This application claims benefit of priority to Japanese Patent Application No. 2019-097642, filed May 24, 2019, the entire content of which is incorporated herein by reference.
The present disclosure relates to a multilayer coil component.
As an example of a coil component, Japanese Unexamined Patent Application Publication No. 2017-212372 discloses a coil component in which the stacking direction and the coil axis are both parallel to the mounting surface of the coil component.
In the coil component disclosed in Japanese Unexamined Patent Application Publication No. 2017-212372, an element body that includes a coil-shaped conductor part includes a first part, a second part, and a third part that are sequentially arranged in a direction parallel to a center axis of the coil. The glass content of the second part is higher than that of the first part and the third part, and the coil component has good characteristics in a high-frequency band located at around 10 GHz. However, in response to the increasing communication speed and miniaturization of electronic devices in recent years, it is demanded that multilayer inductors have satisfactory radio-frequency characteristics in higher frequency bands (for example, a GHz band located at frequencies greater than or equal to 60 GHz). There is a problem with the coil component disclosed in Japanese Unexamined Patent Application Publication No. 2017-212372 in that the radio-frequency characteristics of the coil component are not satisfactory in a band located at frequencies greater than or equal to 60 GHz.
Accordingly, the present disclosure provides a multilayer coil component that has excellent radio-frequency characteristics.
A multilayer coil component according to a preferred embodiment of the present disclosure includes a multilayer body that is formed by stacking a plurality of insulating layers on top of one another in a length direction and that has a coil built into the inside thereof; and a first outer electrode and a second outer electrode that are electrically connected to the coil. The coil is formed by a plurality of coil conductors stacked in the length direction together with the insulating layers being electrically connected to each other. The multilayer body has a first end surface and a second end surface, which face each other in the length direction, a first main surface and a second main surface, which face each other in a height direction perpendicular to the length direction, and a first side surface and a second side surface, which face each other in a width direction perpendicular to the length direction and the height direction. The first outer electrode extends along and covers part of the first end surface and part of the first main surface. The second outer electrode extends along and covers part of the second end surface and part of the first main surface. The first main surface is a mounting surface. A stacking direction of the multilayer body and a coil axis direction of the coil are parallel to the first main surface. A length of a region in which the coil conductors are arranged in the stacking direction lies in a range from 85% to 95% of a length of the multilayer body. A sum of the number of stacked coil conductors that face a part of the first outer electrode that extends along the first main surface and the number of stacked coil conductors that face a part of the second outer electrode that extends along the first main surface is less than or equal to twelve.
According to the preferred embodiment of the present disclosure, a multilayer coil component that has excellent radio-frequency characteristics can be provided.
Other features, elements, characteristics and advantages of the present disclosure will become more apparent from the following detailed description of preferred embodiments of the present disclosure with reference to the attached drawings.
Hereafter, a multilayer coil component according to an embodiment of the present disclosure will be described. However, the present disclosure is not limited to the following embodiment and the present disclosure can be applied with appropriate modifications within a range that does not alter the gist of the present disclosure. Combinations consisting of two or more desired configurations among the configurations described below are also included in the scope of the present disclosure.
A multilayer coil component 1 illustrated in
In the multilayer coil component 1 and the multilayer body 10 of the embodiment of the present disclosure, a length direction, a height direction, and a width direction are respectively an x direction, a y direction, and a z direction in
As illustrated in
Although not illustrated in
The first outer electrode 21 is arranged so as to cover part of the first end surface 11 of the multilayer body 10 as illustrated in
In
As illustrated in
The second outer electrode 22 is arranged so as to cover part of the second end surface 12 of the multilayer body 10 and so as to extend from the second end surface 12 and cover part of the first main surface 13 of the multilayer body 10. Similarly to the first outer electrode 21, the second outer electrode 22 covers a region of the second end surface 12 that includes the edge portion that intersects the first main surface 13. In addition, similarly to the first outer electrode 21, the second outer electrode 22 may extend from the second end surface 12 and cover part of the second main surface 14, part of the first side surface 15, and part of the second side surface 16.
Similarly to the first outer electrode 21, the shape of the second outer electrode 22 is not particularly limited so long as the second outer electrode 22 covers part of the second end surface 12 of the multilayer body 10. For example, the second outer electrode 22 may have an arch-like shape that increases in height from the ends thereof toward the center thereof on the second end surface 12 of the multilayer body 10. Furthermore, the shape of the second outer electrode 22 is not particularly limited so long as the second outer electrode 22 covers part of the first main surface 13 of the multilayer body 10. For example, the second outer electrode 22 may have an arch-like shape that increases in length from the ends thereof toward the center thereof on the first main surface 13 of the multilayer body 10.
