Patent Application
20250038413
The present disclosure relates to a multilayer substrate including a plurality of radiating conductor layers.
A patch antenna described in Patent Document 1 is known as an disclosure related to an antenna element in the related art. The patch antenna includes a dielectric block, a ground electrode, a non-driven electrode, a radiating electrode, and a coupling electrode. The dielectric block has a disk shape having an upper main surface and a lower main surface. The ground electrode is provided on the lower main surface of the dielectric block. The radiating electrode is provided in the vicinity of a center of the upper main surface of the dielectric block. The non-driven electrode is provided on the upper main surface of the dielectric block. The non-driven electrode has an annular shape surrounding the radiating electrode assuming it is viewed in an up-down direction. The coupling electrode is provided on a side surface of the dielectric block. The coupling electrode electrically couples the ground electrode and the non-driven electrode. In the patch antenna described above, the radiating electrode transmits and receives a radio frequency signal.
In the patch antenna described in Patent Document 1, there is a case that it is desired to provide a plurality of radiating electrodes. In the case above, there is a demand for reducing a size of the patch antenna and improving radiation characteristics of the patch antenna.
It is therefore a feature of the present disclosure to reduce a size of a multilayer substrate including a plurality of radiating conductor layers and to improve radiation characteristics of the plurality of radiating conductor layers.
A multilayer substrate according to an aspect of the present disclosure includes:
With the use of the multilayer substrate according to the present disclosure, a size of a multilayer substrate including a plurality of radiating conductor layers may be reduced, and radiation characteristics of the plurality of radiating conductor layers may be improved.
A structure of a multilayer substrate 10 according to an embodiment of the present disclosure will be described below with reference to the drawings.
Hereinafter, a lamination direction of a multilayer body 12 of the multilayer substrate 10 is defined as an up-down direction. The up-down direction coincides with a Z-axis direction. An upward direction is a positive direction of a Z-axis. A downward direction is a negative direction of the Z-axis. Assuming the multilayer substrate 10 is viewed in the up-down direction, two directions in which sides of the multilayer substrate 10 extend are defined as a left-right direction and a front-back direction, respectively. The left-right direction coincides with an X-axis direction. The front-back direction coincides with a Y-axis direction. The left-right direction is orthogonal to the up-down direction. The front-back direction is orthogonal to the up-down direction and the left-right direction. A definition of directions in the present description is an example. Consequently, a direction of the multilayer substrate 10 in actual use could not coincide with a direction in the present description. Further, the up-down direction may be reversed in each drawing. In the same way, the left-right direction may be reversed in each drawing. The front-back direction may be reversed in each drawing.
Hereinafter, an X is a component or a member of the multilayer substrate 10. In the present description, each portion of the X is defined as follows, unless otherwise specified. A front portion of the X may be equivalent to a front half of the X. A back portion of the X may be equivalent to a back half of the X. A left portion of the X may be equivalent to a left half of the X. A right portion of the X may be equivalent to a right half of the X. An upper portion of the X may be equivalent to an upper half of the X. A lower portion of the X may be equivalent to a lower half of the X. A front end of the X may be equivalent to an end in a front direction of the X. A back end of the X may be equivalent to an end in a back direction of the X. A left end of the X may be equivalent to an end in a left direction of the X. A right end of the X may be equivalent to an end in a right direction of the X. An upper end of the X may be equivalent to an end in the upward direction of the X. A lower end of the X may be equivalent to an end in the downward direction of the X. A front end portion of the X may be equivalent to the front end of the X and the vicinity thereof. A back end portion of the X may be equivalent to the back end of the X and the vicinity thereof. A left end portion of the X may be equivalent to the left end of the X and the vicinity thereof. A right end portion of the X may be equivalent to the right end of the X and the vicinity thereof. An upper end portion of the X may be equivalent to the upper end of the X and the vicinity thereof. A lower end portion of the X may be equivalent to the lower end of the X and the vicinity thereof.
