18 are provided in the multilayer body 112 as illustrated in
The multilayer body 112 has a plate shape. The multilayer body 112 has a rectangular shape in a view along the up-down direction. The multilayer body 112 has a structure in which insulator layers 114a to 114c and protective layers 115a and 115b are laminated in the up-down direction (Z-axis direction). The length of the multilayer body 112 in the up-down direction is shorter than the length of the multilayer body 12 in the up-down direction. Accordingly, the length of the multilayer board 210 in the up-down direction (Z-axis direction) is shorter than the length of the multilayer board 10 in the up-down direction (Z-axis direction). The protective layer 115a, the insulator layers 114a to 114c, and the protective layer 115b are arranged in the stated order from top. The material of the insulator layers 114a to 114c is thermoplastic resin such as polyimide or liquid crystal polymer. The multilayer body 112 is flexible. The multilayer board 210 is flexible. The protective layers 115a and 115b will be described later.
The first ground conductor layer 128 is provided on the upper principal surface of the insulator layer 14a. The first ground conductor layer 128 has a rectangular shape in a view along the up-down direction. The long sides of the first ground conductor layer 128 extend in the right-left direction. The short sides of the first ground conductor layer 128 extend in the front-back direction. The first ground conductor layer 128 overlaps the seventh wiring layer 120 and the eighth wiring layer 122 in a view along the up-down direction. The first ground conductor layer 128 is connected to the ground potential.
The outer electrodes 124 and 126 are provided on the upper principal surface of the insulator layer 114a. The outer electrodes 124 and 126 do not contact the first ground conductor layer 128. Accordingly, the outer electrodes 124 and 126 are positioned in an opening provided through the first ground conductor layer 128. The outer electrode 124 overlaps the left end portion of the seventh wiring layer 120 in a view along the up-down direction. The outer electrode 126 overlaps the left end portion of the eighth wiring layer 122 in a view along the up-down direction.
The seventh wiring layer 120 is positioned on the lower side of the first ground conductor layer 128 and on the upper side of the second ground conductor layer 129. In the present modification, the seventh wiring layer 120 is positioned on the upper principal surface of the insulator layer 114b. The seventh wiring layer 120 has a linear shape extending in the right-left direction in a view along the up-down direction. As illustrated in
As illustrated in
As illustrated in
Outer electrodes 125 and 127 are provided on the lower principal surface of the insulator layer 114c. The outer electrodes 125 and 127 do not contact the second ground conductor layer 129. Accordingly, the outer electrodes 125 and 127 are positioned in an opening provided through the second ground conductor layer 129. The outer electrode 125 overlaps the right end portion of the seventh wiring layer 120 in a view along the up-down direction. The outer electrode 127 overlaps the right end portion of the eighth wiring layer 122 in a view along the up-down direction.
The interlayer connection conductors v9 to v12 electrically connect the first ground conductor layer 128 and the second ground conductor layer 129. More specifically, the interlayer connection conductors v9 to v12 penetrate through the insulator layers 114a to 114c in the up-down direction. The upper ends of the interlayer connection conductors v9 to v12 contact the first ground conductor layer 128. The lower ends of the interlayer connection conductors v9 to v12 contact the second ground conductor layer 129.
The interlayer connection conductor v15 electrically connects the outer electrode 124 and the seventh wiring layer 120. More specifically, the interlayer connection conductor v15 penetrates through the insulator layer 114a in the up-down direction. The upper end of the interlayer connection conductor v15 contacts the outer electrode 124. The lower end of the interlayer connection conductor v15 contacts the left end portion of the seventh wiring layer 120.
The interlayer connection conductor v16 electrically connects the outer electrode 126 and the eighth wiring layer 122. More specifically, the interlayer connection conductor v16 penetrates through the insulator layer 114a in the up-down direction. The upper end of the interlayer connection conductor v16 contacts the outer electrode 126. The lower end of the interlayer connection conductor v16 contacts the left end portion of the eighth wiring layer 122.
The interlayer connection conductor v17 electrically connects the seventh wiring layer 120 and the outer electrode 125. More specifically, the interlayer connection conductor v17 penetrates through the insulator layers 114b and 114c in the up-down direction. The upper end of the interlayer connection conductor v17 contacts the right end portion of the seventh wiring layer 120. The lower end of the interlayer connection conductor v15 contacts the outer electrode 125.
