This application relates generally to techniques useful for inkjet printing. The application also relates to components, devices, systems, and methods pertaining to such techniques.
Embodiments discussed in the disclosure are directed to methods and devices used in ink jet printing.
Some embodiments involve a subassembly for an inkjet printer. The subassembly includes a membrane disposed along an ink flow path. The membrane comprises first and second component membranes having first and second coefficients of thermal expansion. The membrane is configured to, in response to a change in ink temperature, mechanically displace as a function of temperature due to a difference in the thermal coefficients of expansion of the first and second component membranes. The mechanical displacement of the membrane causes a volumetric change in a portion of the ink flow path.
According to various aspects, the membrane is a bimetallic membrane. In some implementations, the membrane is configured to provide an abrupt mechanical displacement which causes an abrupt pressurization of ink in the portion of the ink flow path in response to the ink temperature reaching an activation temperature. The activation temperature of the membrane may correspond to a mushy zone temperature of ink. In some cases, the activation temperature is about 80° C.
The membrane may be configured to provide a gradual mechanical displacement which causes a gradual pressurization of ink in the portion of the ink flow path as a function of temperature. In some embodiments, the membrane is configured to provide a substantially linear mechanical displacement which causes a substantially linear pressurization of ink in the portion of the ink flow path as a function of temperature.
According to various implementations, the subassembly also includes one or more heaters configured to heat the ink and to impart a thermal gradient in the ink along the ink flow path. A first and a second membrane have an activation temperature Tact and the thermal gradient causes the first membrane to mechanically displace before the second membrane mechanically displaces during a time that the ink is undergoing a phase change.
In some cases, the membrane is disposed in a printhead of the subassembly. According to various aspects, the membrane is disposed in a reservoir of the subassembly. In some implementations, the dual thermal coefficient membrane is disposed in a manifold of the subassembly.
Some embodiments involve a method of heating or cooling ink in an ink flow path to cause a phase change of the ink. The phase change of the ink causes a volumetric change in a portion of the ink flow path during the phase change. The volumetric change is caused by mechanical displacement of a membrane as a function of temperature. The membrane includes first and second component membranes having first and second thermal coefficients of expansion. The mechanical displacement is caused by differences in the first and second thermal coefficients of expansion.
In some cases, causing the volumetric change comprises pressurizing the ink in the ink flow path. According to various aspects, causing the volumetric change comprises causing an abrupt mechanical displacement that occurs at an activation temperature. In some implementations, causing the volumetric change comprises causing a gradual mechanical displacement that occurs over a temperature range.
According to various embodiments, causing the volumetric change comprises pressurizing the ink during a time that the ink is undergoing a phase change and ink in a first portion of the ink flow path is in a solid phase, ink in a second portion of the ink flow path is in a liquid phase, and ink in the portion of the ink flow path is at a mushy zone temperature range. In some cases, the first portion comprises inkjet nozzles and the second portion comprises an ink reservoir. Pressurizing the ink may include forcing voids from ink in the portion of the ink flow path into the second portion.
In some implementations, a system includes one or more structures fluidically coupled to define an ink flow path. The ink flow path is configured to contain a phase change ink. The system includes means for causing a volumetric change in a portion of the ink flow path during a phase change of the ink. In some cases, the means for causing the volumetric change is configured to cause the volumetric change when the ink in the portion reaches a mushy zone temperature.
The above summary is not intended to describe each embodiment or every implementation. A more complete understanding will become apparent and appreciated by referring to the following detailed description and claims in conjunction with the accompanying drawings.
Ink jet printers operate by ejecting small droplets of liquid ink onto print media according to a predetermined pattern. In some implementations, the ink is ejected directly on a final print media, such as paper. In some implementations, the ink is ejected on an intermediate print media, e.g. a print drum, and is then transferred from the intermediate print media to the final print media. Some ink jet printers use cartridges of liquid ink to supply the ink jets. Some printers use phase-change ink which is solid at room temperature and is melted before being jetted onto the print media surface. Phase-change inks that are solid at room temperature advantageously allow the ink to be transported and loaded into the ink jet printer in solid form, without the packaging or cartridges typically used for liquid inks In some implementations, the solid ink is melted in a page-width print head which jets the molten ink in a page-width pattern onto an intermediate drum. The pattern on the intermediate drum is transferred onto paper through a pressure nip.
In the liquid state, ink may contain bubbles that can obstruct the passages of the ink jet pathways. For example, bubbles can form in solid ink printers due to the freeze-melt cycles of the ink that occur as the ink freezes when printer is powered down and melts when the printer is powered up for use. As the ink freezes to a solid, it contracts, forming voids in the ink that can be subsequently filled by air. When the solid ink melts prior to ink jetting, the air in the voids can become bubbles in the liquid ink.
When phase change ink, which contains a mixture of components, is freezing along an ink flow path, there is typically a mushy zone that spans some temperature range between fully molten and fully solid ink in which only some of the mixture components are frozen.
