Tankless water heaters have become more pervasive in recent years as a way to instantaneously provide heated water. A variety of methods for heating water are available, such as bare wire heaters, to provide this instantaneously heated water. Tankless water heaters also provide the ability to heat water on demand and do not need to constantly maintain a hot water supply as required with conventional water heaters. However, issues can arise if the flow of water passing through the tankless water heater is too great for the tankless water heater to process effectively. Further, tankless water heaters can sometimes be bulky and require a lot of space for installation. Manufacturing and assembly of tankless water heaters can also be troublesome due to the complexity of their design.
In selected embodiments, a heating unit includes a first manifold having at least one inlet, a second manifold connected to the first manifold and having at least one outlet, and a third manifold. The heating unit also includes one or more heating systems which extend from the third manifold to the first manifold via the second manifold, where the one or more heating systems have an inner tube and an outer tube. Further, the heating unit includes a fluid flow path from the at least one inlet to the at least one outlet via the first manifold, an area between the inner tube and outer tube, the interior of the inner tube and the second manifold.
The details of one or more implementations are set forth in the accompanying drawing and description below. Other features, objects, and advantages will be apparent from the description and drawings, and from the claims.
Like reference symbols in various drawing indicate like elements.
Selected embodiments are now described by referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views. It is noted that as used in the specification and the appending claims, the singular forms “a,” “an,” and “the” can include plural references unless the context clearly dictates otherwise.
The tube 10 is molded or machined to act as a supporting structure for at least one electrical resistance heating element 14 which runs the length of the tube 10. In selected embodiments and as illustrated in
The retention clips 22 are formed to provide pivot points for the electrical resistance heating elements 14 connected thereto. In other words, the retention clips 22 can be linearly adjusted along the indexed grooves 18 at which the retention clip is located to linearly adjust the location of the placement of the electrical resistance heating elements 14 on the surface of the tube 10. For example, in
The ability to linearly adjust the electrical resistance heating elements 14 within an indexed groove 18 via the retention clip provides numerous advantageous. For example, each system in which the heating unit 1 is applied can be tested to determine the best heat transfer properties based on the particularities of the system such that the position of the electrical resistance heating elements 14 can be adjusted to maximize heat transfer within that system. Further, should the heat transfer characteristics change at some point, the locations of the electrical resistance heating elements 14 of the heating unit 1 can easily be modified to compensate for this change.
As illustrated in
The use of retention clips 22 as a support structures to provide a gap between a surface of the tube 10 and the surface of the electrical resistance heating elements 14 provides various advantages. For instance, by using the retention clips in this fashion, there will be an increased fluid flow over the electrical resistance heating elements 14 thereby providing an enhanced cooling effect that lowers the risk of burnout or damage to the electrical resistance heating elements 14. Further, connecting the electrical resistance heating elements 14 to the retention clip 22 in this fashion provides for a predetermined amount of tension of the electrical resistance heating elements 14 thereby preventing sag or looseness of the electrical resistance heating elements 14. The use of one or more retention clips 22 also provides a more even temperature distribution when heating liquids passing over the electrical resistance heating elements 14 and further helps to prevent localized boiling on a surface of the electrical resistance heating elements 14 which may be caused by low flow velocities or areas of stagnant flow in contact with the surface of the electrical resistance heating elements 14. Alternatively, or in addition, the indexed grooves 18 themselves could be molded or machined such that they are raised above the surface of the tube 10 thereby providing a support structure on which to raise the electrical resistance heating elements 14 above a surface of the tube 10. Retention clips 22 could then be used on the raised indexed grooves 18 to adjust the position of the electrical resistance heating elements 14 as previously described herein.
