1. Field Of The Invention
This invention relates generally to methods and apparatuses related to the polishing of workpieces, such as semiconductor wafers, and particularly to an improved disk or other shape substrate for conditioning and restoring polishing pads used in such methods.
2. Description Of The Related Art
The production of integrated circuits involves the manufacture of high quality semiconductor wafers. As well known in this industry, a surface that is flat (planar) to a high degree of precision is required on at least one side of the wafer to ensure that appropriate performance objectives are achieved. As the size of the circuit components decreases and the complexity of the microstructures involved increases, the requirement for high precision surface qualities of the wafers increases.
This high precision surface is formed on semiconductor wafers by the polishing or planarization of semiconductor wafers. During this process, a polishing pad is rotated against a surface of the wafer in the presence of an abrasive slurry. The chemical components of the abrasive slurry react with one or more particular materials on the wafer being polished and aid the abrasive in removing portions of this material from the wafer's surface. The typical polishing pad comprises a blown polyurethane-based material such as the IC and GS series of pads available from Rohm and Haas. The hardness and density characteristics of the polishing pads are determined on the basis of the material of the workpiece (semiconductor wafer) that is to be polished.
The following patents provide a broad discussion of chemical, mechanical planarization, which is referred to herein, and in the industry, as CMP: Arai et al. U.S. Pat. No. 4,805,348 issued February, 1989; Arai et al. U.S. Pat. No. 5,099,614 issued March, 1992; Karlsrud et al. U.S. Pat. No. 5,329,732 issued July, 1994; Karlsrud et al. U.S. Pat. No. 5,498,196 issued March, 1996; Karlsrud et al. U.S. Pat. No. 5,498,199 issued March, 1996; Cesna et al. U.S. Pat. No. 5,486,131 issued January, 1996; and Holzapfel et al. U.S. Pat. No. 5,842,912 issued Dec. 1, 1998. All of the foregoing patents are incorporated herein by reference.
During continued use of the polishing pad in the CMP process, the rate of material removal from the wafer gradually decreases due to what is referred to in this field as “pad glazing”. Additionally, with continued use, the surface of the polishing pad normally experiences uneven wear which results in undesirable surface irregularities. Therefore, it is necessary to recondition (true and dress) the polishing pad to restore it to a desirable operating condition by exposing the pad to a pad-conditioning surface, such as the planar surface of a rotating disk, having suitable cutting elements on it. This truing and dressing of the pad may be accomplished during the wafer polishing process (referred to as in-situ conditioning) such as described in U.S. Pat. No. 5,569,062 issued on Oct. 29, 1996 to Karlsrud. However, such conditioning may also be done between polishing steps (referred to as ex-situ conditioning) such as described in U.S. Pat. No. 5,486,131 issued on Jan. 23, 1996 to Cesna et al., both of these patents being incorporated by reference herein.
Reconditioning of a polishing pad restores the appropriate frictional coefficient of the pad surface and thereby allows the pad to continue to be used to provide the desired flat surface on the wafers. Reconditioning also allows effective transport of the polishing slurry to the wafer surfaces in order to obtain the most effective and precise planarization of the semiconductor wafer surface being polished.
The typical pad conditioner comprises a stainless steel disk coated with a monolayer of abrasive particles. The disk is mounted to a rotary motor and the abrasive particle-coated surface is placed against the CMP pad when the surface is being rotated. Diamond particles or cubic boron nitride particles are the preferred abrasives, and are often referred to as “superabrasives” due to their resistance to wear. These superabrasive particles may be secured to the conditioning disk by electroplating, sintering or by a brazing process. The brazing process is preferred due to the formation of a stronger bond between the particles and the substrate, thereby resulting in the particles being less likely, compared to electroplated conditioning disks, to loosen and fall free. If abrasive particles fall free and become embedded in the polishing pad or are otherwise exposed to the wafer being polished, significant deformations in, or abrasions of, the wafer surface may occur that could cause the wafer to be unusable. Such a situation represents a loss of many thousands of dollars of time and labor.
Conditioning disks employing a monolayer of braze bonded diamonds, such as those manufactured by Abrasive Technology, Inc. of Lewis Center, Ohio, have been recognized as very effective and an improvement over prior art conditioning disks using other bonding mediums, particularly in resisting premature loss of diamond abrasive particles. Current art for restoring used CMP polishing pad uses a diamond conditioning disk with a diamond surface on one side of the conditioning disk and a mounting surface on the opposite side of the disk to attach the conditioning disk to the conditioning drive mechanism.