Similarly to the first outer electrode 21, the second outer electrode 22 may be additionally arranged so as to extend from the second end surface 12 and the first main surface 13 and cover part of the second main surface 14, part of the first side surface 15, and part of the second side surface 16. In this case, the parts of the second outer electrode 22 covering the first side surface 15 and the second side surface 16 are preferably formed in a diagonal shape relative to both the edge portion that intersects the second end surface 12 and the edge portion that intersects the first main surface 13. However, the second outer electrode 22 does not have to be arranged so as to cover part of the second main surface 14, part of the first side surface 15, and part of the second side surface 16.
The first outer electrode 21 and the second outer electrode 22 are arranged in the manner described above, and therefore the first main surface 13 of the multilayer body 10 serves as a mounting surface when the multilayer coil component 1 is mounted on a substrate.
Although the size of the multilayer coil component 1 according to the embodiment of the present disclosure is not particularly limited, the multilayer coil component 1 is preferably the 0603 size, the 0402 size, or the 1005 size.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0603 size, the length of the multilayer body 10 (length indicated by double-headed arrow L1 in
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0603 size, the length of the multilayer coil component 1 (length indicated by double arrow L2 in
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0603 size, the length of the part of the first outer electrode 21 that covers the first main surface 13 of the multilayer body 10 (length indicated by double-headed arrow E1 in
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0603 size, the height of the part of the first outer electrode 21 that covers the first end surface 11 of the multilayer body 10 (length indicated by double-headed arrow E2 in
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the length of the multilayer body 10 preferably lies in a range from 0.38 mm to 0.42 mm and the width of the multilayer body 10 preferably lies in a range from 0.18 mm to 0.22 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the height of the multilayer body 10 preferably lies in a range from 0.18 mm to 0.22 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the length of the multilayer coil component 1 preferably lies in a range from 0.38 mm to 0.42 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the width of the multilayer coil component 1 preferably lies in a range from 0.18 mm to 0.22 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the height of the multilayer coil component 1 preferably lies in a range from 0.18 mm to 0.22 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the length of the part of the first outer electrode 21 that covers the first main surface 13 of the multilayer body 10 preferably lies in a range from 0.08 mm to 0.15 mm. Similarly, the length of the part of the second outer electrode 22 that covers the first main surface 13 of the multilayer body 10 preferably lies in a range from 0.08 mm to 0.15 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 0402 size, the height of the part of the first outer electrode 21 that covers the first end surface 11 of the multilayer body 10 preferably lies in a range from 0.06 mm to 0.13 mm. Similarly, the height of the part of the second outer electrode 22 that covers the second end surface 12 of the multilayer body 10 preferably lies in a range from 0.06 min to 0.13 mm. In this case, stray capacitances arising from the outer electrodes 21 and 22 can be reduced.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the length of the multilayer body 10 preferably lies in a range from 0.95 mm to 1.05 mm and the width of the multilayer body 10 preferably lies in a range from 0.45 mm to 0.55 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the height of the multilayer body 10 preferably lies in a range from 0.45 mm to 0.55 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the length of the multilayer coil component 1 preferably lies in a range from 0.95 mm to 1.05 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the width of the multilayer coil component 1 preferably lies in a range from 0.45 mm to 0.55 mm. In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the height of the multilayer coil component 1 preferably lies in a range from 0.45 mm to 0.55 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the length of the part of the first outer electrode 21 that covers the first main surface 13 of the multilayer body 10 preferably lies in a range from 0.20 mm to 0.38 mm. Similarly, the length of the part of the second outer electrode 22 that covers the first main surface 13 of the multilayer body 10 preferably lies in a range from 0.20 mm to 0.38 mm.
In the case where the multilayer coil component 1 according to the embodiment of the present disclosure is the 1005 size, the height of the part of the first outer electrode 21 that covers the first end surface 11 of the multilayer body 10 preferably lies in a range from 0.15 mm to 0.33 mm. Similarly, the height of the part of the second outer electrode 22 that covers the second end surface 12 of the multilayer body 10 preferably lies in a range from 0.15 mm to 0.33 mm. In this case, stray capacitances arising from the outer electrodes 21 and 22 can be reduced.
