The present invention relates to electrical lighting devices and systems and, more specifically, lighting apparatuses using at least one single-chip or multi-chip light-emitting diode (“LED”), back-reflecting collection optics for LEDs, and an improved heat sink mounting apparatus which promotes efficient heat dissipation generated from the LED while minimizing light obstruction and glare.
For years, people have used traditional incandescent or fluorescence lighting apparatuses in order to address their interior lighting concerns. However, such lighting apparatuses present a number of drawbacks. For example, the popular AR111 halogen apparatus presents the following drawbacks—relatively high power consumption, inefficiency of light dispersion due to the placement of its metal shield in the line sight of the halogen bulb, and its limited effectiveness in preventing glare from the halogen bulb.
Recently, a number of LED lighting apparatuses have been designed to replace the AR111 halogen apparatus, as well as other traditional incandescent or fluorescence lighting apparatuses. Typically, in such LED lighting apparatuses, the LED light source is located at the center of a reflector with its light emission directed outward from the reflector. Additionally, there are LED lighting apparatuses, such as PAR38, which use multiple LEDs with their light emissions directed outward from one or more reflectors. These configurations are unable to achieve narrow beam angles, and result in considerable glare since observers are not shielded from the LED light source. Further, these configurations inefficiently distributes heat; thereby, making the use of high-powered LEDs in these configurations practically prohibitive.
To address these problems, alternative LED lighting apparatuses which use a mirror or reflective surface to reflect light back in the direction of the LED light source have been disclosed. See, e.g., U.S. Pat. No. 6,976,769 to McCullough et al. entitled “Light-Emitting Diode Reflector Assembly Having a Heat Pipe,” U.S. Pat. No. 7,246,921 to Jacobson et al. entitled “Back-Reflecting LED Light Source”, and PCT International Publication No. WO 2006/033998 to Magna International Inc. entitled “Thermal Management System for Solid State Automotive Lighting.”
In light of the above, there exists a need to further improve the art. Specifically, there is a need for an LED lighting apparatus that eliminates or reduces glare, and has an improved, compact thermally-conductive assembly which promotes efficient heat dissipation generated from the LED (such as a high-powered LED) while minimizing obstruction of the light path and the number of components needed in such assembly.
In accordance with an aspect of the present invention, a lighting apparatus comprises a main housing; a reflector disposed within the main housing, the reflector having a front side and a rear side; a heat conducting body comprising at least two heat pipes, wherein a first portion of the at least two heat pipes are positioned parallel to a central axis of the lighting apparatus on the front side of the reflector, and a second portion of each of the at least two heat pipes is in the rear side of the reflector and is thermally coupled to the main housing; a heat conducting head located on the front side of the reflector, and is thermally coupled to the heat conducting body; at least two LEDs thermally coupled to the heat conducting head and the heat conducting body, the at least two LEDs being positioned to face the front side of the reflector so that light emitted from the at least two LEDs are directed to the front side of the reflector.
In accordance with another aspect of the present invention, the at least two heat pipes are substantially J-shaped, L-shaped, or a combination thereof.
In accordance with another aspect of the present invention, the heat conducting body provides a pathway for heat to flow from the at least two LEDs toward the main housing.
In accordance with another aspect of the present invention, the reflector has at least two central optical axes.
In accordance with another aspect of the present invention, one end of the heat conducting body is thermally coupled to the at least two LEDs, and the other end of the heat conducting body is thermally coupled to the main housing.
In accordance with another aspect of the present invention, the reflector is in a symmetrical or unsymmetrical shape.
In accordance with another aspect of the present invention, the main housing is substantially frustoconical, cylindrical or cubical in shape, and is made of a thermally-conductive material.
In accordance with another aspect of the present invention, the main housing comprises one or more heat dissipating fins.
In accordance with a further aspect of the present invention, the lighting apparatus further comprises a plastic housing, coupled to the main housing; and a lamp base coupled to the plastic housing.
In accordance with another aspect of the present invention, the lamp base is an E26 lamp base, a GU10 lamp base, an E27 lamp base, or a GU24 lamp base.
In accordance with a further aspect of the present invention, the lighting apparatus further comprises the at least two LEDs being positioned at a range of 0 degree to 120 degrees relative to the central axis of the lighting apparatus.
In accordance with another aspect of the present invention, the heat conducting head has a triangular side profile or an irregular hexagon side profile, and has at least two mounting areas for the at least two LEDs, respectively.
In accordance with another aspect of the present invention, the heat conducting head is made of aluminum, copper, or a combination thereof.
In accordance with another aspect of the present invention, the lighting apparatus further comprises a PCB coupled the at least two LEDs and the heat conducting head.
