Patent Application
20250022668
This application claims the benefit of priority from Chinese Patent Application No. 202311317385.X, filed on Oct. 12, 2023. The content of the aforementioned application, including any intervening amendments thereto, is incorporated herein by reference in its entirety.
This application relates to capacitors, more particularly to a multilayer polymer capacitor (MLPC) with multiple electroplated terminals.
Multilayer polymer capacitors (MLPCs) have been extensively used in consumer electronics such as laptops, cell phones, and networking devices. In order to be compatible with the increasingly-thinned electronic parts, the capacitors also need to be miniaturized. The traditional MLPCs are packaged with epoxy molding compounds (EME), in which positive and negative electrodes of the core are led out by a lead frame, and the lead frame exposed outside the capacitor is bent to form positive and negative terminals. In the traditional MLPC with a height of 1.9 mm or 1.4 mm, the lead frame is bent after welding the electrode plates. Since the thickness of the EME package of MLPCs is enough, the bending operation of the lead pin will not damage the capacitor body. When the capacitor is limited to a total height of 1.0 mm or 1.2 mm, the capacitor body will be damaged when bending the pins since it is too thin, and thus it is not possible to manufacture miniaturized ultra-thin capacitors due to the limitations of process and size. It is a great challenge to manufacture multilayer capacitors with a size of 0.8 mm or less. The bending of the lead frame will take up a certain space, which will further increase the capacitor thickness and affect the structure and performance of the capacitors, failing to achieve the mass production of thinned capacitors. In addition, regarding the traditional multilayer capacitors, the connection between the capacitor body and the positive and negative plates is achieved through lead frames, where the connection of the positive plate is achieved by soldering, and the connection of the negative plate is achieved by bonding with silver paste and curing. The thinned capacitor has a limited thickness and a poor parallel effect, and the traditional equivalent series resistance (ESR) cannot meet the industrial needs. Therefore, how to improve the parallel effect and capacity in a smaller volume, and reduce the equivalent series resistance of the capacitor needs to be urgently resolved.
In view of the deficiencies in the prior art, this application provides a multilayer polymer capacitor (MLPC) with multiple electroplated terminals, where positive and negative electrode terminals are electroplated to be used as lead-out electrodes to realize the product thinning, and the parallel shunt of the negative electrode improves the parallel effect of the capacitor and reduces the equivalent series resistance, thereby solving the limited bending of the lead pin and the poor parallel effect of the capacitor after thinned.
Technical solutions of this application are described as follows.
This application provides a multilayer polymer capacitor (MLPC) with multiple electroplated terminals, comprising:
In an embodiment, a first end of the multiplayer core is configured as a cathode area, and a second end of the multilayer core is configured as an anode area; a first electrically conductive body is filled between a surface of the cathode area and an inner wall of the accommodating cavity; a fixing adhesive is filled between the inner wall of the accommodating cavity and side surfaces of the first electrically conductive body and between the inner wall of the accommodating cavity and a top surface of the first electrically conductive body; and the second electroplated negative terminal is connected to the first electrically conductive body.
In an embodiment, a first end of the anode lead-out part is connected to the anode area, and a second end of the anode lead-out part is configured to pass through the casing to be connected to the electroplated positive terminal; and
In an embodiment, the second electroplated negative terminal comprises a flat portion, a bent portion, and a recessed portion; and
In an embodiment, the through hole is provided in a middle of the casing body; and
In an embodiment, the recessed portion is connected to the flat portion; the recessed portion is configured to extend along the inner wall of the through hole to the first electrically conductive body; and an outer side of the recessed portion is electrically connected to the first electrically conductive body.
In an embodiment, a filler with thermal conductivity and electrical conductivity is embedded at an inner side of the recessed portion.
In an embodiment, a second electrically conductive body is provided in the through hole.
In an embodiment, the second electroplated negative terminal is configured to extend along an inner wall of the through hole to the first electrically conductive body.
In an embodiment, the through hole is round, oval or polygonal.
The present application has the following beneficial technical effects.
Regarding the multilayer polymer capacitor (MLPC) provided herein, positive and negative electrode terminals are formed on the casing surface by electroplating as lead-out electrodes to arrive at a thinned structure. The first and second electroplated negative terminals are combined to improve the parallel effect of the capacitor and reduce the equivalent series resistance, thereby eliminating the limitation when bending the electrode terminal and solving the poor parallel effect after thinning the capacitor.
In the drawings:
The technical solutions of the disclosure will be described in detail below in combination with the drawings in the embodiments to make the technical solutions, objects and advantages of the disclosure clearer. Obviously, described below are merely some embodiments of the disclosure, which are not intended to limit the disclosure. Accordingly, the following detailed description is merely illustrative, and is not intended to limit the scope of the disclosure. For those skilled in the art, other embodiments obtained based on these embodiments without paying creative efforts should fall within the scope of the disclosure defined by the appended claims.
