Patent Application
20200102227
This application claims all benefits accruing under 35 U.S.C. § 119 from China Patent Application No. 201811146610.7, filed on Sep. 29, 2018, in the China National Intellectual Property Administration, the contents of which are hereby incorporated by reference. The application is also related to copending applications entitled, “ANODE OF LITHIUM BATTERY, METHOD FOR FABRICATING THE SAME, AND LITHIUM BATTERY USING THE SAME”, filed ______ (Atty. Docket No. US75095).
The present disclosure relates to a nanoporous copper supported copper oxide nanosheet array composite and method thereof.
A transition metal oxide as an important functional material system has demonstrated excellent characteristics and great application prospects in the fields of new energy, electrochemical catalysis, photocatalysis and molecular detection. A copper oxide, as a P-type semiconductor, has a narrow band gap (1.2˜2 eV). The copper oxide is a promising metal oxide because of low cost, environmental friendliness and easy synthesis.
A microscopic morphology and structure of the copper oxide are the key factors determining the performance of the copper oxide. Nano-array structures (such as one-dimensional nanowire array, two-dimensional nanosheet array, etc.) have unique advantages and characteristics. Conventional methods for preparing a copper oxide nanostructure mainly includes aqueous solution method, chemical vapor deposition method, thermal oxidation method, and the like. The conventional methods offer a variety of options for preparing the transition metal oxide with nanostructures, but each has certain limitations in different aspects. In the aqueous solution method, many adjustable parameters can be used to prepare the transition metal oxide having various nanostructures. However, this method can only obtain a dispersed powder material, and preparation of a material with integrated structure and function may be difficult. The chemical vapor deposition method can precisely control microstructures of the transition metal oxide, and obtain the material with integrated structure and function, but cost is high and efficiency is low. The transition from metal to metal oxide can also be achieved by a thermal oxidation. For example, a copper metal sheets can be heated to form one-dimensional copper oxide nano array. But the peeling phenomenon of the oxide layer is severe because of a thermal stress during thermal oxidation and structure mismatch between layers. Therefore, it is important to develop a low cost and a high efficiency method for preparing a transition metal oxide nano array structure with integrated structure and function.
Implementations of the present technology will now be described, by way of embodiments, with reference to the attached figures.
The disclosure is illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean “at least one”.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale, and the proportions of certain parts may be exaggerated to illustrate details and features of the present disclosure better.
Several definitions that apply throughout this disclosure will now be presented.
The term “comprise” or “comprising” when utilized, means “include or including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.
A nanoporous copper supported copper oxide nanosheet array composite according to one embodiment is provided. The nanoporous copper supported copper oxide nanosheet array composite comprises a nanoporous copper substrate and a copper oxide nanosheet array. In one embodiment, the nanoporous copper supported copper oxide nanosheet array composite consists of the nanoporous copper substrate and the copper oxide nanosheet array. The copper oxide nanosheet array is disposed on one surface of the nanoporous copper substrate. The nanoporous copper substrate is chemically bonded to the copper oxide nanosheet array. The copper oxide nanosheet array comprises a plurality of copper oxide nanosheets. The plurality of copper oxide nanosheets are perpendicular to the nanoporous copper substrate and staggered to form an array structure.
The nanoporous copper substrate is a sheet structure. Referring to
In one embodiment, the nanoporous copper substrate comprises a reinforcement. The reinforcement is embedded in the porous of the nanoporous copper substrate to improve a mechanical strength of the nanoporous copper substrate. The material of the reinforcement can be, but not limited to, a carbon nanotube structure or a graphene. The carbon nanotube structure comprises at least one carbon nanotubes. When the carbon nanotube structure comprises a plurality of carbon nanotubes, the plurality of carbon nanotubes can be randomly arranged, or the plurality of carbon nanotubes form a film structure. The film structure comprises a drawn carbon nanotube film, a pressed carbon nanotube film, or a flocculated carbon nanotube film.
The plurality of carbon nanotubes in the drawn carbon nanotube film are connected to each other end to end by van der Waals force and arranged along a same direction. The plurality of carbon nanotubes in the pressed carbon nanotube film are disordered and arranged in the same direction or in different directions. The plurality of carbon nanotubes in the flocculated carbon nanotube film are attracted to each other by Van der Waals force and tangled to form a network structure comprising micropores.
A height of a copper oxide nanosheet ranges from about 200 nm to about 1.5 μm. A thickness of the copper oxide nanosheet ranges from about 20 nm to about 80 nm. The height of the copper oxide nanosheet array refers to the length of the copper oxide nanosheet perpendicular to the nanoporous copper substrate.
A flowchart is presented in accordance with an embodiment as illustrated. The embodiment of a method 1 for making a nanoporous copper supported copper oxide nanosheet array composite is provided, as there are a variety of ways to carry out the method. The method 1 described below can be carried out using the configurations illustrated in
At block 101, the nanoporous copper substrate is placed in an alkaline solution comprising an ammonia ion, the nanoporous copper substrate floats on a surface of the alkaline solution comprising the ammonia ion.
