Multiple band antenna having isolated feeds

Information

  • Patent Grant
  • 6515627
  • Patent Number
    6,515,627
  • Date Filed
    Wednesday, February 14, 2001
    23 years ago
  • Date Issued
    Tuesday, February 4, 2003
    21 years ago
Abstract
The invention discloses a slot antenna having a pair of orthogonally oriented front and rear reflector panels. In one embodiment, the antenna assembly includes first and second front panels oriented approximately orthogonally to each other, said first and second front panels being coupled together and having a substantially elongate slot defined upon at least a portion of each of the first and second front panels, and first and second rear reflector panels oriented approximately orthogonally to each other, and disposed proximate the first and second front panels, and a feed terminal coupled to one of the first or second front panels, said feed terminal being coupled to an input/output RF connection point. The slot antenna according to the present invention may be disposed within an associated wireless communications device relative to a ground plane element of a printed wiring board, or may be disposed separately away from the associated wireless communications device.
Description




FIELD OF THE INVENTION




The present invention relates generally to antenna assemblies for wireless communication devices and systems, and in particular to multiple band antenna assemblies. The invention provides particular utility to multiple polarization antennas for with telecommunications devices, or other wireless devices.




BACKGROUND OF THE INVENTION




There is a need for a multiple band, isolated feed antenna assembly for efficient operation over a variety of frequency ranges. A further need exists for such an antenna to be suitable for mounting within a communication device and yet have little or no operational interference from other internal components of the device. In addition, there is a need for such antennas to provide polarization diversity, useful for reducing the effects of multipath.




Existing antenna structures for wireless devices include both external and internal structures. External single or multi-band wire dipole antennas are half wave antennas operating over one or more frequency ranges. The typical gain is +2 dBi. These antennas have no front to back ratio and therefore radiate equally toward and away from the user of the wireless device without Specific Absorption Rate (SAR) reduction. LC (inductor and capacitor) traps may be used to achieve multi-band resonances. The bandwidth near the head is limited to 80 degrees nominal.




Another external antenna structure is a single or multi-band asymmetric wire dipole. This antenna is a quarter wave antenna operating over one or more frequency ranges. The typical gain is +2 dBi. There is no front to back ratio or SAR reduction. LC traps may be used to achieve multi-band resonances. An additional quarter wave conductor is needed to achieve additional resonances. The beamwidth near the head is limited to 80 degrees nominal.




Internal single or multi-band antennas include asymmetric dipole antennas. These antennas include quarter wave resonant conductor traces, which may be located on a planar, printed circuit board. These antennas operate over one or more frequency ranges with a typical gain of +1 to +2 dBi, and have a slight front to back ratio and reduced SAR. These antenna structures may have one or more feedpoints, and require a second conductor for a second band resonance.




Another internal antenna structure is a single or multi-band planar inverted F antenna, or PIFA. These are planar conductors that may be formed by metallized plastics. PIFA operate over a second conductor or a ground plane. The typical gain for such antennas is +1.5 dBi. The front to back ratio and SAR values are dependent of frequency.




Yet other known antenna structures include quadrifilar helix and turnstile antenna structures providing circular polarization.




SUMMARY OF THE INVENTION




A multiple band antenna for internal installation in wireless communications devices is described. The antenna includes a plurality of feed points, one each for an associated transmission and reception band. Importantly, the antenna provides enhanced isolation between the plurality of feed points. Additionally, the antenna assembly may be incorporated within such devices with minimal operational interference.




Another object of the invention is to provide an antenna integrated upon a transceiver board for ease and economy of manufacture. The antenna assembly is of a compact size suitable for mounting directly on the printed wiring board of a wireless communications device. The antenna is preferably positioned at an upper rear side of the device.




The antenna assembly of the present invention also preferably provides a dual band antenna for wireless communications devices having separated feeds for each band and isolation between feed points in the range of 10-24 dB.




Other objects and advantages include the provision of: a dual band antenna that exhibits elliptical polarization in at least one of the bands; a relatively high bandwidth; and amenability to efficient mass production processes.