Some devices used for lapping, such as double-sided lapping, could appear to be related to devices used to restoring used CMP pads. Such devices, which are believed to be manufactured by Lap Master and possibly others, are inserted between oppositely-rotated platens and float therein during opposing rotation. Such devices are not driven directly as CMP reconditioning disks must be in typical CMP reconditioning processes due to the fact that CMP polishing pads recondition only one side of a surface at a time. CMP pads are not used to polish two sides of a surface as in the lapping process.
Therefore, the need arises for a conditioning disk that reduces the amount of material used and thereby reduces the cost of the conditioning disk without any reduction in performance.
The invention provides a conditioning tool for restoring a used CMP polishing pad to an operable condition. In a preferred embodiment, the invention includes a substrate, which is preferably a disk having a circular peripheral edge. In a preferred embodiment, the peripheral edge of the disk is beveled with at least two surfaces at an angle with one another.
The disk has a first substantially planar surface to which a first abrasive, such as a monolayer of diamond particles, is attached, such as by brazing. A second abrasive is attached in a similar manner to a second, opposing substantially planar surface. This configuration thereby forms two opposing, substantially planar abrasive surfaces that are used, at different times, for reconditioning a used CMP polishing pad.
A base, which is for drivingly linking the tool to a rotatably driven machine, has a circular shoulder extending from a base surface. The base shoulder diameter is preferably substantially equal to a diameter of the circular peripheral edge of the disk. The base shoulder receives at least a portion of the peripheral edge of the disk, and most preferably receives one of the angled surfaces of the peripheral edge.
A fastener, such as a screw or magnets, mounts the disk to the base. The first abrasive faces away from the base, and the second abrasive is spaced from the base surface so that no wear is experienced by either the second abrasive or the base surface due to contact.
In a preferred embodiment, a ring has an annular body with a circular shoulder defining an aperture. The aperture has a diameter that is smaller than the diameter of the peripheral edge of the disk to prevent passage of the entire disk through the aperture. The ring shoulder diameter is substantially equal to the diameter of the peripheral edge of the disk, and the ring shoulder receives at least a portion of the peripheral edge of the disk.
A fastener, such as a screw or magnets, mounts the ring to the base with the disk held between the ring and the base by a clamping force. The clamping force is preferably applied only to the peripheral edge of the disk by the ring shoulder and the base shoulder. The first abrasive protrudes through the aperture of the ring, and the second abrasive is spaced from the base surface so that no wear is experienced by either the second abrasive or the base surface due to contact.
Thus, in one embodiment of the invention, the base has a disk mounted to it, wherein the disk has abrasive on two opposing sides. The disk is flipped around when the abrasive on one side approaches or reaches the end of its useful life. The disk can be mounted to the base by fastening means, which can include any useful fastener. In the preferred embodiment, the fastening means includes a ring that is slightly larger than the disk, with an aperture through which the abrasive on the disk protrudes, that clamps the disk between the ring and the base. In one particular embodiment, the disk has peripheral edges that are advantageously contacted by the ring and the base, thereby avoiding mounting contact with the abrasive portions of the disk. The peripheral edges of the disk and the receiving surfaces of the base and ring align and retain the disk.
The invention thus effectively provides two useful abrasive conditioning surfaces per disk instead of the current industry standard practice of one, among other advantages and improvements.
In describing the preferred embodiment of the invention which is illustrated in the drawings, specific terminology will be resorted to for the sake of clarity. However, it is not intended that the invention be limited to the specific term so selected and it is to be understood that each specific term includes all technical equivalents which operate in a similar manner to accomplish a similar purpose. For example, the word connected or terms similar thereto are often used. They are not limited to direct connection, but include connection through other elements where such connection is recognized as being equivalent by those skilled in the art.
The preferred embodiment of the present invention includes the following major components that are illustrated in
The pad conditioning substrate, such as the disk 40 in particular, is best shown in
Because the disk 40 can be used as a CMP pad conditioning disk, the portion of the faces 42 and 44 that is covered by abrasive does not extend to the peripheral edge of the disk 40. Instead, according to industry practice, a small gap is formed between the radially outermost edge of the abrasive and the extreme peripheral edge of the disk 40.
The disk 40 is preferably made of a strong, corrosion-resistant material, such as stainless steel, titanium, ceramic or plastic and has substantial thickness, on the order of 5.0 mm, to prevent substantial deformation when in use. The diameter of the disk 40 can be on the order of 10.5 cm. These sizes and materials are examples for the purpose of explanation; the size and material of the disk are not critical and can vary substantially from these examples. Preferably the base 20 and the ring 30 are also made of stainless steel or any other material that is compatible with the circumstances.