As used herein, it should be noted that the orientation or positional relationship indicated by the terms “side, “upper”, “lower”, “top”, “bottom”, “inside”, “outside” is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the technical solutions and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation, or be constructed or operated in a specific orientation. Therefore, these terms should not be understood as a limitation of the present disclosure. As used herein, unless otherwise indicated, the phrase “a plurality of” means two or more. In addition, the term “comprising” and any variations thereof mean “at least comprising”.
In addition, the terms “first” and “second” are merely descriptive, and cannot be understood as indicating or implying relative importance.
As used herein, unless otherwise expressly specified and defined, the terms, such as “form”, “link”, and “connect” should be understood in a broad sense, for example, it may be fixed connection, detachable connection, or integral connection; it may be direct connection or indirect connection through an intermediate medium; and it may be an internal communication between two members. For those skilled in the art, the specific meanings of the above terms can be understood according to specific situations.
As shown in
In an embodiment, the multilayer core 5 is formed by stacking a plurality of electrode plates. Each of the plurality of electrode plates is composed of an anode terminal, a cathode terminal and an insulating adhesive 503, where the anode terminal and the cathode terminal are separated from each other by the insulating adhesive 503. After the plurality of electrode plates are stacked, anode terminals of the electrode plates are connected in parallel to form an anode area 501, and cathode terminals of the electrode plates are connected in parallel to form a cathode area 502. The stacked electrode plate structure is fixed to form the multilayer core 5. One end of the multilayer core 5 is configured as the cathode area 502, and the other end of the multilayer core 5 is configured as the anode area 501. A first electrically conductive body 8 is filled between a surface of the cathode area 502 and an inner wall of the accommodating cavity 1012. A fixing adhesive 9 is filled between the inner wall of the accommodating cavity 1012 and side surfaces of the first electrically conductive body 8 and between the inner wall of the accommodating cavity 1012 and a top surface of the first electrically conductive body 8. The second electroplated negative terminal 4 is connected to the first electrically conductive body 8. An end of the anode lead-out part 6 is connected to the anode area 501, and the other end of the anode lead-out part 6 passes through the casing 1 to be connected with the electroplated positive terminal 2. An end of the cathode lead-out part 7 is connected to the cathode area 502, and the other end of the cathode lead-out part 7 passes through the casing 1 to be connected with the first electroplated negative terminal 3.
As shown in
In this embodiment, the anode lead-out part 6 and the cathode lead-out part 7 are made of copper foil, aluminum foil, or silver foil, preferably copper foil. An electrical connection is formed between the inner side of the anode lead-out part 6 and the anode area 501 by coating silver paste or by soldering, thereby configuring as an anode lead-out. An electrical connection is formed between the inner side of the cathode lead-out part 7 and the outer surface of the multilayer core 5 by bonding silver paste, as thereby configuring a cathode lead-out.
In this embodiment, the electroplated positive terminal 2 and the first electroplated negative terminal 3 having a certain shape are formed by plating the exposed end of the anode lead-out part 6 and the exposed end of the cathode lead-out part 7 on the surface of the casing 1, respectively. The electroplated positive terminal 2 and the first electroplated negative terminal 3 are connected to the anode lead-out part 6 and the cathode lead-out part 7, respectively, to form the lead-out electrodes of the positive and negative electrodes. The electroplated positive terminal 2 and the first electroplated negative terminal 3 are covered on the outer surfaces of both ends of the casing 1 to form a whole. The thickness of the positive and electroplated negative terminals can be set according to the actual needs of any size, not limited by the thickness of the terminals. The thickness of the capacitor can be made thinner, breaking through the constraints of bending size limitations of positive and negative terminals of traditional multiplayer capacitor. Any thickness of the electrode terminals can be made on any size of the multiplayer capacitor. In the case of the total height of the capacitor remains unchanged, this disclosure reduces the thickness of the electrode terminals, increases the electrodes of the capacitor to improve the electrostatic capacity, and achieves lighter-thinner and high-capacity design.
In an embodiment, the through hole 1011 is round, oval or polygonal. In this embodiment, the through hole is oval, and the number of through holes 1011 is not limited.