A plurality of connection ports are also illustrated in
The optical assembly 55 provides the heating system 50 with the ability to efficiently detect overheating of the electrical resistance heating elements 14. Under normal conditions, the electrical resistance heating elements 14 will not emit any visible light and will only emit heat energy. However, if at least one of the electrical resistance heating elements 14 is dry fired without the presence of a fluid or has been energizing stagnant fluids for extended periods, the electrical resistance heating element 14 will begin to emit light energy in the visible spectrum. For example, the electrical resistance heating element 14 may begin in this instance to emit a visible red, orange or yellowish glow. The optical sensor 56 is an optical sensor as would be recognized by one of ordinary skill in the art and is calibrated, selected and/or filtered such that the optical sensor 56 will detect light emitted from one or more overheating electrical resistance heating element 14. To reduce the amount of non-visible infrared emission from one or more of the electrical resistance heating elements 14 which could cause false readings by the optical sensor 56, at least one translucent filter 58 is provided as described herein which filters the infrared emission before it is detected by the optical sensor 56. In selected embodiments, the optical sensor 56 may also be configured to detect infrared wavelengths that co-relate to predetermined element surface temperatures that are above normal operating conditions for the electrical resistance heating elements 14. This provides an advanced warning as to whether an electrical resistance heating element 14 may be overheating before the electrical resistance heating element 14 starts to emit light energy in the visible spectrum.
To prevent further false readings by the optical sensor 56, the light blocking element 57 is provided over a portion of the translucent filter 58 to prevent ambient light from entering the opening 60 of the heating chamber 51 between the heating chamber 51 and the translucent filter 57 and/or the translucent filter 57 and the backplane 54. Further, in selected embodiments, the heating chamber 51 may be molded or machined from an opaque material to further reduce the amount of ambient light that may enter an inner surface of the heating chamber 51. Additionally, in selected embodiments, the backplane 54 may consist of Printed Circuit Board (PCB) made of an opaque material to prevent ambient light from entering a backside of the PCB and affecting readings made by the optical sensor 56. Power is provided to the optical sensor 56 via the backplane 54 which is powered from an external source as would be understood by one of ordinary skill in the art.
The heating system 50 described above having a heating chamber 51 comprising an optical assembly 55 which can detect overheating of electrical resistance heating elements 14 of the enclosed heating unit 1 provides numerous advantages. At any point at which the optical sensor 56 detects visible light being emitted from at least one of the electrical resistance heating elements 14, a signal may be generated by the optical sensor 56 and processed by the PCB to transmit a signal to cut power to a specific overheating electrical resistance heading element 14 or to all the electrical resistance heating elements. Signals output from the optical sensor 56 may also be further filtered by software or hardware to ignore ambient light from external sources and limit detection and warning to light emitted by the electrical resistance heating elements 14 in a particular visible spectrum. Further, detecting overheating via the optical sensor 56 through the detection of light provides extremely high speed of light reaction times for shutting down one or more electrical resistance heating elements 14. Therefore, the heating system 50 can easily prevent damage to the electrical resistance heating elements 14 or other parts thereby increasing the longevity of the system as a whole and reducing cost for replacement parts.
It should be noted that while the description above with respect to
Additional configurations are possible via design options for the heating chamber 51 such that the heating chamber 51 may be machined or molded with one or more connection ports 59 and openings 60. Accordingly, the heating chamber 51 may have connection ports 59 on various sides of the heating chamber 51 such that a plurality of electrical resistance heating elements 14 are visible through openings 60. Accordingly, a plurality of optical assemblies 55 may be affixed to the connection ports 59 to provide enhanced thermal detection and safety activation procedures to reduce the chances of damage to the electrical resistance heating elements 14. To provide the heating system 50 at a lower cost, fewer optical assemblies 55 may be used to detect light emitted from one or more electrical resistance heating elements 14. In this configuration, the optical sensor 56 may be configured to detect lower level amounts of visible light such that light emitted by overheating electrical resistance heating elements 14 on the opposite side of the connection port 59 of which the optical assembly 55 is attached may be detected. Further, in selected embodiments reflective optics may be placed on the outer surface of the tube 10 and/or an inner surface of the heating chamber 51 such that light emitted by overheating electrical resistance heating elements 14 is transmitted through the interior of the heating system 51 and/or magnified for enhanced detection by the optical sensor 56. Further, the interior of tube 10 may be manufactured to have a glossy finish thereby providing enhanced reflective properties. In this configuration, cost may be saved as fewer optical assemblies may be required.
