Patent Application
20190151996
Biosensor test strips are typically formed as a series of biosensor test elements on a relatively thin, continuous film material. The film material facilitates the handling of the test strips while various test strip features are provided. These steps may include, for example, the formation of electrodes and the application of reagents. The continuous film material is subsequently divided into individual test strips. In this process, the line of division of the test strips may be quite close to relatively sensitive test components, such as the electrodes and reagent. It is therefore desirable to perform this separation with precision and minimum disruption, while also having relatively high processing speeds.
There may also be a desire to cut off an end portion, such as at the dosing end, of a test strip to provide desired edge properties. In that circumstance, it is desirable to provide specified edge characteristics, without damaging the test components.
It has been conventional to mechanically slit biosensor film materials to separate the test strips. However, film deflection during this slitting operation may cause reagent layers and electrodes to crack. Reagent and electrode cracking may lead to variation in test strip performance, resulting in inaccurate test results or failed tests indicated by error codes on a meter. The film deflection may also deform the physical shape of the test strip, which could for example affect dosing or capillary transport of a test sample to the testing site. Moreover, problems with the slitter blades during set-up or batch processing can lead to increased manufacturing cost due to yield loss, production delays, quality checks, and the like.
In one approach, test strips are formed in a “2-up” process. In this process, a single film material is used to form two series of test elements on opposite sides of a centerline extending between what will be the dosing ends of the test strips. Separating these two series of test elements along the centerline requires cutting the film material in the narrow space between the opposed test elements. In certain situations, the working area of the biosensors is located adjacent to and on opposing sides of the cut line. A mechanical slitting process therefore has a narrow operating window where the slitter blade and film interaction must be carefully controlled. When slitting and separating a 2-up film into two products, the mechanical slitter blade also may produce opposing products with slightly asymmetrical cut edge geometry and different reagent layer cracking patterns. This may result in strip performance differences in product generated on opposing sides of the blade.
Laser slitting has been known for dividing biosensor test strips formed on a continuous film material. The use of lasers to some extent addresses problems associated with mechanical slitting of biosensors by avoiding film deflection, providing improved edge geometry, and minimizing reagent layer cracking. However, slitting completely through a film material can be detrimental to product performance when the reagent layer is heated, and/or debris produced by the laser cutting is deposited on the reagent surface.
A method is provided for slitting a film material of a biosensor test strip. The test strip comprises a substrate having a bottom surface and an opposed working surface, the working surface including functional components of the test strip. The methods use separate laser beams which cut into the substrate—one directed at the bottom surface and the other directed at the working surface. The film material is moved relative to the bottom and working surface laser beams. The bottom laser beam partially cuts into the bottom surface of the film material, and the working surface laser beam cuts into the working surface. The bottom laser cut and working surface laser cut may overlap and fully separate the film material into two portions, or the two cuts may not overlap, leaving a small bridge connection between the two portions of the film material.
It is an object of the present invention to provide a method which reduces substrate deflection during test element singulation to form test strips and which therefore results in less reagent and electrode cracking.
Another object of the invention is to cut biosensor test strips with reduced damage to reagents, electrodes, structural members and other components of the biosensor test strips.
It is a further object of the present invention to provide a method for cutting biosensor test strips with minimized kerf width, a smaller heat affected zone (HAZ), lower recast, and reduced deposit of debris on the working surface of a biosensor test strip.
Further forms, objects, features, aspects, benefits, advantages, and embodiments of the present invention will become apparent from a detailed description and drawings provided herewith.
For the purpose of promoting an understanding of the principles of the invention, reference will now be made to the embodiments illustrated in the drawings and specific language will be used to describe the same. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended. Any alterations and further modifications in the described embodiments, and any further applications of the principles of the invention as described herein are contemplated as would normally occur to one skilled in the art to which the invention relates. One embodiment of the invention is shown in great detail, although it will be apparent to those skilled in the relevant art that some features that are not relevant to the present invention may not be shown for the sake of clarity.
