Network floor structure

Abstract

A network floor structure is specifically composed of main bodies made by a plurality of wood-plastic material, which is processed with an injection molding in a whole unit. The main body includes a base board and a plurality of cover boards, wherein a plurality of conduction conduits are formed by a plurality of supporting boards located at a top end of the base board, and the plurality of cover boards are covered on each conduction conduit respectively, so as to integrally collect all kinds of wiring materials into the conduction conduits. As the conduction conduits are intersected in a straight and slant line, a many years of problem that the wiring materials cannot be bended by 90 degrees can be solved. In addition, a power socket can be installed at a proper position on the baseboard by the characteristics that the wood-plastic material can be sawn, planed, nailed, and drilled.

Description

BACKGROUND OF THE INVENTION

(a) Field of the Invention

The present invention relates to a network floor design, and more particularly to a network floor constituted by a plurality of main bodies of wood-plastic material processed by an injection molding in a whole unit for solving a problem that wire cables, and fiber optics, etc cannot be bended by 90 degrees.

(b) Description of the Prior Art

For setting up network lines, telephone lines, or power lines in an ordinary office or a place requiring a large-scale wiring, all kinds of wirings are conventionally embedded in pre-built wire conduits inside walls for effectively performing all kinds of wiring integration and collection. However, as the layout of wiring will be usually changed according to requirements, so as to replace or move its position, which will cause an insufficiency of the pre-built wire conduits. Therefore, the wirings must be exposed out of the wall corners, which will destroy a beauty of entire space.

Accordingly, a network floor arises to meet the requirements of market. An ordinary network floor uses primarily a plurality of cover boards to cover on passageways between the board materials, thereby laying out all kinds of wiring materials in the passageways, and then covering one by one the passageways with the cover boards for constituting a complete network floor as shown in Taiwan Utility Patent No. M262539, 568467, and 519153.

However, most of the network floors applied in the existing market comprise primarily a plastic, or in particular, metallic material. The network floors made by the metallic material such as an alloy steel are heavy in weight, and can be conducted electrically. Therefore, it is easy to cause a danger of getting an electric shock by exposing the wires, and is rather inconvenient in implementing. Moreover, its cost is relatively higher and it is not easy to be recycled.

On the other hand, although the network floors made by the plastic material are light in weight, and convenient to be recycled, the cover boards must be covered on the passageways formed between the board materials due to that the entire network floor is composed of a plurality of board materials. In addition, fixing boards should also be used between the board materials to position the board materials to avoid a shifting of the board materials, upon re-assembling the board materials, thereby preventing the board materials from being shifted in re-assembling, and affecting an efficiency and a quality of implementation.

Furthermore, a height of the conventional network floor is completely dependent on the height defined in manufacturing by manufacturers, and cannot be adjusted by a consumer by oneself. If a different height of network floor is required, the manufacturers will have to re-manufacture, which relatively increases a cost, thereby causing a limitation to a utilization of the network floor. In particular, the most troublesome is that the thick and large wire cables and fiber optics cannot be bended by 90 degrees, which has been an issue eager to be solved by the industries for many years.

SUMMARY OF THE INVENTION

The present invention is composed primarily of a plurality of main bodies formed by a wood-plastic materials processed by an injection molding in a whole unit and connected with one another, wherein the main body is constituted by a base board and a plurality of cover boards, with a plurality of conduction conduits in a star shape constituted by a plurality of supporting boards on a top end of the base board. The cover board is covered on each conduction conduit, so as to integrally collect all kinds of wiring materials into the conduction conduit. In addition, a power socket can be installed on a proper position of the cover board with the characteristics that the wood-plastic material can be sawn, planed, nailed, and drilled.

The primary object of the present invention is to integrally collect the wiring materials using the main bodies made by the wood-plastic materials processed with the injection molding, and the conduction conduits formed by the plurality of supporting boards installed on each base board, to prevent the wiring materials from being damaged through a covering with the cover boards, and to provide a network floor which is easy to implement and can be quickly assembled with the characteristics that the wood-plastic materials can be sawn, planed, nailed, and drilled.

Another object of the present invention is to enable that a large and thick wire cable and fiber optics can be easily installed without being bended by 90 degrees, and can maintain a quality of signal transmission.

