This application claims benefit of priority to Japanese Patent Application No. 2017-226909, filed Nov. 27, 2017, the entire content of which is incorporated herein by reference.
The present disclosure relates to a multilayer coil component.
A multilayer inductor that is disclosed, as an example of multilayer coil components, in Japanese Unexamined Patent Application Publication No. 9-129447 is formed of coil conductors and insulating members that are laminated. The multilayer inductor disclosed in Japanese Unexamined Patent Application Publication No. 9-129447 is characterized in that the axial direction of a coil that is formed of the coil conductors that are electrically connected to each other is perpendicular to outer electrodes to which end portions of the coil are electrically connected, and a lamination direction of a multilayer body that is formed of the coil conductors and the insulating members is perpendicular to the outer electrodes.
The multilayer body of the multilayer inductor disclosed in Japanese Unexamined Patent Application Publication No. 9-129447 is obtained by laminating insulating sheets that include the coil conductors. The coil conductors are connected in series with each other via through-holes and form the coil. The lamination direction of the insulating sheets is parallel to a mounting surface and is perpendicular to the outer electrodes. The axial direction of the coil is parallel to the mounting surface and is perpendicular to the outer electrodes.
The multilayer inductor disclosed in Japanese Unexamined Patent Application Publication No. 9-129447 can allegedly decrease a stray capacitance between the coil and each outer electrode because the axial direction of the coil is perpendicular to the outer electrode.
In the case where an attempt is made to further decrease the stray capacitance between the coil and each outer electrode, the outer electrode is formed on a part of an end surface or a part of a side surface of the multilayer body to decrease the area of the outer electrode that faces the coil. However, when each outer electrode is formed on the part of the end surface or the part of the side surface of the multilayer body, visual inspection of the upper and lower surfaces, the side surfaces, and the end surfaces of the multilayer body is not enough to determine a location at which the outer electrode is to be formed. Accordingly, it is also difficult to achieve automatic determination with, for example, a sensor.
The present disclosure thus provides a multilayer coil component that enables the location at which the outer electrode is to be formed to be readily determined.
According to preferred embodiments of the present disclosure, a multilayer coil component includes a multilayer body that is formed of laminated insulating layers and that contains a coil, and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed of coil conductors that are stacked together with the insulating layers and that are electrically connected to each other. The multilayer body has a first end surface and a second end surface that face away from each other in a length direction, a first main surface and a second main surface that face away from each other in a height direction perpendicular to the length direction, and a first side surface and a second side surface that face away from each other in a width direction perpendicular to the length direction and the height direction. The first outer electrode covers a part of the first end surface, extends from the first end surface, and covers a part of the first main surface. The second outer electrode covers a part of the second end surface, extends from the second end surface, and covers a part of the first main surface. The first main surface serves as a mounting surface. A lamination direction of the multilayer body and an axial direction of the coil are parallel to the mounting surface. A determination mark is formed on a surface of the multilayer body at a location at which the first outer electrode or the second outer electrode is formed.
According to preferred embodiments of the present disclosure, it is preferable that the multilayer body contain a first connection conductor and a second connection conductor. The first connection conductor linearly connects a part of the first outer electrode that covers the first end surface and one of the coil conductors that faces the part of the first outer electrode to each other, and the second connection conductor linearly connects a part of the second outer electrode that covers the second end surface and another of the coil conductors that faces the part of the second outer electrode to each other. Also, the first connection conductor and the second connection conductor overlap the coil conductors in a plan view along the lamination direction and are nearer than a central axis of the coil to the mounting surface.
According to preferred embodiments of the present disclosure, the first outer electrode may further extend from the first end surface and the first main surface and cover a part of the first side surface and a part of the second side surface. Also, the second outer electrode may further extend from the second end surface and the first main surface and cover a part of the first side surface and a part of the second side surface.
According to preferred embodiments of the present disclosure, the determination mark is preferably formed of a mark conductor pattern that is formed on one of the insulating layers, and the mark conductor pattern is preferably in contact with an outer circumferential edge of the one of the insulating layers. According to preferred embodiments of the present disclosure, the determination mark is preferably formed on the first main surface of the multilayer body.