According to another aspect of the present invention the lighting apparatus comprises a main housing having a generally frustoconical shape; a reflector disposed within the main housing, the reflector having a front side, a rear side and at least two central optical axes; a heat conducting body comprising at least two substantially J-shaped heat pipes, wherein a first portion of the at least two substantially J-shaped heat pipes is bar-shaped and located on the front side of the reflector, and is coupled to a heat conducting head located at or near a central axis of the lighting apparatus, a second portion of the at least two substantially J-shaped heat pipes which goes through the reflector via an opening at or near the central axis of the lighting apparatus, and a third portion of the at least two substantially J-shaped heat pipes is curved and at least a portion of which is coupled to the main housing; and at least two LEDs thermally coupled to the heat conducting head and positioned facing the front side of the reflector at an inclined angle relative to a central axis of the lighting apparatus so that light emitted from the at least two LEDs are directed to the front side of the reflector.
In accordance with a further aspect of the present invention, the lighting apparatus further comprises an anti-glare cap coupled to the heat conducting head.
For the purposes of illustrating the present invention, the drawings reflect a form which is presently preferred; it being understood however, that the invention is not limited to the precise form shown by the drawings in which:
As shown in
In this aspect of the present invention, the LED 6 is located above at or near a central optical axis 300 of the reflector 4, and is positioned so that light emitted from the LED 6 is substantially or entirely directed to the front side of the reflector 4; thereby, as shown in
In this aspect of the present invention, the heat generated from the LED 6 travels the following heat path through the lighting apparatus: metal core PCB 7, mounting platform 5, cladding 9, heat pipe 8, cladding 9, and then top rim 3 and reflector 4. The heat generated from the LED 6 can also travel through metal core PCB 7, mounting platform 5, cladding 9, heat pipe 8, and then top rim 3 and reflector 4. The top rim 3 and reflector 4 act as heat sinks.
Another aspect of the present invention is shown in
This aspect of the present invention includes a main housing 57 which has one or more heat dissipating fins 58 for maximizing surface area; thereby, increasing its heat dissipation capacity. The top rim 52, reflector 53, and the main housing 57 act as heat sinks, with the main housing 57 acting as the primary heat sink.
As shown in
Another aspect of the present invention is shown in
As shown in
The heat conducting body 1000 includes a mounting platform 530 which is positioned near or at the central optical axis of the reflector 502, and a mounting plate 531 coupled between the mounting platform 530 and LED 504. The heat conducting body 1000 also includes a heat pipe is located at the middle portion 1001 and/or one or both of the curved wing portions 1002 and 1003.
A metal cladding 550 can be coupled to the heat conducting body 1000. For example, as shown in
As shown in
The present invention can also include a plastic housing 700 that is coupled to the bottom end of the main housing 501, and a lamp base 701 (e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a G24 lamp base) that is coupled to the plastic housing 700.
Another aspect of the present invention is shown in
The lighting apparatus 1200 also includes an anti-glare cap 1700, which is coupled to the heat conducting head 1500, and covers at least a portion of the at least two LEDs 5000, 5001. As seen in
As shown in
Heat conducting head 1500 can have a triangular or irregular hexagon side profile, and has at least two mounting areas 1530a, 1530b which the at least two LEDs 5000, 5001 may be directly or indirectly coupled thereto, respectively. The heat conducting head 1500 is made of a thermally-conductive material such as aluminum, copper, any other high-heat conductive material, or a combination thereof.
As shown in
In this aspect of the present invention, the heat generated from the at least two LEDs 5000, 5001 travels the following heat path through the lighting apparatus 1200: heat conducting head 1500, heat conducting body 1600, and then reflector 1800 and main housing 1300. The reflector 1800 and main housing 1300 act as heat sinks.
Another aspect of the present invention is shown in
One of the advantages of the present invention shown in
Further, a user can mix color from the at least two LEDs 5000, 5001, and therefore can choose a wider range of colors of light to emanate from the lighting apparatus 1200, 1800.
Heat Conducting Body
As shown in
As discussed above, and as shown in
Alternatively, as shown in
In another aspect of the present invention, the heat pipe is not cladded. For example,
The heat pipe (such as heat pipe 8, 56, 101, 1601a, 1601b) can be made of porous copper incorporating a large number cavities filled with pure water. As shown in
The heat pipe can be flattened (in a cross-section direction) into a thin strip in order to minimize light absorption.
Another aspect of the present invention includes a heat conducting body with one or more heat pipes. For multiple heat pipes, each heat pipe is connected to a center hub (like a spoke on a wheel) positioned near or at the central optical axis of a reflector. The center hub acts as a mounting platform for one or more LEDs, and is made of thermally-conductive material such as aluminum, copper or any other high-heat conductive material.
