Claims
- 1. A method for manufacturing a multilayer ceramic capacitor, comprising the steps of:
forming a ceramic slurry; forming ceramic green sheets from the ceramic slurry; printing internal electrode patterns on the ceramic green sheets; generating a laminated body by stacking the ceramic green sheets provided with the internal electrode patterns printed thereon; dicing the laminated body to thereby form chip-shaped ceramic bodies; and sintering the chip-shaped ceramic bodies, wherein the ceramic slurry includes a glass component containing one or more additive elements selected from the group consisting of Mn, V, Cr, Mo, Fe, Ni, Cu and Co.
- 2. The method of claim 1, wherein an amount of the additive elements included in the ceramic slurry is in a range of about 0.01 to about 1.0 mol %.
- 3. The method of claim 1, wherein the ceramic slurry is formed from a ceramic compound of barium titanate or strontium titanate.
- 4. The method of claim 1, wherein the ceramic slurry includes one or more rare-earth compounds selected from the group consisting of Sc, Y, Gd, Dy, Ho, Er, Yb, Tm and Lu.
- 5. The method of claim 4, wherein the glass component contains the rare-earth compounds in a form of a solid solution, an amount of the rare-earth compounds being equal to or less than 2.0 mol %.
- 6. The method of claim 1, wherein the glass component contains Li2O—SiO2-MO or B2O3—SiO2-MO as a major component, MO being one or more metal oxides selected from the group consisting of BaO, SrO, CaO, MgO and ZnO.
- 7. The method of claim 1, wherein the sintering step includes the steps of:
sintering the chip-shaped ceramic bodies in a non-oxidative atmosphere; and re-oxiding the sintered chip-shaped ceramic bodies in an oxidative atmosphere.
- 8. The method of claim 1, wherein the ceramic slurry includes a basic component powder and an additive component powder, the additive component powder contains the glass component containing one or more additive elements selected from the group consisting of Mn, V, Cr, Mo, Fe, Ni, Cu and Co.
- 9. The method of claim 1, wherein the multilayer ceramic capacitor is formed by alternately stacking a plurality of dielectric layers and a multiplicity of internal electrodes which are connected to a pair of external electrodes, and wherein each of the dielectric layers is obtained from a dielectric ceramic compound composed of ceramic grains and the glass component connecting the ceramic grains.
- 10. The method of claim 8, wherein the multilayer ceramic capacitor is formed by alternately stacking a plurality of dielectric layers and a multiplicity of internal electrodes which are connected to a pair of external electrodes, and wherein each of the dielectric layers is obtained from a dielectric ceramic compound composed of ceramic grains and the glass component connecting the ceramic grains.
Priority Claims (3)
Number |
Date |
Country |
Kind |
2000-094532 |
Mar 2000 |
JP |
|
2000-094536 |
Mar 2000 |
JP |
|
2000-125289 |
Apr 2000 |
JP |
|
CROSS REFERENCE TO RELATED APPLICATIONS
[0001] This is a divisional of pending U.S. application Ser. No. 09/823,157 filed Mar. 30, 2001.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09823157 |
Mar 2001 |
US |
Child |
10702931 |
Nov 2003 |
US |