According to preferred embodiments of the present disclosure, the determination mark is preferably provided in a plurality and the determination marks are formed in at least two regions each of which contains a corner of the first main surface such that each determination mark is composed of a line or a plurality of lines and are more preferably formed in four regions. The determination marks are preferably symmetric with each other with respect to a point.
According to preferred embodiments of the present disclosure, the length of the line is preferably no less than 0.04 mm and no more than 0.1 mm (i.e., from 0.04 mm to 0.1 mm). According to preferred embodiments of the present disclosure, a multilayer coil component that enables the location at which the outer electrode is to be formed to be readily determined.
Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments of the present disclosure with reference to the attached drawings.
A multilayer coil component according to an embodiment of the present disclosure will hereinafter be described.
The present disclosure, however, is not limited to the embodiment described below and can be appropriately changed and carried out without departing from the spirit of the present disclosure. The present disclosure includes a combination of two or more preferable features described below.
The multilayer coil component that is designated as 1 in
The length direction, the height direction, and the width direction of the multilayer coil component and the multilayer body 10 according to the embodiment of the present disclosure correspond to the x-direction, the y-direction, and the z-direction in
As illustrated in
As illustrated in
In
As illustrated in
The second outer electrode 22 covers a part of the second end surface 12 of the multilayer body 10, extends from the second end surface 12, and covers a part of the first main surface 13. The second outer electrode 22 covers a region of the second end surface 12 that contains the ridge along which the second end surface 12 and the first main surface 13 meet but does not cover a region that contains the ridge along which the second end surface 12 and the second main surface 14 meet as in the first outer electrode 21. Accordingly, a part of the second end surface 12 is exposed at the region that contains along which the second end surface 12 and the second main surface 14 meet. The second outer electrode 22 does not cover the second main surface 14.
The shape of the second outer electrode 22 is not particularly limited, provided that the second outer electrode 22 covers the part of the second end surface 12 of the multilayer body 10 as in the first outer electrode 21. For example, a part of the second outer electrode 22 on the second end surface 12 of the multilayer body 10 may have a substantially arching shape that bulges from end portions toward a central portion. The shape of the second outer electrode 22 is not particularly limited, provided that the second outer electrode 22 covers the part of the first main surface 13 of the multilayer body 10. For example, a part of the second outer electrode 22 on the first main surface 13 of the multilayer body 10 may have a substantially arching shape that bulges from end portions toward a central portion.
The second outer electrode 22 may further extend from the second end surface 12 and the first main surface 13 and cover a part of the first side surface 15 and a part of the second side surface 16 as in the first outer electrode 21. In this case, the parts of the second outer electrode 22 that cover the first side surface 15 and the second side surface 16 are preferably formed at an angle with respect to the ridges along which the first side surface 15 and the second side surface 16 meet the second end surface 12 and the first main surface 13. The second outer electrode 22 may not cover the part of the first side surface 15 and the part of the second side surface 16.
Since the first outer electrode 21 and the second outer electrode 22 are thus arranged, when a multilayer coil component 1 is mounted on a substrate, the first main surface 13 of the multilayer body 10 serves as a mounting surface. The size of the multilayer coil component according to the embodiment of the present disclosure is not particularly limited but is preferably 0603 size or 0402 size so-called in the industry.
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0603 size, the length (length represented by a double-headed arrow L in
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0603 size, the height (length represented by a double-headed arrow T in
When the length of the part of the first outer electrode 21 that covers the first main surface 13 of the multilayer body 10 and the length of the part of the second outer electrode 22 that covers the first main surface 13 of the multilayer body 10 are not constant, the maximum length is preferably within the above range.
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0603 size, the height (length represented by a double-headed arrow E2 in
The height of the part of the first outer electrode 21 that covers the first end surface 11 of the multilayer body 10 and the height of the part of the second outer electrode 22 that covers the second end surface 12 of the multilayer body 10 are not constant, the maximum height is preferably within the above range.