As best viewed in
When the angle α is 180 degrees, the peripheral edge 45 is flat; that is, the edge 45 defines a single curved, circular surface angled at ninety degrees from the major surfaces 42 and 44 of the disk. Although this embodiment is not illustrated, such a disk has a configuration resembling a conventional coin. In another alternative disk 340 shown in
The base 20 is shown in
A second base end 24 (see
The ring 30 has a circular body 31 with an aperture 35 formed through the body 31. The aperture 35 is defined by the radially inwardly extending shoulder 36 that is most easily seen in
The ring 30 mounts to the base 20 by at least one fastener, such as the screws 32, 33 and 34, shown in
It is preferred that when the disk 40 is clamped between the base 20 and the ring 30, the only surfaces in contact between the three respective bodies are the surfaces at the periphery of the disk 40 as shown clearly in
The disk 40 is also restricted from moving rotationally relative to the holder 10 by a key 57 that extends into the aligned notches 37 and 47 (see
It should be understood that although the invention shows a single key 57, it is contemplated that more than one such key can be used, and that the shape of the key can be varied from that shown. For example, the key can be circular, rectangular, triangular, dovetail or any other shape that is suitable. In an alternative embodiment, the key 57 is replaced by a magnet that has such strong attraction to the disk itself, or a structure mounted in the disk or another structure, that any expected rotational force applied to the disk 40 by the workpiece is insufficient to cause relative motion.
A gap 60 (
The invention operates in a preferred embodiment in the following manner. The base 20 is mounted to the driving machine and the disk 40 is placed in the ring 30. The ring 30 and the disk 40 are placed under the base 20 (with the notch 47 aligned with the notch 37 and the key 57 inserted in the notches 37 and 47 as described herein) and the screws 32-34 are inserted and tightened in the apertures. Upon tightening, the disk 40 is clamped in place between the ring 30 and base 20, and the angled peripheral surfaces 46 and 48 are seated against the angled surfaces 28 and 38 of the base 20 and ring 30, respectively.
Once the disk 40 is mounted to the holder 10, the holder 10 and the disk 40 are rotated. The rotating major disk surface 44 is seated against one or more CMP polishing pads and the CMP pads are reconditioned as is conventional. Once the abrasive on the major disk surface 44 reaches a predetermined degree of wear, the rotating machine is halted and the ring 30 is removed from the base 20 by removing the screws 32-34 and manually pulling the ring 30 and the disk 40 away from the base 20, typically as a combination. Once the ring 30 and disk 40 are removed from the base 20, the disk 40 can be removed manually from the ring 30 by simply pulling the disk 40 away from the ring 30.
The removed disk 40 is then flipped so that the worn major disk surface 44 faces toward the base 20 and the fresh major disk surface 42 faces away from the base 20. Of course, the entire apparatus, including the disk, can first be cleaned, if necessary. In one contemplated embodiment, a film, coating or other indicator of whether a major disk surface has been used is fixed to the surface to make instantly recognizable whether the major disk surface 42 has been used. The disk's notch 47 is aligned with the notch 37 and key 57, and the ring 30 is then reattached to the base 20 in the same way it was attached previously. This forms a gap between the major disk surface 44 and the base surface 25 that is essentially identical to the gap 60. The holder 10 and the disk 40 are rotated and the major disk surface 42 is seated against one or more CMP polishing pads so the CMP pads can be reconditioned.
The invention permits only one abrasive surface of the disk 40 to be used at any time. This is due to the fact that the holder 10 substantially covers all other sides of the disk 40 when the disk 40 is being rotated in contact with a workpiece. Furthermore, because of the gap 60, the use of one abrasive surface has little to no effect on the opposing abrasive surface, because little to no wear occurs to the abrasive surface that is not in use or to its adjacent structure.
It will become apparent from the description herein that various substitutes can be made for the preferred structures and methods described herein. For example, the fasteners used to mount the ring 30 to the base 20 are preferably screws, because screws facilitate the removal and replacement of the disk 40 from the base 20 numerous times using common tools. However, other removable fasteners can be used instead of the screws 32-34, including without limitation, magnetic fasteners, rivets, clamps and specialized structures made for the purpose of fastening the ring to the base or any combination of these or equivalents. Similarly, although the base 20 is shown attached to the driving machine by threaded apertures 23 formed therein, the person having ordinary skill knows that such fastening means can likewise be replaced by a single threaded chuck, clamps, and other fastening means. Furthermore, sealing structures can be added to prevent the slurry from leaking into the holder 10. For example, compressible O-rings or adhesive-backed plastic gaskets can be inserted between the ring 30 and the base 20, as well as between the disk 40 and the base 20 and between other structures.
