Claims
- 1. A process of deposition comprising:providing a feed comprising from the group consisting of solids and fluids; providing a thermal reactor system to produce a vapor from the feed; providing a zone to nucleate nanoscale powders from the vapor; providing a thermal quench of said nucleated powders at rates of at least 1000° C. per second through a converging-diverging nozzle; providing a substrate in the diverging section of the nozzle; and forming a nanostructured layer over the substrate.
- 2. The process of claim 1 wherein the layer consists of an electrolyte.
- 3. The process of claim 1 wherein the layer consists of an electrode.
- 4. The process of claim 1 wherein the temperature of the vapor is greater than 1500 K.
- 5. The process of claim 1 wherein the temperature of the vapor is greater than 3000 K.
- 6. The process of claim 1 wherein the nanoscale powders comprise an oxygen containing compound.
- 7. The process of claim 1 wherein the nanoscale powders comprise a metal containing compound.
- 8. The process of claim 1 wherein the nanoscale powders comprise a metal.
- 9. A process for forming a nanostructured layer on a substrate comprising:feeding a raw material to a thermal reactor system, wherein the raw material is a solid or a fluid; producing a vapor from the raw material fed into the thermal reactor system and a zone to form nucleated vapor from the vapor; quenching thermally the nucleated vapor through a converging-diverging nozzle to form a nucleated nanoscale powder, wherein said quenching through the nozzle has a rate of at least 1000° C. per second; and providing a substrate in a diverging section of the converging-diverging nozzle to form a nanostructured layer on the substrate.
- 10. The process of claim 9, wherein said nanostructured layer comprises an electrolyte.
- 11. The process of claim 9, wherein said nanostructured layer comprises an electrode.
- 12. The process of claim 9, wherein the temperature of the vapor is greater than 2500 K.
- 13. The process of claim 9, wherein the temperature of the vapor is greater than 3000 K.
- 14. The process of claim 9, wherein said nucleated nanoscale powder comprises an oxygen containing compound.
- 15. The process of claim 9, the nanoscale powders comprise a metal containing compound.
- 16. The process of claim 9, wherein the nanoscale powders comprise a metal.
- 17. A method for forming a nanostructured coating comprising:vaporizing a liquid precursor; delivering the vaporized liquid precursor to a boundary-layer converging diverging nozzle, thereby forming a stream comprising of nanopowders; and delivering the stream comprising of nanopowders to a substrate, thereby forming a nanostructured coating on the substrate.
- 18. The method of claim 17 wherein the step of vaporizing the liquid precursor is performed at a temperature greater than 2500 K.
RELATED APPLICATIONS
This application is a continuation of copending U.S. Ser. No. 09/251,313 entitled “Nanostructured Solid Electrolytes and Devices”, filed Feb. 17, 1999, now U.S. Pat. No. 6,387,560, which is a continuation of U.S. Ser. No. 08/739,257, filed Oct. 30, 1996, now U.S. Pat. No. 5,905,000, which is a continuation-in-part of U.S. Ser. No. 08/730,661, entitled “Passive Electronic Components from Nano-Precision Engineered Materials,” filed on Oct. 11, 1996, now U.S. Pat. No. 5,952,040, which is a continuation-in-part of U.S. Ser. No. 08/706,819, filing date Sep. 30, 1996 entitled “Integrated Thermal Process and Apparatus for the Continuous Synthesis of Nanoscale Powders,” now issued as U.S. Pat. No. 5,851,507 on Dec. 22, 1998, and U.S. Ser. No. 08/707,341, entitled “Boundary Layer Joule-Thompson Nozzle for Thermal Quenching of High Temperature Vapors,” filed concurrently on Sep. 3, 1996, now issued as U.S. Pat. No. 5,788,738 on Aug. 4, 1998. These applications and patents are all commonly owned with the present application, and are all incorporated by reference herein.
US Referenced Citations (8)
Number |
Name |
Date |
Kind |
5149596 |
Smith et al. |
Sep 1992 |
A |
5338430 |
Parsonage et al. |
Aug 1994 |
A |
5569561 |
Exnar et al. |
Oct 1996 |
A |
5624718 |
Dearney |
Apr 1997 |
A |
5788738 |
Pirzada et al. |
Aug 1998 |
A |
5851507 |
Pirzada et al. |
Dec 1998 |
A |
5876683 |
Glumac et al. |
Mar 1999 |
A |
6042900 |
Rakhimov et al. |
Mar 2000 |
A |
Continuations (2)
|
Number |
Date |
Country |
Parent |
09/251313 |
Feb 1999 |
US |
Child |
09/988901 |
|
US |
Parent |
08/739257 |
Oct 1996 |
US |
Child |
09/251313 |
|
US |
Continuation in Parts (3)
|
Number |
Date |
Country |
Parent |
08/730661 |
Oct 1996 |
US |
Child |
08/739257 |
|
US |
Parent |
08/706819 |
Sep 1996 |
US |
Child |
08/730661 |
|
US |
Parent |
08/707341 |
Sep 1996 |
US |
Child |
08/706819 |
|
US |