The components described above can be manufactured, in selected embodiments, via injection molding or machining as would be understood by one of ordinary skill in the art. Therefore, the tube 10 and heating chamber 51 may be molded into any shape or made from any material, such as thermoplastic or thermosetting polymers, as would be understood by one of ordinary skill in the art. Accordingly, common polymers such as epoxy, phenolic, nylon, polyethylene or polystyrene may be utilized. This material is fed into a heated barrel, mixed and forced into a mold cavity (formed of a material such as steel or aluminum and machined to a form that features the desired part) where it cools and hardens to the configuration of the cavity. Exemplary molding machines that may be utilized for such a process include a Ferromatik milcaron injection molding machine or those built by Arburg.
The components described above, such as the heating unit 1 and heating chamber 51, may be also be precision machined manually or automatically by computer numerical control (CNC) as would be understood by one of ordinary skill in the art. Accordingly, the components can be formed of metal, such as steel or aluminum, and formed via a combination of turning, drilling, milling, shaping, planning, boring, broaching and sawing.
The electrical resistance heating elements 14 can be made from any type of alloy as would be understood by one of ordinary skill in the art. For example, the electrical resistance heating elements 14 may consist of a high temperature resistance alloy such as nickel-chrome alloy or iron chrome aluminum alloy. These may be formed as coils as illustrated in
The optical sensor 56 in selected embodiments may be any electro-optical sensor as would be recognized by one of ordinary skill in the art. The optical sensor measures the physical quantity of light rays and converts this information into electronic signals which are process by the PCB. The translucent filter 57 may be any filter that can block infrared wavelengths but pass visible light as would be understood by one of ordinary skill in the art. For instance, the translucent filter may be an infrared cut-off filter or heat-absorbing filter which reflects or blocks infrared wavelengths while passing visible light.
The inlet manifold 710 provides an entryway for liquids to enter the modular heating unit 700 via the inlet 714. It should be noted that in selected embodiments, the modular heating unit 700 may contain more than one inlet 714. Liquids may be received from any source via an inlet tube (not shown) connected to the inlet 714.
The outlet manifold 702 provides an exit for liquids to leave the modular heating unit 700 via the outlet 708. In selected embodiments and as with the inlet 714, the modular heating unit 700 may contain more than one outlet 708. Liquids exiting the outlet 708 may be transmitted to any destination, such as a shower or sink, via an outlet tube (not shown) connected to the outlet 708. The outlet manifold 702 further includes an outlet manifold lid 706 to contain liquids within the outlet manifold 702 before they are transmitted externally via the outlet 708. The outlet manifold lid 706 is attached to the outlet manifold 702 via the fastening device 707. Alternatively, or in addition to, additional fastening devices may be radially provided around the inlet manifold 710 and outlet manifold 702.
The heating systems 50 extend between the outlet manifold 702 and the bottom manifold 716 via the inlet manifold 710. The term heating systems 50 is used herein to represent one or more heating systems 50. In selected embodiments, the one or more heating systems may be the heating systems 50 described previously herein whereas in other embodiments other types of heating systems may be utilized. Further, a combination of the heating systems 50 and other heating systems may be employed in the modular heating unit 700. Advantageously, any number of heating systems 50 may be employed in the modular heating unit 700 based on the user needs, water flow and temperature requirements.
The flow path 804 illustrates a flow path from the entry of liquids via the inlet 714 of the inlet manifold 710, the flow channel 38 of the heating systems 50, the bottom manifold 716, an interior of the tube 10, a throughway passage 818 and the outlet 708 of the outlet manifold 702. More specifically, liquids enter via the inlet 714 into the interior of the inlet manifold 710 and then enter the flow channel 38 via an opening 808 in the inlet manifold 710 connected to the space between the tube 10 and the heating chamber 51. The opening 808 is a space between an opening of the inlet manifold 710 which receives the tube 10 and the tube 10 itself. Liquid then flows down the flow channel 38 and into the bottom manifold 716.
The bottom manifold 716 contains a plurality of openings 810 to receive the heating systems 50 and liquids flowing in the flow channel 38. As illustrated in
Based on liquid pressure and the parabolic curvatures 812, liquids continue along the flow path 804 into the interior of the tube 10 and back up the length of the heating system 50. Liquids are then passed into a chamber of the outlet manifold 702 via a throughway passage 818. The heated liquid is then transmitted out of the modular heating unit 700 via the outlet 708 of the outlet manifold 702. As described previously herein with respect to the heating system 50, the flow path 804 of the modular heating unit 700 may be reversed.