Disclosed herein are methods for producing biosensor test strips in quantity and at rapid rates. Each test strip includes a bottom surface on one side, and a working surface on the other side. The term “working surface” refers to a surface of a test strip substrate containing various test components, such as the dosing location for receiving analyte samples, the sample receiving chamber, the capillary passageway leading from the dosing location to the sample receiving test chamber, and the electrodes and reagent positioned within the test chamber. In one embodiment, the test strips are produced by forming a number of working surfaces on one side of a continuous film material, and then dividing the film material into individual test strips. In some instances, the bottom surface may also include working components.
In particular, the individual test strips are separated from the continuous film material by laser cutting the film material. The methods provide separate, controlled-depth cutting of the opposed bottom and working surfaces of the film material using at least a bottom laser beam and a working surface laser beam. The bottom laser beam is used to partially cut into the bottom surface of the film material. The working surface laser beam is used to cut into the working surface. The bottom and working surface laser beams may come from two separate lasers or from a single laser having a split beam. The cuts may be made in a single pass or in multiple passes.
Laser cutting, in general, works by passing the output of a high-power laser through optics which are used to direct the laser beam against the material to be cut. The focused laser beam is directed at the material, which then either melts, burns, vaporizes, or is blown away by a jet of gas. Material removal can occur via photothermal interaction and/or photoablation depending on laser and material type. Along with the removal of material, laser cutting has several attendant consequences. For example, the amount of material removed, the “kerf”, will vary, impacting the character of the resulting edge surface such as smoothness, and angle and depth of the cut. The laser beam also will heat the surrounding material, which may result in recast and/or affect the integrity or nature of the surrounding material including nearby electrodes and reagent.
There are several types of lasers currently used in laser cutting, including CO2 lasers, UV lasers, neodymium (Nd)-based lasers and other semiconductor based solid state lasers. Each type of laser provides a different quality of cut for a given film material. Moreover, each type of laser is operable at varying parameters, which also provide differing cuts. It is envisioned the laser providing the bottom laser beam will be of a different type than the laser providing the working surface laser beam. In one embodiment, the disclosed processes utilize a CO2 laser, optionally a pulsed CO2 laser, to provide the bottom laser beam, and a UV laser, optionally a picosecond (“PS”) UV laser, to provide the working surface laser beam.
The inventive methods utilize laser beams in which the bottom laser beam is relatively “coarse” as compared to the working surface laser beam, which is a relatively more “fine” laser beam. The term “coarse” as used herein with respect to a laser or laser beam is a relative term. A coarse laser beam is one which results in less controlled or less desired characteristics of the produced cut. For example, a coarse laser may produce a wider kerf, a shallower cut angle, a larger HAZ, more recast, and/or more debris as compared to a “fine” laser beam. A coarse laser beam, as compared to a fine laser beam, may also be more likely to damage the working surface components.
The disclosed processes provide for a significant portion of the cutting of the film material to use a “coarse” laser system on the bottom surface without the bottom laser cut extending through to the other side of the film material. The laser cut on the bottom surface only extends part way into the film material, and therefore does not present the laser beam directly against or adjacent to the working surface. The rough bottom cut thus presents reduced risks to the components on the working surface since the cut does not go all the way through the film material.
The bottom, coarse laser may therefore operate under conditions that are more severe than for the working surface laser. This provides advantages in that the bottom laser beam may cut a major portion of the thickness of the test strip, leaving less thickness for the working surface laser beam to cut. The bottom laser beam accordingly may operate at a faster material removal rate (material volume per unit time), create a larger kerf width, have a larger HAZ, and result in a higher debris and recast than the working surface laser beam.
In contrast, the working surface laser uses a “fine” laser beam for cutting into the working surface of the film material. The working surface laser may operate under conditions which create less disruption to the test strip substrate and the components of the working surface. For example, the fine laser beam may operate at a lower material removal rate, create a narrower kerf, have a smaller HAZ, and result in lower debris and recast than the bottom laser.