In another aspect of the present invention, the heat conducting body extends up to or near the central axis of a reflector and being coupled to the top rim at only one connection point (such as connection point 900 or 901 for
The mounting platform 5, 54, 102, 530 are made of a thermally-conductive material such as aluminum, copper or any other high-heat conductive material. Also, as mentioned above, the mounting platform provides increased non-glare protection from the LED relative to existing light apparatuses. In the present invention, the possibility of direct glare from the LED is eliminated (or at least mitigated) since (1) the LED is coupled onto the mounting platform and positioned facing directly at the reflector so as that light emitted from the LED is substantially or entirely directed to the reflector, and (2) the mounting platform is shaped (e.g., circular) in a manner which prevents a direct view of the LED at any viewing angle.
Reflector.
The reflector 4, 53, 502, 1800 are made of a thermally-conductive material such as aluminum, and act as a heat sink. Alternatively, the reflector 4, 53, 502, 1800 can be made of a non-thermally-conductive material such as plastic.
As shown in
The reflector 4, 53, 502, 1800 can take a variety of shapes to achieve various light beam patterns. It can be shaped in any conic section (e.g., hyperbola, ellipse or parabola), used singularly or in various combinations, in two-dimension or three-dimensional shapes. Further, the reflector 4, 53, 502, 1800 can be symmetrical or asymmetrical.
LED
An LED can be an LED module with one or more chips. The LED can be a high-powered LED. One or more LEDs can be used in the present invention.
The LED 6, 55, 504 are coupled to a metal core PCB 7, 60 or a mounting plate 531. In the alternative, the LED 91, 103 are coupled to the mounting platform 92 and 102. With respect to the at least two LEDs 5000, 5001, such LEDs can be coupled to a PCB (metal core or F4-based) which is then coupled to the heat conducting head 1500, or can be coupled on the heat mounting head 1500.
The LED can be soldered onto a metal core PCB, mounting plate, mounting platform, or heat conducting head. Thermal paste, thermal grease, soldering, reflow soldering or any other soldering materials or techniques known in the art can be used to couple the LED onto the metal core PCB, mounting plate, mounting platform, or heat conducting head.
The at least two LEDs 5000, 5001 can be the same or different colors. Allowing LED 5000, 5001 to be different colors allows color mixing and variation. LEDs 5000, 5001 can create a color temperature range of 2700K to 5000K. Such LEDs 5000, 5001 can be programmed by individually controlling LED current. Power supplies and control unit are needed to allow such color mixing and variation.
Metal Core PCB or Mounting Plate
The present invention includes a metal core PCB (see metal core PCB 7, 60 shown in
Alternatively, as shown in
Alternatively, as shown in
Top Rim and Cap Rim
The top rim 3, 52, 503 are made of a thermally-conductive material, such as aluminum, copper or zinc or any other high-heat conductive material. The top rim 3 acts as a primary heat sink (for example, see
As shown in
Main Housing, Plastic Housing and Lamp Base
The main housing 57, 501, 1300 are made of a thermally-conductive material, such as aluminum, copper, zinc or any other high-heat conductive material. The main housing 57, 501, 1300 act as a primary heat sink (for example, see
In an aspect of the present invention, one end of the main housing 57, 501, 1300 are coupled with a plastic housing 700, the plastic housing 700 coupled to a lamp base 701 (e.g., an E26 lamp base, a GU10 lamp base, an E27 lamp base, a GU24 lamp base). The plastic housing 700 contains main circuit boards, and electrically insulate such main circuit boards from the main housing 57, 501.
It will be appreciated by one skilled in the art that the main housing can be utilized in conjunction with the aspect of the present invention set forth in
Although specific embodiments have been illustrated and described herein, it will be appreciated by those of ordinary skill in the art that a variety of alternate and/or equivalent implementations may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, it is intended that this invention be limited only by the claims and the equivalents thereof.
This is a utility application which is a continuation-in-part of U.S. Ser. No. 12/470,332, filed May 21, 2009, which claims priority under 35 U.S.C. §119(e) to U.S. Provisional Patent Application Ser. No. 61/055,858, filed May 23, 2008, U.S. Provisional Patent Application Ser. No. 61/057,289, filed May 30, 2008, and U.S. Provisional Patent Application Ser. No. 61/118,202, filed Nov. 26, 2008, the entirety of which are incorporated herein by reference. Throughout this application, several patents and references are referenced. Disclosure of these patents and references in their entirety is hereby incorporated by reference into this application.
Number | Date | Country | |
---|---|---|---|
61055858 | May 2008 | US | |
61057289 | May 2008 | US | |
61118202 | Nov 2008 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 12470332 | May 2009 | US |
Child | 13401724 | US |