BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a sectional view schematically showing a semiconductor laser element which is a nitride semiconductor device according to one embodiment of the present invention.
FIG. 2 is a graph showing the relation between the peak concentration of oxygen, carbon, and silicon in the interface between a p-type optical guide layer and a p-type cladding layer and the operating voltage in the semiconductor laser element according to one embodiment of the present invention.
FIG. 3 is a graph showing the relation between the peak concentration of oxygen, carbon, and silicon in the interface between the p-type optical guide layer and the p-type cladding layer and the Mg concentration in the p-type optical guide layer in the semiconductor laser element according to one embodiment of the present invention.
FIGS. 4A to 4E are sectional views showing a method for fabricating a semiconductor laser element according to one embodiment of the present invention in the order of its fabrication process steps.
FIG. 5 is a graph showing the impurity concentrations of magnesium, oxygen, carbon, and silicon in the interface between the p-type optical guide layer and the p-type cladding layer in the semiconductor laser element according to one embodiment of the present invention.
FIG. 6 is a graph showing the impurity concentrations of magnesium, oxygen, carbon, and silicon in the interface between a p-type optical guide layer and a p-type cladding layer in a conventional semiconductor laser element.