The present invention relates to a multilayer inductor and, in particular, to a multilayer inductor including a coil therein.
An existing multilayer inductor is described in, for example, Japanese Unexamined Patent Application Publication No. 2008-130970 (Patent Document 1). The multilayer inductor according to Patent Document 1 is described below with reference to the accompanying drawings.
The multilayer body 111 includes magnetic layers 112a to 112l, internal conductors 114a to 114f, and via hole conductors B1 to B5. The magnetic layers 112a to 112l are insulating layers arranged from top to bottom in this order in the stacking direction.
The internal conductor 114a is disposed on the magnetic layer 112d. One end of the internal conductor 114a is led out and exposed through the right side surface of the multilayer body 111. The internal conductors 114b to 114e loop through a length of one turn on the magnetic layers 112e to 112h, respectively. One end of each of the internal conductors 114b to 114e has a corresponding one of connection portions 116b to 116e. The internal conductors 114b and 114d have the same shape. The internal conductors 114c and 114e have the same shape. In addition, the internal conductor 114f is disposed on the magnetic layer 112i, and one end of the internal conductor 114f is led out and exposed through the left side surface of the multilayer body 111.
Furthermore, the via hole conductors B1 to B5 connect neighboring ones of the internal conductors 114a to 114f in the stacking direction to each other. Thus, a coil L having a spiral shape is formed in the multilayer body 111.
Note that as described in more detail below, the multilayer inductor described in Patent Document 1 has a disadvantage in that delamination easily occurs.
As shown in
Accordingly, the present invention is directed to a multilayer inductor including a coil formed from coil electrodes each having a one-turn length, which can prevent the occurrence of delamination.
According to an embodiment of the present invention, a multilayer inductor includes a multilayer body including a plurality of insulating layers stacked therein, a plurality of first coil electrodes each looping through a length of one turn on one of the insulating layers so as to make a ring-shaped track when viewed in plan in a stacking direction. The first coil electrode includes a first end portion located on the ring-shaped track and a second end portion located off the ring shape track. The multilayer inductor includes a first via hole conductor for connecting neighboring ones of the first end portions in the stacking direction, and a second via hole conductor for connecting neighboring ones of the second end portions in the stacking direction. Second coil electrodes are disposed above and beneath the plurality of first coil electrodes in the stacking direction. The second coil electrodes are electrically connected to the plurality of first coil electrodes and each of the second coil electrodes includes a land portion that overlaps a region surrounded by the first end portions and the second end portions of the first coil electrodes when viewed in plan in the stacking direction.
In a more specific exemplary embodiment of the multilayer inductor, the land portion may overlap the first end portions and the second end portions when viewed in plan in the stacking direction.
In another more specific exemplary embodiment, the multilayer inductor according may further include first and second external electrodes provided along opposing side surfaces of the stacked insulating layers. Each of the second coil electrodes may include a lead out portion, and the lead out portions may respectively connect to the first and second external electrodes.
In yet another more specific exemplary embodiment, the first end portions and second end portions of adjacent ones of the first coil electrodes in the stacking direction may be substantially perpendicular to each other.
In another more specific exemplary embodiment, each land portion may overlap an entire region surrounded by the first end portions and the second end portions of the first coil electrodes when viewed in plan in a stacking direction.
In another more specific exemplary embodiment, the plurality of insulating layers may be made of magnetic layers.
Embodiments consistent with the claimed invention can reduce or prevent the occurrence of delamination.
Other features, elements, characteristics and advantages of the present invention will become more apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings.
A multilayer inductor according to an exemplary embodiment of the present invention is now described.