In addition, the shape of the disk 40, ring 30 and base 20 can be modified from the preferred embodiment shown in
One distinct advantage of the invention is that it is manufactured to be very similar in material and size to existing one-sided disks, and therefore can be used in existing machines, but there is abrasive on both sides instead of only one side. This permits the subsequent use of a second side of the disk without substantial added material costs in the underlying substrate (disk). Similarly, the only portion of the abrasive device that must be either discarded or recycled after use is the component that seats directly against the surface to be abraded. Because the holder 10 is re-used, costs over conventional one-sided disks are lower in the long term.
Another advantage of the invention is the reduced time required to change a disk. The holder 10 does not have to be removed from the machine that drives the holder. Instead, the holder remains in the driver and a few small screws are removed and then replaced after rotation of the disk to expose the unused side. Still further, when it is desired to expose a new abrasive surface in any holder that is using a disk with an unused abrasive surface, this can be accomplished without having to locate another disk. Instead, a fresh disk is retained within the holder 10.
It is also contemplated that instead of a disk with only two sides, other substrate shapes can be used. For example, a stainless steel cube is contemplated having six planar sides and between two and six abrasive surfaces. Each side has a monolayer of superabrasive extending to near the edges thereof. A base has a shoulder with a square-shaped surface that seats against the cube. A square ring with a similar shoulder around an aperture that is slightly smaller than each of the cube's sides is mounted to the base, thereby clamping the cube to the base. The base, ring and cube are mounted to a device that rotates the combination and the protruding surface of the cube abrades the workpiece. Upon reaching a certain point of wear, the cube is removed and moved to expose a different, unused abrasive surface of the cube through the aperture in the ring by removing the ring and then replacing the ring after movement of the cube. Alternative shapes are also contemplated.
The abrasive characteristics of each side of a substrate are preferably substantially the same. However, it is contemplated that the abrasive on one side can differ slightly or substantially from the abrasive on the opposing side. Additionally, with a multi-sided substrate each side can differ so that, for example, each abrasive can be used for a portion of a polishing procedure on a workpiece. In a contemplated example, a coarse abrasive is used first, and then a more fine abrasive, and then a still finer abrasive.
Another alternative embodiment of the invention is shown in
The disk 140 is substantially the same as the disk 40 shown and described herein. The base 120 is shown in
A second base end 124 (see
The ring 130 mounts to the base 120 by at least one fastener, such as the screws 132, and 134, shown in
The disk 140 is restricted from moving rotationally relative to the holder 110 by a key 157 (see
Another alternative embodiment of the invention is shown in
When the disk 240 is mounted to the base 220, these complimentary surfaces permit the shoulders 236 and 226 of the base 220 to contact the disk 240 where there are no abrasive particles. Thus, when the screws 232 and 233 are tightened against the central region 250 of the disk 240, the opposite side of the disk 240 seats against the base 220, but a gap is formed between the abrasive surface and the disk's surface 225. Of course, the peripheral edge of the disk 240 need not be beveled. Instead, the peripheral edge can be angled at 90 degrees from the major surfaces of the disk.
Another alternative embodiment of the invention is shown in
As best viewed in
The base 420 is shown in
The ring 430 has a circular body with an aperture formed through the body. The aperture is defined by the shoulder 436 that forms a disk-shaped void that seats against the peripheral edge 449 of the disk 440. The shoulder 436 defines a rib that is inserted in the groove, formed at the peripheral edge of the disk 430, during use (as shown in
The ring 430 mounts to the base 420 by at least one fastener, such as screws (not illustrated). It is preferred that when the disk 440 is mounted in the ring 430, the only surfaces in contact between the three respective bodies are the surfaces at the periphery of the disk 440 as with the embodiment of
The disk 440 is restricted from moving rotationally relative to the holder 410 by a key 457 (see
This detailed description in connection with the drawings is intended principally as a description of the presently preferred embodiments of the invention, and is not intended to represent the only form in which the present invention may be constructed or utilized. The description sets forth the designs, functions, means, and methods of implementing the invention in connection with the illustrated embodiments. It is to be understood, however, that the same or equivalent functions and features may be accomplished by different embodiments that are also intended to be encompassed within the spirit and scope of the invention and that various modifications may be adopted without departing from the invention or scope of the following claims.