The multilayer substrate 10 is used for an electronic device such as a mobile phone. As illustrated in
The multilayer body 12 has a plate shape. As illustrated in
The first radiating conductor layer 20 radiates and/or receives a first radio frequency signal. The first radiating conductor layer 20 is provided to the multilayer body 12 to be in contact with the insulator layers 14b and 14c (first insulator layers). In the present embodiment, the first radiating conductor layer 20 is positioned on an upper main surface of the insulator layer 14c. As illustrated in
The second radiating conductor layer 21 radiates and/or receives a second radio frequency signal. The second radiating conductor layer 21 is provided to the multilayer body 12 to be in contact with the insulator layer 14a (second insulator layer). In the present embodiment, the second radiating conductor layer 21 is positioned on an upper main surface of the insulator layer 14a. With this, the second radiating conductor layer 21 is positioned above the first radiating conductor layer 20 (in the positive direction of the Z-axis). A distance in the up-down direction between the second radiating conductor layer 21 and the first radiating conductor layer 20 is ¼ of a wavelength of the second radio frequency signal.
Further, as illustrated in
As illustrated in
The first ground conductor layer 16 is provided to the multilayer body 12. More specifically, the first ground conductor layer 16 is positioned above the first radiating conductor layer 20 (in the positive direction of the Z-axis). In the present embodiment, the first ground conductor layer 16 is provided at the same position in the up-down direction (Z-axis direction) as the second radiating conductor layer 21. Consequently, the first ground conductor layer 16 is positioned on the upper main surface of the insulator layer 14a.
Further, the first ground conductor layer 16 does not overlap the first radiating conductor layer 20 or the second radiating conductor layer 21 assuming it is viewed in the up-down direction (Z-axis direction). In the present embodiment, assuming it is viewed in the up-down direction (Z-axis direction), the first ground conductor layer 16 is positioned on a left side (positive direction of an X-axis), a right side (negative direction of the X-axis), a front side (positive direction of a Y-axis), and a back side (negative direction of the Y-axis) of the first radiating conductor layer 20 and the second radiating conductor layer 21. Consequently, the first ground conductor layer 16 has an annular shape surrounding the first radiating conductor layer 20 and the second radiating conductor layer 21 assuming it is viewed in the up-down direction (Z-axis direction). In the present embodiment, the first ground conductor layer 16 has an outer edge and an inner edge of a rectangular shape having two sides extending in the front-back direction and two sides extending in the left-right direction.
The outer electrodes 24a, 24b, 26a, and 26b each are provided on the lower main surface of the insulator layer 14g. The outer electrodes 24a, 24b, 26a, and 26b each are in no contact with the planar ground conductor layer 18. Consequently, the outer electrodes 24a, 24b, 26a, and 26b each are positioned in an opening provided in the planar ground conductor layer 18. The outer electrodes 24a and 24b overlap the first radiating conductor layer 20 assuming it is viewed in the up-down direction. The outer electrodes 26a and 26b overlap the second radiating conductor layer 21 assuming it is viewed in the up-down direction. The first radio frequency signal is inputted to and outputted from the outer electrodes 24a and 24b. The second radio frequency signal is inputted to and outputted from the outer electrodes 26a and 26b.
The interlayer coupling conductor v1 electrically couples the first radiating conductor layer 20 and the outer electrode 24a. The interlayer coupling conductor v1 passes through the insulator layers 14c to 14g in the up-down direction. The interlayer coupling conductor v1 is positioned in the vicinity of a midpoint of a left front side of the first radiating conductor layer 20 assuming it is viewed in the up-down direction. A point at which the interlayer coupling conductor v1 is in contact with the first radiating conductor layer 20 is a first feed point P1.
The interlayer coupling conductor v2 electrically couples the first radiating conductor layer 20 and the outer electrode 24b. The interlayer coupling conductor v2 passes through the insulator layers 14c to 14g in the up-down direction. The interlayer coupling conductor v2 is positioned in the vicinity of a midpoint of a left back side of the first radiating conductor layer 20 assuming it is viewed in the up-down direction. A point at which the interlayer coupling conductor v2 is in contact with the first radiating conductor layer 20 is a second feed point P2.
The interlayer coupling conductor v3 electrically couples the second radiating conductor layer 21 and the outer electrode 26a. The interlayer coupling conductor v3 passes through the insulator layers 14a to 14g in the up-down direction. The interlayer coupling conductor v3 is positioned in the vicinity of a midpoint of a right front side of the second radiating conductor layer 21 assuming it is viewed in the up-down direction. A point at which the interlayer coupling conductor v3 is in contact with the second radiating conductor layer 21 is a third feed point P3.
