Claims
- 1. A carrier assembly for carrying a semiconductor device, comprising:
- a base;
- a thin film interconnect extending over a top surface of said base;
- a plurality of contact bumps on a top surface of said thin film interconnect for contacting bond pads on the semiconductor device;
- a pair of posts extending from said base, each of said posts having a shaft having a first diameter and a head having a second diameter greater than said first diameter;
- a lid having a pair of openings through which said shafts of said posts extend;
- a rotary latch attached to said lid and having a pair of ramps, each of said ramps having an opening through which said posts extend, each of said openings having a first portion smaller than a head of an associated one of said posts;
- a spring positioned between said lid and said rotary latch, said rotary latch applying force to said lid through said spring, whereby rotation of said rotary latch causes said heads to move up said ramps to increase the force applied by said rotary latch to said lid through said spring.
- 2. The carrier assembly of claim 1 in which each of said openings has a second portion larger than a head of an associated one of said posts, said first portion of each opening extending upwardly from said second portion.
- 3. The carrier assembly of claim 1 in which each of said ramps includes an upper portion having a detent for receiving an associated one of said heads.
- 4. The carrier assembly of claim 1 further comprising:
- signal traces on said top surface of said thin film interconnect electrically connected to said contact bumps;
- a conductive clip between a top surface of the semiconductor device and said lid for contacting said signal traces and the top surface of the semiconductor device for electrically biasing the semiconductor device.
CROSS-REFERENCE TO RELATED APPLICATIONS
This is a continuation, of application Ser. No. 08/146,726, filed Oct. 29, 1993, now U.S. Pat. No. 5,397,245.
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Continuations (1)
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Number |
Date |
Country |
Parent |
146726 |
Oct 1993 |
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