As shown in
As shown in
In the multilayer body 11, the coil electrodes 14a to 14f are electrically connected to one another and, thus, form the coil L. Each of the coil electrodes 14b to 14e is formed from a conductive material made of Ag. When viewed in plan in the z-axis direction, each of the coil electrodes 14b to 14e loops through a length of one turn on the magnetic layers 12e to 12h, respectively. More specifically, each of the coil electrodes 14b to 14e loops through a length of one turn so as to make a substantially rectangular ring-shaped track R (refer to the magnetic layer 12e shown in
In addition, the coil electrode 14a is disposed on the positive direction side of the coil electrodes 14b to 14e in the z-axis direction. The coil electrode 14a is electrically connected to the coil electrodes 14b to 14e and, therefore, forms part of the coil L. The coil electrode 14a is formed from a conductive material made of Ag. When viewed in plan in the z-axis direction, the coil electrode 14a extends for ¾ of a turn on the magnetic layer 12d. As shown in
Furthermore, the coil electrode 14f is disposed on the negative direction side of the coil electrodes 14b to 14e in the z-axis direction. The coil electrode 14f is electrically connected to the coil electrodes 14b to 14e and, therefore, forms part of the coil L. The coil electrode 14f is formed from a conductive material made of Ag. When viewed in plan in the z-axis direction, the coil electrode 14f extends for ½ of a turn on the magnetic layer 12i. As shown in
The land portions 18a and 18f are described next with reference to the accompanying drawings.
As shown in
Via hole conductors b1 to b5 electrically connect the coil electrodes 14a to 14f to one another and, thus, the spiral coil L is formed. More specifically, as shown in
A method for manufacturing the multilayer inductor 10 according to an exemplary embodiment is now described with reference to
First, raw materials of ferric oxide (Fe2O3), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) are weighed so as to be in predetermined ratios and are placed in a ball mill. Thereafter, wet mixing is performed. The obtained mixture is dried and pulverized. The obtained particles are calcined at a temperature of 800° C. for one hour. The obtained calcined particles are wet-milled in a ball mill and are dried. After the calcined particles are dried, the particles are chopped. Thus, ferrite ceramic particles can be obtained.
A binding agent (e.g., vinyl acetate or water-soluble acrylic), a plasticizing agent, a wet material, and a dispersing agent are added to the ferrite ceramic particles and are mixed in a ball mill. Thereafter, decompression is performed so that defoaming is performed. Thus, a ceramic slurry can be obtained. The ceramic slurry is formed into a sheet on a carrier sheet using a doctor blade method. Subsequently, the sheet is dried. In this way, ceramic green sheets to be made into the magnetic layers 12 are produced.
Subsequently, the via hole conductors b1 to b5 are formed in the ceramic green sheets to be made into the magnetic layers 12d to 12h. More specifically, a laser beam is emitted to the ceramic green sheets to be made into the magnetic layers 12d to 12h so that the via holes are formed. Subsequently, the via holes are filled with a conductive paste of Ag, Pd, Cu, Au, or an alloy thereof using, for example, a print coating method.
Subsequently, a conductive paste consisting primarily of Ag, Pd, Cu, Au, or an alloy thereof is applied onto the ceramic green sheets to be made into the magnetic layers 12d to 12i using a screen printing method or a photolithography method. Thus, the coil electrodes 14a to 14f are formed. Note that the step of forming the coil electrodes 14a to 14f and the step of filling the via holes with a conductive paste may be performed in the same step.
Subsequently, the ceramic green sheets are stacked. More specifically, the ceramic green sheet to be made into the magnetic layer 12l is placed. A carrier film of the ceramic green sheet to be made into the magnetic layer 12l is peeled off, and the ceramic green sheet to be made into the magnetic layer 12k is placed on the ceramic green sheet to be made into the magnetic layer 12l. Thereafter, the ceramic green sheet to be made into the magnetic layer 12k is pressure-bonded to the ceramic green sheet to be made into the magnetic layer 12l under conditions in which the pressure is 100 t to 200 t for 1 sec to 30 sec. The carrier film is ejected by suction or using a chuck. Subsequently, in a similar manner, the ceramic green sheets to be made into the magnetic layer 12j, 12i, 12h, 12g, 12f, 12e, 12d, 12c, 12b, and 12a are stacked and pressure-bonded in this order. Thus, a mother multilayer body is formed. The mother multilayer body is subjected to main pressure bonding using, for example, isostatic pressing.
Subsequently, the mother multilayer body is cut into a predetermined size using Guillotine cutting. Thus, the unfired multilayer body 11 is obtained. The unfired multilayer body 11 is subjected to a binder removal process and a sintering process. The binder removal process is performed at a temperature of 500° C. under low oxygen atmosphere for 2 hours. The sintering process is performed at a temperature of, for example, 900° C. for 3 hours.