Still another object of the present invention is to pre-configure a reserved block for installing a power socket when performing the injection molding to each cover board, thereby facilitating a quick installation of the power socket after removing the reserved block on demand.

Yet another object of the present invention is to install a latch bump and a latch groove, which are corresponding to each other and can be latched together, on an edge of each base board, thereby enabling a quick assembly and position between each base board through the latching of the latch bump and the latch groove.

Still another object of the present invention is to install at least one adjusting plate, which can be used to adjust a height, at a bottom of each base board, thereby providing a consumer to adjust the required height of network floor by oneself.

To enable a further understanding of the said objectives and the technological methods of the invention herein, the brief description of the drawings below is followed by the detailed description of the preferred embodiments.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a schematic view upon assembling the present invention.

FIG. 2 shows a schematic view of a first implementation of a base board of the present invention.

FIG. 3 shows a schematic view of a first cover board of the present invention.

FIG. 4 shows a schematic view of a second cover board of the present invention.

FIG. 5 shows a schematic view of a third cover board of the present invention.

FIG. 6 shows a schematic view of a bottom of a first implementation of a base board of the present invention.

FIG. 7 shows a schematic view of a second implementation of a base board of the present invention.

FIG. 8 shows a schematic view of a bottom of a second implementation of a base board of the present invention.

FIG. 9 shows a cutaway view of a bottom of a cover board of the present invention.

FIG. 10 shows a partial cutaway view after assembling the present invention.

FIG. 11 shows a schematic view of a separation board of the present invention.

FIG. 12 shows a schematic view of a bottom of a fourth cover board of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Referring to FIG. 1 and FIG. 2, a network floor 10 of the present invention comprises primarily a plurality of main bodies 20 connected with one another, wherein the main body 20 is made by a wood-plastic material (i.e., a plastic material added with a wood material and can be sawn, planed, nailed, and drilled) which is processing with an injection molding in a whole unit. The main body 20 is composed of a base board 30 and a plurality of cover boards (described below), wherein a plurality of three-dimensional supporting boards 31 are installed on the base board 30, and a plurality of mutually intersected conduction conduits 32 are divided on the base board 30 through the supporting boards 31, thereby forming a status of mutual conduction at an intersection between each base board 30. The plurality of cover boards are covered on a top end of the conduction conduit 32, and a concaved groove 33 is installed at a periphery of a top end face of each supporting board 31.

Referring to FIG. 3, 4, and 5, the cover board of this implementation includes a first cover board 41, a second cover board 42, and a third cover board 43, wherein restraining strips are located at positions close to edges of a bottom face of each cover board. An outer rim 45 of each restraining strip 44 is patched on two sides of the conduction conduits 32, and a cover face 46 is constituted at an edge of a bottom face of each cover board through a separation of the restraining strips 44, in order to patch the cover face 46 on an end face of the groove 33, so as to firmly cover the cover board 20 on a top end of the conduction conduits 32, thereby enabling wiring materials such as network lines, telephone lines, or power lines to be integrally collected into the conduction conduits 32, such that all the wiring materials can be completely hidden in the main body 20.

Referring to FIG. 6, in order to increase a structural intensity of each cover board, reinforced ribs are installed on a bottom end face of the cover board; the figure shows the first cover board 41 as an implementation. The reinforced ribs 47 are connected at positions close to each restraining strip 44, and are lower than the restraining strips 44, so as to prevent the restraining ribs 47 from being pressed on each wiring material, thereby causing damage to the wiring materials.

Moreover, a reserved block is pre-configured on the base cover for installing a power socket. As shown in the figure, at least one reserved block 48 is located at a proper position on the first cover board 41. As a shape of the reserved block 48 is corresponding to an appearance of all kinds of power sockets, the power socket can be installed at the position of reserved block 48 after removing the reserved block 48, thereby enabling an entire wiring layout to be even more complete.

Referring to FIG. 7 and FIG. 8, it shows another implementation of the present invention. Two corresponding supporting boards 31 are located on the base board 30, which forms a conduction conduit 32 between the two supporting boards 31. As shown in FIG. 9, a cover board 40 in a shape of long strip is covered on the conduction conduit 32, and in order to prevent the base board 30 from generating a deformation due to a large volume during performing an injection molding process, a bottom of the supporting board 31 is a hollow groove 36, wherein a plurality of protruded cylinders 37 are located in the hollow groove 36. The cylinders 37 can be used to increase an intensity of the supporting board 31, and can also reduce a volume of the base board 30, thereby preventing the base board 30 from generating a deformation during performing the injection molding process.

