Patent Grant
12020848
This application claims benefit of priority to Japanese Patent Application No. 2019-238909, filed Dec. 27, 2019, the entire contents of which is incorporated herein by reference.
The present disclosure relates to multilayer coil components and methods for designing multilayer coil components.
The recent trend toward a higher current in electronic devices has led to a need for a multilayer coil component with a higher rated current. An example of a multilayer coil component known in the related art includes a body and a coil disposed in the body, as described, for example, in Japanese Unexamined Patent Application Publication No. 2019-47015. The multilayer coil component disclosed in Japanese Unexamined Patent Application Publication No. 2019-47015 is manufactured by forming coil conductor layers with a thickness of about 30 μm on magnetic layers for formation of the body to obtain coil conductor printed sheets and bonding together by pressure and firing the coil conductor printed sheets.
Research conducted by the inventors has revealed that a high current flowing through a multilayer coil component may cause a plating constituent present in outer electrodes, particularly Ni, to diffuse into solder and may thus decrease the joint reliability.
Accordingly, the present disclosure provides a multilayer coil component that maintains its high joint reliability when a high current flows therethrough and a method for designing such a multilayer coil component.
According to preferred embodiments of the present disclosure, there is provided a multilayer coil component including an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. At least one of the coil conductor layers includes an extended portion and a winding portion and is connected to the outer electrode via the extended portion. The area S of an exposed portion of the extended portion exposed from the insulator portion is 0.018 mm2 or more.
In the multilayer coil component, the area S may be 0.020 mm2 or more.
In the multilayer coil component, the area S may be 0.032 mm2 or less.
In the multilayer coil component, the thickness of the extended portion may be larger than the thickness of the winding portion.
In the multilayer coil component, the ratio of the thickness of the extended portion to the thickness of the winding portion may be 1.1 to 2.0.
According to preferred embodiments of the present disclosure, there is also provided a method for designing a multilayer coil component including an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. At least one of the coil conductor layers includes an extended portion and a winding portion and is connected to the outer electrode via the extended portion. The method includes determining the rated current (I) of the multilayer coil component and determining the area (S) of an exposed portion of the extended portion exposed from the insulator portion such that the ratio (I/S) of the rated current (I) to the area (S) is 210 A/mm2 or less.
According to preferred embodiments of the present disclosure, a multilayer coil component that allows a high current to flow therethrough and that has high joint reliability can be provided. According to preferred embodiments of the present disclosure, a multilayer coil component that has high joint reliability can also be provided.
Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments of the present disclosure with reference to the attached drawings.
A multilayer coil component according to an embodiment of the present disclosure will hereinafter be described in detail with reference to the drawings. However, the shapes, arrangements, and other details of the multilayer coil component according to the present embodiment and the individual constituent elements thereof are not limited to the illustrated example.
As illustrated in
The above multilayer coil component 1 according to the present embodiment will hereinafter be described. The embodiment described herein is an embodiment in which the insulator portion 6 is formed from a ferrite material.
The body 2 of the multilayer coil component 1 according to the present embodiment is composed of the insulator portion 6 and the coil 7.
The insulator portion 6 may include the first insulator layers 11 and the second insulator layers 12.
The first insulator layers 11 are disposed between the coil conductor layers 15 adjacent to each other in the stacking direction and between the coil conductor layers 15 and the upper and lower surfaces of the body 2.
The second insulator layers 12 are disposed around the coil conductor layers 15 such that the upper surfaces (upper main surfaces in
That is, in the multilayer coil component according to the present embodiment, the insulator portion is a multilayer body including first and second insulator layers, the coil conductor layers are disposed on the first insulator layers, and the second insulator layers are disposed on the first insulator layers so as to be adjacent to the coil conductor layers.
The thickness of the first insulator layers 11 between the coil conductor layers 15 may preferably be about 5 μm to about 100 μm, more preferably about 10 μm to about 40 μm, even more preferably about 16 μm to about 30 μm. If the thickness is about 5 μm or more, insulation can be more reliably ensured between the coil conductor layers 15. If the thickness is about 100 μm or less, better electrical characteristics can be achieved.
