Claims
- 1. A multipoint electrical interconnection for providing a plurality of electrical pathways between electrically conductive hooks on a substrate and a battery, comprising:
- first and second substrates each having a plurality of electrically conductive hooks generally formed in the shape of a `J` and having a head portion and a hook portion, the head portion affixed to each substrate such that the hook portion protrudes above each respective substrate;
- deformable support member behind the first substrate or the second substrate;
- a battery having positive and negative terminals; and
- the battery disposed between the first and second substrates such that each terminal contacts and deforms at least three of the plurality of electrically conductive hooks on each substrate, the deformed hooks providing a spring force to effect a multipoint electrical connection.
- 2. A multipoint electrical interconnection for providing a momentary electrical contact between electrically conductive hooks on a substrate and an electrical component, comprising:
- a first substrate having two or more openings therein, said openings arranged to form an island bounded by the openings, said island being connected to the substrate by two or more webs;
- a plurality of electrically conductive hooks generally formed in the shape of a `J` and having a head portion and a hook portion;
- the head portion affixed to a first surface of said island such that the hook portion protrudes beyond the first surface;
- a second substrate having an electrically conductive portion;
- the first substrate disposed to be adjacent to the second substrate such that the electrically conductive hooks face the electrically conductive portion; and
- such that an electrical connection is made between the electrically conductive hooks on the first substrate and the electrically conductive portion on the second substrate when the island is urged towards the second substrate in a manner sufficient to cause the hook portion to contact the second substrate.
- 3. The multipoint electrical interconnection as described in claim 2, wherein the webs provide a restoring spring force when the island is urged towards the second substrate.
- 4. The multipoint electrical interconnection as described in claim 2, wherein the electrically conductive hooks are deformed when the electrical connection is made.
- 5. The multipoint electrical interconnection as described in claim 2, further comprising an overlay keypad situated adjacent to a second side of the first substrate.
- 6. The multipoint electrical interconnection as described in claim 5, wherein the overlay keypad has a bump corresponding to the island, said bump disposed on a side of the keypad adjacent to the first substrate.
- 7. The multipoint electrical interconnection as described in claim 2, further comprising a circuit pattern selectively metallized on the first substrate, the circuit pattern electrically connected to the plurality of electrically conductive hooks.
- 8. The multipoint electrical interconnection as described in claim 2, wherein the substrate is an electrical insulator.
- 9. The multipoint electrical interconnection as described in claim 8, wherein the substrate is a woven material.
- 10. The multipoint electrical interconnection as described in claim 9, wherein the substrate and electrically conductive hooks comprise VELCRO.RTM. having an electrically conductive coating.
- 11. The multipoint electrical interconnection as described in claim 2, wherein the hooks are metal wires.
CROSS REFERENCE TO RELATED APPLICATIONS
This application is related to U.S. Pat. No. 5,457,610, issued Oct. 10, 1995 by Bernardoni, et al., entitled "Low Profile Mechanical Interconnect System Having Metallized Loop and Hoop Area," and assigned to Motorola, Inc., and to U.S. application Ser. No. 08/575,652 filed Dec. 20, 1995, by Urbish, et al., entitled "Solderless Electrical Interconnection," filed concurrently herewith, and assigned to Motorola, Inc.,
US Referenced Citations (8)