In selected embodiments, one or more temperature sensors may be incorporated into the outlet manifold 702, or in the outlet 708, to measure the temperature of liquids exiting the outlet manifold 702 via the outlet 708. One or more flow sensors may also be incorporated into the outlet manifold 702, or in the outlet 708, to measure the flow of liquids exiting the outlet manifold via the outlet 708. In selected embodiments, one or more flow sensors may also be incorporated into the inlet manifold 710, or in the inlet 714, to measure the flow of liquids entering the modular heating unit 700. Therefore, the flow of liquids may be measured at the outlet 708 or based on the difference of pressure between the inlet 714 and outlet 708 of the modular heating unit 700. Alternatively, or in addition to, the flow may be measured by the difference in temperature between the inlet 714 and outlet 708 of the modular heating unit 700 after it has received a signal from a flow switch. These measurements are performed by a control device described further with respect to
The flow modulation device 1400 advantageously allows the modular heating unit 700 to correct and modulate the flow of liquids based on a desired temperature and the heating capacity of the modular heating unit 700. For instance, if the flow rate of liquids exiting the outlet manifold 702 via the outlet 708 is too high for the heating system 50 to effectively heat, the flow rate may be restricted via the flow modulation device 1400 to enable the liquid to be heated to the required temperature. In selected embodiments, the flow modulation device 1400 is a gear that is actuated by pinion or electromagnetically via one or more solenoids. Therefore, each opening of the outlet manifold 702 is simultaneously restricted the same amount based on the movement of the gear via gear teeth 1402 to cover a portion of each opening. However, in selected embodiments, the flow modulation device 1400 may include separately controlled gears such that some openings of the outlet manifold 702 may be restricted while at the same time other openings of the outlet manifold 702 may be fully restricted or not restricted at all.
Further, the processes may be provided as a utility application, background daemon, or component of an operating system, or combination thereof, executing in conjunction with CPU 1500 and an operating system such as Microsoft Windows 7, UNIX, Solaris, LINUX, and other systems known to those skilled in the art or a custom built operating system.
CPU 1500 may be a Xenon or Core processor from Intel of America, an Opteron processor from AMD of America or an Atmel chip manufactured by Atmel Corporation, or may be other processor types that would be recognized by one of ordinary skill in the art. Alternatively, the CPU 1500 may be implemented on an FPGA, ASIC, PLD or using discrete logic circuits, as one of ordinary skill in the art would recognize. Further, CPU 1500 may be implemented as multiple processors cooperatively working in parallel to perform the instructions of the inventive processes described above.
The control unit 1500 in
The control unit 1500 may further include a display controller 1508, such as a NVIDIA GeForce GTX or Quadro graphics adaptor from NVIDIA Corporation of America for interfacing with display 1510, such as a Hewlett Packard HPL2445w LCD monitor. The display 1510 may also be a small LCD screen located on the modular heating unit 700 itself. The display 1510 may provide information allowing a user to interact, via CPU 1500 to provide settings to the modular heating unit 700. For example, the display 1510 may allow a user to set a temperature, change metric units, flow rate, software version, error codes or error messages and identify a load power percentage. Upon setting a temperature, the control unit 1500 will command power to be applied to the electrical resistance heating elements 14 until an appropriate temperature of liquids is determined between the temperature sensors and flow sensors. Error messages may include event and fault codes that are communicated until they are resolved. These include as non-limiting examples a thermistor out of range, no change in temperature detected, leak detected, excessive or minimal flow detected, inlet temperature too hot to generate heat or communication issues. A general purpose I/O interface 1512 may interface with a keyboard and/or mouse 1514 as well as a touch screen panel 516 on or separate from display 1510. General purpose I/O interface may also connect to a plurality of lights that may be illuminated based on predetermined conditions identified within the modular heating unit 700 by the control unit 1500. The general purpose I/O interface 1512 may also be used to enable or disable the display as well as to lock the display by entering a predetermined code, setting or holding a button for a predetermined period of time.
A sound controller 1520 may also be provided in the control unit 1500, such as Sound Blaster X-Fi Titanium from Creative, to interface with speakers/microphone 1522 thereby providing sounds and/or music. The control unit 1500 may also emit certain codes or sound patterns, corresponding to the error messages, based on the identification of the predetermined conditions to alert a user to an issue or concern with respect to the modular heating unit 700.
