The present invention generally relates to a method, system and software product used in computer-aided engineering analysis of a structure, more particularly to performing finite element analysis of an engineering structure including a multiscale susbstructures (e.g., spot welds). Multiscale is referred to as the substructure and overall engineering structure having a different scale finite element analysis model.
The finite element method (FEM) (sometimes referred to as finite element analysis (FEA)) is a numerical technique for finding approximate solutions of partial differential equations (PDE) as well as of integral equations. The solution approach is based either on eliminating the differential equation completely (steady state problems), or rendering the PDE into an approximating system of ordinary differential equations, which are then numerically integrated using standard techniques such as Euler's method, Runge-Kutta, etc.
FEA is becoming increasingly popular with automobile manufacturers for optimizing both the aerodynamic performance and structural integrity of vehicles. Similarly, aircraft manufacturers rely upon FEA to predict airplane performance long before the first prototype is built. Rational design of semiconductor electronic devices is possible with Finite Element Analysis of the electrodynamics, diffusion, and thermodynamics involved in this situation. FEA is utilized to characterize ocean currents and distribution of contaminants. FEA is being applied increasingly to analysis of the production and performance of such consumer goods as ovens, blenders, lighting facilities and many plastic products. In fact, FEA has been employed in as many diverse fields as can be brought to mind, including plastics mold design, modeling of nuclear reactors, analysis of the spot welding process, microwave antenna design, simulating of car crash and biomedical applications such as the design of prosthetic limbs. In short, FEA is utilized to expedite design, maximize productivity and efficiency, and optimize product performance in virtually every stratum of light and heavy industry. This often occurs long before the first prototype is ever developed.
One of the most challenging FEA tasks is to simulate an impact event such as car crash or metal forming. In a typical car, there are a larger number of spot welds connecting body parts to form the vehicle structure. For accurate simulation of the vehicle as a whole, those spot welds have to be modeled accurately. Spot welds are typically placed 2-3 centimeters apart, and each spot weld has a diameter between 4 to 9 millimeters. Traditionally, each spot weld has been modeled either with a very short beam element (e.g., length of 1-2 millimeters) in FEA or with a cluster of solid elements of roughly the same size as the surrounding elements (generally shell elements). As the modern computer improves, users (e.g., engineering, scientists, etc.) of the finite element analysis demand more detailed study of spot welds. That means a much finer model for the spot welds is required. Sometimes, the detailed spot weld model contains solid elements having characteristic dimension at least one order of magnitude less than that of the surrounding elements, for example, ten times less. When a substructure such as spot weld is so finely meshed, the time-marching simulation of the overall structure is affected.
Due to limitations of explicit solution scheme of the finite element method, a much smaller time-step is required to maintain a stable numerical solution for analyzing finely meshed spot welds. As a result, the time-marching simulation of the entire structure would take at least one order of magnitude longer time to run, which is not feasible in a production environment. Therefore, it would be desirable to have new improved method and system for performing a time-marching simulation of an engineering structure using finite element analysis, when a portion of the engineering structure is modeled with one or more much finely meshed substructures (e.g., spot welds).
This section is for the purpose of summarizing some aspects of the present invention and to briefly introduce some preferred embodiments. Simplifications or omissions in this section as well as in the abstract and the title herein may be made to avoid obscuring the purpose of the section. Such simplifications or omissions are not intended to limit the scope of the present invention.
Methods and systems for conducting a time-marching simulation of a product using a finite element analysis model including at least one multiscale substructure are disclosed. According to one aspect of the present invention, a finite element analysis (FEA) model of a product (e.g., car, airplane, etc.) is defined for a time-marching simulation. The term “multiscale” is referred to as multiple time scales in terms of time-step sizes, for example, overall main structure may require a particular time-step size to maintain a stable solution in explicit FEM, while a substructure require another. The FEA model comprises an overall structure, and at least one multiscale substructure. Each of the substructures corresponds to some of the master representative segments defined in the overall structure. An example of using multiscale substructures is spot weld, which is used extensively in manufacturing of an automobile.
Characteristic dimension of the finite element analysis model for the overall structure is at least one order of magnitude (e.g., ten times) larger than that of the substructures. Each substructure can have different size FEA models. In other words, a first substructure and a second substructure can be modeled differently and, therefore requiring different time scales.
Time-marching simulation of the product is conducted with first and second sets of timescale. The first set is configured for the overall structure, or master group, while the second set for the substructures, or slave group. Due to characteristic dimension of the FEA model, the first set is run at a time step significantly larger than the second set. Synchronization of the responses of the two groups is performed at the end of each solution cycle corresponds to the first set (i.e., overall structure or master group) of timescale. The responses include, but are not limited to, deformations around the master representative segment.