With the understanding that the material removal rates are different for the coarse and fine laser beams, film processing speeds can be maximized by optimizing relative laser beam cut depths. The disclosed processes thereby allow for the rapid and efficient production of test strips while yielding test strips for which the components of the working surface have improved properties. The components may, for example, be more uniform in structure and function, have improved integrity, and provide more accurate test results. Further, the test strips have improved edge smoothness and cut angle. Less variability occurs than when mechanical slitting causes deflection of the film material during cutting.
Referring to
Bottom laser system 22 directs bottom laser beam 24 in the direction of centerline 20 of bottom surface 14. Working surface laser system 26 directs working surface laser beam 28 in the direction of centerline 20 of working surface 12. In this exemplary embodiment, both of the bottom and working surface laser beams are stationary relative to an external supporting surface and film material 10 is moved at a constant rate in direction 30 relative to the laser beams.
The film material in the method depicted in
As represented in
As shown in
The process is shown in
The described processes involve providing relative movement between the film material and the bottom and working surface laser beams. There are generally three different configurations of laser cutting machines for providing such relative movement: moving material, hybrid, and flying optics systems. These terms refer to the way that the laser beam and material to be cut are moved relative to one another. Moving material laser systems have stationary cutting heads and move the material under them (X and Y axis directions). Hybrid laser systems provide a method which moves the material being processed in one direction (usually the X-axis direction), and the laser beam is moved along the shorter (Y) axis. Flying optics lasers feature a stationary table and a cutting head with laser beam that moves over the workpiece in both of the horizontal dimensions (X and Y axis directions). The disclosed methods are operable with respect to each of these types of systems and any combination thereof. In a preferred method, the bottom and working surface laser beams are stationary except when adjusting for centerline 20 position, and the film material is moved relative thereto.
The result of laser cutting is a cut edge with a surface profile and finish which depend on the type and operating conditions of the laser system(s). The present processes involve an approach in which at least two laser beams are used. Generally, the relatively “coarse” bottom laser beam is more disruptive or provides less desirable results in terms of any one or more of several factors. Thus, the processes described herein present distinct advantages over a single cut-through laser directed at either the working surface or bottom surface. Further, the laser cutting is a contactless operation and does not have many of the disadvantages associated with mechanical slitting of the film material.
A laser burns away and/or vaporizes a portion of material when it cuts into the material. This material is known as the laser “kerf”. There are a number of factors involved with respect to the kerf. These include, inter alia, the total amount of material removed, the width of the cut at the level of the material surface, and the shape and depth of the cut. These characteristics in turn depend on a number of factors, including the properties of the material being cut, its thickness, laser power, laser wavelength, laser pulse frequency, laser pulse width, laser beam geometry (size and shape), focal length of the laser lens, type of laser assist gas and relative speed of the laser beam to the material being processed.
Advantages are obtained with a small kerf in that it reduces the amount of material lost during the cutting process, it allows close nesting of parts, and it may reduce the time required for the cut. However, the width of the cut will depend in part on the depth of the cut, as the sides of the cut have an angle such that the width at the material surface is greater than the width at the bottom of the cut. This means that the width at the material surface increases with the depth of cut required. Cutting a film material entirely through from one side thus presents a relatively wide cut as compared to cutting the film material in a two-step process as described herein, once from one side and once from the other side. This also means that the total amount of removed material may be greater with only a single cut from one side, which in turn may generate additional debris and require more energy and time to accomplish.
Certain laser cutting essentially vaporizes much of the kerf. However, in almost all settings, the laser cutting will release particles or otherwise generate debris. It is therefore the case that this produced debris may become deposited on an adjacent surface of the film material. It is desirable to minimize this debris as it can adversely affect many aspects of a biosensor test strip, including sample transport and functioning of the electrodes and reagent.
