This invention relates generally to electrical connectors and more particularly, to differential pair electrical connectors.
A variety of connectors exist today for use in differential pair applications. In differential pair applications, a signal is divided in half (each half being the inverse of the other half) and each half is transmitted over a separate data line to a mating interface of a connector. The mating interface of an electrical connector may have a plurality of contacts, and in differential pair applications, the contacts are generally organized into differential pairs. The signal quality of a differential pair of contacts may be reduced due to cross talk/noise and the like caused by electromagnetic fields (EMFs) created by nearby differential pairs of contacts. The structure and configuration of an electrical connector affects the cross talk aspects of the electrical connector. The electronics industry has offered various solutions for improving the quality of differential signals at the mating interface for an electrical connector.
One approach involves arranging ground shields within the connector to reduce the EMF interference on a differential pair of connectors from nearby differential pairs. When mating the header and receptacle connectors, the ground shields make contact before the signal contacts engage one another. In certain connectors, the shape of the receiving chamber is matched to the shape of the electrical contact being received so as to reduce the air gap therebetween, thus reducing the impedance of the terminal contact, and thereby improving signal performance.
Supplying ground shields and planes within the configuration of the connector provides one approach to reducing the EMF interference on differential pairs. However, the addition of numerous ground shields may increase the cost of the connector. Furthermore, the footprint or size of the electrical connector may increase with the addition of ground contacts and shields. Moreover, as the data rate increases, the electrical connector may need to reduce further the EMF interference.
A need still exists for further reduction of the cross talk/noise in differential pair connectors that are used in high speed data connections.
An electrical connector is provided that includes a housing having a mating interface. Contacts provided in the housing are organized in differential pairs with the contacts in each of the differential pairs being located along an associated differential pair contact line. The differential pairs are aligned in a row wherein the adjacent differential pairs in the row have different orientations from one another.
An electrical connector is provided that includes a housing having a mating interface. Contacts provided in the housing are organized in differential pairs with the contacts in each of the differential pairs being located along an associated differential pair contact line. The differential pairs are aligned in rows and columns. The adjacent differential pairs in the rows have different orientations from one another, and the adjacent differential pairs in the columns have different orientations from one another.
The differential pairs 20 and 22 are positioned adjacent to one another and form a row in the direction of an arrow A, as shown in
The bisector axis 28 is oriented perpendicular to the contact line 24 and coincides with the contact line 26. Since the contacts 16 and 18 lie along the contact line 26, which is the perpendicular bisector of the contact line 24, the contact 16 is equidistant from the contacts 12 and 14 and, likewise, the contact 18 is equidistant from the contacts 12 and 14. The bisector axis 30 is perpendicular to the contact line 26. The differential pairs 20 and 22 are configured such that their corresponding contact lines 24 and 26 are perpendicular to one another and one contact line (e.g. 26) overlays the perpendicular bisector of the other contact line (e.g. 24).
In operation, differential signals passing through the differential pairs 20 and 22 form EMF. The contact 16 is in the presence of an electromagnetic field (EMF+) 32 that is generated by the contact 12. The contact 16 is also in the presence of an electromagnetic field (EMF−) 34 that is generated by the contact 14. Because the contacts 12 and 14 form the differential pair 20 with equal and opposite (inverse) signals and because the contact 16 is equidistant from the contacts 12 and 14, the EMF 32 cancels the EMF 34 at the contact 16. The net effect of the EMF 32 and the EMF 34 at the contact 16 is zero. Similarly, the net effect of the EMF 32 and the EMF 34 at the contact 18 is zero too. The cross talk/noise generated at the contact 16 due to EMF 32 and 34 created by the contacts 12 and 14 is self canceling with the net effect on the signal component carried at the contact 16 being zero. In the embodiment of
The contacts 322–328 of
In operation, the unique structure of footprint 300 shown in
The ground contact 402 eliminates cross talk along the diagonal axes 412 and 414. EMF effects of the differential pair 404 on the differential pair 408, and of the differential pair 408 on the differential pair 404 are eliminated by the ground contact 402. Likewise, EMF effects of the differential pair 406 on the differential pair 410, and of the differential pair 410 on the differential pair 406 are eliminated by the ground contact 402. The orthogonal orientation of adjacent differential pairs, e.g. 404 and 406, 406 and 408, 408 and 410, and 410 and 404, eliminate the EMF effects between adjacent differential pairs.
A physical module (also known as a chicklet module) may have the contour shape of the stepped outline 504 following a row arrangement of the differential pairs 506 of the row. Modules 501–503 are fitted and shaped to be slid into the electrical connector housing in an interlocking fashion. In an alternative embodiment, the shape of the modules 501–503 may not follow the configuration of the differential pairs, but may be of some other shape, for example a smooth planar shape.
Examples of applications for embodiments of this invention include board connectors for backplane/daughter card connectors, mezzanine style connectors, and I/O style connectors. The cross talk/noise present in the footprint of such connectors may be as low as 1 percent with data rates of 2 or 3 Gigabits per second (Gps).
In one embodiment, the contact configurations described above may be included in a connector assembly of the type described in U.S. Pat. No. 6,461,202, the subject matter of which is incorporated in its entirety by reference. In yet another embodiment, the contact configurations may be included in a connector assembly of the type described in U.S. Pat. No. 6,682,368, the subject matter of which is incorporated in its entirety by reference.
While the invention has been described in terms of various specific embodiments, those skilled in the art will recognize that the invention can be practiced with modification within the spirit and scope of the claims.
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