In one embodiment, portions of the second insulator layers 12 may be disposed so as to extend over the outer edge portions of the coil conductor layers 15. In other words, the second insulator layers 12 may be disposed so as to cover the outer edge portions of the coil conductor layers 15. That is, as the coil conductor layers 15 and the second insulator layers 12 adjacent to each other are viewed in plan view from the upper side, the second insulator layers 12 may extend inwardly of the outer edges of the coil conductor layers 15.
The first insulator layers 11 and the second insulator layers 12 may be integrated with each other in the body 2. In this case, the first insulator layers 11 can be assumed to be present between the coil conductor layers 15, whereas the second insulator layers 12 can be assumed to be present at the same heights as the coil conductor layers 15.
The insulator portion 6 is preferably formed of a magnetic material, more preferably a sintered ferrite. The sintered ferrite contains at least Fe, Ni, and Zn as the main constituents. The sintered ferrite may further contain Cu.
The first insulator layers 11 and the second insulator layers 12 may have the same composition or different compositions. In a preferred embodiment, the first insulator layers 11 and the second insulator layers 12 have the same composition.
In one embodiment, the sintered ferrite contains at least Fe, Ni, Zn, and Cu as the main constituents.
The Fe content of the sintered ferrite on an Fe2O3 basis may preferably be about 40.0 mol % to about 49.5 mol %, more preferably about 45.0 mol % to about 49.5 mol % (based on the total amount of the main constituents; the same applies hereinafter).
The Zn content of the sintered ferrite on a ZnO basis may preferably be about 5.0 mol % to about 35.0 mol %, more preferably about 10.0 mol % to about 30.0 mol % (based on the total amount of the main constituents; the same applies hereinafter).
The Cu content of the sintered ferrite on a CuO basis is preferably about 4.0 mol % to about 12.0 mol %, more preferably about 7.0 mol % to about 10.0 mol % (based on the total amount of the main constituents; the same applies hereinafter).
The Ni content of the sintered ferrite is not particularly limited and may be the balance excluding the other main constituents described above, namely, Fe, Zn, and Cu.
In one embodiment, the sintered ferrite contains Fe in an amount, on an Fe2O3 basis, of about 40.0 mol % to about 49.5 mol %, Zn in an amount, on a ZnO basis, of about 5.0 mol % to about 35.0 mol %, and Cu in an amount, on a CuO basis, of about 4.0 mol % to about 12.0 mol %, the balance being NiO.
In the present embodiment, the sintered ferrite may further contain additive constituents. Examples of additive constituents for the sintered ferrite include, but not limited to, Mn, Co, Sn, Bi, and Si. The Mn, Co, Sn, Bi, and Si contents (amounts added) on Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2 bases are each preferably about 0.1 parts by weight to about 1 part by weight based on a total of 100 parts by weight of the main constituents (i.e., Fe (on an Fe2O3 basis), Zn (on a ZnO basis), Cu (on a CuO basis), and Ni (on a NiO basis)). The sintered ferrite may further contain incidental impurities introduced during manufacture.
As described above, the coil 7 is composed of the coil conductor layers 15 electrically connected to each other in a coil pattern. The coil conductor layers 15 adjacent to each other in the stacking direction are connected together via the connection conductors 16 extending through the insulator portion 6 (specifically, the first insulator layers 11). In the present embodiment, the coil conductor layers 15 are referred to as, in order from the lower side, “coil conductor layers 15a to 15f”.
As illustrated in
The area S of the exposed portions of the extended portions exposed from the insulator portion may be about 0.018 mm2 or more, preferably about 0.020 mm2 or more, more preferably about 0.022 mm2 or more, particularly preferably about 0.028 mm2 or more. If the area S of the exposed portions is about 0.018 mm2 or more, the current density at the connections between the extended portions and the outer electrodes can be reduced to a relatively low level. This inhibits diffusion of a constituent present in the outer electrodes, particularly Ni, into solder when a high current flows therethrough, thus improving the joint reliability of the multilayer coil component. On the other hand, the area S of the exposed portions of the extended portions exposed from the insulator portion may preferably be about 0.032 mm2 or less, more preferably about 0.030 mm2 or less, particularly preferably about 0.028 mm2 or less. If the area S of the exposed portions is about 0.032 mm2 or less, cracking can be inhibited.