In one embodiment, the antenna assembly may be disposed away from the ground plane of an associated wireless communications device and coupled via a pair of signal transmission lines such as RF coax lines, microstrip transmission lines, coplanar wave guides, or other known signal transmission approaches as appreciated by those skilled in the arts.











BRIEF DESCRIPTION OF THE DRAWINGS





FIG. 1

is a perspective view of a wireless communications device incorporating an antenna assembly according to the present invention;





FIG. 2

is a detailed perspective view of the antenna assembly of

FIG. 1

;





FIG. 3

illustrates various view of the antenna assembly of

FIGS. 1 and 2

;





FIG. 4

is a perspective view of a wireless communications device incorporating another embodiment of an antenna assembly according to the present invention; and





FIG. 5

is a detailed perspective view of the antenna assembly of FIG.


4


.











DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS




Referring now to the drawings, wherein like numerals depict like parts throughout,

FIGS. 1 and 2

illustrate an antenna assembly


20


according to the present invention disposed near the upper rear portion of a hand-held wireless communications device


22


. The antenna


20


is disposed within the housing


24


of the wireless communications device


22


. The antenna assembly


20


according to the present invention includes a resonator structure


26


disposed relative to a ground plane


28


of the wireless communications device


22


. As depicted, the resonator structure


26


of the antenna assembly


20


is disposed at an upper end portion of a printed wiring board (PWB)


30


and is operatively coupled to the PWB


30


by a pair of signal feed elements


40


,


42


, including a high frequency feed element


40


and a lower frequency feed element


42


. The resonator structure


26


is illustrated as conductive sections disposed upon a dielectric substrate element


50


. Alternatively, the resonator structure


26


may be formed from bent metal elements or plated plastic components (not shown).




The resonator structure


26


includes a high frequency resonator


52


and a low frequency resonator


54


, each separately coupled to the ground plane


28


and respective input/output ports


56


,


58


on the printed wiring board


30


, and each sized to resonate at the respective frequency bands.




Referring to

FIGS. 1 and 2

, the resonator structure


26


includes an upper face surface


60


, a top surface


62


, a bottom surface


64


and left and right surfaces


66


,


68


. The upper face surface


60


, top surface


62


, and bottom surface


64


, each include portions of both high and low frequency resonator elements


52


,


54


. The left surface


66


includes a portion


82


of the low frequency resonator element


54


. The right surface


68


includes portions


92


,


94


of the high frequency resonator surface


52


.




The upper face surface


60


includes portions


70


,


72


of both the high and low frequency resonator elements


52


,


54


. The portion


70


of the high frequency resonator element


52


extends to the top, bottom, and right surfaces


62


,


64


,


68


. The portion


72


of the low frequency resonator element


54


extends between the top, bottom, and left surfaces


62


,


64


,


66


.




As shown in

FIG. 1

, the top surface


62


of the resonator includes a portion


74


of the high frequency resonator element


52


defining a high frequency feed point


76


. The high frequency feed point


76


is coupled via the high frequency feed element


40


to the high frequency input/output RF port


56


of the PWB


30


. The portion


74


extends between the upper face surface


60


and the right surface


68


. The top surface


62


further includes a portion


78


of the low frequency resonator element


54


defining a ground connection point


80


. As described in more detail hereinafter, the ground connection point


80


is coupled to the ground plane


28


of the PWB


30


via a low frequency grounding element


96


. The portion


78


extends between the upper face surface


60


and the left surface


66


.




As further shown in

FIGS. 1 and 2

, the left surface


66


of the resonator


26


includes a portion


82


of the low frequency resonator element


54


. The portion


82


extends between the upper face surface


60


, the top surface,


62


and the bottom surface


64


. The portion


82


is coupled to portions


72


,


78


, and


86


.




