Network interface connectors are components of networking active equipment such as routers, switches, controllers and network interface cards. Only the mateable interface geometry proper of these connectors is covered by the modular connector standards.
The transmission properties of these connectors usually vary depending upon the PCB impedance and other components utilized in the active networking equipment printed wiring boards. For these reasons the transmission properties, while being critical for the equipment functionality, are not covered by U.S. or international standards, but are defined by each equipment manufacturer based on its own system experimental evaluation.
Network interface connectors require designers to address and solve a combination of unique transmission parameters as well as other limitations common to modular connectors. These include:
Network equipment providers market a large variety of appliances for 10/100 MbE, 1 GbE and 10 GbE. Network interface connectors are integral parts of these appliances. The application market requires both single port and multiport connectors. The connectors are soldered to multi-layer motherboards together with other components such as PHY, resistors, magnetics, capacitors, etc.
Moreover, network applications require smaller and denser designs because, in part, the motherboard PCBs are multilayer and expensive.
Conventional techniques for enhancing the transmission performance of connectors on a motherboard PCB can be very costly. An RJ45 standard connector is often the tallest component on the PCB—so its height over the PCB needs to be reduced without sacrificing the standard dimensions.
While the outline and dimensions of modular connectors are subject to U.S. and international standards such as IEC 600603-7 and TIA 568 series, the internal designs of connectors differ widely.
The desired transmission properties of these connectors usually vary depending upon the PHY input impedance and other components utilized in the active networking equipment printed wiring boards.
Typical transmission requirements commonly referred to as categories (category 5e is characterized up to 100 MHz, category 6 up to 250 MHz and category 6a up to 500 MHz) are used as guidelines only.
The networking companies must have connectors of the same physical dimensions but be able to accommodate any one of a variety of options in transmission response. Moreover, the electrical response should differentiate for various transmission speeds. It is desirable for connectors, of identical appearance and footprint, provide matched electrical response for 10/100 Mbe, 1 GbE or 10 GbE chipsets. Presently, connectors are designed for specific issues such as a given common mode noise at a given frequency for a specific PHY.
The performance of a connector is judged by either direct measurement of the transmitted signals or by controlling the major transmission parameters such as NEXT, Return loss and Common mode noise and Common to Differential mode conversion. These parameters are specified in the US in TIA 568-10 and internationally in the IEC 60603-7 standard series.
Low profile RJ45 connectors are known and are used as network interface connectors. Their interface geometry is still governed by the TIA 568 and IEC/ISO 60603-7 series of standards. However network interface connectors are not parts of the channel as defined by the standards.
Since the location of the PHY and/or other components in the channel, such as magnetics (filters and isolation transformers) and discharge capacitors, distorts the NEXT and Return Loss, the requirements for NEXT and RL compensation differ from application to application. In order to meet such requirements connector manufacturers supply different connectors to work with specific PHYs.
The transmission performance of RJ45 type network interface connectors is enhanced by internal compensation such as by providing compensation circuitry on an internal PCB or on flexible circuits. The connector contacts are soldered to the internal PCBs.
Presently, it is not feasible to enhance or modify the transmission characteristics of such connectors after they are soldered to the motherboard.
Tests of connectors are conducted using the exact network equipment and PHY specific to the application. In order to tune the performance for a particular application, connectors have to be de-soldered and removed from the motherboards, re-assembled or discarded and new connectors used. If a problem is found in the field, often the complete network installation has to be re-placed or scrapped.
It would be advantageous to be able to modify, upgrade or change the transmission characteristics and performance of a network interface connector after it has been soldered to a motherboard.
Accordingly, it is an object of the present invention to provide a new and improved network interface connector, the electrical properties and transmission characteristics of which can be easily modified, upgraded or changed.
It is another object of the present invention to provide such a new and improved network interface connector, the electrical properties and transmission characteristics of which can be easily modified, upgraded or changed after it has been soldered to a motherboard.