The area S of the exposed portions can be measured as follows. A sample is covered with a resin such that its WT surface is exposed. The multilayer coil component is polished with a polisher in the L direction until the outer electrode disappears, for example, by a length of about 20 to 50 μm. After polishing, ion milling treatment is performed. The exposed extended portion is observed under a digital microscope, and the area of the exposed portion is determined.
In a preferred embodiment, the angle between the main surfaces of the extended portions 18 and the end surfaces of the body 2 may be about 45° or more, preferably about 60° or more, more preferably about 75° or more, even more preferably about 85° or more, particularly preferably about 90°. For example, if the angle is 90°, the extended portions are positioned perpendicular to the end surfaces of the body, and the area S is equal to the cross-sectional area of the extended portions. Here, “the angle between the main surfaces of the extended portions and the end surfaces of the body” refers to an angle of 90° or less between both surfaces.
Examples of materials that form the coil conductor layers 15 include, but not limited to, Au, Ag, Cu, Pd, and Ni. The material that forms the coil conductor layers 15 is preferably Ag or Cu, more preferably Ag. Conductive materials may be used alone or in combination.
The thickness of the winding portions of the coil conductor layers 15 (i.e., the thickness of the portions other than the extended portions) may preferably be about 15 μm to about 70 μm, more preferably about 20 μm to about 60 μm, even more preferably about 25 μm to about 50 μm. As the thickness of the coil conductor layers becomes larger, the resistance of the multilayer coil component becomes lower. Here, the thickness of the coil conductor layers refers to the thickness of the coil conductor layers in the stacking direction.
The extended portions of the coil conductor layers 15 may include a region with a larger thickness (hereinafter referred to as “thicker portion”) and a region with a smaller thickness (hereinafter referred to as “thinner portion”). The thicker region is located closer to the outer electrode to which the extended portion is connected. Specifically, the extended portion 18a of the coil conductor layer 15a includes a thinner portion 18a1 and a thicker portion 18a2. The thicker portion 18a2 is located closer to the outer electrode 4 than is the thinner portion 18a1. The extended portion 18f of the coil conductor layer 15f includes a thinner portion 18f1 and a thicker portion 18f2. The thicker portion 18f2 is located closer to the outer electrode 5 than is the thinner portion 18f1. This configuration improves the sealability at the connections between the outer electrodes and the extended portions.
The thickness of the thinner portion may preferably be about 15 μm to about 70 μm, more preferably about 20 μm to about 60 μm, even more preferably about 25 μm to about 50 μm. As the thickness of the thinner portion becomes larger, the resistance of the coil becomes lower.
The ratio of the thickness of the thicker portion to the thickness of the thinner portion (thickness of thicker portion/thickness of thinner portion) is preferably about 1.05 to about 2.00, more preferably about 1.10 to about 1.80, even more preferably about 1.20 to about 1.70, further preferably about 1.25 to about 1.65. If the ratio of the thickness of the thicker portion to the thickness of the thinner portion falls within the above range, a gap is unlikely to form between the coil conductors of the extended portions and the insulator portion, and the adhesion between the coil conductors of the extended portions and the insulator portion is improved.
In one embodiment, the thickness of the extended portions is larger than the thickness of the winding portions. If the thickness of the extended portions is larger than the thickness of the winding portions, diffusion of a constituent present in the outer electrodes, particularly Ni, into solder can be inhibited when a current corresponding to the rated current of the multilayer coil component flows therethrough, thus further improving the joint reliability. Here, if the extended portions include the thicker portion and the thinner portion, the thickness of the extended portions refers to the thickness of the thicker portion.
In a preferred embodiment, the ratio of the thickness of the extended portions to the thickness of the winding portions is preferably about 1.05 to about 2.00, more preferably about 1.10 to about 1.80, even more preferably about 1.20 to about 1.70, further preferably about 1.25 to about 1.65. If the ratio of the thickness of the extended portions to the thickness of the winding portions is 2.0 or less, cracking due to the difference in thickness can be inhibited.