The coil that is built into the multilayer body 10 of the multilayer coil component 1 according to the embodiment of the present disclosure will be described next. The coil is formed by electrically connecting a plurality of coil conductors, which are stacked together with insulating layers in the length direction, to one another.
Coil conductors 32b (32b1 and 32b2) and 32c (32c1 and 32c2) and via conductors 33b (33b1 and 33b2) and 33c (33c1 and 33c2) are respectively provided on and in the insulating layers 31b (31b1 and 31b2) and 31c (31c1 and 31c2). The coil conductors 32b (32b1 and 32b2) and 32c (32c1 and 32c2) each include a line portion and land portions disposed at the ends of the line portion. As illustrated in
The coil conductors 32b (32b1 and 32b2) and 32c (32c1 and 32c2) are respectively provided on main surfaces of the insulating layers 31b (31b1 and 31b2) and 31c (31c1 and 31c2) and are stacked together with the insulating layers 31a, 31b (31b1 and 31b2), and 31c (31c1 and 31c2). Therefore, in
The via conductors 33a, 33b (33b1 and 33b2), and 33c (33c1 and 33c2) are provided so as to respectively penetrate through the insulating layers 31a, 31b (31b1 and 31b2), and 31c (31c1 and 31c2) in the stacking direction (x direction in
Therefore, a solenoid coil having a coil axis A that extends in the x direction is formed inside the multilayer body 10 by stacking the insulating layers 31a, 31b (31b1 to 31bn), and 31c (31c1 to 31cn) on top of one another in the x direction as illustrated in
In addition, as illustrated in
As illustrated in
On the other hand, the via conductors 33a formed in the insulating layers 31a form a first connection conductor 41 and a second connection conductor 42 inside the multilayer body 10 and are exposed at the first end surface 11 and the second end surface 12. One connection conductor is connected in a straight line between the first outer electrode 21 and the coil conductor 32b that faces the first outer electrode 21 and the other connection conductor is connected in a straight line between the second outer electrode 22 and the coil conductor 32b that faces the second outer electrode 22 inside the multilayer body 10.
It is acceptable for the sum of the number of stacked coil conductors 32 that face the part of the first outer electrode 21 that extends along the first main surface 13 and the number of stacked coil conductors 32 that face the part of the second outer electrode 22 that extends along the first main surface 13 to be less than or equal to twelve, but it is preferable for the sum of these stacked coil conductors 32 to be at least two from the viewpoint of ensuring mountability of the multilayer coil component 1.
As illustrated in
When the length L3 of the region in which the coil conductors 32 are arranged in the stacking direction lies in a range from 85% to 95% of the length L1 of the multilayer body 10 and the sum of the number of stacked coil conductors 32 that face the part of the first outer electrode 21 that extends along the first main surface 13 and the number of stacked coil conductors 32 that face the part of the second outer electrode 22 that extends along the first main surface 13 is less than or equal to twelve, the transmission coefficient S21 of the multilayer coil component 1 at 60 GHz can be made to be greater than or equal to −3 dB. When the transmission coefficient S21 of the multilayer coil component 1 at 60 GHz is greater than or equal to −3 dB, the multilayer coil component 1 can be suitably used in a bias-tee circuit inside an optical communication circuit, for example. The transmission coefficient S21 is obtained from the ratio of the power of a transmitted signal to the power of an input signal. The transmission coefficient S21 at each frequency can be obtained using a network analyzer, for example. The transmission coefficient S21 is basically a dimensionless quantity, but is usually expressed in dB using the common logarithm.
The coil conductors forming the coil preferably overlap in a plan view from the stacking direction. In addition, the coil preferably has a substantially circular shape in a plan view from the stacking direction. In the case where the coil includes land portions, the shape of the coil is taken to be the shape obtained by removing the land portions (i.e., the shape of the line portions). In addition, in the case where land portions are connected to the via conductors forming the connection conductors, the shape of the connection conductors is the shape obtained by removing the land portions (i.e., the shape of the via conductors).
The phrase “the first connection conductor 41 is connected in a straight line between the first outer electrode 21 and the coil” means that the via conductors 33a forming the first connection conductor 41 overlap one another in a plan view from the stacking direction and it is not necessary for the via conductors 33a to be perfectly arranged in a straight line. In addition, the phrase “the second connection conductor 42 is connected in a straight line between the second outer electrode 22 and the coil” means that the via conductors 33a forming the second connection conductor 42 overlap one another in a plan view from the stacking direction and it is not necessary for the via conductors 33a to be perfectly arranged in a straight line. In the case where land portions are connected to the via conductors forming the connection conductors, the shape of the connection conductors is the shape obtained by removing the land portions (i.e., the shape of the via conductors).
