NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Abstract

A nitride semiconductor device and its manufacturing method are provided which are capable of achieving low-resistance ohmic properties and high adhesion. A nitride semiconductor device has an n-type GaN substrate over which a semiconductor element is formed and an n-electrode as a metal electrode formed over the back surface of the GaN substrate. A surface denatured layer functioning as a carrier supply layer is provided between the GaN substrate and the n-electrode. The surface denatured layer is formed by denaturing the back surface of the GaN substrate by causing it to react with a material that contains silicon.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing an example of the structure of a nitride semiconductor device according to a first preferred embodiment;

FIG. 2 is an enlarged cross-sectional view showing the back surface side of the substrate of the nitride semiconductor device of the first preferred embodiment;

FIG. 3 is an enlarged cross-sectional view showing the back surface side of a substrate of a nitride semiconductor device for comparison;

FIGS. 4 to 9 are process diagrams illustrating a method of manufacturing the nitride semiconductor device of the first preferred embodiment;

FIG. 10 is a graph used to describe an effect of the first preferred embodiment; and

FIG. 11 is an enlarged cross-sectional view illustrating the back surface side of the substrate of a nitride semiconductor device according to a second preferred embodiment.

Claims

1. A nitride semiconductor device comprising: a nitride semiconductor substrate;a layered-structure of a nitride semiconductor element that is provided on a first main surface side of said nitride semiconductor substrate;a metal electrode provided on a second main surface side of said nitride semiconductor substrate; anda surface denatured layer that contains Si and is provided between said nitride semiconductor substrate and said metal electrode, said surface denatured layer being formed by denaturing the second main surface of said nitride semiconductor substrate by causing the second main surface to react with a first material that contains Si.

2. The nitride semiconductor device according to claim 1, wherein said surface denatured layer is further made to react with oxygen and thus contains oxygen.

3. The nitride semiconductor device according to claim 1, further comprising a barrier layer provided between said metal electrode and said surface denatured layer.

4. The nitride semiconductor device according to claim 1, wherein said metal electrode comprises a metal layer that at least contains any of Ti, Al, Ta, Zr and Mo in contact with said surface denatured layer.

5. The nitride semiconductor device according to claim 4, wherein said metal electrode comprises a Ti layer, a Pt layer, and an Au layer stacked in this order.

6. A nitride semiconductor device manufacturing method comprising: a step of forming a layered-structure of a nitride semiconductor element on a first main surface of a nitride semiconductor substrate;a denatured layer forming step of forming a surface denatured layer that contains Si on a second main surface of said nitride semiconductor substrate by denaturing the second main surface of said nitride semiconductor substrate by causing the second main surface to react with a first material that contains Si; andan electrode forming step of forming a metal electrode on said surface denatured layer.

7. The nitride semiconductor device manufacturing method according to claim 6, further comprising a thermal treatment step of performing a thermal treatment after said electrode forming step.

8. The nitride semiconductor device manufacturing method according to claim 6, wherein said denatured layer forming step comprises: a grinding and polishing step of applying grinding and polishing to the second main surface of said nitride semiconductor substrate;a plasma treatment step of, after said grinding and polishing step, applying a surface treatment to the second main surface of said nitride semiconductor substrate with a plasma that contains said first material; andan oxygen plasma treatment step of, after said plasma treatment step, applying a surface treatment to the second main surface of said nitride semiconductor substrate with a plasma that contains oxygen.

9. The nitride semiconductor device manufacturing method according to claim 8, wherein said grinding and polishing step comprises a mechanical polishing step of performing a mechanical polishing using a diamond slurry, andsaid plasma treatment step is performed following said mechanical polishing step.

10. The nitride semiconductor device manufacturing method according to claim 9, wherein said diamond slurry has a particle size of 0.4 μm or more and a pH of 8.5 or less.

11. The nitride semiconductor device manufacturing method according to claim 8, wherein said nitride semiconductor substrate is formed as one piece with a second material other than nitride semiconductors, andsaid plasma treatment step applies said surface treatment with a chlorine-based gas contained in said plasma, with said second material covered by silicon.

12. The nitride semiconductor device manufacturing method according to claim 8, wherein said plasma treatment step is performed such that the second main surface of said nitride semiconductor substrate has a roughness of 2 nm or more.

13. The nitride semiconductor device manufacturing method according to claim 8, wherein said electrode forming step comprises a step of applying an ion milling to deposited metal by using a predetermined pattern of resist as a mask.

14. The nitride semiconductor device manufacturing method according to claim 7, wherein said thermal treatment step performs the thermal treatment in a temperature range of not less than 360° C. nor more than 400° C.