One mechanism that has been shown to help eliminate the voids that turn into bubbles is pressurization of the fluid passages during the freezing and the melting of the ink. This has been demonstrated to be effective at reducing bubbles by pressurizing the reservoir after the nozzles have frozen. The pressurization forces more ink into the volume as it shrinks A dual thermal membrane can be introduced into an ink flow path. Dual thermal membranes have at least two component membranes with different coefficients of thermal expansion (COEs). The different component membranes expand at different rates at a given temperature. While materials other than metals can be used, the examples provided herein are directed to bimetallic membranes. The bimetallic membranes comprise first and second component metallic membranes, wherein the metal of the first component membrane has a different coefficient of thermal expansion than the second component membrane.
In some cases, bimetallic membranes are configured to gradually deflect over a temperature range. According to various embodiments, bimetallic membranes can operate substantially linearly over a temperature range to change the pressure of a passage or chamber. The gradual mechanical deflection of the membrane produces a gradual pressure on the ink which pushes air bubbles out of the system. In some embodiments, the membrane may abruptly deflect. Abrupt mechanical displacement can cause an abrupt pressurization of the ink which may facilitate removal of pockets of air from the ink flow path in some situations.
The operating range of the bimetallic membranes can be tailored to the temperature range where bubbles are formed. According to various embodiments described herein, the bimetallic membrane is configured to deflect at a temperature within the mushy zone temperature where the ink is mushy as it transition from liquid and solid or from solid to liquid. For example, the mushy zone temperature range for some inks is about 75° to 85° C. For example, in various scenarios, as the ink freezes, the bimetallic membranes gradually or abruptly deflect into the ink flow path. As the ink melts from the frozen state, the bimetallic gradually or abruptly return to their undeflected state. It will be appreciated, that in various embodiments, the deflection of the bimetallic membranes may be reversed, i.e., the membranes may be undeflected while the ink is frozen and may deflect as the ink melts.
The bimetallic membrane can be configured to deflect at a particular ink temperature, such as when the ink in the vicinity of the bimetallic membrane is at a mushy zone temperature of the ink which occurs as the ink is freezing.
The print head assembly 600 includes one or more thermal elements 646, 647 that are configured to heat and/or cool the ink along the ink flow path. As depicted in
The control unit may activate and/or deactivate the thermal elements 646, 647 and/or may otherwise modify the energy output of the thermal elements 646, 647 to achieve the desired set point temperature. The thermal elements can be configured to heat the ink by resistive or inductive heating, for example.
Optionally, the print head assembly 600 may include one or more sensors 660 positioned along the ink flow path or elsewhere on the print head assembly 600. The sensors 660 are capable of sensing the pressure of the ink and/or the temperature of the ink (or components that form the ink flow path) and generating electrical signals modulated by the sensed parameters. In some cases, the control unit uses the sensor signals to generate feedback signals to control the operation of the thermal units 646, 647 and/or other processes.
Optionally, the print head assembly includes a pressure unit (not shown in
Some approaches to void reduction and subsequent bubble reduction involve creation of a thermal gradient along the ink flow path during a time that the ink is changing phase. The ink may be changing phase from a liquid phase to a solid phase, or to a solid phase to a liquid phase. When ink transitions from liquid to solid phase, the ink contracts, leaving voids in the solid phase ink. These voids may eventually be filled with air, which form air bubbles in the ink when the ink transitions from solid to liquid phase. As the ink is changing phase in the presence of the thermal gradient, a first portion of the ink in a first region of ink flow path may be in liquid phase while a second portion of the ink in a second region of the ink flow path is in solid phase.
A thermal gradient along the ink flow path when the ink is changing phase from liquid to solid may be created to reduce the number of voids that form while the ink is freezing. Keeping a first portion of the ink solid in a first region, e.g., near the print head, and another portion of the ink liquid in a second region, e.g., near the reservoir, allows liquid ink from the reservoir region to flow into the portion of the ink near the freeze front to reduce the number of voids that are formed during the phase transition.
As described with regard to
Particularly when the ink is changing phase, the ink in an ink flow path may be at different temperatures at different positions in the ink flow path. A thermal gradient can be created and/or controlled using controllable thermal elements. In some cases, the thermal gradient is controlled to achieve a higher ink temperature at or near a reservoir and a lower ink temperature at or near the print head, for example.
Various modifications and additions can be made to the preferred embodiments discussed above. Systems, devices or methods disclosed herein may include one or more of the features, structures, methods, or combinations thereof described herein. For example, a device or method may be implemented to include one or more of the features and/or processes described below. It is intended that such device or method need not include all of the features and/or processes described herein, but may be implemented to include selected features and/or processes that provide useful structures and/or functionality.
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Number | Date | Country | |
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20140168310 A1 | Jun 2014 | US |