The coil conductors illustrated in
In
In a plan view from the stacking direction, the line width of the line portions of the coil conductors preferably lies in a range from 30 μm to 80 μm and more preferably lies in the range from 30 μm to 60 μm. In the case where the line width of the line portions is smaller than 30 μm, the direct-current resistance of the coil may be large. In the case where the line width of the line portions is larger than 80 μm, the electrostatic capacitance of the coil may be large, and therefore the radio-frequency characteristics of the multilayer coil component 1 may be degraded.
The multilayer coil component 1 of the embodiment of the present disclosure is preferably configured so that the land portions are not positioned inside the inner periphery of the line portions and partially overlap the line portions in a plan view from the stacking direction. If the land portions are positioned inside the inner periphery of the line portions, the impedance may undesirably decrease. In addition, the diameter of the land portions is preferably 1.05 to 1.3 times the line width of the line portions in a plan view from the stacking direction. If the diameter of the land portions is less than 1.05 times the line width of the line portions, the connections between the land portions and the via conductors may be unsatisfactory. On the other hand, if the diameter of the land portions is greater than 1.3 times the line width of the line portions, the radio-frequency characteristics may be degraded due to the stray capacitances arising from the land portions becoming larger.
The shape of the land portions in a plan view from the stacking direction may be a substantially circular shape or may be a substantially polygonal shape. In the case where the shape of the land portions is a substantially polygonal shape, the diameter of the land portions is taken to be the diameter of an area-equivalent circle of the polygonal shape.
Coil conductors 52a, 52b (52b1 to 52bn), 52c (52c1 to 52cn), and 52d and via conductors 53a, 53b (53b1 to 53bn), 53c (53c1 to 53cn), and 53d are respectively provided on and in the insulating layers 51a, 51b (51b1 to 51bn), 51c (51c1 to 510, and 51d.
The coil conductors 52a, 52b (52b1 to 52bn), 52c (52c1 to 52cn), and 52d are respectively provided on the main surfaces of the insulating layers 51a, 51b (51b1 to 51bn), 51c (51c1 to 51cn), and 51d. In
In the multilayer body obtained by stacking the insulating layers 51a, 51b (51b1 to 51bn), 51c (51c1 to 51cn), and 51d illustrated in
The thickness of the coil conductors is not particularly limited, but preferably lies in a range from 3 μm to 6 μm. If the thickness of the coil conductors is less than 3 μm, the direct-current resistance (Rdc) will become large and the amount of heat generated when power is supplied will become large. On the other hand, in the case where the thickness of the coil conductors is greater than 6 μm, stray capacitances may increase due to the distance between coil conductors that are adjacent to each other in the stacking direction becoming smaller and the radio-frequency characteristics may be degraded. When the thickness of the coil conductors lies in a range from 3 μm to 6 μm, the radio-frequency characteristics can be improved while realizing low resistance.
In the multilayer coil component 1 of the embodiment of the present disclosure, the number of stacked coil conductors forming the multilayer body 10 preferably lies in a range from 40 to 60. If the number of stacked coil conductors is less than 40, the stray capacitances will become larger and the transmission coefficient S21 will decrease. If the number of stacked coil conductors exceeds 60, the direct current resistance (Rdc) will become large. The transmission coefficient S21 at 60 GHz can be improved by making the number of stacked coil conductors lie in a range from 40 to 60.
The distance between coil conductors that are adjacent to each other in the stacking direction in the multilayer coil component 1 according to the embodiment of the present disclosure is not particularly limited but preferably lies in a range from 3 μm to 10 μm. When the distance between coil conductors that are adjacent to each other in the stacking direction is greater than 10 μm, it may be necessary to make the land portions larger in order to connect coil conductors to each other and stray capacitances may increase. On the other hand, when the distance between coil conductors that are adjacent to each other in the stacking direction is less than 3 μm, the stray capacitances generated between the coil conductors may increase and the transmission coefficient S21 may decrease.
In the present specification, the distance between coil conductors that are adjacent to each other in the stacking direction is the shortest distance in the stacking direction between the coil conductors that are connected to each other by via conductors. Therefore, the distance between coil conductors that are adjacent to each other in the stacking direction and the distance between coil conductors that cause stray capacitances to be generated are not necessarily the same.
