Claims
- 1. A process for forming a biaxially oriented multilayer film comprising the steps of: co-extruding in the absence of an adhesive at least first and second resin layers wherein the first resin layer comprises substantially amorphous poly(1,3-propylene 2,6-naphthalate) and the second resin layer comprises substantially amorphous poly(ethylene terephthalate); and biaxially stretching the co-extruded film at a temperature of from about 90° C. to about 115° C.
- 2. The process of claim 1 wherein the film is biaxially stretched at a temperature of from about 100° C. to about 110° C.
- 3. The process of claim 2 further comprising the step of heatsetting the film at a temperature of from about 160° C. to about 180° C. after the step of biaxial stretching.
- 4. A process for forming a biaxially oriented multilayer film comprising the steps of: co-extruding in the absence of an adhesive tie layer at least first and second resin layers wherein the first resin layer comprises substantially amorphous poly(1,3-propylene 2,6-naphthalate) and the second resin layer comprises substantially amorphous poly(ethylene terephthalate); and biaxially stretching the co-extruded film at a temperature of from about 90° C. to about 115° C.
- 5. A process for forming a hollow container comprising the steps of: forming a multilayer preform comprising at least a first resin layer and a second resin layer wherein the first resin layer comprises substantially amorphous poly(1,3-propylene 2,6-naphthalate) and the second resin layer comprises substantially amorphous poly(ethylene terephthalate); and blow molding the preform at a temperature of from about 90° C. to about 115° C.
Parent Case Info
This application is a division application Ser. No. 09/145,230, filed Sep. 1, 1998, now abandoned.
US Referenced Citations (14)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1-26940 |
May 1989 |
JP |
5-131602 |
May 1993 |
JP |
Non-Patent Literature Citations (2)
Entry |
Appellate Decision of the Board of Patent Appeals and Interferences in Ex parte P. Subr (Appeal No. 2001-2556; Application 09/145,230) mailed Sep. 23, 2002. |
Co-pending U.S. patent application Ser. No. 10/461,308 to Subramanian et al. filed Aug. 29, 2003 (Attorney Docket No. PT-0017 US DIV 1). |