The interlayer connection conductor v18 electrically connects the eighth wiring layer 122 and the outer electrode 127. More specifically, the interlayer connection conductor v18 penetrates through the insulator layers 114b and 114c in the up-down direction. The upper end of the interlayer connection conductor v18 contacts the right end portion of the eighth wiring layer 122. The lower end of the interlayer connection conductor v18 contacts the outer electrode 127.
The protective layers 115a and 115b have dielectric constants larger than the dielectric constants of the insulator layers 114a to 114c. The protective layer 115a covers the upper principal surface of the insulator layer 114a. Accordingly, the protective layer 115a protects the first ground conductor layer 128. However, an opening h1 is provided through the protective layer 115b. Accordingly, the outer electrodes 124 and 126 are exposed to the outside of the multilayer board 210 through the opening h1. The protective layer 115b covers the lower principal surface of the insulator layer 114c. Accordingly, the protective layer 115b protects the second ground conductor layer 129. However, an opening h2 is provided through the protective layer 115b. Accordingly, the outer electrodes 125 and 127 are exposed to the outside of the multilayer board 210 through the opening h2.
The multilayer board 210 is mounted on the multilayer board 10. Specifically, the outer electrode 124 is fixed to the outer electrode 24 by solder S. Accordingly, the seventh wiring layer 120 is electrically connected to the first wiring layer 20. Thus, the first high-frequency signal is input to or output from the outer electrode 125. The outer electrode 126 is fixed to the outer electrode 26 by the solder S. Accordingly, the eighth wiring layer 122 is electrically connected to the second wiring layer 22. Thus, the second high-frequency signal is input to or output from the outer electrode 127.
The antenna module 100 can achieve the same effects as the multilayer board 10. In addition, according to the antenna module 100, the effects (d) and (e) can be achieved.
(f) According to the antenna module 100, bending fabrication of the antenna module 100 is easy. More specifically, the multilayer board 210 has the region AR1 overlapping the multilayer board 10 in a view along the up-down direction (Z-axis direction), and the region AR2 not overlapping the multilayer board 10 in a view along the up-down direction (Z-axis direction). The length of the multilayer board 210 in the up-down direction (Z-axis direction) is shorter than the length of the multilayer board 10 in the up-down direction (Z-axis direction). Thus, the region AR2 of the multilayer board 210 is more easily deformable than the multilayer board 10. In other words, the region AR2 of the multilayer board 210 is easily bendable. Accordingly, the antenna module 100 can be easily bend. As a result, bending fabrication of the antenna module 100 is easy.
An antenna module 100a according to a thirteenth modification will be described below.
The antenna module 100a is different from the antenna module 100 in that the antenna module 100a includes a multilayer board 10l and a multilayer board 210a. The multilayer board 10l is different from the multilayer board 10 in that the multilayer board 10l does not include the ground conductor layer 28 nor the interlayer connection conductors v5 to v8.
The multilayer board 210a is different from the multilayer board 210 in that the first ground conductor layer 128 is positioned only in the region AR2 in a view along the up-down direction as illustrated in
The antenna module 100a can achieve the same effects as the antenna module 100.
(g) According to the antenna module 100a, the length of the region AR1 in the up-down direction (Z-axis direction) can be shortened. More specifically, no first ground conductor layer 128 facing the first radiation conductor layer 16 exists. Capacitance generated between the first radiation conductor layer 16 and the second ground conductor layer 129 is dominant as capacitance generated between the first radiation conductor layer 16 and a ground conductor. Thus, the length of the region AR1 in the up-down direction (Z-axis direction) can be shortened when desired capacitance is to be formed.
A multilayer board according to the present disclosure is not limited to the multilayer boards 10 and 10a to 10k but is changeable within the scope of the present disclosure. The structures of the multilayer boards 10 and 10a to 10k may be optionally combined.
An antenna module according to the present disclosure is not limited to the antenna modules 100 and 100a but is changeable within the scope of the present disclosure. The structures of the antenna modules 100 and 100a may be optionally combined. The antenna module 100 may include the multilayer boards 10a to 10l.
The annular ground conductor layer 30 is not an essential component.
The first wiring layer 20 and the second wiring layer 22 do not necessarily need to be parallel to each other. The third wiring layer 220 and the fourth wiring layer 222 do not necessarily need to be parallel to each other. The fifth wiring layer 320 and the sixth wiring layer 322 do not necessarily need to be parallel to each other.
