Patent Application
20080007955
The features of the invention believed to be novel are set forth with particularity in the appended claims. The invention itself however may be best understood by reference to the following detailed description of the invention, which describes certain exemplary embodiments of the invention, taken in conjunction with the accompanying drawings in which:
The characteristics and the technical contents of the present invention will be described with reference to the following detailed description and the accompanying drawings. However, it should be understood that the drawings are illustrative but not used to limit the scope of the present invention.
The heat-conducting base 10 can be made of aluminum, copper or other materials having good heat conductivity and has a circular plate 11. A circular protruding plate 12 extends upwardly on the plate 11. The outer diameter of the circular protruding plate 12 is slightly smaller than that of the plate 11. Further, the outer peripheries of the plate 11 and the protruding plate 12 are recessed to form a plurality of symmetric notches 13. The center of the protruding plate 12 is provided with a circular accommodating hole 14.
The heat pipe 20 can be formed into an I-lettered, L-lettered, U-lettered shape or other different shapes. The outside of the heat pipe has a heat-absorbing end 21 and a heat-releasing end 22. The interior thereof is filled with the capillary structure and a working fluid. In the present embodiment, the heat pipe is constituted of one I-lettered heat pipe 20 and two U-lettered heat pipes 20. The heat-absorbing end 21 of the I-lettered heat pipe 20 is connected into the accommodating hole 14 of the heat-conducting base 10. The heat-absorbing end 21 of the U-lettered heat pipe 20 is used for adhering to and contacting with the top face of the protruding plate 12 of the heat-conducting base 10.
The heat-dissipating body 30 can be made by extruding the materials having good heat conductivity and heat-dissipating performance (such as aluminum). The heat-dissipating body has a hollow cylinder 31. The outer periphery of the cylinder 31 is formed with a plurality of radial heat-dissipating pieces 32. The cylinder is used for covering on the heat-releasing end 22 of each heat pipe 20. One side of the cylinder 31 is provided with a solder inlet 33. The solder inlet 33 can be a hole in communication with the interior and exterior of the cylinder 31. The solder inlet 33 of each heat-dissipating body 30 is arranged toward the same direction (as shown in
The heat-dissipating structure of the present invention can be applied to a LED lamp 5. The LED lamp 5 comprises a LED set 50, a lamp cover 51 covered over the LED set 50 and two power lines 52 electrically connected to the LED set 50. In assembling, the bottom surface of the LED set 50 adheres on the bottom surface of the heat-conducting base 10. Two power lines 52 penetrate through the notches 13 of the heat-conducting base 10, respectively. The lamp cover 51 covers the I-lettered heat pipe 20 with the heat pipe penetrating therethrough, and then is fixedly connected onto the plate 11 of the heat-conducting base 10. Then, each heat-dissipating body 30 is subsequently connected onto the heat-releasing end 22 of the heat pipe 20. The solder inlet 30 of each heat-dissipating body 30 is filled with solder (not shown). Then, by heating, the solder melts and flows into the gap between the heat-releasing end 22 of the heat pipe 20 and the inner wall of the cylinder 31. In this way, a LED lamp can be constructed.
In use, after each power line 52 of the LED lamp 5 is supplied with electric current, the light-emitting diodes of the LED set 50 can emit light and generate heat. With the heat conduction of the heat-conducting base 10, the heat can be transferred to the heat-absorbing end 21 of each heat pipe 20. With the phase change between liquid phase and vapor phase of the working liquid within each heat pipe 20, the generated heat can be rapidly transferred to the outside. By dispersing each heat-dissipating body 30, the heat generated by the light-emitting diodes of the LED set 50 can be dissipated by each heat pipe 20 and heat-dissipating body 30, thereby to perform the heat conduction and dissipation. As a result, the LED set 50 can be continuously operated in a suitable working temperature, so that its life can be elongated.
According to the above, the multiple-set heat-dissipating structure for the LED lamp in accordance with the present invention indeed achieves the desired effects by employing the above-mentioned structure. Further, since the construction of the present invention has not been used in any products of the same kind or in public or published prior to applying for patent. Therefore, the present invention has novelty and inventive steps and completely conforms to the requirements for a utility model patent.
Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still be occurred to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.