The general purpose storage controller 1524 connects the storage medium disk 1504 with communication bus 1526, which may be an ISA, EISA, VESA, PCI, or similar, for interconnecting all of the components of the control unit 1500. A description of the general features and functionality of the display 1510, keyboard and/or mouse 1514, as well as the display controller 1508, storage controller 1524, network controller 506, sound controller 1520, and general purpose I/O interface 512 is omitted herein for brevity as these features are known.
As noted herein, the control unit 1500 measures values from one or more sensors such as flow sensors and temperature sensors and based on those measurements controls the feedback or movement of the flow modulation device 1300 to appropriately restrict or enlarge the openings of the outlet manifold 702. These measurements may be received locally by the control unit 1500 or wirelessly via the network 1524. The control unit 1500 may also provide control commands to the modular heating unit wirelessly via network 1524.
While two types of heating systems 50/1600 are illustrated in
Further, although not illustrated, one modular heating unit 700 may be connected to one or more other modular heating units 700 to provide additional heating capacity based on customer need. As such, in selected embodiments, the outlet 708 of one modular heating unit 700 may be connected to the inlet of 714 of another modular heating unit 700 and so forth. Therefore, for example, customers having large flow and variable temperature requirements can chain as many modular heating units 700 together as required to meet their flow and temperature needs.
Another advantage provided by the modular heating unit 700 is the compact design. Due to the parallel placement of the heating systems and the compact placement of the inlet manifold, outlet manifold and bottom manifold, the modular heating unit 700 can be placed in small locations as may be required for some customers.
The components of the modular heating unit described above can be manufactured, in selected embodiments, via injection molding or machining as would be understood by one of ordinary skill in the art. Therefore, the components may be molded into any shape or made from any material, such as thermoplastic or thermosetting polymers, as would be understood by one of ordinary skill in the art. Accordingly, common polymers such as epoxy, phenolic, nylon, polyethylene or polystyrene may be utilized. This material is fed into a heated barrel, mixed and forced into a mold cavity (formed of a material such as steel or aluminum and machined to a form that features the desired part) where it cools and hardens to the configuration of the cavity. Exemplary molding machines that may be utilized for such a process include a Ferromatik Milacron injection molding machine or those built by Arburg.
The components of the modular heating unit 700 described above may be also be precision machined manually or automatically by computer numerical control (CNC) as would be understood by one of ordinary skill in the art. Accordingly, the components can be formed of metal, such as steel or aluminum, and formed via a combination of turning, drilling, milling, shaping, planning, boring, broaching and sawing.
Obviously, numerous modifications and variations of the present advancements are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the present advancements may be practiced otherwise than as specifically described herein.
