Claims
- 1. A carrier assembly for carrying a semiconductor device, comprising:
- a base;
- a thin film interconnect extending over a top surface of said base;
- a plurality of contact bumps on a top surface of said thin film interconnect for contacting bond pads on the semiconductor device;
- a pair of posts extending from said base, each of said posts having a shaft having a first lateral dimension and a head having a second lateral dimension greater than said first lateral dimension;
- a lid positioned over said base;
- a rotary latch positioned over said lid, said rotary latch having a pair of openings through which said posts extend, each of said openings having a first portion in a first surface of said rotary latch and a second portion in a second surface of said rotary latch, said first and second surfaces being spaced vertically apart;
- a spring positioned between said lid and said rotary latch, said rotary latch applying force to said lid through said spring, whereby rotation of said rotary latch moves said heads from said first portion to said second portion to increase the force applied by said rotary latch to said lid through said spring.
- 2. The carrier assembly of claim 1 further comprising:
- signal traces on said top surface of said thin film interconnect electrically connected to said contact bumps;
- a conductive clip between a top surface of the semiconductor device and said lid for contacting said signal traces and the top surface of the semiconductor device for electrically biasing the semiconductor device.
- 3. The carrier assembly of claim 1 in which said lid has a pair of openings through which said shafts of said posts extend.
- 4. The carrier assembly of claim 1 in which said first portion is larger than the head of an associated one of said posts and said second portion is smaller than the head of the associated one of said posts.
- 5. The carrier assembly of claim 1 in which each of said openings has a third portion between said first and second portions, said third portion in a surface extending between said first surface and said second surface.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation of application Ser. No. 08/375,863, filed Jan. 20, 1995, now U.S. Pat. No. 5,468,150, which is a continuation of application Ser. No. 08/146,726 filed Oct. 29, 1993, now U.S. Pat. No. 5,397,245.
US Referenced Citations (6)
Number |
Name |
Date |
Kind |
4684184 |
Grabbe et al. |
Aug 1987 |
|
4832612 |
Grabbe et al. |
May 1989 |
|
4846703 |
Matsuoka et al. |
Jul 1989 |
|
5127837 |
Shah et al. |
Jul 1992 |
|
5180976 |
Van Loan et al. |
Jan 1993 |
|
5397245 |
Roebuck et al. |
Mar 1995 |
|
Continuations (2)
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Number |
Date |
Country |
Parent |
375863 |
Jan 1995 |
|
Parent |
146726 |
Oct 1993 |
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