Through the above-described steps, the sintered multilayer body 11 is obtained. The multilayer body 11 is subjected to barrel processing so as to be chamfered. Thereafter, for example, an electrode paste consisting primarily of silver is applied to the surface of the multilayer body 11 using, for example, a dipping method and is baked onto the surface. In this way, silver electrodes serving as the external electrodes 13a and 13b are formed. The silver electrodes are baked at a temperature of 800° C. for 1 hour.
Finally, Ni plating/Si plating is performed on the surface of the silver electrodes. Thus, the external electrodes 13a and 13b are formed. Through the above-described steps, the multilayer inductor 10 as shown in
As described in more detail below, the multilayer inductor 10 having the above-described structure can prevent the occurrence of delamination in the region E even when the multilayer inductor 10 includes the coil L formed from the coil electrodes 14 each having a length of one turn. More specifically, in the multilayer inductor described in Patent Document 1, the thickness of the multilayer body 111 in the region E in the stacking direction is smaller than the thickness of the multilayer body 111 in a region in the vicinity of the region E by the thicknesses of the internal conductors 114a to 114f. Accordingly, when the multilayer body 111 is pressure-bonded, a pressing tool cannot enter the region E. Thus, a sufficient pressure may not be applied to the region E. As a result, delamination easily occurs in the region E of the multilayer inductor described in Patent Document 1, which is problematic.
In contrast, as shown in
Furthermore, in the multilayer inductor 10, the land portions 18a and 18f overlap the end portions t3 to t9 when viewed in plan in the z-axis direction. Accordingly, as described below, the length of the coil L can be changed without increasing the number of patterns of the coil electrodes 14.
More specifically, when the length of the coil L is changed, a magnetic layer the same as the magnetic layer 12e having the coil electrode 14b formed thereon or a magnetic layer the same as the magnetic layer 12f having the coil electrode 14c formed thereon can be inserted between the magnetic layer 12h and the magnetic layer 12i. For example, when it is desired to increase the length of the coil L from the length shown in
If the length of the coil L is changed by using the above-described technique, the coil electrode 14 located next to the coil electrode 14f is either a coil electrode the same as the coil electrode 14b or the coil electrode 14c. At that time, the end portion t4 of the coil electrode 14b and the end portion t6 of the coil electrode 14c are located at different positions. Accordingly, in general, two types of the coil electrode 14f: the coil electrode 14f connectable to the end portion t4 of the coil electrode 14b and the coil electrode 14f connectable to the end portion t6 of the coil electrode 14c are used.
In contrast, in the multilayer inductor 10, the land portions 18a and 18f overlap the end portions t3 to t9 when viewed in plan in the z-axis direction. Accordingly, even when either the coil electrode 14b or 14c is located next to the coil electrode 14f, the coil electrode 14f can be connected to the coil electrode 14b or 14c using a via hole conductor b. Thus, for the multilayer inductor 10, the coil electrode 14f having only one pattern is sufficient and, therefore, the length of the coil L can be changed without increasing the number of the patterns of the coil electrodes 14.
While, in the multilayer inductor 10, the end portions t4, t5, t8, and t9 have been located inside of a region surrounded by the ring-shaped track R, the end portions t4, t5, t8, and t9 may be located outside of a region surrounded by the ring-shaped track R.
Embodiments consistent with the claimed invention are effective for multilayer inductors and can prevent the occurrence of delamination.
While exemplary embodiments of the claimed invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the invention. The scope of the invention, therefore, is to be determined solely by the following claims and their equivalents.
Number | Date | Country | Kind |
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2008-204551 | Aug 2008 | JP | national |
The present application is a continuation of International Application No. PCT/JP2009/062124, filed Jul. 2, 2009, which claims priority to Japanese Patent Application No. 2008-204551 filed Aug. 7, 2008, the entire contents of each of these applications being incorporated herein by reference in their entirety.
Number | Date | Country | |
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Parent | PCT/JP2009/062124 | Jul 2009 | US |
Child | 12985740 | US |