The thickness of the coil conductor layers can be measured as follows. A chip is polished, with its LT surface facing polishing paper. Polishing is stopped at the central position along the width of the coil conductor layers. Thereafter, observation is performed under a microscope. The thickness at the central position along the length of the coil conductor layers is measured by a measuring function accompanying the microscope.
The connection conductors 16 are disposed so as to extend through the first insulator layers 11. The material that forms the connection conductors 16 may be any of the materials as mentioned for the coil conductor layers 15. The material that forms the connection conductors 16 may be the same as or different from the material that forms the coil conductor layers 15. In a preferred embodiment, the material that forms the connection conductors 16 is the same as the material that forms the coil conductor layers 15. In a preferred embodiment, the material that forms the connection conductors 16 is Ag.
The voids 21 function as so-called stress relaxation spaces.
The thickness of the voids 21 is preferably about 1 μm to about 30 μm, more preferably about 5 μm to about 15 μm. If the thickness of the voids 21 falls within the above range, the internal stress can be further relieved, and cracking can thus be further inhibited.
The thickness of the voids can be measured as follows. A chip is polished, with its LT surface facing polishing paper. Polishing is stopped at the central position along the width of the coil conductor layers. Thereafter, observation is performed under a microscope. The thickness of the voids at the central position along the length of the coil conductor layers is measured by a measuring function accompanying the microscope.
In one embodiment, the voids 21 have a larger width than the coil conductor layers 15 in a cross-section perpendicular to the winding direction of the coil. That is, the voids 21 are provided so as to extend beyond both edges of the coil conductor layers 15 in directions away from the coil conductor layers 15.
In one embodiment, the voids 21 at the winding portions 17 have one main surface thereof in contact with the insulator portion and the other portion thereof in contact with any of the coil conductor layers 15. The voids 21 have one main surface thereof in contact with any of the first insulator layers 11 and the other surface thereof in contact with any of the coil conductor layers 15. In other words, the voids 21 over the first insulator layers 11 are covered by the coil conductor layers 15.
In a preferred embodiment, as illustrated in
The outer electrodes 4 and 5 are disposed so as to cover both end surfaces of the body 2. The outer electrodes are formed of a conductive material, preferably one or more metal materials selected from Au, Ag, Pd, Ni, Sn, and Cu.
The outer electrodes may be composed of a single layer or a plurality of layers. In one embodiment, the outer electrodes may be composed of a plurality of layers, preferably two to four layers, for example, three layers.
In one embodiment, the outer electrodes may be composed of a plurality of layers including a layer containing Ag or Pd, a layer containing Ni, or a layer containing Sn. In a preferred embodiment, the outer electrodes are composed of a layer containing Ag or Pd, a layer containing Ni, and a layer containing Sn. Preferably, the outer electrodes are composed of, in sequence from the coil conductor layer side, a layer containing Ag or Pd, preferably Ag, a layer containing Ni, and a layer containing Sn. Preferably, the layer containing Ag or Pd is a layer formed by baking a Ag paste or a Pd paste, and the layer containing Ni and the layer containing Sn may be plating layers.
The ratio (I/S) of the rated current I (A) of the multilayer coil component according to the present embodiment to the area S (mm2) of the exposed portions may preferably be about 210 A/mm2 or less, more preferably about 200 A/mm2 or less, even more preferably about 190 A/mm2 or less, particularly preferably about 180 A/mm2 or less. If the US ratio is about 210 A/mm2 or less, diffusion of a constituent present in the outer electrodes, typically Ni, can be inhibited, thus alleviating a decrease in joint reliability.
The multilayer coil component according to the present embodiment preferably has a length of about 0.4 mm to about 3.2 mm, a width of about 0.2 mm to about 2.5 mm, and a height of about 0.2 mm to about 2.0 mm, more preferably a length of about 0.6 mm to about 2.0 mm, a width of about 0.3 mm to about 1.3 mm, and a height of about 0.3 mm to about 1.0 mm.