The interlayer coupling conductor v4 electrically couples the second radiating conductor layer 21 and the outer electrode 26b. The interlayer coupling conductor v4 passes through the insulator layers 14a to 14g in the up-down direction. The interlayer coupling conductor v4 is positioned in the vicinity of a midpoint of a right back side of the second radiating conductor layer 21 assuming it is viewed in the up-down direction. A point at which the interlayer coupling conductor v4 is in contact with the second radiating conductor layer 21 is a fourth feed point P4.
The interlayer coupling conductors v5 to v8 each electrically couple the first ground conductor layer 16 and the planar ground conductor layer 18. The interlayer coupling conductors v5 to v8 each pass through the insulator layers 14a to 14g.
The first ground conductor layer 16, the planar ground conductor layer 18, the first radiating conductor layer 20, the second radiating conductor layer 21, and the outer electrodes 24a, 24b, 26a, and 26b are formed by, for example, patterning a copper foil attached to the upper main surface or the lower main surface of the insulator layers 14a to 14g. Each of the interlayer coupling conductors v1 to v8 is a via-hole conductor, for example. The via-hole conductor is formed by forming a through hole in the insulator layers 14a to 14g, filling the through hole with a conductive paste, and sintering the conductive paste.
In the multilayer substrate 10 described above, the first ground conductor layer 16, the planar ground conductor layer 18, and the first radiating conductor layer 20 function as a patch antenna that radiates or receives the first radio frequency signal. The first ground conductor layer 16, the planar ground conductor layer 18, and the second radiating conductor layer 21 function as a patch antenna that radiates or receives the second radio frequency signal.
With the use of the multilayer substrate 10, the multilayer substrate 10 including the first radiating conductor layer 20 and the second radiating conductor layer 21 may be reduced in size. More specifically, the second radiating conductor layer 21 overlaps the first radiating conductor layer 20 assuming it is viewed in the up-down direction. With this, assuming it is viewed in the up-down direction, an area of the multilayer substrate 10 is smaller than an area of a multilayer substrate in which two radiating conductors are arranged in the front-back direction or the left-right direction. Thus, with the use of the multilayer substrate 10, the multilayer substrate 10 including the first radiating conductor layer 20 and the second radiating conductor layer 21 may be reduced in size.
With the use of the multilayer substrate 10, the radiation characteristics of the first radiating conductor layer 20 may be improved. More specifically, the area of the first radiating conductor layer 20 is larger than the area of the second radiating conductor layer 21. Because of that, the first radiating conductor layer 20 is positioned near the first ground conductor layer 16 assuming it is viewed in the up-down direction. In the case above, a current of a reverse phase flows in the planar ground conductor layer 18. As a result, the radiation characteristics of the first radiating conductor layer 20 deteriorate.
In the multilayer substrate 10, the first radiating conductor layer 20 is provided to the multilayer body 12 to be in contact with the insulator layers 14b and 14c. The dielectric constant of each of the insulator layers 14b and 14c is higher than the dielectric constant of the insulator layer 14a. With this, a wavelength shortening effect makes it possible to reduce the first radiating conductor layer 20 in size without changing the frequency of the first radio frequency signal radiated or received by the first radiating conductor layer 20. This makes the first radiating conductor layer 20 be separated from the first ground conductor layer 16 assuming it is viewed in the up-down direction. Thus, a current of a reverse phase is less likely to flow in the planar ground conductor layer 18. As described above, with the use of the multilayer substrate 10, the radiation characteristics of the first radiating conductor layer 20 may be improved.
With the use of the multilayer substrate 10, the radiation characteristics of the second radiating conductor layer 21 may be improved. More specifically, the frequency of the second radio frequency signal radiated or received by the second radiating conductor layer 21 is higher than the frequency of the first radio frequency signal radiated or received by the first radiating conductor layer 20. Because of that, the area of the second radiating conductor layer 21 is smaller than the area of the first radiating conductor layer 20. In the case above, it is hard to improve the radiation characteristics of the second radiating conductor layer 21.