Other objects, features, and advantages of the present invention will become apparent upon examining the following detailed description of an embodiment thereof, taken in conjunction with the attached drawings.
These and other features, aspects, and advantages of the present invention will be better understood with regard to the following description, appended claims, and accompanying drawings as follows:
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it will become obvious to those skilled in the art that the present invention may be practiced without these specific details. The descriptions and representatives herein are the common means used by those experienced or skilled in the art to most effectively convey the substance of their work to others skilled in the art. In other instances, well-known methods, procedures, components, and circuitry have not been described in detail to avoid unnecessarily obscuring aspects of the present invention.
Reference herein to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Further, the order of blocks in process flowcharts or diagrams representing one or more embodiments of the invention do not inherently indicate any particular order nor imply any limitations in the invention.
To facilitate the description of the present invention, it deems necessary to provide definitions for some terms that will be used throughout the disclosure herein. It should be noted that the definitions following are to facilitate the understanding and describe the present invention according to an embodiment. The definitions may appear to include some limitations with respect to the embodiment, the actual meaning of the terms has applicability well beyond such embodiment, which can be appreciated by those skilled in the art:
FEA stands for Finite Element Analysis.
Implicit FEA refers to K u=F, where K is the effective stiffness matrix, u is the unknown displacement array and F is the effective loads array. F is a right hand side loads array while K is a left hand side stiffness matrix. The solution is performed at the global level with a factorization of the effective stiffness matrix, which is function of the stiffness, mass and damping. One exemplary solution method is the Newmark integration scheme.
Explicit FEA refers to M a=F, where M is the diagonal mass array, a is the unknown nodal acceleration array and F is the effective loads array. The solution can be carried out at element level without factorization of a matrix. One exemplary solution method is called the central difference method.
Beam element refers to a one-dimensional finite element defined by two nodes.
Solid element refers to a three-dimensional finite element with volume. Typical solid elements may include, but not be limited to, tetrahedron, hexahedron, and the likes.
Embodiments of the present invention are discussed herein with reference to
Referring now to the drawings, in which like numerals refer to like parts throughout several views. The present invention may be implemented using hardware, software or a combination thereof and may be implemented in a computer system or other processing system. In fact, in one embodiment, the invention is directed towards one or more computer systems capable of carrying out the functionality described herein. An example of a computer system 100 is shown in
Computer system 100 also includes a main memory 108, preferably random access memory (RAM), and may also include a secondary memory 110. The secondary memory 110 may include, for example, one or more hard disk drives 112 and/or one or more removable storage drives 114, representing a floppy disk drive, a magnetic tape drive, an optical disk drive, etc. The removable storage drive 114 reads from and/or writes to a removable storage unit 118 in a well-known manner. Removable storage unit 118, represents a flash memory, floppy disk, magnetic tape, optical disk, etc. which is read by and written to by removable storage drive 114. As will be appreciated, the removable storage unit 118 includes a computer usable storage medium having stored therein computer software and/or data.
In alternative embodiments, secondary memory 110 may include other similar means for allowing computer programs or other instructions to be loaded into computer system 100. Such means may include, for example, a removable storage unit 122 and an interface 120. Examples of such may include a program cartridge and cartridge interface (such as that found in video game devices), a removable memory chip (such as Erasable Programmable Read-Only Memory (EPROM), Universal Serial Bus (USB) flash memory, or PROM) and associated socket, and other removable storage units 122 and interfaces 120 which allow software and data to be transferred from the removable storage unit 122 to computer system 100. In general, Computer system 100 is controlled and coordinated by operating system (OS) software, which performs tasks such as process scheduling, memory management, networking and I/O services.
There may also be a communications interface 124 connecting to the bus 102. Communications interface 124 allows software and data to be transferred between computer system 100 and external devices. Examples of communications interface 124 may include a modem, a network interface (such as an Ethernet card), a communications port, a PCMCIA slot and card, etc.
The computer 100 communicates with other computing devices over a data network based on a special set of rules (i.e., a protocol) to send data back and forth. One of the common protocols is TCP/IP (Transmission Control Protocol/Internet Protocol) commonly used in the Internet. In general, the communication interface 124 manages the assembling of a data file into smaller packets that are transmitted over the data network or reassembles received packets into the original data file. In addition, the communication interface 124 handles the address part of each packet so that it gets to the right destination or intercepts packets destined for the computer 100.
In this document, the terms “computer recordable storage medium”, “computer recordable medium” and “computer readable medium” are used to generally refer to media such as removable storage drive 114, and/or a hard disk installed in hard disk drive 112. These computer program products are means for providing software to computer system 100. The invention is directed to such computer program products.
The computer system 100 may also include an I/O interface 130, which provides the computer system 100 to access monitor, keyboard, mouse, printer, scanner, plotter, and alike.