A method for manufacturing the above multilayer coil component 1 according to the present embodiment will hereinafter be described. The embodiment described herein is an embodiment in which the insulator portion 6 is formed from a ferrite material.
(1) Preparation of Ferrite Paste
A ferrite material is first prepared. The ferrite material contains Fe, Zn, and Ni as the main constituents and further contains Cu as desired. Typically, the main constituents of the ferrite material are substantially composed of Fe, Zn, Ni, and Cu oxides (ideally, Fe2O3, ZnO, NiO, and CuO).
As the ferrite material, Fe2O3, ZnO, CuO, NiO, and optionally additive constituents are weighed so as to give a predetermined composition and are mixed and pulverized. The pulverized ferrite material is dried and calcined to obtain a calcined powder. Predetermined amounts of a solvent (e.g., a ketone-based solvent), a resin (e.g., polyvinyl acetal), and a plasticizer (e.g., an alkyd-based plasticizer) are added to the calcined powder, and they are mixed in a machine such as a planetary mixer and are further dispersed in a machine such as a three-roll mill. Thus, a ferrite paste can be prepared.
The Fe content of the ferrite material on an Fe2O3 basis may preferably be about 40.0 mol % to about 49.5 mol %, more preferably about 45.0 mol % to about 49.5 mol % (based on the total amount of the main constituents; the same applies hereinafter). The Zn content of the ferrite material on a ZnO basis may preferably be about 5.0 mol % to about 35.0 mol %, more preferably about 10.0 mol % to about 30.0 mol % (based on the total amount of the main constituents; the same applies hereinafter).
The Cu content of the ferrite material on a CuO basis is preferably about 4.0 mol % to about 12.0 mol %, more preferably about 7.0 mol % to about 10.0 mol % (based on the total amount of the main constituents; the same applies hereinafter).
The Ni content of the ferrite material is not particularly limited and may be the balance excluding the other main constituents described above, namely, Fe, Zn, and Cu.
In one embodiment, the ferrite material contains Fe in an amount, on an Fe2O3 basis, of about 40.0 mol % to about 49.5 mol %, Zn in an amount, on a ZnO basis, of about 5.0 mol % to about 35.0 mol %, and Cu in an amount, on a CuO basis, of about 4.0 mol % to about 12.0 mol %, the balance being NiO.
In the present embodiment, the ferrite material may further contain additive constituents. Examples of additive constituents for the ferrite material include, but not limited to, Mn, Co, Sn, Bi, and Si. The Mn, Co, Sn, Bi, and Si contents (amounts added) on Mn3O4, Co3O4, SnO2, Bi2O3, and SiO2 bases are each preferably about 0.1 parts by weight to about 1 part by weight based on a total of 100 parts by weight of the main constituents (i.e., Fe (on an Fe2O3 basis), Zn (on a ZnO basis), Cu (on a CuO basis), and Ni (on a NiO basis)). The ferrite material may further contain incidental impurities introduced during manufacture.
The Fe content (on an Fe2O3 basis), Mn content (on a Mn2O3 basis), Cu content (on a CuO basis), Zn content (on a ZnO basis), and Ni content (on a NiO basis) of the sintered ferrite may be assumed to be substantially equal to the Fe content (on an Fe2O3 basis), Mn content (on a Mn2O3 basis), Cu content (on a CuO basis), Zn content (on a ZnO basis), and Ni content (on a NiO basis) of the ferrite material before firing.
(2) Preparation of Conductive Paste for Coil Conductors
A conductive material is first prepared. The conductive material may be, for example, Au, Ag, Cu, Pd, or Ni, preferably Ag or Cu, more preferably Ag. A predetermined amount of a powder of the conductive material is weighed and mixed with predetermined amounts of a solvent (e.g., eugenol), a resin (e.g., ethylcellulose), and a dispersant in a machine such as a planetary mixer and is then dispersed in a machine such as a three-roll mill. Thus, a conductive paste for coil conductors can be prepared.