The “cut character” refers to the precision and smoothness of the line along which the cutting occurs along the surface of the film material. It also refers to the angle of the edge surface formed by the laser cut relative to the bottom or working surface of the film material. Laser cutting according to the present processes allows for optimization of the cut character, particularly along the working surface edge adjacent to the working components of the biosensor test strip. In another aspect, for a film material having multiple biosensor test strips, such as in a 2-up process, it is desirable to have the cut on the working surface of the film material precisely positioned, and to have a well-defined surface edge and profile.
Laser cutting presents varying degrees of heat in the area being cut. The resulting HAZ will vary depending on the type of laser, its operating parameters, the nature of the film material, and other factors. This HAZ may affect portions of the test strip in or near the zone. It may have particular affect on the structure of the opening to the capillary chamber, the electrodes and/or the reagent.
Laser cutting can leave a recast layer 54 (
Analyte reagents may include components which are sensitive to exposure to UV rays. There is therefore a risk in using a UV laser directed at the working surface of a biosensor test strip. If a UV laser is to be used, care must be taken to avoid contacting the reagent material.
The dual laser cuts on the bottom surface and working surface allow for separation of the film material. In one approach, the cuts are overlapping such that they intersect, and the film material is fully separated by virtue of the cuts alone. In another approach, the cuts are not overlapping and leave a small bridge of connective material remaining. In the latter case, the separation of the film material is completed in simple fashion, such as by passing the film material over a film guide to physically pull the film material apart.
For intersecting cuts, the vertical alignment simply involves having the two cuts overlap. With the bottom laser cut being made before the working surface laser cut, the bottom laser cut occurs while the working surface is not exposed. The film material is therefore moved relative to the bottom laser beam and the working surface laser beam in a process direction such that the bottom laser beam contacts the film material first. The working surface laser is then positioned relative to the film material such that the working surface laser beam contacts the film material second, after the bottom laser beam has made its cut.
In the alternative, the bottom and working surface laser cuts do not intersect. For such non-overlapping laser cuts, the order of cutting is less relevant. That is, regardless of the order, the bottom laser cut is made without exposure to the working surface as the connecting material seals away the working surface from the bottom laser beam. Thus, in one embodiment the bottom laser and the working surface laser may be positioned with the bottom laser beam making its cut first, as for intersecting cuts. However, for non-overlapping cuts the film material alternatively may as well be contacted by the working surface laser beam first, followed by contact by the bottom laser beam.
The working surface laser is selected to provide improved cutting over the bottom laser in terms of reducing any or all of the following: kerf, the HAZ, the recast, the amount of debris deposited on the working surface, and the amount of damage to the electrodes, reagents or other working components of the biosensor test strip. In this manner, the type and operating conditions of the working surface laser and the bottom laser are selected such that production throughput is high while the resulting laser cut at the working surface is in excellent condition. The produced biosensor test strips also have enhanced product performance.
In its broadest application, the present concept allows for improved laser cutting of the working surface of a biosensor test strip regardless of the relative characteristics of the working surface laser beam compared to the bottom laser beam. As presently disclosed, the use of separate bottom and working surface laser beams allows for rapid processing with advantageous cut properties along the working surface. The bottom laser is used to cut part way into the film material, thereby reducing the depth of cut required by the working surface laser.
Even if the working surface laser beam is inferior as to some characteristics, the use of the bottom laser beam results in the working surface laser beam doing less cutting into the working surface, which correspondingly reduces the affect of kerf, HAZ, recast, debris, etc. as compared to a full cut-through of the film material in one direction.
For the same reasons, the present processes also provide advantages with respect to an embodiment in which the same or equivalent bottom and working surface laser beams are used. These approaches may be desirable, for example, as the process may be performed with two identical laser systems, thus providing advantages in terms of maintenance and other considerations for the laser systems. This could also be done by use of a split laser beam in which separate portions of the laser beam are directed against the bottom surface and the working surface of the film material, providing increased film cutting efficiency, reduced deposited debris and improved cut symmetry.