To deal with that, the second radiating conductor layer 21 is provided to the multilayer body 12 to be in contact with the insulator layer 14a. The dielectric constant of the insulator layer 14a is lower than the dielectric constant of each of the insulator layers 14b to 14d. Thus, the wavelength shortening effect is less likely to occur in the second radiating conductor layer 21. Because of that, the area of the second radiating conductor layer 21 may be increased without changing the frequency of the second radio frequency signal radiated or received by the second radiating conductor layer 21. As a result, with the use of the multilayer substrate 10, the radiation characteristics of the second radiating conductor layer 21 may be improved.
With the use of the multilayer substrate 10, an antenna gain of the first radiating conductor layer 20 for first polarization and an antenna gain of the first radiating conductor layer 20 for second polarization may be made close to each other. More specifically, the first radiating conductor layer 20 radiates and receives the first radio frequency signal of the first polarization at the first feed point P1. The first radiating conductor layer 20 radiates and receives the first radio frequency signal of the second polarization at the second feed point P2. In order to make the antenna gain of the first radiating conductor layer 20 for the first polarization and the antenna gain of the first radiating conductor layer 20 for the second polarization close to each other, a distance between the first feed point P1 and the first ground conductor layer 16 and a distance between the second feed point P2 and the first ground conductor layer 16 could be made close.
In the multilayer substrate 10, as illustrated in
With the use of the multilayer substrate 10, the antenna gain of the second radiating conductor layer 21 may be improved. More specifically, the second radiating conductor layer 21 radiates the second radio frequency signal in the upward direction and the downward direction. The second radio frequency signal radiated in the downward direction is reflected by the first radiating conductor layer 20 and travels in the upward direction. Here, the distance in the up-down direction between the second radiating conductor layer 21 and the first radiating conductor layer 20 is ¼ of the wavelength of the second radio frequency signal. This makes a phase of the second radio frequency signal be shifted by 180°. Further, the phase of the second radio frequency signal is shifted by 1800 at the time of reflection. As a result, the phase of the second radio frequency signal radiated in the downward direction matches the phase of the second radio frequency signal radiated in the upward direction. Thus, with the use of the multilayer substrate 10, the antenna gain of the second radiating conductor layer 21 may be increased.
A multilayer substrate 10a according to a first modification will be described below.
The multilayer substrate 10a is different from the multilayer substrate 10 in that the multilayer body 12 further includes protection layers 15a and 15b. The difference will be described below. The insulator layer 14a (second insulator layer) is positioned above the insulator layers 14b to 14d (first insulator layers) (in the positive direction of the Z-axis). The protection layer 15a is positioned above the insulator layer 14a (second insulator layer) (in the positive direction of the Z-axis). In the present embodiment, the protection layer 15a covers the upper main surface of the insulator layer 14a. Further, the protection layer 15a covers the second radiating conductor layer 21. The protection layer 15b covers the lower main surface of the insulator layer 14g. Further, the protection layer 15b covers the planar ground conductor layer 18. Note that the outer electrodes 24a, 24b, 26a, and 26b and part of the planar ground conductor layer 18 are exposed from the protection layer 15b.
A dielectric constant of each of the protection layers 15a and 15b is lower than the dielectric constant of the insulator layer 14a (second insulator layer). The second radiating conductor layer 21 is embedded in the protection layer 15a. With this, an area in which the second radiating conductor layer 21 is in contact with the protection layer 15a is larger than an area in which the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). Other structures of the multilayer substrate 10a are the same as those of the multilayer substrate 10. The multilayer substrate 10a may achieve the same effects as those of the multilayer substrate 10.
With the use of the multilayer substrate 10a, the radiation characteristics of the second radiating conductor layer 21 may be improved. More specifically, the dielectric constant of the protection layer 15a is lower than the dielectric constant of the insulator layer 14a (second insulator layer). The area in which the second radiating conductor layer 21 is in contact with the protection layer 15a is larger than the area in which the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This makes the wavelength shortening effect be less likely to occur in the second radiating conductor layer 21. Because of that, the area of the second radiating conductor layer 21 may be increased without changing the frequency of the second radio frequency signal radiated or received by the second radiating conductor layer 21. As a result, with the use of the multilayer substrate 10a, the radiation characteristics of the second radiating conductor layer 21 may be improved.
A multilayer substrate 10b according to a second modification will be described below.