(3) Preparation of Resin Paste
A resin paste for formation of voids in the multilayer coil component 1 is prepared. The resin paste can be prepared by adding a resin (e.g., an acrylic resin) that disappears during firing to a solvent (e.g., isophorone).
(4) Fabrication of Multilayer Coil Component
(4-1) Fabrication of Body
A thermal release sheet and a polyethylene terephthalate (PET) film are first stacked on a metal plate (not illustrated). The ferrite paste is applied by printing a predetermined number of times to form a first ferrite paste layer 31 that forms an outer layer (
The resin paste is then applied by printing to the area where the void 21a is to be formed to form a resin paste layer 32 (
The conductive paste is then applied by printing to the area where the extended portion 18 is to be formed between the resin paste layer 32 and the end surface to form an extended conductor additional layer 37 (
The conductive paste is then applied by printing to the entire area where the coil conductor layer 15a is to be formed to form a conductive paste layer 33 (
The ferrite paste is then applied by printing to the region where the conductive paste layer 33 is not formed to form a second ferrite paste layer 34 (
The ferrite paste is then applied by printing to the region other than the area where a connection conductor for connecting coil conductor layers adjacent to each other in the stacking direction is to be formed to form a first ferrite paste layer 41 (
The conductive paste is then applied by printing to the hole 42 to form a connection conductor paste layer 43 (
Steps similar to those in
The layers are then bonded together on the metal plate by pressure, followed by cooling and removal of the metal plate and then the PET film to obtain an element assembly (unfired multilayer block)). This unfired multilayer block is cut into individual bodies with a tool such as a dicer.
The resulting unfired bodies are subjected to barrel finishing to round the corners of the bodies. Barrel finishing may be performed either on the unfired multilayer bodies or on fired multilayer bodies. Barrel finishing may be performed either by a dry process or by a wet process. Barrel finishing may be performed by polishing the elements either with each other or with media.
After barrel finishing, the unfired bodies are fired at a temperature of, for example, about 910° C. to about 935° C. to obtain bodies 2 for multilayer coil components 1. After firing, the resin paste layers disappear, thus forming the voids 21.
(4-2) Formation of Outer Electrodes
A Ag paste containing Ag and glass for formation of outer electrodes is then applied to the end surfaces of the bodies 2 and is baked to form underlying electrodes. A Ni coating and a Sn coating are then formed in sequence over the underlying electrodes by electrolytic plating to form outer electrodes. Thus, multilayer coil components 1 as illustrated in
Although one embodiment of the present disclosure has been described above, various modifications can be made to the present embodiment.
For example, in the above embodiment, elements may be obtained by preparing ferrite sheets corresponding to the individual insulating layers, forming coil patterns on the sheets by printing, and bonding the sheets together by pressure.
The multilayer coil components manufactured by the above method according to the present embodiment allow a high current to flow therethrough and also have high joint reliability.
The present embodiment provides a method for designing a multilayer coil component that allows a high current to flow therethrough and that has high joint reliability. Specifically, the present embodiment provides a method for designing a multilayer coil component including an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. At least one of the coil conductor layers includes an extended portion and a winding portion and is connected to the outer electrode via the extended portion. The method includes determining the rated current (I) of the multilayer coil component and determining the area (S) of an exposed portion of the extended portion exposed from the insulator portion such that the ratio (US) of the rated current (I) to the area (S) is about 210 A/mm2 or less. The design method according to the present embodiment facilitates design of a multilayer coil component that allows a high current to flow therethrough and that has high joint reliability.
In other words, the ratio (US) of the rated current (I) to the area (S) of the exposed portion of the extended portion exposed from the insulator portion is the current (A) through the exposed portion of the extended portion per unit area (mm2). The US ratio may preferably be about 200 A/mm2 or less, more preferably about 190 A/mm2 or less, even more preferably about 180 A/mm2 or less. If the US ratio is about 210 A/mm2 or less, diffusion of a constituent present in the outer electrodes, typically Ni, can be inhibited when a high current, for example, a current equal to the rated current, flows through the multilayer coil component, thus alleviating a decrease in joint reliability.
The present disclosure will now be described with reference to the following examples, although the present disclosure is not limited to these examples.