The working surface laser beam is selected to provide the cut characteristics desired for the edge of the working surface of the biosensor test strips. The type and/or operating parameters of the working surface laser beam are established to achieve one or more desired cut properties. This in turn may establish other characteristics of the cut and the production process, such as depth of cut or line speed.
Specification of the working surface laser beam may be based on any of several different factors. A particular consideration for the working surface laser beam is the optimization of certain quality factors. The factors may include optimizing any of the previously described cut characteristics such as kerf width, debris, etc. It is desirable, for example, that the working surface laser beam be based more on photoablation of kerf material, rather than thermal interaction, as it produces less debris, and therefore less need to remove debris during the process. The working surface laser may produce as compared to the bottom laser beam a more precise and uniform cut line and angle. As another example, lower HAZ and/or recast are desirable as they reduce the likelihood of damage to nearby working components such as the reagent and electrodes. Other factors may include practical considerations based on the type of laser systems available, including cost, power requirements and the like.
The working surface laser may be of a type and/or operate under conditions to provide a finer, more precise cut edge. Since less depth of cut and removal of kerf is involved than for cutting fully through the film material, the working surface laser is able to provide the desired cut in less time. Where the bottom laser cuts to a greater degree than the working surface laser, the working surface laser is even better able to complete the relatively “fine” cut under less harsh conditions, and still accomplish the cut in the same time required for the bottom laser to make its cut.
A factor in the production of commercial quantities of biosensor test strips is the line speed of the film material on which the biosensors are formed. The present invention illustratively allows for higher quality working surface cuts at faster film speeds than with a single, cut-through laser. For example, working surface cuts with a fine working surface laser can accomplish film speeds of at least 20 m/min.
When a UV laser is used to cut into the working surface, it is advantageous that the working surface laser beam may be more focused in accordance with the present invention. This lessens the risk of a UV laser damaging the reagent. If a UV laser is used, it is desirable that the laser beam be relatively small to minimize or eliminate the potential for reducing the efficacy of the enzymes, mediators or other components of the reagent.
The bottom laser beam is selected to coordinate with the working surface laser beam to be used. For example, the bottom laser beam preferably cuts at the same line speed as the working surface laser beam, and also cuts to a depth of cut sufficient to closely approach or connect with the cut by the working surface laser beam. The bottom laser typically has a faster processing speed, a more thermal and larger kerf width, a larger HAZ, and/or a higher recast than the working surface laser.
In one embodiment, the bottom laser cuts into the film material to a greater depth than the working surface laser. In this respect, the bottom laser is of a type and/or operates under parameters such that a deeper cut can be made in the same amount of time as the shallower cut into the working surface. The bottom cut may also be wider as the additional loss of “kerf”, and resulting debris, is of less consequence at the bottom surface of the test strip. By using a working surface laser that results in reduced kerf, the amount of material which may become deposited on the components of the working surface is correspondingly reduced. Since a significant portion of the kerf is produced on the underside of the film material, it is remote from the working surface and will not contribute appreciably to any deposit of material on the working surface. Further, the edge properties at the bottom surface are also of less consequence as it is not directly involved in the dosing of liquid to the test strip.
Illustratively, two lasers were used with a pulsed CO2 laser operating as the bottom laser, and a picosecond UV (PS UV) laser functioning as the working surface laser. In this example, the CO2 and UV laser systems and beams were positioned at a stationary point and the film material was constantly moved relative to the laser beams. The laser cuts overlapped in the vertical direction, thereby completely separating the PET into first and second portions.
This combination of lasers exemplified the advantageous results achieved by the dual laser approach disclosed herein.