As shown in

FIG. 2

, the bottom surface


64


of the resonator includes a portion


84


of the high frequency resonator element


52


. The portion


84


extends to the upper face surface


60


and is coupled with portion


70


. The bottom surface further


64


includes a portion


86


of the low frequency resonator element


54


defining a low frequency feed point


88


. The low frequency feed point


88


is coupled to the low frequency input/output RF port


58


via the low frequency feed element


42


. The portion


86


extends between the upper face surface


60


and the left surface


66


and is coupled to portions


72


and


82


.




As further shown in

FIGS. 1 and 2

, the right surface


68


of the resonator includes a portion


90


of the high frequency resonator element


52


defining a high frequency ground connection point


92


. As described in more detail hereinafter, the high frequency ground connection point


92


is coupled to the ground plane


28


of the PWB


30


via a high frequency grounding element


98


. The portion


90


extends between the upper face surface


60


and the top surface


62


and is coupled to portions


70


and


74


. The right surface


68


further includes a portion


94


of the high frequency resonator element


52


which extends to the upper face surface


60


and surface


64


and is coupled to portion


70


.




Referring to

FIG. 1

, high frequency feed element


40


includes a first end which is operatively connected to the resonator structure


26


at feed point


76


, or portion


74


and a second end which is operatively connected to the PWB


30


at a high frequency RF 50 ohm input/output terminal or port


90


.




Referring to

FIG. 2

, low frequency feed element


42


includes a first end which is operatively connected to the resonator structure


26


at feed point


88


on portion


86


, and a second end which is operatively connected to the PWB


30


at a low frequency RF 50 ohm input/output terminal or port


92


.




High frequency grounding element


98


has two ends, one end of which is operatively coupled to portion


90


of the high frequency resonator element


52


. The other end of the high frequency grounding element


96


is operatively connected near the top of the PWB


30


to the ground plane


28


in a conventional manner. Low frequency grounding element


96


has two ends, one end of which is operatively coupled to portion


78


of the resonator element


54


. The other end of the low frequency grounding element


96


is operatively connected near the top of the PWB


30


to the ground plane


28


in a conventional manner.




The antenna assemblies


20


of

FIGS. 1 and 2

are sized to function over two different frequency bands, such as 880-960 MHz and 1710-1880 MHz or 824-894 MHz and 1850-1990 MHz.

FIG. 3

illustrates views of the resonator element


26


of the antenna assembly


20


of the present invention. Dimensions of the features of the components indicated in

FIG. 3

are as follows:



















Item




Dimension (in.)



























a




1.47







b




1.34







c




1.24







d




.792







e




.774







f




.655







g




.363







h




.278







i




.276







j




.148







k




1.47







l




.159







m




.250







n




.281







o




.315







p




.79







q




.459







r




.558







s




.79







t




.315







u




.505







v




.666







w




.79







x




.437







y




.315







z




.299







aa




.126







bb




.588







cc




.427







dd




.280







ee




.208







ff




.078







gg




.227







hh




.240







ii




.355







jj




.576







kk




.248







ll




.446
















FIGS. 4 and 5

illustrate another embodiment of the antenna assembly


120


according to the present invention. The resonator structure


126


includes a high frequency resonator


152


and a low frequency resonator


154


, each separately coupled to the ground plane


128


and respective input/output ports


156


,


158


on the printed wiring board


130


, and each sized to resonate at the respective frequency bands.




The resonator structure


126


includes an upper face surface


160


, a top surface


162


, a bottom surface


164


, and left and right surfaces


166


,


168


. The upper face surface


160


, top surface


162


, and bottom surface


164


, each include portions of both high and low frequency resonator elements


152


,


154


. The left surface


166


includes a portion


190


of the high frequency resonator element


152


. The right surface


168


includes a portion


182


of the low frequency resonator surface


154


.




The upper face surface


160


includes portions of


170


,


172


both the high and low frequency resonator elements


152


,


154


. The portion


170


of the high frequency resonator element


152


extends to the top, bottom, and left surfaces


162


,


164


,


166


. The portion


170


is coupled to portions


174


,


184


,


190


. The portion


172


of the low frequency resonator element


154


extends between the top, bottom, and right surfaces


162


,


164


,


168


. The portion


172


is coupled to portions


178


,


182


,


186


.