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0402 size, the length of the multilayer coil component is preferably no less than 0.38 mm and no more than 0.42 mm (i.e., from 0.38 mm to 0.42 mm), and the width of the multilayer coil component is preferably no less than 0.18 mm and no more than 0.22 mm (i.e., from 0.18 mm to 0.22 mm). When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0402 size, the height of the multilayer coil component is preferably no less than 0.18 mm and no more than 0.22 mm (i.e., from 0.18 mm to 0.22 mm).
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0402 size, the length of the part of the first outer electrode 21 that covers the first main surface 13 of the multilayer body 10 is preferably no less than 0.08 mm and no more than 0.15 mm (i.e., from 0.08 mm to 0.15 mm). Similarly, the length of the part of the second outer electrode 22 that covers the first main surface 13 of the multilayer body 10 is preferably no less than 0.08 mm and no more than 0.15 mm (i.e., from 0.08 mm to 0.15 mm).
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0402 size, the height of the part of the first outer electrode 21 that covers the first end surface 11 of the multilayer body 10 is preferably no less than 0.06 mm and no more than 0.13 mm (i.e., from 0.06 mm to 0.13 mm). Similarly, the height of the part of the second outer electrode 22 that covers the second end surface 12 of the multilayer body 10 is preferably no less than 0.06 mm and no more than 0.13 mm (i.e., from 0.06 mm to 0.13 mm). In this case, the stray capacitance due to each outer electrode can be decreased.
As illustrated in
The insulating layers 31a, 31b, 31c, and 31d include respective coil conductors 32a, 32b, 32c, and 32d, and respective via conductors 33a, 33b, 33c, and 33d. Each insulating layer 31e include a via conductor 33e. Each insulating layer 31f includes a via conductor 33f and mark conductor patterns 34.
The coil conductors 32a, 32b, 32c, and 32d are disposed on main surfaces of the corresponding insulating layers 31a, 31b, 31c, and 31d and are stacked together with the insulating layers 31a, 31b, 31c, 31d, 31e, and 31f. As illustrated in
The via conductors 33a, 33b, 33c, 33d, 33e, and 33f extend through the insulating layers 31a, 31b, 31c, 31d, 31e, and 31f in the thickness direction (x-direction in
The mark conductor patterns 34 are formed on the main surfaces of the insulating layers 31f. In
The insulating layers 31a, 31b, 31c, 31d, 31e, and 31f that have the above structure are laminated in the X-direction as illustrated in
In the multilayer body 10, the via conductors 33e and 33f form connection conductors, which are exposed from respective end surfaces of the multilayer body 10. In the multilayer body 10, each connection conductor linearly connects the first outer electrode 21 and the coil conductor 32a that faces the first outer electrode 21 or linearly connects the second outer electrode 22 and the coil conductor 32d that faces the second outer electrode 22. The mark conductor patterns 34 are exposed from the first main surface 13 of the multilayer body 10 and serve as determination marks 50.
As illustrated in
As a result of the coil and the outer electrodes being linearly connected, extended portions can be simple, and the high-frequency characteristics can be improved. In the case where the via conductors that form the connection conductors overlap in a plan view from the lamination direction, the via conductors that form the connection conductors may not be strictly arranged linearly.
As illustrated in
In
As illustrated in
Determination marks 50 are formed at locations of a surface of the multilayer body 10 at which the first outer electrode 21 and the second outer electrode 22 are formed. In
The determination marks 50 that are formed on the surface of the multilayer body 10 enable locations at which the outer electrodes are to be formed to be readily determined. This enables automatic determination with, for example, a sensor.
The determination marks 50 are preferably formed on the first main surface 13 of the multilayer body 10. However, the determination marks 50 may be formed on the first end surface 11 or the second end surface 12 or may be formed on the first side surface or the second side surface, provided that the locations thereof are the same as the locations at which the first outer electrode 21 and the second outer electrode 22 are formed.
In an example illustrated in
As illustrated in
The length (dimension in the width direction of the multilayer body 10) of the lines of the determination marks 50 is not particularly limited but is preferably no less than 0.04 mm and no more than 0.1 mm (i.e., from 0.04 mm to 0.1 mm). The width (dimension in the length direction of the multilayer body 10) and shape of the lines, for example, are not particularly limited.