The process was performed on PET film of a type used in the production of biosensor test strips. A pulsed CO2 laser was used as it was known to cut PET film efficiently, enabling suitably fast film processing speeds. While the PET film was in motion, the bottom laser cut (upstream) was made by the pulsed CO2 laser into the bottom of the film. The laser made a controlled-depth cut into the majority of the film thickness (approximately 72%-96%). The laser cut into the bottom surface without breaking through to the working surface of the biosensor to better protect the working surface from damage, minimize debris deposited on the reagent surface, and minimize heat transfer to the reagent surface. The high removal rate of the pulsed CO2 laser facilitated faster production processing speeds
Pulsed CO2 lasers typically have beam diameters focused to 50-60 μm, depending on set-up. When used for providing the bottom laser beam, this resulted in a tapered cut profile with a wider cut at the bottom surface of the film material where it is not significant and a narrow cut toward the top of the film where the cut will be adjacent, or connect with, the cut of the working surface laser beam.
However, the CO2 laser produced a larger kerf width, had higher levels of recast, and was more thermal, resulting in a larger HAZ, than the PS UV laser. The relatively larger focused beam diameter of the CO2 laser affected a larger section of film material. The resulting higher recast at the edge of the working surface might have negatively affected biosensor dosing behavior if on the working surface side, but it was readily acceptable on the bottom surface. Thus, use of a single pulsed CO2 laser would have been less suitable, or completely unsuitable, as a cut-through laser, but it was useful in accordance with the present invention.
IR energy from the pulsed CO2 laser was readily absorbed by the PET. The highly thermal cutting process easily cut the PET film. The controlled-depth cut positioned well below the reagent layer minimized heat transfer and any associated thermal damage to the reagent. It also enabled faster film slitting speeds. After accounting for laser characteristics and system set-up, controlled-depth cutting into the bottom of the PET film without breaking through to the top surface led to less debris in the functional area of the biosensor
A PS UV laser was used to provide the working surface laser beam. The PS UV laser was significantly less thermal (more photonic bond breaking). It also slit the biosensors with a smaller kerf width, smaller HAZ, and lower recast. The PS UV laser had a relatively smaller focused beam diameter and picosecond pulse duration, and therefore cut the PET with minimal film and reagent damage. The resulting minimal recast at the edge of the working surface had a less deleterious effect on the biosensor dosing behavior.
In contrast, using a single PS UV laser to cut through the PET would not have allowed the fast film slitting speeds, as the PS UV laser cuts PET film less efficiently, requiring slower film processing speeds. On the other hand, using multiple PS UV laser systems to increase the biosensor slitting speed (production throughput) would be cost prohibitive.
The picosecond UV laser (PS UV) was characterized by a beam diameter focused to a 7-15 μm diameter, providing a very narrow cut width in the PET film. This minimized wasted reagent and PET film in the functional area of the biosensor. The UV wavelength and pulse duration (<15 ps) minimized heat transfer and thermal damage to the reagent layer. After accounting for laser characteristics and system set-up, controlled-depth cutting into the top of the PET film with the PS UV laser led to less debris in the functional area of the biosensor. The small, controlled-depth cut through the reagent layer into the PET enabled faster film processing speeds.
While the PET film was in motion, the working surface laser cut (downstream) was made by the PS UV laser into the working surface of the film. The laser made a controlled-depth cut into the remaining film thickness (approximately 4%-28%), separating the film material into two separate, opposing portions. The laser cut through to the preceding bottom-side laser cut without damaging the working surface of the biosensor by minimizing heat transfer, recast and debris on the reagent surface. Using the PS UV laser for a small portion of the overall required cut depth facilitated faster production processing speeds
The use of CO2 and UV lasers was by way of example only. As has been described, the selection of the bottom and working surface laser beams may readily be made by a person of ordinary skill in the art based on the present teachings. The selection may depend on the materials being divided, desired cut characteristics, and other considerations. An advantage is obtained by using suitable lasers in the manner that the bottom surface may be cut in a more expedient manner without affecting the working surface components. The working surface laser then is selected to provide conditions with less disruption, e.g., less kerf, HAZ, recast, and debris.