In addition, in order to fix each base board 30 in connecting, a corresponding latch bump 34 and a latch groove 35 are located at two adjacent edges of the base board 30, as shown in FIG. 2 and FIG. 8, so as to insert the base board 30 into the latch groove 35 through the latch bump 34 upon connecting each base board 30, thereby enabling a mutual latching between each base board 30 for restraining and fixing.

Referring to FIG. 10, in order to increase an adjustability to a height of the entire network floor 10, an adjusting plate 50 is installed at a bottom end of the three-dimensional supporting board 31 above the base board 30, with a rotating rod 51 extended upward from the adjusting plate 50. A rotating member 52 is located at a top end of the rotating rod 51, and is extended to a top end face of the supporting board 31 and aligned with the end face, such that the rotating member 52 on the end face of the supporting board 31 can be rotated to adjust an up and down position of the adjusting plate 50 along an axial direction of the rotating rod 51 through the rotating rod 51, thereby adjusting the height of the base board 30 for adjusting the height of the entire network floor 10 on demand.

Referring to FIG. 1 and FIG. 11, a separation board 60 can be installed between the base board 30 and the first cover board 41. A leveling board 61 is located at an edge of a bottom end of the separation board 60, and is a little lower than the first cover board 40, such that the conduction conduit 32 between the base board 30 and the first cover board 41 can be divided into an upper and a lower conduits through the separation board 60, thereby enabling an orderly integration of all wiring materials distributed between the upper and lower conduits, without being easily tied up or twisted together. As shown in FIG. 12, the cover board can be further a fourth cover board 49 in a cross shape and is covered on the conduction conduit 32. Similarly, restraining strips 44, conduction conduits 45, and reinforced ribs 47 are also located at a bottom end of the fourth cover board 49.

It is of course to be understood that the embodiments described herein is merely illustrative of the principles of the invention and that a wide variety of modifications thereto may be effected by persons skilled in the art without departing from the spirit and scope of the invention as set forth in the following claims.

Claims

1. A network floor structure comprising primarily a plurality of main bodies connected with one another, wherein the main body is composed of a base board and a plurality of cover boards, a plurality of supporting boards are installed on the base board to divide into a plurality of intersected conduction conduits in a star shape and to form a status of mutual conduction at an intersection between each base board, and the plurality of cover boards are covered on a top end of the conduction conduits.

2. The network floor structure according to claim 1, wherein a concaved groove is located at a periphery of a top end face of each supporting board.

3. The network floor structure according to claim 1, wherein reinforced ribs are installed at a bottom of the cover board, and are lower than the supporting boards.

4. The network floor structure according to claim 1, wherein restraining strips are located at positions close to edges of a bottom face of the cover board, with an outer rim of each restraining strip patched on two sides of the conduction conduit.

5. The network floor structure according to claim 1, wherein a reserved block can be pre-configured on the cover board for providing an installation of a power socket.

6. The network floor structure according to claim 1, wherein a corresponding latch bump and a latch groove are located at two adjacent edges of the base board, so as to firmly fix each base board through a mutual latching of the latch bump and the latch groove at edges of each base board.

7. The network floor structure according to claim 1, wherein the supporting board is in a three-dimensional shape.

8. The network floor structure according to claim 7, wherein an adjusting plate is located at a bottom end of the three-dimensional supporting board, a rotating rod is extended upward from the adjusting plate, and a rotating member is located at a top end of the rotating rod and is extended to an upper end face of the base board, so as to adjust an up and down position of the adjusting plate along an axial direction by rotating the rotating member, thereby adjusting a height of the adjusting plate.

9. The network floor structure according to claim 1, wherein a bottom of the supporting board is a hollow groove, and a plurality of protruded cylinders are installed in the hollow groove.

10. The network floor structure according to claim 1, wherein a separation board is installed between the base board and the cover board, and a leveling board is located at an edge of bottom end of the separation board and is a little lower than the first cover board.