The multilayer substrate 10b is different from the multilayer substrate 10a in that the dielectric constant of each of the protection layers 15a and 15b is higher than the dielectric constant of the insulator layer 14a (second insulator layer). The second radiating conductor layer 21 is embedded in the insulator layer 14a. With this, an area in which the second radiating conductor layer 21 is in contact with the protection layer 15a is smaller than an area in which the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). Other structures of the multilayer substrate 10b are the same as those of the multilayer substrate 10a. The multilayer substrate 10b may achieve the same effects as those of the multilayer substrate 10a.
With the use of the multilayer substrate 10b, deterioration in the radiation characteristics of the second radiating conductor layer 21 may be suppressed. More specifically, the dielectric constant of each of the protection layers 15a and 15b is higher than the dielectric constant of the insulator layer 14a (second insulator layer). Note that the area in which the second radiating conductor layer 21 is in contact with the protection layer 15a is smaller than the area in which the second radiating conductor layer 21 is in contact with the insulator layer 14a (second insulator layer). This suppresses that the wavelength shortening effect excessively occurs in the second radiating conductor layer 21. Because of that, a decrease in the area of the second radiating conductor layer 21 may be suppressed without changing the frequency of the second radio frequency signal radiated or received by the second radiating conductor layer 21. As a result, with the use of the multilayer substrate 10b, deterioration in the radiation characteristics of the second radiating conductor layer 21 may be suppressed.
A multilayer substrate 10c according to a third modification will be described below.
The multilayer substrate 10c is different from the multilayer substrate 10 in that the multilayer substrate 10c further includes a first matching circuit 50a and a second matching circuit 50b. More specifically, the multilayer body 12 has a structure in which the insulator layer 14a (second insulator layer), the insulator layers 14b to 14d (first insulator layers), and insulator layers 14e, 14h, 14i, and 14g (third insulator layers) are arranged in this order in the downward direction (negative direction of the Z-axis). A dielectric constant of each of the insulator layers 14e, 14h, 14i, and 14g (third insulator layers) is lower than a dielectric constant of each of the insulator layers 14b to 14d (first insulator layers).
The multilayer substrate 10c further includes a planar ground conductor layer 28, first signal conductor layers 30 and 32, second signal conductor layers 34 and 36, and interlayer coupling conductors v11 to v14. The planar ground conductor layer 28 is positioned on an upper main surface of the insulator layer 14h.
The first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are positioned on an upper main surface of the insulator layer 14i. Consequently, the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are positioned below the planar ground conductor layer 28 and above the planar ground conductor layer 18. The first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 overlap the planar ground conductor layers 18 and 28 assuming it is viewed in the up-down direction. The first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 each extend in the left-right direction.
The interlayer coupling conductor v1 electrically couples the first radiating conductor layer 20 and a right end portion of the first signal conductor layer 30. The interlayer coupling conductor v11 electrically couples a left end portion of the first signal conductor layer 30 and the outer electrode 24a.
The interlayer coupling conductor v2 electrically couples the first radiating conductor layer 20 and a right end portion of the first signal conductor layer 32. The interlayer coupling conductor v12 electrically couples a left end portion of the first signal conductor layer 32 and the outer electrode 24b.
The interlayer coupling conductor v3 electrically couples the second radiating conductor layer 21 and a left end portion of the second signal conductor layer 34. The interlayer coupling conductor v13 electrically couples a right end portion of the second signal conductor layer 34 and the outer electrode 26a.
The interlayer coupling conductor v4 electrically couples the second radiating conductor layer 21 and a left end portion of the second signal conductor layer 36. The interlayer coupling conductor v14 electrically couples a right end portion of the second signal conductor layer 36 and the outer electrode 26b.
As described above, the first signal conductor layers 30 and 32, the second signal conductor layers 34 and 36, and the planar ground conductor layers 18 and 28 have a stripline structure. With this, the first signal conductor layers 30 and 32 and the planar ground conductor layers 18 and 28 form the first matching circuit 50a. The second signal conductor layers 34 and 36 and the planar ground conductor layers 18 and 28 form the second matching circuit 50b.