The determination marks 50 may be formed on the insulating layers so as to be exposed from a surface of the multilayer body 10 or may be formed on the surface of the multilayer body 10 after the insulating layers are laminated. However, the determination marks 50 are preferably formed on the insulating layers. In other words, the determination marks 50 preferably extend from the inside of the multilayer body 10 and are preferably formed on the surface of the multilayer body 10.
In particular, each determination mark is preferably formed of a conductor pattern that is formed on the corresponding insulating layer. In this case, the conductor pattern is formed so as to be in contact with an outer circumferential edge of the insulating layer. This enables a contact portion of the conductor pattern to be exposed from the multilayer body 10, and the determination mark can be readily formed. The material of each determination mark is not particularly limited, and examples thereof may include a nonconductive material such as a ceramic material.
The structure of the multilayer body 10 of the multilayer coil component according to the embodiment of the present disclosure is not limited to the structure illustrated in
When the size of the multilayer coil component according to the embodiment of the present disclosure is the 0603 size, the distance between the coil conductors in the lamination direction is preferably no less than 3 μm and no more than 7 μm (i.e., from 3 μm to 7 μm). When the distance between the coil conductors in the lamination direction is no less than 3 μm and no more than 7 μm (i.e., from 3 μm to 7 μm), the number of turns of the coil can be increased, an electrostatic capacity between the coil conductors decreases, and the impedance can be increased. In addition, a transmission coefficient S21 at high frequencies, described later, can be decreased.
The multilayer coil component according to the embodiment of the present disclosure preferably includes the first connection conductor and the second connection conductor described above. The multilayer coil component has excellent high-frequency characteristics in a high frequency band, particularly, in a band of no less than 30 GHz and no more than 80 GHz (i.e., from 30 GHz to 80 GHz). Accordingly, the multilayer coil component is preferably used for, for example, a bias-tee circuit in an optical communication circuit.
The transmission coefficient S21 at about 40 GHz is evaluated as the high-frequency characteristics of the multilayer coil component according to the embodiment of the present disclosure. The transmission coefficient S21 is calculated from a ratio of power of a transmission signal to an input signal. The transmission coefficient S21 is basically a dimensionless quantity and is typically expressed by a unit of dB with a common logarithm. The transmission coefficient S21 of the multilayer coil component according to the embodiment of the present disclosure at about 40 GHz is preferably no less than −1.0 dB and no more than 0 dB (i.e., from −1.0 dB to 0 dB).
An example of a method of manufacturing the multilayer coil component according to the embodiment of the present disclosure will now be described.
A ceramic green sheet for the insulating layers is first manufactured. For example, an organic binder such as a polyvinyl butyral resin, an organic solvent such as ethanol or toluene, and a dispersant are added in a ferrite material and kneaded to form a slurry. Subsequently, a magnetic sheet having a thickness of about 12 μm is obtained by, for example, a doctor blade method.
After oxidizable materials such as iron, nickel, zinc, and copper are mixed as ferrite materials and are pre-fired at about 800° C. for about 1 hour, the materials are pulverized with a ball mill and dried. Consequently, a Ni—Zn—Cu ferrite material (powder of mixed oxides) having an average particle diameter of about 2 μm can be obtained.
Examples of the material of the ceramic green sheet for the insulating layers can include a magnetic material such as a ferrite material, and a non-magnetic material such as a glass ceramic material, and a mixed material of these magnetic materials and/or the non-magnetic materials. When the ceramic green sheet is manufactured with a ferrite material, to achieve a high L value (inductance), the ceramic green sheet is preferably manufactured with a ferrite material that is composed of Fe2O3 in an amount of no less than 40 mol % and no more than 49.5 mol % (i.e., from 40 mol % to 49.5 mol %), ZnO in an amount of no less than 5 mol % and no more than 35 mol % (i.e., from 5 mol % to 35 mol %), CuO in an amount of no less than 4 mol % and no more than 12 mol % (i.e., from 4 mol % to 12 mol %), and a rest of NiO and a small amount of additive (containing inevitable impurities).