This application is based upon and claims the benefit of priority from U.S. Provisional Application No. 61/672,336, filed Jul. 17, 2012, and U.S. Provisional Application No. 61/740,653, filed on Dec. 21, 2012, the entire contents of which are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
270478 | Pumphrey | Jan 1883 | A |
601585 | McElroy | Mar 1898 | A |
1718970 | Lonergan | Jul 1929 | A |
1729483 | Koch | Sep 1929 | A |
1777744 | Breuer | Oct 1930 | A |
1821525 | Nielsen | Sep 1931 | A |
1851851 | Lee et al. | Mar 1932 | A |
2032416 | Hunt | Mar 1936 | A |
2041687 | Benson | May 1936 | A |
2224422 | Ballman | Dec 1940 | A |
2360019 | Ryan et al. | Oct 1944 | A |
2576298 | Kessler | Nov 1951 | A |
2589566 | Neth et al. | Mar 1952 | A |
2681409 | Dobbins | Jun 1954 | A |
2730609 | Constantinesco | Jan 1956 | A |
2824199 | Browne | Feb 1958 | A |
2996316 | Terhune | Aug 1961 | A |
3088017 | Leonid | Apr 1963 | A |
3108174 | Hynes | Oct 1963 | A |
3310769 | Simmons | Mar 1967 | A |
3313921 | Mohn et al. | Apr 1967 | A |
3329455 | Becker et al. | Jul 1967 | A |
3512114 | Dzaack | May 1970 | A |
3625549 | De Vries | Dec 1971 | A |
3633748 | Hanley et al. | Jan 1972 | A |
3921505 | Wunsch | Nov 1975 | A |
3977073 | Shirey | Aug 1976 | A |
4056143 | Martin | Nov 1977 | A |
4142515 | Skaats | Mar 1979 | A |
4185187 | Rogers | Jan 1980 | A |
4242775 | Eickmann | Jan 1981 | A |
4250399 | King | Feb 1981 | A |
4270367 | Santore | Jun 1981 | A |
4338888 | Gerstmann et al. | Jul 1982 | A |
4439669 | Ryffel | Mar 1984 | A |
4460201 | McGugan | Jul 1984 | A |
4600334 | Soussloff | Jul 1986 | A |
4682578 | Schmidt | Jul 1987 | A |
4762980 | Insley | Aug 1988 | A |
4775258 | Lange | Oct 1988 | A |
4808793 | Hurko | Feb 1989 | A |
4813992 | Hale | Mar 1989 | A |
4835365 | Etheridge | May 1989 | A |
4885840 | McManus | Dec 1989 | A |
4892432 | Cooper | Jan 1990 | A |
5054108 | Gustin et al. | Oct 1991 | A |
5122640 | Holmes | Jun 1992 | A |
5124534 | Williams et al. | Jun 1992 | A |
RE34018 | Petersen et al. | Aug 1992 | E |
5216743 | Seitz | Jun 1993 | A |
5243185 | Blackwood | Sep 1993 | A |
5269572 | Mefferd | Dec 1993 | A |
5293446 | Owens et al. | Mar 1994 | A |
5308207 | Jaskowiak | May 1994 | A |
5325822 | Fernandez | Jul 1994 | A |
5384032 | De Souza | Jan 1995 | A |
5400432 | Kager et al. | Mar 1995 | A |
5408575 | Bolivar | Apr 1995 | A |
5549078 | Annecharico et al. | Aug 1996 | A |
5559924 | Kadotani et al. | Sep 1996 | A |
5628895 | Zucholl | May 1997 | A |
5740315 | Onishi et al. | Apr 1998 | A |
5772355 | Ross et al. | Jun 1998 | A |
5897269 | Ross et al. | Apr 1999 | A |
5930458 | Yane et al. | Jul 1999 | A |
5959254 | Martin, Sr. | Sep 1999 | A |
5995711 | Fukuoka et al. | Nov 1999 | A |
6005225 | Kowalski et al. | Dec 1999 | A |
6020577 | Barker | Feb 2000 | A |
6055360 | Inoue et al. | Apr 2000 | A |
6091890 | Gruzdev et al. | Jul 2000 | A |
6097007 | Wang | Aug 2000 | A |
6157778 | Kadotani | Dec 2000 | A |
6199515 | Clarke | Mar 2001 | B1 |
6231194 | Raj et al. | May 2001 | B1 |
6236810 | Kadotani | May 2001 | B1 |
6240250 | Blanco, Jr. | May 2001 | B1 |
6246831 | Seitz et al. | Jun 2001 | B1 |
6252220 | Jedlicka et al. | Jun 2001 | B1 |
6259070 | Audet | Jul 2001 | B1 |
6297740 | Hill et al. | Oct 2001 | B1 |
6345769 | MacIntyre | Feb 2002 | B2 |
6509554 | Howard et al. | Jan 2003 | B2 |
6593553 | Whitfield | Jul 2003 | B2 |