As described above, the first matching circuit 50a is electrically coupled to the first radiating conductor layer 20 through the interlayer coupling conductors v1 and v2. The second matching circuit 50b is electrically coupled to the second radiating conductor layer 21 through the interlayer coupling conductors v3 and v4. The first matching circuit 50a and the second matching circuit 50b each are in contact with the insulator layers 14e to 14g (third insulator layers). Other structures of the multilayer substrate 10c are the same as those of the multilayer substrate 10, and thus a description thereof is omitted. The multilayer substrate 10c may achieve the same effects as those of the multilayer substrate 10.
With the use of the multilayer substrate 10c, the first matching circuit 50a and the second matching circuit 50b each are in contact with the insulator layers 14e to 14g (third insulator layers). The dielectric constant of each of the insulator layers 14e to 14g (third insulator layers) is lower than the dielectric constant of each of the insulator layers 14b to 14d (first insulator layers). With this, capacitance is less likely to be formed between the first signal conductor layers 30 and 32 and the planar ground conductor layers 18 and 28. Capacitance is less likely to be formed between the second signal conductor layers 34 and 36 and the planar ground conductor layers 18 and 28. Consequently, assuming a line width of each of the first signal conductor layers 30 and 32 and a line width of each of the second signal conductor layers 34 and 36 are increased, the capacitance value does not become excessively large. Thus, a resistance value of each of the first signal conductor layers 30 and 32 and a resistance value of each of the second signal conductor layers 34 and 36 may be lowered while maintaining a characteristic impedance of each of the first matching circuit 50a and the second matching circuit 50b at a desired characteristic impedance.
A multilayer substrate 10d according to a fourth modification will be described below.
The multilayer substrate 10d is different from the multilayer substrate 10c in the structure of the multilayer body 12. The multilayer body 12 has a first region A1 and a second region A2. The first region A1 is a region where the insulator layer 14a (first insulator layer), the insulator layers 14b to 14d (second insulator layers), and the insulator layers 14e, 14h, 14i, and 14j (third insulator layers) are present assuming it is viewed in the up-down direction (Z-axis direction). The second region A2 is a region where none of the insulator layer 14a (second insulator layer) and the insulator layers 14b to 14d (first insulator layers) are present, and the insulator layers 14e, 14h, 14i, and 14g (third insulator layers) are present assuming it is viewed in the up-down direction (Z-axis direction).
The first signal conductor layer 30 is electrically coupled to the first radiating conductor layer 20 through the interlayer coupling conductor v1. The first signal conductor layer 32 is electrically coupled to the first radiating conductor layer 20 through the interlayer coupling conductor v2. The second signal conductor layer 34 is electrically coupled to the second radiating conductor layer 21 through the interlayer coupling conductor v3. The second signal conductor layer 36 is electrically coupled to the second radiating conductor layer 21 through the interlayer coupling conductor v4. The first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 are in contact with the insulator layers 14h and 14i (third insulator layers), and extend from the first region A1 to the second region A2. Other structures of the multilayer substrate 10d are the same as those of the multilayer substrate 10c, and thus a description thereof will be omitted. The multilayer substrate 10d may achieve the same effects as those of the multilayer substrate 10c.
In the multilayer substrate 10d, the resistance value of each of the first signal conductor layers 30 and 32 and the resistance value of each of the second signal conductor layers 34 and 36 may be lowered for the same reason as in the multilayer substrate 10c. With this, even assuming the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 become long, insertion loss is less likely to occur in the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36.
In the multilayer substrate 10d, a thickness of the second region A2 in the up-down direction is smaller than a thickness of the first region A1 in the up-down direction. Thus, the second region A2 is more deformable than the first region A1. This makes it possible to use the multilayer substrate 10d with the second region A2 being bent.
A multilayer substrate 10e according to a fifth modification will be described below.
The multilayer substrate 10e is different from the multilayer substrate 10 in that the multilayer substrate 10e further includes a third radiating conductor layer 120 and a fourth radiating conductor layer 121. The third radiating conductor layer 120 is provided to the multilayer body 12 to be in contact with the insulator layers 14b and 14c (first insulator layers). The fourth radiating conductor layer 121 is provided to the multilayer body 12 to be in contact with the insulator layer 14a (second insulator layer). The fourth radiating conductor layer 121 is positioned above the third radiating conductor layer 120 (in the positive direction of the Z-axis), and overlaps the third radiating conductor layer 120 assuming it is viewed in the up-down direction (Z-axis direction).