Still another object of the present invention is to provide such a new and improved network interface connector of the modular type whose mateable interface geometry conforms with modular connector standards.
Still another object of the present invention is to provide such a new and improved network interface connector which has a single port or multiple ports.
Still another object of the present invention is to provide such a new and improved network interface modular connector for applications for at least 1 GbE.
Still another object of the present invention is to provide such a new and improved network interface modular connector which has a low profile and which can be mounted mid-board.
Still another object of the present invention is to provide such a new and improved network interface modular connector the components of which are easy to manufacture at low cost using conventional methods and equipment.
Still another object of the present invention is to provide such a new and improved network interface connector the transmission enhancements of which, such as compensation, are situated within the connector.
Still another object of the present invention is to provide such a new and improved network interface connector which meets selected specified requirements when tested as specified in TIA 568A and IEC 60603-7.
Still another object of the present invention is to provide such a new and improved network interface connector which can be customized to a high degree to differentiate from 1 GbE to other limits specified by customers.
Still another object of the present invention is to provide such a new and improved network interface connector which can be shielded or unshielded and can be provided with condition-indicating LEDs.
Briefly, these and other objects are attained by providing a network interface connector comprising an outer housing and a contact assembly situated in the outer housing. The contact assembly includes a mounting block, a first group of first or upper elongate contacts mounted on the mounting block and a second group of second or lower elongate contacts mounted on the mounting block. The first and second elongate contacts are configured such that contact portions of the first and second contacts are coplanar and spaced according to U.S. and international standards for modular connectors. The first and second elongate contacts have rearward portions that are situated in first and second spaced parallel planes respectively to define a proximity gap between them. A proximity insert is situated, preferably removably, in the proximity gap between the rearward portions of the first and second elongate contacts.
The proximity insert preferably extends between the rearward portions of all of the first and second contacts.
The construction of the proximity insert is chosen in view of the desired transmission and electrical properties of the connector. For example, the proximity insert can be constituted by a printed circuit board having conductors coupled to the elongate contacts. The proximity insert can be formed of a non-conductive material or of a material having a high dielectric constant, such as BaTio2 or ceramics. Alternatively, the proximity insert can be formed of a metallic material coated with an isolating material such as polymide, PBT or acrylic paint, or be formed of ferrite.
The contact portions of the first and second contacts preferably alternate with one another. The first and second groups of elongate contacts preferably include four first elongate contacts and four second elongate contacts. At least one pair of first and second elongate contacts cross over each other.
The connector either has a single port or multiple ports. In a multiple port embodiment a contact assembly is associated with each port. The contact assemblies are configured such that the proximity gaps of the contact assemblies are aligned with each other and single proximity insert is configured to be situated, preferably removably, in aligned proximity gaps.
A more complete appreciation of the present invention and many of the attendant advantages thereof will be readily understood by reference to the accompanying drawings which illustrate preferred embodiments of the invention wherein:
a)-(e) are plan views showing the proximity insert of
a) and
Referring now to the drawings in which like reference characters designate identical or corresponding parts throughout the several views and, more particularly to
According to the invention, a variety of different proximity inserts are possible for use in particular applications to achieve desired electrical properties and improved transmission characteristics.
As described below, the contact assembly 8 is assembled and situated within the outer housing 1. A metallic shield 2 is optionally provided around housing 1 for use in a shielded system as is conventional. A pair of conditioning-indicating LEDs 7a and 7b and leads are optionally provided.