In an embodiment, a part of the second electrically conductive body 81 seals the opening of the through hole 1011, and the through hole 1011 is filled with the second electrically conductive body 81. The conductive body 8 passes through the through hole 1011 to externally form the lead-out point, which increases the current conductive area, reduces the impedance, has a strong electron mobility, improves the current parallel export of the cathode, and improves the large ripple current. The lead-out electrode is formed in the opening of the through hole 1011 by the plating, that is, the second electroplated negative terminal 4. The negative electrode export of the entire capacitor is parallel common output of the first electroplated negative terminal 3 and the second electroplated negative terminal 4. The second electroplated negative terminal 4 is formed by electroplating. The second electroplated negative terminal 4 includes a flat portion 401 and a bent portion 402. The flat portion 401 is attached to the bottom outer surface of the casing body 101 to connect directly with the conductive body 8 filled in the through hole 1011. The bent portion 402 is attached to two outer side surfaces of the casing body 101. In an embodiment, the through hole 1011 is not filled with the first electrically conductive body 8. In this embodiment, the second electroplated negative terminal 4 further includes a recessed portion 403. The recessed portion 403 is connected to the flat portion 401, and the recessed portion 403 extends along the inner wall of the through hole 1011 to the first electrically conductive body 8. In some embodiments, the outer side of the recessed portion 403 is electrically connected to the first electrically conductive body 8, and the inner side of the recessed portion 403 is electrically connected to the filler 10. The filler 10 is embedded in the inner side of the recessed portion 403. The filler 10 is made of materials with high heat dissipation, which improves heat exportation and heat dissipation. Furthermore, the filler 10 is electrically conductive materials with a strong electrical conductivity, such as silver, gold, and copper, which is filled with a good conductor and reduces the resistivity, thereby improving the problem of the parallel current of the negative electrode to generate heat.
Specifically, the second electroplated negative terminal 4 is formed by electroplating, and the shape of the second electroplated negative terminal 4 is not limited. The flat portion 401 of the second electroplated negative terminal 4 is attached to the outer bottom surface of the casing body 101. The flat portion 401 is connected to the first electrically conductive body 8 in the accommodating cavity 1012 and the second electrically conductive body 81 in the through hole 1011 via the recessed portion 403 to form the second negative electrode export. The negative electrode export of the entire capacitor is jointly output by the first electroplated negative terminal 3 and the second electroplated negative terminal 4, thereby increasing the parallel connection efficiency of the capacitor and reducing the equivalent series resistance of the multiplayer capacitor. The conductive terminals are formed by the electroplated positive terminal 2, the first electroplated negative terminal 3, the second electroplated negative terminal 4 by plating, which also breaks through the traditional size limitations, and the height of the capacitor is reduced to 0.3-1.0 mm. The electrode terminals are formed by plating to realize the thin design of the capacitor, instead of the electrode terminals led out by the traditional bending method. The electroplating terminals combined with the parallel connection reduces the equivalent series resistance.
The second electroplated negative terminal 4 extends outwardly to the bottom surface of the casing 1. The electroplated positive terminal 2, the first electroplated negative terminal 3, and the second electroplated negative terminal 4 are attached to the surface of the casing 1 and combined with the casing 1 to form a whole.
In this embodiment, the through hole 1011 is disposed in the middle of the bottom of the casing body 101. The second electroplated negative terminal 4 further includes a protruding portion 404 extending along one side of the flat portion 401 toward the first electroplated negative terminal 3. The width of the protruding portion 404 is greater than that of the flat portion 401. The protruding portion 404 reduces inductance, improves resistance to large ripple current effect, increases heat dissipation area, improves heat dissipation effect, increases welding area, and improves solidity.
When the capacitor is mounted on a printed circuit board (PCB), the second electroplated negative terminal 4 is welded to the PCB in addition to the electroplated positive terminal 2 and the first electroplated negative terminal 3. On the one hand, the parallel export of the second electroplated negative terminal 4 reduces the equivalent series resistance of the multiplayer capacitor, and on the other hand, the second electroplated negative terminal 4 is welded to the PCB, which improves the stability and the heat dissipation performance of the capacitor. The electroplated positive terminal 2, the first electroplated negative terminal 3, and the second electroplated negative terminal 4 are terminals formed by plating. The thickness of the positive and electroplated negative terminals formed by plating can be set according to the actual size needs, not limited to the thickness of the multiplayer capacitor. The multiplayer capacitor can be thinner, thereby breaking through the constraints of bending size limitations of positive and negative terminals of traditional multiplayer capacitor. Any thickness of the electrode terminals can be made on any size of the multiplayer capacitor. In the case of the total height of the capacitor remains unchanged, this disclosure reduces the thickness of the electrode terminals, increases the electrodes of the capacitor to improve the electrostatic capacity, and achieves lighter-thinner and high-capacity design.
It is clear that described below are merely some embodiments of the disclosure, which are not intended to limit the disclosure. For those skilled in the art, other embodiments obtained based on these embodiments without paying creative efforts should fall within the scope of the disclosure defined by the appended claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202311317385.X | Oct 2023 | CN | national |