Preparation of Ferrite Paste
Powders of Fe2O3, ZnO, CuO, and NiO were weighed such that the amounts thereof were 49.0 mol %, 25.0 mol %, 8.0 mol %, and the balance, respectively, based on the total amount of the powders. These powders were mixed and pulverized, were dried, and were calcined at 700° C. to obtain a calcined powder. Predetermined amounts of a ketone-based solvent, polyvinyl acetal, and an alkyd-based plasticizer were added to the calcined powder, and they were mixed in a planetary mixer and were further dispersed in a three-roll mill. Thus, a ferrite paste was prepared.
Preparation of Conductive Paste for Coil Conductors
A predetermined amount of silver powder was prepared as a conductive material. The silver powder was mixed with eugenol, ethylcellulose, and a dispersant in a planetary mixer and was then dispersed in a three-roll mill. Thus, a conductive paste for coil conductors was prepared.
Preparation of Resin Paste
A resin paste was prepared by mixing isophorone with an acrylic resin.
Fabrication of Multilayer Coil Component
Unfired multilayer blocks were fabricated by the procedure illustrated in
The multilayer blocks were then cut into individual elements with a dicer. The resulting elements were subjected to barrel finishing to round the corners of the elements. After barrel finishing, the elements were fired at a temperature of 920° C. to obtain bodies.
A Ag paste containing Ag and glass for formation of outer electrodes was then applied to the end surfaces of the bodies and was baked to form underlying electrodes. A Ni coating and a Sn coating were then formed in sequence over the underlying electrodes by electrolytic plating to form outer electrodes. Thus, multilayer coil components were obtained.
The multilayer coil components obtained as described above each had a length (L) of 1.6 mm, a width (W) of 0.8 mm, and a height (T) of 0.8 mm.
Evaluation: Moisture Resistance Load Life Test
Each sample (multilayer coil component) fabricated as described above was mounted on a substrate (epoxy substrate) with solder and was supplied with a current of 3.7 A, 4.0 A, or 4.5 A at 85° C. and 85% RH. After the current was supplied for 3,000 hours, the sample was removed in the soldered state. The sample after testing was covered with a resin such that its LT surface was exposed. The sample was polished with a polisher in the W direction until substantially the central portion in the W direction was exposed. After polishing, ion milling treatment was performed. The polished cross-section of the outer electrodes was subjected to mapping analysis for Ni by wavelength-dispersive X-ray spectroscopy (instrument: JEOL JXA-8530F). One multilayer coil component was analyzed for each type of sample. Samples having no area where the Ni coating of the outer electrodes diffused and disappeared were determined as good, whereas samples having an area where the Ni coating of the outer electrodes diffused and disappeared were determined as poor. The results are summarized in Table 1 below.
The results demonstrated that diffusion of Ni is inhibited if the area S is 0.018 mm2 or more. The results also demonstrated that diffusion of Ni is inhibited when a higher current flows if the area S is 0.020 mm2 or more, particularly 0.022 mm2 or more.
Multilayer coil components according to embodiments of the present disclosure can be used in a wide variety of applications including inductors.
While preferred embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-238909 | Dec 2019 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 20100253464 | Miyoshi | Oct 2010 | A1 |
| 20150014042 | Noguchi | Jan 2015 | A1 |
| 20160172103 | Jeong | Jun 2016 | A1 |
| 20170018351 | Yatabe | Jan 2017 | A1 |
| 20180308617 | Ha | Oct 2018 | A1 |
| 20180315541 | Okura | Nov 2018 | A1 |
| 20190074131 | Yamanaka | Mar 2019 | A1 |
| Number | Date | Country |
|---|---|---|
| H07-99116 | Apr 1995 | JP |
| H08-55727 | Feb 1996 | JP |
| H0855727 | Feb 1996 | JP |
| H08-130115 | May 1996 | JP |
| 2000-209057 | Jul 2000 | JP |
| 2017-022304 | Jan 2017 | JP |
| 2019047015 | Mar 2019 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20210202161 A1 | Jul 2021 | US |