At block 102, the nanoporous copper substrate reacts with the alkaline solution comprising the ammonia ion to form a composite material.
At block 103, the composite material is dried to form a nanoporous copper supported copper oxide nanosheet array composite.
At block 101, the nanoporous copper substrate can be obtained by a conventional method, such as a dealloying method. The nanoporous copper substrate can be formed by dealloying an alloy substrate. The alloy substrate is a copper alloy substrate, such as, a copper-zinc alloy or a copper-aluminum alloy. The dealloying method can be a method of free etching or electrochemical dealloying. A thickness of the nanoporous copper substrate is related to a thickness of the alloy substrate. The nanoporous copper substrate is a sheet structure. The thickness of the nanoporous copper substrate ranges from about 0.01 mm to about 1 mm. The nanoporous copper substrate has a plurality of pores. A diameter of each of the pores ranges from about 20 nm to about 200 nm. In one embodiment, the thickness of the nanoporous copper substrate is about 0.05 mm, and the diameter of each pore ranges from about 20 nm to about 200 nm.
The nanoporous copper substrate can be tailored to a size and a shape as required. The nanoporous copper substrate is gently placed on the surface of the alkaline solution comprising the ammonia ion to avoid damaging the nanoporous copper substrate and affecting a morphology of a subsequently formed copper oxide nanosheet array. Since the nanoporous copper substrate has a small density and a high specific surface area, the nanoporous copper substrate can freely float on the surface of an alkaline solution comprising the ammonia ion. The alkaline solution comprising the ammonia ion is an ammonia solution or a sodium hydroxide solution. A concentration of the alkaline solution comprising the ammonia ion ranges from about 0.016 mol/L to about 1 mol/L. In one embodiment, the concentration of the alkaline solution comprising the ammonia ion ranges from about 0.016 mol/L to about 0.033 mol/L. Further, a step of removing impurities from the nanoporous copper substrate can be comprised before block 101, so that a finally formed nanoporous copper supported copper oxide nanosheet array composite has a good morphology. In one embodiment, the nanoporous copper substrate can be performed by a cleaning and drying treatment. Firstly, the nanoporous copper substrate can be washed with hydrochloric acid to remove the oxide layer on the surface of the nanoporous copper substrate. Secondly, the nanoporous copper substrate is cleaned and degreased by pure water or alcohol. A cleaned nanoporous copper substrate is placed in a vacuum drying oven and dried for 2 hours to 6 hours at a temperature in a range from about 140° C. to about 200° C. In one embodiment, the cleaned nanoporous copper substrate is placed in the vacuum drying oven and dried at a temperature of 80° C. for 2 hours.
In one embodiment, the nanoporous copper substrate comprises a reinforcement. The reinforcement is embedded in the porous of the nanoporous copper substrate to improve the mechanical strength of the nanoporous copper substrate. The material of the reinforcement can be, but not limited to, a carbon nanotube structure or a graphene. The carbon nanotube structure comprises at least one carbon nanotubes. When the carbon nanotube structure comprises a plurality of carbon nanotubes, the plurality of carbon nanotubes can be randomly arranged, or the plurality of carbon nanotubes forms a film structure. The film structure comprises a drawn carbon nanotube film, a pressed carbon nanotube film, or a flocculated carbon nanotube film.
The plurality of carbon nanotubes in the drawn carbon nanotube film are connected end to end by van der Waals force and arranged along a same direction. The plurality of carbon nanotubes in the pressed carbon nanotube film are disordered and arranged in the same direction or in different directions. The plurality of carbon nanotubes in the flocculated carbon nanotube film are attracted to each other by Van der Waals force and entangled to form a network structure with micropores.
The method of forming the nanoporous copper supported copper oxide nanosheet array composite does not affect a structure of the reinforcement. When the nanoporous copper substrate comprises the reinforcement, the nanoporous copper supported copper oxide nanosheet array composite eventually formed also has the reinforcement, and the structure of the reinforcement is unchanged.
Referring to
A rapid formation of the copper hydroxide array by oxidizing the nanoporous copper substrate mainly depends on a coordination of the ammonia ion, an activity of atoms at the metal ligament of the nanoporous copper substrate, and a rapid oxygen transmission at the surface of the alkaline solution. A principle of rapid oxidation reaction of the nanoporous copper substrate is as follows: the metal ligament of the nanoporous copper substrate has a small size, and copper atoms at the metal ligament are chemically highly active, so that the copper atoms are dissolved. The dissolved copper atoms are located in a contact surface between the nanoporous copper substrate and the alkaline solution comprising the ammonia ion, and the contact surface has a high oxygen concentration, thereby facilitating oxygen transmission. Therefore, the dissolved copper atoms are oxidized by oxygen in the alkaline solution to form divalent copper ions. Under an action of a strong ligand (NH3), the divalent copper ions tend to form a four-coordination ligand [Cu(H2O)2(NH3)]2+ with a planar quadrilateral configuration. A formed copper ligand continuously aggregates and grows at the metal ligament location, a Cu(OH)2 crystal with good thermodynamic stability is formed. A nucleation and growth of Cu(OH)2 crystal is supported by the metal ligament, and the Cu(OH)2 crystal growth mode is an unidirectional growth. The Cu(OH)2 crystal grows along a gravity direction by a gravity pull, and a one-dimensional acicular nano copper hydroxide array is formed.