Via holes having a diameter of no less than about 20 μm and no more than about 30 μm (i.e., from about 20 μm to about 30 μm) are formed in the manufactured ceramic green sheet by a predetermined laser process. A via hole that is formed in a specific sheet is filled with an Ag paste. Conductor patterns (coil conductors) each having a thickness of about 11 μm for coil circling with ¾ turns are formed by screen printing. After drying, coil sheets are obtained.
After cutting, the coil sheets are stacked such that the coil having a winding axis parallel to the mounting surface is formed in a multilayer body 10. The via conductors that form the connection conductors are formed in via sheets, and the via sheets are stacked. At least one of the sheets includes the mark conductor pattern for the mark as needed.
After the multilayer body 10 is subjected to thermo-compression bonding to obtain a bonded body having a thickness of about 0.67 mm, the bonded body is cut with chip dimensions of a length of about 0.67 mm, a width of about 0.34 mm, a height of about 0.34 mm to obtain individual chips. The individual chips may be processed with a rotating barrel to round the corners and ridges thereof.
A fired body (multilayer body) that contains the coil is obtained by a binder removing process and a firing process at a predetermined temperature for a period of time each.
An Ag paste is elongated to have a predetermined thickness to form a layer, and the chip is obliquely inserted into the layer and baked to form underlying electrodes for the outer electrodes on four surfaces (a main surface, an end surface, and side surfaces) of the multilayer body 10.
The above method enables the underlying electrodes to be formed at a time unlike the case where the underlying electrodes are formed on the main surface and end surface of the multilayer body 10 at two times.
Ni films and Sn films that have predetermined thicknesses are successively formed on the underlying electrodes by plating to form the outer electrodes. In this way, the multilayer coil component according to the embodiment of the present disclosure can be manufactured.
While preferred embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims.
Number | Date | Country | Kind |
---|---|---|---|
2017-226909 | Nov 2017 | JP | national |
Number | Name | Date | Kind |
---|---|---|---|
6073339 | Levin | Jun 2000 | A |
6165866 | Kobayashi | Dec 2000 | A |
6218925 | Iwao | Apr 2001 | B1 |
6577218 | Hamatani et al. | Jun 2003 | B2 |
6580350 | Kobayashi | Jun 2003 | B1 |
7212095 | Sato et al. | May 2007 | B2 |
7251120 | Takazawa | Jul 2007 | B2 |
7375977 | Maeda et al. | May 2008 | B2 |
7694414 | Maeda et al. | Apr 2010 | B2 |
8159322 | Iwasaki et al. | Apr 2012 | B2 |
8618902 | Nogi | Dec 2013 | B2 |
8921706 | Toda | Dec 2014 | B2 |
9343230 | Takeuchi et al. | May 2016 | B2 |
9412509 | Im et al. | Aug 2016 | B2 |
10079089 | Yoon | Sep 2018 | B1 |
10475569 | Yatabe | Nov 2019 | B2 |
10720276 | Ueyama et al. | Jul 2020 | B2 |
10748696 | Shibuya | Aug 2020 | B2 |
10847307 | Tajima et al. | Nov 2020 | B1 |
10854383 | Choi | Dec 2020 | B2 |
10998126 | Nishikawa | May 2021 | B2 |
11217372 | Jung | Jan 2022 | B2 |
11605498 | Kazuta | Mar 2023 | B2 |
20050181684 | Ito | Aug 2005 | A1 |
20070040163 | Okuzawa | Feb 2007 | A1 |
20100253464 | Miyoshi | Oct 2010 | A1 |
20110032066 | Chung | Feb 2011 | A1 |
20110102969 | Togashi | May 2011 | A1 |
20110128107 | Kitagawa | Jun 2011 | A1 |
20120062348 | Hashimoto | Mar 2012 | A1 |