Computer programs (also called computer control logic) are stored as application modules 106 in main memory 108 and/or secondary memory 110. Computer programs may also be received via communications interface 124. Such computer programs, when executed, enable the computer system 100 to perform the features of the present invention as discussed herein. In particular, the computer programs, when executed, enable the processor 104 to perform features of the present invention. Accordingly, such computer programs represent controllers of the computer system 100.
In an embodiment where the invention is implemented using software, the software may be stored in a computer program product and loaded into computer system 100 using removable storage drive 114, hard drive 112, or communications interface 124. The application module 106, when executed by the processor 104, causes the processor 104 to perform the functions of the invention as described herein.
The main memory 108 may be loaded with one or more application modules 106 that can be executed by one or more processors 104 with or without a user input through the I/O interface 130 to achieve desired tasks. In operation, when at least one processor 104 executes one of the application modules 106, the results are computed and stored in the secondary memory 110 (i.e., hard disk drive 112). The status of the finite element model definition (e.g., the spot weld definitions, simulation results of the substructures at the end of desired solution cycles, etc.) is reported to the user via the I/O interface 130 either as a list or a graph.
In one embodiment, an application module 106 is configured to facilitate generation of solid elements representing substructures (e.g., spot welds). As an indication flag is detected, the application module 106 replaces the beam definition with one or more solid elements.
Manufacturing a complex structure such as an automobile, there are many structure members being connected to each other by some mechanical means, e.g., spot welds. In simulating large deformation (e.g., crash) of such complex structure, the overall FEA model requires not only to include the structure members but also to take into account the connectors, or spot welds.
The solid elements representing the same spot weld are grouped together into a cluster, so that the resultant force and moment of the cluster (i.e., the spot weld) can be reported. Several exemplary solid element clusters are shown in
Beam and/or the solid elements representing spot welds are referred as master representative segments in the overall FEM model.
According to one aspect, each spot weld as a master representative segment 326 is further modeled with a finely meshed model of much smaller solid elements (e.g., more than 100 solid elements). Each of the finely meshed models is referred to as a substructure associated with respective master representative segment. The association between substructure and master representative segment can be one-to-one or one-to-many. In other words, each substructure is tied to some of the master representative segments defined in the overall FEM model. For example, several spot welds can be defined by one detailed substructure model. Plan views of two exemplary substructures are shown in
Depending on the location of interests and the detail of the simulation, one or more substructures may be constructed in a main structure under FEA analysis. Based on their characteristic dimensions, each of the substructure models may have different numbers of element and may be simulated in different size time-steps.
Process 500 starts at step 502 by defining a finite element analysis (FEA) model used in a time-marching simulation of a product. The FEA model comprises a master and a slave group. The master group includes the overall structure, while the slave group includes at least one multiscale substructure. Each substructure is integrated to the overall structure via corresponding master representative segment. The substructure is generally modeled with significantly finer mesh than the overall structure. As a result, characteristic dimension of the two FEA models (i.e., the master group and slave group) are significantly different. Usually the difference is at least one order of magnitude (e.g., ten times).
In order to maintain a stable solution for explicit solver of the FEA, first and second sets of timescale are required to perform the time-marching simulation. (step 504). The first set is configured for the master group, while the second set for the slave group. The time step size is controlled by the characteristic dimension of respective FEA models.
Finally at step 506, the simulated structural responses are synchronized at the end of each solution cycle of the first set of timescale. The simulated responses include deformations around the master representative segment.
Time-marching simulation can be performed on a multi-processor computer system. Parallel processing is achieved by dividing the master group and slave group into different domains independently. A root process of the master group and a root process of each of the substructures are the controller for synchronization operations.
To be able to couple the solutions of the substructure and the overall structure before the start of next time-marching simulation cycle, a solution synchronizing point 630 is set at T1, or at the end of each solution cycle of the first set of timescale, according to one embodiment of the present invention. This synchronization is carried out repeatedly at the end of each of the first set of timescale cycles as the time-marching simulation continues, for example, the next synchronization point is at T2 (not shown).
Although the present invention has been described with reference to specific embodiments thereof, these embodiments are merely illustrative, and not restrictive of, the present invention. Various modifications or changes to the specifically disclosed exemplary embodiments will be suggested to persons skilled in the art. For example, whereas illustration of substructure's finite element mesh is in two-dimension, the present invention is generally used in three-dimension. Additionally, whereas only two different configurations of substructure (
This application claims the benefits of U.S. Provisional Application No. 61/300,439, filed Feb. 1, 2010, and entitled “Multiscale Substructures in Finite Element Analysis”, which is hereby incorporated by reference for all purposes.
Number | Date | Country | |
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61300439 | Feb 2010 | US |