6909843 | Fabrizio | Jun 2005 | B1 |
7007316 | Lutz, II | Mar 2006 | B2 |
7039305 | Chen | May 2006 | B1 |
7046922 | Sturm | May 2006 | B1 |
7156425 | Atkinson | Jan 2007 | B2 |
7190894 | Chamberlain, Jr. | Mar 2007 | B2 |
7293914 | Wang | Nov 2007 | B2 |
7324746 | Tanaka et al. | Jan 2008 | B2 |
7592572 | Schlipf | Sep 2009 | B2 |
7593625 | Kamikawa et al. | Sep 2009 | B2 |
7668444 | Tsai | Feb 2010 | B2 |
7744008 | Chapman, Jr. et al. | Jun 2010 | B2 |
7857002 | Reck | Dec 2010 | B2 |
7972077 | Kim | Jul 2011 | B2 |
8104434 | Fabrizio | Jan 2012 | B2 |
8165461 | Sullivan | Apr 2012 | B2 |
8280236 | Fabrizio | Oct 2012 | B2 |
8380056 | Evans | Feb 2013 | B2 |
8426779 | Schlipf | Apr 2013 | B2 |
8577211 | Lucker et al. | Nov 2013 | B2 |
9140466 | Jurczyszak et al. | Sep 2015 | B2 |
20020008970 | Hanson et al. | Jan 2002 | A1 |
20030026603 | Castaneda et al. | Feb 2003 | A1 |
20040051313 | Trouyet | Mar 2004 | A1 |
20040069517 | Olson | Apr 2004 | A1 |
20040098831 | Elmer | May 2004 | A1 |
20050072103 | Hopwood | Apr 2005 | A1 |
20060168756 | Sato et al. | Aug 2006 | A1 |
20060215178 | Seko et al. | Sep 2006 | A1 |
20060222349 | Sturm et al. | Oct 2006 | A1 |
20070017265 | Andersson | Jan 2007 | A1 |
20070023418 | Schlipf | Feb 2007 | A1 |
20080028512 | Hughson | Feb 2008 | A1 |
20080152331 | Ryks | Jun 2008 | A1 |
20080274823 | Lindner | Nov 2008 | A1 |
20080285964 | Sullivan | Nov 2008 | A1 |
20090025399 | Kamen et al. | Jan 2009 | A1 |
20090034947 | Tsai | Feb 2009 | A1 |
20090116826 | Evans | May 2009 | A1 |
20100068123 | Edwin et al. | Mar 2010 | A1 |
20100086289 | Johnson et al. | Apr 2010 | A1 |
20100093205 | Stone et al. | Apr 2010 | A1 |
20100126108 | Andrikopoulos | May 2010 | A1 |
20100212752 | Fima | Aug 2010 | A1 |
20110203781 | Ellingwood | Aug 2011 | A1 |
20110233191 | Gubler et al. | Sep 2011 | A1 |
20110240269 | Mackenzie | Oct 2011 | A1 |
20110318090 | Lai | Dec 2011 | A1 |
20120055917 | Kimmins et al. | Mar 2012 | A1 |
20120063755 | Lucker et al. | Mar 2012 | A1 |
20120141100 | Evans | Jun 2012 | A1 |
20120237191 | Clark | Sep 2012 | A1 |
20120275775 | Iskrenovic | Nov 2012 | A1 |
20130034344 | Lutz et al. | Feb 2013 | A1 |
20130156492 | Maier | Jun 2013 | A1 |
20140023352 | Jurczyszak et al. | Jan 2014 | A1 |
Number | Date | Country |
---|---|---|
201844531 | May 2011 | CN |
102200346 | Sep 2011 | CN |
197 26 288 | Jun 1997 | DE |
2 573 642 | Mar 2013 | EP |
11-148716 | Jun 1999 | JP |
WO 9831045 | Jul 1998 | WO |
Entry |
---|
International Search Report dated Jun. 5, 2013 in PCT/US13/32298 filed Mar. 15, 2013. |
International Written Opinion dated Jun. 5, 2013 in PCT/US13/32298 filed Mar. 15, 2013. |
International Search Report dated Jan. 3, 2014, in PCT/US2013/050897, filed Jul. 17, 2013. |
Written Opinion of the International Searching Authority dated Jan. 3, 2014, in PCT/US2013/050897, filed Jul. 17, 2013. |
U.S. Appl. No. 13/840,066, filed Mar. 15, 2013, 2014-0023352 Jurczyszak, et al. |
U.S. Appl. No. 13/835,346, filed Mar. 15, 2013, Hayden, et al. |
Combined Chinese Office Action and Search Report dated Sep. 25, 2015 in Patent Application No. 201380046720.5 (with English language translation). |
Office Action dated May 19, 2016, in Chinese Patent Application No. 201380046720.5 (with English language translation). |
Number | Date | Country | |
---|---|---|---|
20140023354 A1 | Jan 2014 | US |
Number | Date | Country | |
---|---|---|---|
61672336 | Jul 2012 | US | |
61740653 | Dec 2012 | US |