Claims
- 1. A process for using a member selected from the group consisting of nanosized copper, nanosized copper oxides, nanosized copper chlorides, other nanosized copper salts, and mixtures thereof as sources of catalytic copper in the Direct Synthesis of trialkoxysilane of formula HSi(OR)3 wherein R is an alkyl group containing from 1 to 6 carbon atoms inclusive, said process comprising:
(a) forming a reaction mixture comprising a thermally stable solvent, silicon metal, a catalytically effective amount of said nanosized copper catalyst precursor; (b) agitating and heating this mixture to form copper-activated silicon in situ and injecting into said reaction mixture an alcohol to react with said copper-activated silicon to produce said trialkoxysilane; and (c) recovering said trialkoxysilane from the reaction product.
- 2. The process of claim 1 further comprising:
(d) remediating and reusing the reaction solvent in the Direct Synthesis of trialkoxysilanes.
- 3. The process of claim 1 wherein forming said reaction mixture includes mixing with a solvent used in preparation of said nanosized copper catalyst precursor.
- 4. The process of claim 1 wherein forming said reaction mixture includes providing a foam control agent.
- 5. The process of claim 1 wherein the Direct Synthesis of trimethoxysilane and triethoxysilane occurs with about 300 to about 5000 parts per million copper based on an amount of silicon.
- 6. The process of claim 1 wherein said member selected from the group consisting of nanosized copper, nanosized copper oxides, nanosized copper chlorides, other nanosized copper salts, and mixtures thereof, has an average particle size in a range from about 0.1 to about 600 nanometers.
- 7. The process of claim 6 wherein said member selected from the group consisting of nanosized copper, nanosized copper oxides, nanosized copper chlorides, other nanosized copper salts, and mixtures thereof has an average particle size in a range from about 0.1 to about 500 nanometers.
- 8. The process of claim 7 wherein said member selected from the group consisting of nanosized copper, nanosized copper oxides, nanosized copper chlorides, other nanosized copper salts, and mixtures thereof, has an average particle size in a range from about 0.1 to about 1 00 nanometers.
- 9. A process for the Direct Synthesis of trialkoxysilanes comprising the steps of:
(a) providing a slurry of silicon metal, and a copper catalyst precursor having an average particle size of about 0.1 to 600 nanometers in a thermally stable solvent; (b) forming a copper-silicon intermetallic; (c) reacting said copper-silicon intermetallic with an alcohol of formula ROH wherein R is an alkyl group having 1 to 6 carbon atoms inclusive, to form a trialkoxysilane of the formula HSi(OR)3 wherein R is as previously defined; (d) recovering the trialkoxysilane; and (e) remediating the thermally stable solvent for subsequent Direct Synthesis of trialkoxysilanes.
- 10. The process of claim 9 wherein in step (a) said slurry is formed with nanosized silicon metal.
- 11. The process of claim 9 wherein in step (a) said silicon metal is produced by acid leaching and said copper catalyst precursor comprises nanosized copper chloride.
- 12. The process of claim 9 wherein in step (a), said thermally stable solvent is a member selected from the group consisting of linear and branched paraffins, cycloparaffins, alkylated benzenes, aromatic ethers, and polyaromatic hydrocarbons.
- 13. The process of claim 9 wherein in step (a), an initial copper concentration is about 300 to about 5000 ppm based on an amount of said silicon metal.
- 14. The process of claim 9 wherein in step (a), said copper catalyst precursor has an average particle size of about 0.1 to 100 nanometers.
- 15. The process of claim 9 wherein in step (a), said copper catalyst precursor is selected from the group consisting of nanosized copper, nanosized copper oxides, nanosized copper chlorides, other nanosized copper salts, and mixtures thereof.
- 16. The process of claim 9 wherein in step (b) said copper-silicon intermetallic is formed by heating said copper catalyst precursor in said slurry for about 0.01 to about 24 hours at a temperature of about 20 to about 400° C.
- 17. The process of claim 9 wherein in step (b) said copper-silicon intermetallic is formed in situ.
- 18. The process of claim 9 wherein in step (b) said copper-silicon intermetallic is formed in a separate reaction vessel prior to reaction with said alcohol.
- 19. The process of claim 9 wherein in step (c) said alcohol is introduced as a gaseous stream to react with said copper-silicon intermetallic.
- 20. The process of claim 9 wherein in step (c) more than one alcohol is present to react with said copper-silicon intermetallic.
- 21. The process of claim 9 wherein step (c) comprises reacting said copper-silicon intermetallic with ethanol at a temperature of about 200 to about 210° C.
- 22. A composition useful for the Direct Synthesis of trialkoxysilanes comprising:
silicon metal having a particle size of less than about 500 μm; one or more copper catalyst precursors having an average particle size from about 0.1 nm to about 600 nm, a surface area as low as 0.1 m2/g, in an amount from about 0.01 to about 5 parts by weight per 100 parts of said silicon metal such that about 0.008 to about 4.5 parts elemental copper is present based on 100 parts by weight of said silicon metal; and a thermally stable reaction solvent present in an amount that provides a gravimetric ratio of solids to solvent of about 1:2 to about 1:4.
- 23. The composition of claim 22 wherein said copper catalyst precursors are selected from the group consisting of copper metal, copper (I) oxide, copper (II) oxide, copper (I) chloride, copper (II) chloride, copper (I) carboxylates, copper (II) carboxylates, other copper salts, and mixtures thereof.
- 24. A method of controlling Direct Synthesis of trialkoxysilanes comprising the steps of:
providing a silicon metal; providing a thermally stable solvent; providing one or more copper catalyst precursors having an average particle size of less than 600 nm; heating said silicon metal and said one or more copper catalyst precursors in said thermally stable solvent; forming copper-silicon intermetallics for reaction with an alcohol; and maintaining an effective copper concentration during a steady state of the Direct Synthesis wherein selectivity for trialkoxysilane is greater than about 10.
- 25. A trialkoxysilane produced by the process of claim 1.
- 26. A trialkoxysilane produced by the process of claim 9.
Parent Case Info
[0001] This application claims priority from provisional U.S. patent application Ser. No. 60/265,154 filed on Jan. 31, 2001, which is herein incorporated by reference in its entirety.
Provisional Applications (1)
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Number |
Date |
Country |
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60265154 |
Jan 2001 |
US |