In the multilayer board 10a, the first straight line E1 and the second straight line E2 may be positioned on the left side of the first part EP1 of the first outer edge EE1 except for the first straight line E1 and the second straight line E2 (on the negative side thereof along the X axis), and the third straight line E3 and the fourth straight line E4 may be positioned on the right side of the second part EP2 of the second outer edge EE2 except for the third straight line E3 and the fourth straight line E4 (on the positive side thereof along the X axis).
The second straight line E2 only needs to intersect the first straight line E1 in a view along the up-down direction and does not necessarily need to be orthogonal to the first straight line E1. The fourth straight line E4 only needs to intersect the third straight lines E3 in a view along the up-down direction and does not necessarily need to be orthogonal to the third straight line E3. The sixth straight line E6 only needs to intersect the fifth straight line E5 in a view along the up-down direction and does not necessarily need to be orthogonal to the fifth straight line E5.
The first straight line E1 and the second straight line E2 do not necessarily need to intersect each other in a view along the up-down direction.
The first power supply point P1 may be positioned closest to any other point in the first straight line E1 than the middle point of the first straight line E1.
The second power supply point P2 may be positioned closest to any other point in the second straight line E2 than the middle point of the second straight line E2.
The third power supply point P3 may be positioned closest to any other point in the third straight line E3 than the middle point of the third straight line E3.
The fourth power supply point P4 may be positioned closest to any other point in the fourth straight line E4 than the middle point of the fourth straight line E4.
The fifth power supply point P5 may be positioned closest to any other point in the fifth straight line E5 than the middle point of the fifth straight line E5.
The sixth power supply point P6 may be positioned closest to any other point in the sixth straight line E6 than the middle point of the sixth straight line E6.
The rigid portion A3 does not necessarily need to overlap the protective layer 15a in a view along the up-down direction (Z-axis direction).
The first ground conductor layer 128 is not an essential component.
The seventh wiring layer 120 and the eighth wiring layer 122 may each overlap the first radiation conductor layer 16 in a view along the up-down direction. However, coupling between each of the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16 can be prevented by increasing the distance between each of the seventh wiring layer 120 and the eighth wiring layer 122 and the first radiation conductor layer 16, and thus the seventh wiring layer 120 and the eighth wiring layer 122 each do not overlap the first radiation conductor layer 16 in a view along the up-down direction.
The matching portions PMC may be included in the seventh wiring layer 120 and the eighth wiring layer 122.
Even when the matching portions PMC are provided separately from the first wiring layer 20, the second wiring layer 22, the seventh wiring layer 120, and the eighth wiring layer 122, the matching portions PMC only need not to overlap the first radiation conductor layer 16 in a view along the up-down direction. In this case, each matching portions PMC may be formed of an electronic component such as a chip capacitor constituting a matching circuit for characteristic impedance matching.
The stub portions ST may be included in the seventh wiring layer 120 and the eighth wiring layer 122. Each stub portion ST may be a short stub connected to the ground potential.
The present disclosure has a structure described below.
(1) A multilayer board including:
(2) The multilayer board according to (1), in which
(3) The multilayer board according to (1) or (2), further including:
(4) The multilayer board according to (3), in which
(5) The multilayer board according to (3) or (4), further including:
(6) The multilayer board according to (5), in which
(7) The multilayer board according to (5), in which
(8) The multilayer board according to (5), in which
(9) The multilayer board according to (5), in which
(10) The multilayer board according to (1) or (2), further including:
(11) The multilayer board according to any one of (1) to (10), further including an annular ground conductor layer provided in the multilayer body and positioned on the positive side of the ground conductor layer along the Z axis, in which
(12) The multilayer board according to (11), in which
(13) The multilayer board according to any one of (1) to (12), in which
(14) The multilayer board according to any one of (1) to (12), in which
(15) The multilayer board according to any one of (1) to (14), further including:
(16) The multilayer board according to (15), further including an annular ground conductor layer provided in the multilayer body and positioned on the positive side of the ground conductor layer along the Z axis, in which
(17) The multilayer board according to (15) or (16), further including:
(18) The multilayer board according to (17), in which
(19) An antenna module including:
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-145551 | Sep 2022 | JP | national |
| 2023-097403 | Jun 2023 | JP | national |