Alternatively, the controlled-depth cuts may be made without overlapping. This is accomplished by having the bottom and working surface laser beams leave a small bridge of uncut film material. Shown in
In this example, both the CO2 laser and the UV laser beams were stationary and the film material was constantly moved relative thereto. The controlled-depth laser cuts did not overlap in the vertical direction and a subsequent film guide separated the film material into two portions.
A third option is to provide only intermittent regions where the cuts by the working surface and bottom laser beams intersect. For example, the energy of the bottom or working surface laser beam may be increased at successive, spaced times to cause a cut by the beam which alternates between a relatively shallow cut and a relatively deeper cut. This cut is provided to a depth such that the cut connects with the opposed laser cut only where the relatively deeper cuts are made. The result is a series of through-holes forming a perforated line between the first and second portions of film material. This maintains the connection between the two portions, subject to later separation. This also provides a serrated edge upon separation. In some situations, the serrated edge is located adjacent to the location where a blood or other sample will be applied to the biosensor test strip. This can be advantageous because the serrated edge may assist in breaking the surface tension of the sample, which then promotes transfer of the sample to the test chamber.
In another aspect, the working surface and bottom surface may be cut at multiple times in a single pass of the film material. Referring in particular to
Thus, advantages may be achieved by making multiple cuts which will modify the results that would otherwise occur if only a single cut was made to the same depth. For example, this more efficient PS UV laser cutting method delivers deeper PS UV controlled-depth cuts at a particular film speed and focused spot size, with minimal debris deposited on the reagent surface. This in turn allows the pulsed CO2 cut and its associated heat to be positioned further away from the functional surface of the biosensor, keeping heat away from the reagent layer and minimizing any potential product performance concerns.
The set-up for a multiple laser beam pass is shown diagrammatically in
The use of multiple laser systems and/or multiple laser beams provides flexibility and greater opportunity for optimization of cutting conditions to define the characteristics of each successive cut. For example, the focal plane of subsequent beams may be located at increasingly deeper film depths.
In an alternative method, a laser beam is split into multiple beams to facilitate efficient film slitting with reduced debris and recast. This may increase utilization of the energy from a single laser, e.g., a PS UV laser. This also may allow for avoiding the cost of multiple laser systems to provide the multiple laser beams. For example, a single beam from a PS UV laser may be split into 2, 3 or more beams directed to make successive, aligned cuts in separating the biosensor test strips.
By way of example, the method may distribute the pulse energy from a single picosecond (“PS”) UV laser by splitting the original, high energy beam into multiple beams. Each beam delivers lower fluence (J/cm2) to the substrate in the ablation zone than the original, single beam. Multiple PS UV beams avoid the cost of additional lasers by generating multiple beams from a single laser system. The beams may be mechanically arranged in tandem and in-line with the film direction, and each focused spot is positioned for efficient ablation/cutting and minimal debris generation. The beams may be focused without overlapping each other, maintaining a small gap between subsequent beams.
In yet another embodiment, the working surface and/or bottom laser beam is not held stationary, but instead scans a distance along the line of movement of the film material relative to the scanning beam. This results in successively deeper cuts with each scan over a given location. In one example, the working surface laser beam scanned a short line within the process window (defined by field-of-view, film speed, laser scan rate) along the film material coincident to the direction of travel of the film material. The scanning of the laser beam effectively extended the time of exposure of the film material to the laser cutting, thereby providing a deeper cut than in the case of a fixed beam acting upon a film material moving at the same speed.
By way of further example,
While the invention has been illustrated and described in detail in the drawings and foregoing description, the same is to be considered as illustrative and not restrictive in character, it being understood that only the preferred embodiment has been shown and described and that all changes, equivalents, and modifications that come within the spirit of the inventions defined by following claims are desired to be protected. All publications, patents, and patent applications cited in this specification are herein incorporated by reference as if each individual publication, patent, or patent application were specifically and individually indicated to be incorporated by reference and set forth in its entirety herein.