At block 103, the composite material is dried and dehydrated in the vacuum drying oven. The copper hydroxide array in the composite material is converted into a copper oxide array to form the nanoporous copper supported copper oxide nanosheet array composite. The Raman spectrum of
A drying temperature and a drying time period of the composite material are set in stages in order to form the copper oxide nanosheet array having better crystallinity. In one embodiment, firstly, the composite material is dried at a lower temperature to remove part of water under mild conditions. Then, the temperature is increased to achieve a polymerization growth of the copper oxide to form the copper oxide nanosheet array with better crystallinity. In one embodiment, the composite material is finally dried and dehydrated at the temperature about 150° C. or more. In another embodiment, the composite material is finally dried and dehydrated at the temperature about 180° C.
In order to form the copper oxide nanosheet array having a good morphology, the composite material can be cleaned and dried to remove impurities before drying the composite material at block 103. In one embodiment, the composite material is placed in pure water or alcohol to clean the composite material, and then vacuum dried.
The morphology of the copper oxide nanosheet array is related to a concentration and type of the alkaline solution, the oxidation time, a drying temperature time. Therefore, the concentration and type of the alkaline solution, the oxidation time, the drying temperature and the drying time can be adjusted to achieve a required morphology of the copper oxide nanosheet array.
In Embodiment 1, a nanoporous copper substrate having a size of 1 cm by 1 cm is provided. Firstly, the nanoporous copper substrate is cleaned with hydrochloric acid to remove an oxide layer on surfaces of the nanoporous copper substrate. Secondly, the nanoporous copper substrate is degreased by pure water or alcohol. Finally, the nanoporous copper substrate is dried in a vacuum drying oven at a temperature of 80° C. for 2 hours. Then, the nanoporous copper substrate is oxidized as follows: the nanoporous copper substrate is gently placed on a surface of a 0.033 mol/L ammonia solution in a natural floating state at a room temperature for 12 hours, and the nanoporous copper is oxidized to form a composite material (copper hydroxide array). The composite material is taken out from the ammonia solution, washed in pure water and alcohol respectively, and vacuum dried. Then, the dried composite material is placed in the vacuum drying oven. Firstly, the vacuum drying oven is set at a temperature 60° C. for 2 hours; then the vacuum drying oven is set at a temperature 120° C. for 2 hours; finally the vacuum drying oven is set at a temperature 180° C. for 2 hours, and naturally cooled to room temperature to obtain the nanoporous copper supported copper oxide nanosheet array composite. The copper oxide nanosheet array is formed on one surface of the nanoporous copper substrate. An average length of the copper oxide nanosheet under this condition is about 1.2 μm, and an average thickness of the copper oxide nanosheets is about 40 nm.
The method for making a nanoporous copper supported copper oxide nanosheet array has the following characteristics. First, a plurality of nanoporous copper substrates prepared by different methods can be used to form the copper oxide nanosheet array by an oxidation treatment. The nanoporous copper substrate is easy to obtain. Second, the method is convenient and efficient and without complicated and expensive equipment. The method can be carried out at room temperature. The nanoporous copper is rapidly oxidized to form the copper oxide nanosheet array, and the morphology of the copper oxide nanosheet is conveniently adjustable. Third, the copper oxide nanosheet array is formed on one surface of the nanoporous copper. The nanoporous copper supported copper oxide nanosheet array not only has the performance of the copper oxide nanosheet array, but also retains structural characteristics and properties of the nanoporous copper. Therefore, the nanoporous copper supported copper oxide nanosheet array realizes the structural and functional integration of the two materials after compounding, and further fully synergizes the two materials. Fourth, the copper oxide nanosheet array is chemically bonded to the nanoporous copper substrate. There is a strong binding force between the copper oxide nanosheet array and the nanoporous copper substrate. Therefore, the copper oxide nanosheet array is not easily peeled off from the nanoporous copper substrate. Fifth, when the nanoporous copper substrate comprises the reinforcement, a mechanical strength of the nanoporous copper substrate can be improved.
Even though numerous characteristics and advantages of certain inventive embodiments have been set out in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only. Changes may be made in detail, especially in matters of arrangement of parts, within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Depending on the embodiment, certain of the steps of methods described may be removed, others may be added, and the sequence of steps may be altered. It is also to be understood that the description and the claims drawn to a method may comprise some indication in reference to certain steps. However, the indication used is only to be viewed for identification purposes and not as a suggestion as to an order for the steps.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, especially in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201811146610.7 | Sep 2018 | CN | national |