Referring to
The proximity insert 6 preferably comprises a body having the shape of a thin rectangular prism having opposed parallel upper and lower faces 32, 42, although other shapes are possible. The thickness of the proximity insert 6, i.e., the distance between the upper and lower surfaces 32 and 42 of the proximity insert 6, is substantially equal to or slightly smaller than the distance g of the proximity gap 50 and is within the range of between about 0.01″ to 0.2″. The proximity insert 6 is situated in the proximity gap 50 as shown in
Referring to
The second elongate contacts 401, 403, 405 and 407 of the lower contact array 4 are mounted on the mounting block 5 by inserting their pin portions d through the holes 36 of the lower shelf 20. The rearward portions c of the contacts are received in respective ones of the recesses 24 formed in the lower horizontal shelf 20. The contacts have rectangular cross-sections and the upper surfaces of the rearward portions c are substantially coplanar with, or slightly recessed from, the upper surface of shelf 20. The contact portions a of the second contacts 401, 403, 405 and 407 slant downwardly from the forward ends of the recesses 24 of lower horizontal shelf 20 and are coplanar with each other. The forward ends of the contact portions a of contacts 401, 403, 405 and 407 are situated in the first, third, fifth and seventh guide recesses 38 (as seen from the right side of the contact mounting block 5 in
Still referring to
The thickness of the proximity insert 6c is substantially equal to the size g of the proximity gap 50 (
Referring to
As mentioned above, the rearward portions b, c of the elongate contacts of the first and second contact arrays 3 and 4 may engage or may be slightly spaced from the respective opposite surfaces of proximity insert 6 depending on the application. The proximity insert 6 is not soldered to any of the contacts. The assembly of first and second contacts of the upper and lower contact arrays 3 and 4 and the proximity insert 6c onto the mounting block 5 (as shown in
An advantage of the construction of the present invention is that the proximity insert is removable from the proximity gap after the connector has been soldered to a motherboard and replaceable by another proximity insert having different electrical characteristics to provide the connector with different transmission properties without de-soldering the connector from the motherboard. Referring to
Referring to
Five possible proximity inserts 6a-6e which can alternatively be interchangeably incorporated as part of a single port connector 10 to achieve desired electrical characteristics in accordance with the invention are illustrated in
Proximity insert 6a comprises a printed circuit board made of modified epoxy resin in which metal conductors are embedded. This embodiment is discussed in greater detail below in connection with
Proximity insert 6b is formed of a non-conductive material having a low dielectric constant in a range of between about 1.1 to 3.7, such as plastic or paper or PTFE. This type of proximity insert prevents the rearward contact portions b and c from engaging each other when the proximity gap is small and provides necessary isolation for high voltages. Due to safety requirements, the connectors 10 must withstand 1000 volts between contacts. A proximity insert formed of high dielectric strength has better electrical performance than air.
Proximity insert 6c is formed of a material having a relatively high dielectric strength such as BaTiO2 or a ceramic material. The proximity insert 6c increases coupling and correspondingly increases the differential Near End Crosstalk between contacts 302 and 401 which may be of opposite phase to the crosstalk at a different part of a complete transmission line, i.e., in the modular plug. As a result, overall crosstalk will be reduced.
Proximity insert 6d is formed of metal covered on both its upper and lower surfaces with isolating material such as polyimide or PBT or acrylic paint. Such construction reduces impedance possibly to the characteristic impedance of the line in the immediate vicinity of PHY resulting in better balance and corresponding better Return Loss.
Proximity insert 6e is formed of ferrite material so as to comprise a low pass filter attenuating unwanted parasitic common and differential noise as well as attenuating some of the high frequency portion of the signal spectra, resulting in higher fidelity and improvements in noise to signal ratios.
While the illustrated embodiments of the proximity inserts fill the proximity gap between the rearward portions of all of the contacts of the upper and lower arrays, the length of the proximity inserts can be shorter and fill the proximity gap between only some of the contacts and still achieve improved transmission properties.
Referring to
The multiport contact assembly 80 is situated in an appropriately formed multiport outer housing 1′ which may be covered by a shield 2′ as seen in
As seen in
Referring to
a) and
Numerous modifications and variations of the illustrated preferred embodiments are possible in light of the above teachings within the scope of the claims appended hereto.
Reference is made to U.S. provisional patent application Ser. No. 62/008,013 filed Jun. 5, 2014, the filing date of which is hereby claimed.
Number | Date | Country | |
---|---|---|---|
62008013 | Jun 2014 | US |