As shown in

FIG. 4

, the left surface


166


of the resonator includes a portion


190


of the high frequency resonator element


152


defining the high frequency feed point


176


. The high frequency feed point


176


is coupled via the high frequency feed element


140


to the high frequency input/output RF port


156


of the PWB


130


. The portion


190


of the high frequency resonator element


154


further defines a ground connection point


192


. As described in more detail hereinafter, the ground connection point


192


is coupled to the ground plane


128


of the PWB


130


via a high frequency grounding element


198


.




As further shown in

FIGS. 4 and 5

, the right surface


168


of the resonator


126


includes a portion


182


of the low frequency resonator element


154


. The portion


182


extends between the upper face surface


160


, the top surface


162


, and the bottom surface


164


. The portion


182


is coupled to portions


172


,


178


, and


186


.




As shown in

FIG. 5

, the bottom surface


164


of the resonator includes a portion


184


of the high frequency resonator element


152


. The portion


184


extends to the upper face surface


160


and left surface


166


, and is coupled to portions


170


and


190


. The bottom


164


further includes a portion


186


of the low frequency resonator element


154


. The portion


186


extends between the upper face surface


160


and the right surface


166


and is coupled to portions


172


and


182


. A tuning capacitor


202


may be coupled between the conductive portion


186


and the ground plane circuit


130


.




The top surface


162


of the resonator includes a portion


178


of the low frequency resonator element


154


defining a low frequency ground connection point


180


. As described in more detail hereinafter, the low frequency ground connection point


180


is coupled to the ground plane


128


of the PWB


130


via a low frequency grounding element


196


. The portion


178


extends between the upper face surface


160


and the right surface


168


and is coupled to portions


172


and


182


. The portion


178


further defines a low frequency feed point


178


. A low frequency feed element


142


includes a first end which is operatively connected to the resonator structure


126


at feed point


178


, and a second end which is operatively connected to the PWB


130


at a low frequency RF 150 ohm input/output port


158


.




High frequency feed element


140


includes a first end which is operatively connected to the resonator structure


126


at feed point


176


on portion


174


and a second end which is operatively connected to the PWB


130


at a high frequency RF


150


ohm input/output terminal or port


156


.




The resonator structure


126


includes high and low frequency grounding points


192


,


180


, and high and low frequency grounding elements


198


,


196


. High frequency grounding element


198


has two ends, one end of which is operatively coupled to portion


190


of the high frequency resonator element


152


. The other end of the high frequency grounding element


198


is operatively connected near the top of the PWB


130


to the ground plane


128


in a conventional manner. Low frequency grounding element


196


has two ends, one end of which is operatively coupled at ground point


180


. The other end of the low frequency grounding element


196


is operatively connected near the top of the PWB


130


to the ground plane


128


in a conventional manner.




The view of

FIGS. 1

,


2


,


4


, and


5


are not necessarily to scale, but illustrate possible orientations and components of a wireless communications device including an antenna assembly according to the present invention.




It should be noted that the drawings may indicate proportions and dimensions of components of the antenna device. However, e.g., thickness of conductive layers have been exaggerated for clarity. Although, in many embodiments conductive layers have been mentioned, it is understood that it includes the use of conductive plates, foils, etc., possibly attached, secured, or otherwise disposed upon dielectric substrate(s).




With knowledge of the present disclosure, other modifications will be apparent to those persons skilled in the art. Such modifications may involve other features which are already known in the design, manufacture and use of antennas and component parts thereof and which may be used instead of or in addition to features already described herein. Such modifications may include alternative manufacturing processes to form the various antenna portions, e.g., for example, conductive material selectively plated over dielectric substrate or dielectric materials, and plated plastic components and conductive foil elements. In an alternative, the antenna assembly


120


may be operatively coupled to the PWB


30


,


130


via a coaxial RF cable, a strip line feed, a ground portion of a coplanar wave guide, or other methods as known to those skilled in the relevant arts. Additionally, while the preferred embodiments have been described herein as applying to the wireless local area network frequencies, operation in alternative bandwidths may also be feasible. Those skilled in the relevant arts will appreciate the applicability of the antenna assembly of the present invention to alternative bandwidths by proper scaling of the antenna components, etc. Still other changes may be made without departing from the spirit and scope of the present invention.



