Claims
- 1. In an acoustical transducer comprising
- a piezoelectric crystal having an electrically conductive surface plated thereon,
- an absorbant backing material placed against one surface of said crystal for dampening the oscillations thereof, and
- a housing for supporting the crystal and backing material,
- the improvement characterized by
- said backing material comprising a mixture of low melting point metal powder having a low acoustical impedance relative to said crystal to form a matrix into which is evenly distributed one or more metallic powders having a relatively high acoustical impedance, one of which is tungsten, said mixture formed into a cohesive solid having an acoustical impedance precisely matching the impedance of said crystal.
- 2. The transducer as claimed in claim 1 wherein said backing material is electrically conductive.
- 3. The transducer as claimed in claim 1 wherein said backing material is fuzed to said crystal plating.
- 4. The transducer as claimed in claim 1 wherein said backing material is in acoustical and electrical contact with said crystal plating.
- 5. The transducer of claim 1 wherein said low melting point metal powders have a melting point less than the Curie temperature of said crystal.
- 6. In an acoustical transducer comprising
- a piezoelectric crystal having an electrically conductive surface plated thereon,
- an absorbant backing material placed against one surface of said crystal for dampening the oscillations thereof, and
- a housing for supporting the crystal and backing material,
- the improvement characterized by
- said backing material comprising a mixture of a low melting point powder of InPb alloy having a low acoustical impedance relative to said crystal to form a matrix into which is added one or more powders of tungsten and copper having a high acoustical impedance relative to said crystal to form a cohesive solid having an acoustical impedance closely matching the impedance of said crystal.
- 7. In an acoustical transducer comprising
- a piezoelectric crystal having an electrically conductive surface plated thereon,
- an absorbant backing material placed against one surface of said crystal for dampening the oscillations thereof, and
- a housing for supporting the crystal and backing material,
- the improvement characterized by
- said backing material comprising a mixture of about 50% InPb 50--50 having size of less than 44 microns to form a matrix into which is added about 30% tungsten, having a size of less than 150 microns, and about 20% copper, having a size of less than 44 microns, to form a cohesive solid having an acoustical impedance closely matching the impedance of said crystal.
Government Interests
The U.S. Government has a paid-up license in this invention and the right in limited circumstances to require the patent owner to license others on reasonable terms as provided for by the terms of Contract No. F33615-80-C-5015 awarded by The Department of the Air Force.
US Referenced Citations (3)
Number |
Name |
Date |
Kind |
RE29785 |
Leschek et al. |
Sep 1978 |
|
2736823 |
Sheppard et al. |
Feb 1956 |
|
3553501 |
Thill |
Jan 1971 |
|