The first main surface 13 of the multilayer coil component 1 according to the embodiment of the present disclosure serves as a mounting surface.
Specific examples of the preferred dimensions of the coil conductors and connection conductors will be described hereafter for cases where the size of the multilayer coil component 1 is the 0603 size, the 0402 size, and the 1005 size.
1. Multilayer coil component is 0603 size
2. Multilayer coil component 1 is 0402 size
3. Multilayer coil component 1 is 1005 size
Method of Manufacturing Multilayer Coil Component
Hereafter, an example of a method of manufacturing a multilayer coil component according to an embodiment of the present disclosure will be described.
First, ceramic green sheets, which will later form the insulating layers, are manufactured. For example, an organic binder such as a polyvinyl butyral resin, an organic solvent such as ethanol or toluene, and a dispersant are added to a ferrite material and the resulting mixture is kneaded to form a slurry. After that, ceramic green sheets having a thickness of around 12 μm are manufactured using a method such as a doctor blade technique.
The ferrite material may be manufactured using the following method, for example. First, iron, nickel, zinc, and copper oxide materials are mixed together and calcined at 800° C. for one hour. After that, manufacture of a Ni—Zn—Cu ferrite material (oxide mixed powder) having an average particle diameter of 2 μm is completed by pulverizing the obtained calcined material with a ball mill and then drying the material.
When manufacturing the ceramic green sheets using a ferrite material, it is preferable that the composition of the ferrite material consist of Fe2O3 in a range from 40 mol % to 49.5 mol %, ZnO in a range from 5 mol % to 35 mol %, CuO in range from 4 mol % to 12 mol %, and the remainder consisting of NiO and trace amounts of additives (including inevitable impurities) in order to realize a high inductance.
As a ceramic green sheet material, other than a magnetic material such as the ferrite material described above, for example, a non-magnetic material such as a glass ceramic material or a mixed material consisting of a magnetic material and a non-magnetic material may be used.
Next, conductor patterns that will later form the coil conductors and via conductors are formed on and in the ceramic green sheets. For example, first, via holes having a diameter of around 20 μm to 30 μm are formed by subjecting the ceramic green sheets to laser processing. Then, via-conductor conductor patterns are formed by filling the via holes with a conductive paste such as silver paste. In addition, coil-conductor conductor patterns having a thickness of around 11 μm are formed via printing using a method such as screen printing using a conductive paste such as silver paste on main surfaces of the ceramic green sheets. For example, conductor patterns and so on corresponding to the coil conductors illustrated in
Next, drying is performed, and as a result coil sheets having a configuration in which the coil-conductor conductor patterns and the via-conductor conductor patterns are formed on and in ceramic green sheets are obtained. The coil-conductor conductor patterns and the via-conductor conductor patterns are connected to each other in the coil sheets.
Furthermore, via sheets that have a configuration in which via-conductor conductor patterns are formed are manufactured separately from the coil sheets. The via-conductor conductor patterns of the via sheets are conductor patterns that will later form the via conductors constituting the connection conductors.
Next, the coil sheets are stacked in a prescribed order so that a coil having a coil axis that is parallel to the mounting surface will be formed inside the multilayer body after division into individual components and firing. In addition, via sheets are stacked above and below the multilayer body formed of the coil sheets.
The multilayer body consisting of the coil sheets and the via sheets is subjected to thermal pressure bonding in order to obtain a pressure-bonded body, and then the pressure-bonded body is cut into pieces of a predetermined chip size to obtain individual chips. The divided chips may be subjected to barrel polishing in order to round the corner portions and edge portions thereof.
Next, the divided chips are subjected to binder removal and firing at a prescribed temperature and for a prescribed period of time, and multilayer bodies (fired bodies) having a built-in coil are formed. At this time, the coil-conductor conductor patterns and the via-conductor conductor patterns become the coil conductors and the via conductors after firing. The coil is formed by the coil conductors being connected to one another by the via conductors. In addition, the stacking direction of the multilayer body and the coil axis direction of the coil are parallel to the mounting surface.
Next, a conductive paste such as silver paste is spread so as to form a layer of a predetermined thickness and then each multilayer body is dipped at an angle into this layer and baked to form a base electrode layer of an outer electrode on four surfaces (a main surface, an end surface, and both side surfaces) of the multilayer body. Using this method, the base electrode can be formed in one go in contrast to the case where the base electrode is formed separately on the main surface and the end surface of the multilayer body in two steps.