Claims
  • 1. An antenna assembly for a multiple-band wireless communications device, comprising:a circuit board element defining at least a ground plane and a pair of input/output RF connection points; and first and second resonator structures, each of the resonator structures including a plurality of orthogonal conductive elements, each of the resonator structures being connected to the ground plane and to one of the pair of RF connection points, and each of the resonator structures including at least one conductive corner structure wherein three of the orthogonal conductive elements are coupled together.
  • 2. The antenna assembly of claim 1 wherein the first and second resonator structures are disposed upon a dielectric substrate element.
  • 3. The antenna assembly of claim 2 wherein the dielectric substrate element is substantially rectangular.
  • 4. The antenna assembly of claim 2 wherein the dielectric element includes plated portions and the resonator structures are the plated portions of the dielectric substrate element.
  • 5. The antenna assembly of claim 1 wherein the first and second resonator structures are formed from bent conductive material.
  • 6. The antenna assembly of claim 5, further comprising:a tuning capacitor element operatively coupling one of the resonator structures to the ground plane of the wireless communications device.
  • 7. The antenna assembly of claim 1, wherein each of the resonator structures are coupled to the ground plane and to one of the pair of RF connection points on different ones of the plurality of orthogonal conductive elements.
  • 8. An antenna assembly for a multiple-band wireless communications device, comprising:a board element defining at least a ground plane and a pair of input/output RF connection points; and first and second resonator structures disposed in side by side relation a predetermined distance away from the ground plane, each of the resonator structures including a plurality of orthogonal conductive elements, each of the resonator structures including at least one conductive corner structure wherein three of the orthogonal conductive elements are coupled together, and each of the resonator structures being connected to the ground plane and to one of the pair of RF connection points.
  • 9. The antenna assembly of claim 8 wherein the first and second resonator structures are disposed upon a dielectric substrate element.
  • 10. The antenna assembly of claim 9 wherein the dielectric substrate element is substantially rectangular.
  • 11. The antenna assembly of claim 9 wherein the dielectric element includes plated portions and the resonator structures are the plated portions of the dielectric substrate element.
  • 12. The antenna assembly of claim 8 wherein the first and second resonator structures are formed from bent conductive material.
  • 13. The antenna assembly of claim 8, wherein each of the resonator structures are coupled to the ground plane and to one of the pair of RF connection points on different ones of the plurality of orthogonal conductive elements.
  • 14. The antenna assembly of claim 8, further comprising:a tuning capacitor element operatively coupling one of the resonator structures to the ground plane of the wireless communications device.
  • 15. An antenna element for a wireless communications device having a circuit board element defining a pair of input/output RF connection points and a pair of ground connection points, said antenna element comprising:a pair of resonator structures, each of the pair of resonator structures being connected to one of the ground connection points and to one of the RF connection points, wherein each of the pair of resonator structures includes a top surface portion and a plurality of substantially orthogonal side portions coupled to top surface portion, and wherein each of the pair of resonator structures defines at least one conductive corner structure defined by three of the side portions which are coupled together.
  • 16. The antenna element of claim 15 wherein the pair of resonator structures are disposed upon a dielectric substrate element.
  • 17. The antenna element of claim 16 wherein the dielectric substrate element is substantially rectangular.
  • 18. The antenna element of claim 15 wherein the dielectric element includes plated portions and the resonator structures are the plated portions of the dielectric substrate element.
  • 19. The antenna element of claim 15 wherein the pair of resonator structures are formed from bent conductive material.
  • 20. The antenna element of claim 15 further comprising:a tuning capacitor element operatively coupling one of the resonator structures to the ground plane of the wireless communications device.
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