An area of the fourth radiating conductor layer 121 is smaller than an area of the third radiating conductor layer 120. With this, a frequency of a fourth radio frequency signal (electromagnetic wave) radiated or received by the fourth radiating conductor layer 121 is higher than a frequency of a third radio frequency signal (electromagnetic wave) radiated or received by the third radiating conductor layer 120.
The first ground conductor layer 16 has an annular shape surrounding the first radiating conductor layer 20, the second radiating conductor layer 21, the third radiating conductor layer 120, and the fourth radiating conductor layer 121 assuming it is viewed in the up-down direction (Z-axis direction). Other structures of the multilayer substrate 10e are the same as those of the multilayer substrate 10, and thus a description thereof is omitted. The multilayer substrate 10e may achieve the same effects as those of the multilayer substrate 10.
The multilayer substrate according to the present disclosure is not limited to the multilayer substrate 10, 10a to 10e, and can be modified within the scope of the gist thereof. Further, the structures of the multilayer substrate 10 and 10a to 10e may be used with any combination.
The number of first insulator layers could be one or more.
The number of second insulator layers could be one or more.
The number of third insulator layers could be one or more.
Note that any one of the following may be satisfied: a frequency of an electromagnetic wave radiated or received by the second radiating conductor layer 21 is higher than a frequency of an electromagnetic wave radiated or received by the first radiating conductor layer 20; and the area of the second radiating conductor layer 21 is smaller than the area of the first radiating conductor layer 20.
Note that any one of the following may be satisfied: a frequency of an electromagnetic wave radiated or received by the fourth radiating conductor layer 121 is higher than a frequency of an electromagnetic wave radiated or received by the third radiating conductor layer 120; and the area of the fourth radiating conductor layer 121 is smaller than the area of the third radiating conductor layer 120.
Any one of the interlayer coupling conductors v1 and v2 may be provided alone. Any one of the interlayer coupling conductors v3 and v4 may be provided alone.
Further, the interlayer coupling conductors v1 may be provided alone. In the case above, the interlayer coupling conductor v1 is coupled to both the first radiating conductor layer 20 and the second radiating conductor layer 21, and is coupled to the outer electrode 24a as well. Both the first radio frequency signal and the second radio frequency signal are inputted to and outputted from the outer electrode 24a. Assuming the first radiating conductor layer 20 receives the first radio frequency signal and the second radiating conductor layer 21 receives the second radio frequency signal, a duplexer is coupled to the outer electrode 24a, for example. The duplexer separates the first radio frequency signal and the second radio frequency signal from each other.
The dielectric constant of the insulator layer 14a is not necessarily equal to the dielectric constant of each of the insulator layers 14e to 14g.
The first ground conductor layer 16 does not necessarily have an annular shape.
The first radiating conductor layer 20 is sandwiched by the first insulator layers in the up-down direction. However, the first radiating conductor layer 20 may be in contact with the insulator layer 14b (first insulator layer) alone or may be in contact with the insulator layer 14c (first insulator layer) alone.
The second radiating conductor layer 21 may be sandwiched by the second insulator layers in the up-down direction.
At least one of the first matching circuit 50a and the second matching circuit 50b could be in contact with the insulator layers 14e to 14g (third insulator layers).
At least one of the first signal conductor layers 30 and 32 and the second signal conductor layers 34 and 36 could be in contact with the insulator layers 14h and 14i (third insulator layers).
The present disclosure has the following structure.
(1)
A multilayer substrate, comprising:
The multilayer substrate according to (1),
The multilayer substrate according to (1) or (2),
The multilayer substrate according to (1) or (2),
The multilayer substrate according to any one of (1) to (4), further comprising:
The multilayer substrate according to any one of (1) to (5),
The multilayer substrate according to any one of (1) to (5),
The multilayer substrate according to any one of (1) to (7),
| Number | Date | Country | Kind |
|---|---|---|---|
| 2022-071274 | Apr 2022 | JP | national |
This is a continuation application of PCT/JP2023/010031, filed on Mar. 15, 2023, designating the United States of America, which is based on and claims priority to Japanese Patent Application No. JP 2022-071274 filed on Apr. 25, 2022. The entire contents of the above-identified applications, including the specifications, drawings and claims, are incorporated herein by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2023/010031 | Mar 2023 | WO |
| Child | 18918370 | US |