Next, a nickel film and a tin film having predetermined thicknesses are formed on the base electrode layers by performing plating. Thus, the outer electrodes are formed.
A multilayer coil component according to an embodiment of the present disclosure can be manufactured as described above.
Hereafter, examples that illustrate the multilayer coil component 1 according to the embodiment of the present disclosure in a more specific manner will be described. The present disclosure is not limited to just the following examples.
Manufacture of Test Pieces
1. A ferrite material (calcined powder) having a prescribed composition was prepared.
2. A magnetic slurry was manufactured by adding an organic binder (polyvinyl butyral resin) and organic solvents (ethanol and toluene) to the calcined powder and putting the mixture into a pot mill along with PSZ balls and then sufficiently mixing and pulverizing the mixture in a wet state.
3. The magnetic slurry was molded into a sheet shape using a doctor blade method and then punched into rectangular shapes, thereby producing a plurality of ceramic green sheets having a thickness of 15 μm.
4. An inner-conductor conductive paste containing Ag powder and an organic vehicle was prepared.
5. Via Sheet Manufacture
Via holes were formed by irradiating prescribed locations on the ceramic green sheets with a laser. Via conductors were formed by filling the via holes with a conductive paste and land portions were formed by performing screen printing with a conductive paste in circular shapes around the peripheries of the via conductors.
6. Coil Sheet Manufacture
The coil sheets were obtained by forming via conductors by forming via holes in prescribed locations on the ceramic green sheets and filling the via holes with a conductive paste, and then forming coil conductors including land portions and line portions by performing printing.
7. These sheets were stacked as illustrated in
8. (Fired) multilayer bodies were manufactured by placing the multilayer molded bodies in a firing furnace, subjecting the bodies to a binder removal treatment under an air atmosphere at a temperature of 500° C. and then firing the bodies at a temperature of 900° C. The dimensions of thirty of the obtained multilayer bodies were measured using a micrometer, and the following average values were determined: L=0.60 mm, W=0.30 mm, and T=0.30 mm.
9. An outer-electrode conductive paste containing Ag powder and glass frit was poured into a coating film forming tank in order to form a coating film of a predetermined thickness. The places where the outer electrodes are to be formed on each multilayer body were immersed in the coating film.
10. After the immersion, each multilayer body was baked at a temperature of around 800° C. and in this way the base electrodes of the outer electrodes were formed.
11. Formation of the outer electrodes was completed by sequentially forming a Ni film and a Sn film on the base electrodes by performing electroplating. Test pieces of example 1 having the internal structure of the multilayer body 10 illustrated in
Measurement of Transmission Coefficient S21
The transmission coefficient S21 was measured by obtaining the power of an input signal to the test piece and the power of a transmitted signal from the test piece and changing the signal frequency using a network analyzer 63. The two ends of the signal path 61 are connected to the network analyzer 63. The measurement results are illustrated in
Multilayer coil components according to examples 2 to 4 and comparative examples 1 to 3 were manufactured using the same procedure as described in example 1 except that the total length of the parts of the outer electrodes that extend along the first main surface were changed by adjusting the angle and depth at which each multilayer body was immersed in the coating film in the step of forming the base electrodes and the number of stacked coil conductors facing the outer electrodes was changed as illustrated in Table 1, and then the transmission coefficients S21 were measured. The results are illustrated in
From the results listed in Table 1, it is clear that the multilayer coil component 1 according to the embodiment of the present disclosure has a transmission coefficient S21 that is greater than or equal to −3.0 dB at 60 GHz and has excellent radio-frequency characteristics.
While preferred embodiments of the disclosure have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the disclosure. The scope of the disclosure, therefore, is to be determined solely by the following claims.
Number | Date | Country | Kind |
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JP2019-097642 | May 2019 | JP | national |
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20140145816 | Sato | May 2014 | A1 |
20150084729 | Lee | Mar 2015 | A1 |
20170345552 | Nakano | Nov 2017 | A1 |
Number | Date | Country |
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212461291 | Feb 2021 | CN |
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2000-138120 | May 2000 | JP |
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Entry |
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An Office Action; “Notice of Reasons for Refusal,” mailed by the Japanese Patent Office dated Dec. 21, 2021, which corresponds to Japanese Patent Application No. 2019-097642 and is related to U.S. Appl. No. 16/881,910 with English translation. |
Number | Date | Country | |
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20200373071 A1 | Nov 2020 | US |