20120274432 | Jeong et al. | Nov 2012 | A1 |
20130187744 | Seko et al. | Jul 2013 | A1 |
20130294009 | Takeuchi et al. | Nov 2013 | A1 |
20130299215 | Taseda | Nov 2013 | A1 |
20140159849 | Bae et al. | Jun 2014 | A1 |
20140176284 | Lee et al. | Jun 2014 | A1 |
20140224418 | Seko | Aug 2014 | A1 |
20140300001 | Choi | Oct 2014 | A1 |
20140311780 | Shizuno | Oct 2014 | A1 |
20150009003 | Ozawa et al. | Jan 2015 | A1 |
20150014040 | Ahn | Jan 2015 | A1 |
20150187486 | Lim | Jul 2015 | A1 |
20150287514 | Lim | Oct 2015 | A1 |
20150287516 | Park | Oct 2015 | A1 |
20150371757 | Takezawa | Dec 2015 | A1 |
20160268038 | Choi | Sep 2016 | A1 |
20160372255 | Maki | Dec 2016 | A1 |
20170018351 | Yatabe et al. | Jan 2017 | A1 |
20170316867 | Kamijima et al. | Nov 2017 | A1 |
20170365419 | Demizu | Dec 2017 | A1 |
20170367187 | Chae | Dec 2017 | A1 |
20180122557 | Kim | May 2018 | A1 |
20180166206 | Ueyama et al. | Jun 2018 | A1 |
20190115143 | Tachibana | Apr 2019 | A1 |
20190164685 | Hirukawa | May 2019 | A1 |
20190198232 | Sato et al. | Jun 2019 | A1 |
20210304950 | Takahashi | Sep 2021 | A1 |
20220122760 | Jung | Apr 2022 | A1 |
Number | Date | Country |
---|---|---|
1929050 | Mar 2007 | CN |
106133856 | Nov 2016 | CN |
60035632 | Nov 2007 | DE |
H08-335528 | Dec 1996 | JP |
H09-129447 | May 1997 | JP |
H11-307344 | Nov 1999 | JP |
2000-138120 | May 2000 | JP |
2001-093730 | Apr 2001 | JP |
2001-196240 | Jul 2001 | JP |
2002-093623 | Mar 2002 | JP |
2002118022 | Apr 2002 | JP |
2002305111 | Oct 2002 | JP |
3351738 | Dec 2002 | JP |
2002367833 | Dec 2002 | JP |
2003031424 | Jan 2003 | JP |
2003086425 | Mar 2003 | JP |
2003-109818 | Apr 2003 | JP |
2004350236 | Dec 2004 | JP |
2005-322743 | Nov 2005 | JP |
2006-108383 | Apr 2006 | JP |
2012060049 | Mar 2012 | JP |
2012-227225 | Nov 2012 | JP |
2017-022304 | Jan 2017 | JP |
2017-201761 | Nov 2017 | JP |
2019-096819 | Jun 2019 | JP |
WO-2007072617 | Jun 2007 | WO |
Entry |
---|
An Office Action; “Notification of Reasons for Refusal,” Mailed by the Japanese Patent Office dated Jan. 21, 2020, which corresponds to Japanese Patent Application No. 2017-226909 and is related to U.S. Appl. No. 16/197,127; with English language translation. |
An Office Action; “Notification of Reasons for Refusal,” mailed by the Japanese Patent Office dated Jul. 14, 2020, which corresponds to Japanese Patent Application No. 2018-071003 and is related to U.S. Appl. No. 16/197,127 with English language translation. |
An Office Action mailed by the China National Intellectual Property Administration dated Jul. 2, 2020, which corresponds to Chinese Patent Application No. 201811415222.4 and is related to U.S. Appl. No. 16/197,127 with English language translation. |
An Office Action mailed by the Japanese Patent Office dated Sep. 15, 2020, which corresponds to Japanese Patent Application No. 2017-226909 and is related to U.S. Appl. No. 16/197,127 with English language translation. |
An Office Action mailed by China National Intellectual Property Administration dated May 11, 2021 which corresponds to Chinese Patent Application No. 201811415222.4 and is related to U.S. Appl. No. 16/197,127 with English language translation. |
An Office Action; “Notice of Reasons for Refusal,” mailed by the Japanese Patent Office dated Oct. 5, 2021, which corresponds to Japanese Patent Application No. 2020-173331 and is related to U.S. Appl. No. 16/197,127 with English translation. |
Number | Date | Country | |
---|---|---|---|
20190164684 A1 | May 2019 | US |