Patent Application
20140272471
Processing steps are often used to form magnetic elements, such as magnetic recording heads used in the disc drive industry. The performance of magnetic elements can be influenced by the orientation and separation with respect to other magnetic elements. This particularly can be true as magnetic elements are placed in closer proximity to one another.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. Other features, details, utilities, and advantages of the claimed subject matter will be apparent from the following more particular written Detailed Description of various implementations and implementations as further illustrated in the accompanying drawings and defined in the appended claims.
In accordance with one embodiment, an apparatus can be configured that includes a main pole layer of magnetic material; a second layer of magnetic material; a first gap layer of non-magnetic material disposed between the main pole layer and the second layer of magnetic material; a second gap layer of non-magnetic material disposed between the main pole layer and the second layer of magnetic material; and wherein the second gap layer of non-magnetic material is disposed directly adjacent to the second layer of magnetic material. In accordance with one embodiment, this allows the gap to serve as a non-magnetic seed for the second layer of magnetic material.
In another embodiment, a method can be utilized that includes depositing a main pole layer of magnetic material; depositing a first gap layer of non-magnetic material; depositing a second gap layer of non-magnetic material; and depositing a second layer of magnetic material directly adjacent to the second gap layer of non-magnetic material so that the second gap layer of non-magnetic material is disposed between the main pole layer of magnetic material and the second layer of magnetic material.
These and various other features and advantages will be apparent from a reading of the following detailed description.
A further understanding of the nature and advantages of the present technology may be realized by reference to the figures, which are described in the remaining portion of the specification.
Embodiments of the present technology are disclosed herein in the context of a disc drive system. However, it should be understood that the technology is not limited to a disc drive system and could readily be applied to other technology systems as well.
As areal density of magnetic recording media increases, more and more bits of information are being stored on the magnetic media. Thus, there is a need to store each bit of information in a smaller storage location than has previously been used. As a result, the write head of a disc drive needs to be able to record the bit on the magnetic media without disrupting the information stored in neighboring bit locations.
Write heads can be inefficient if there is a lack of a uniform gap between the magnetic material of the write pole and the magnetic material of the front shield. This non-uniformity allows more magnetic flux to leak from the write pole to the front shield during a write operation—rather than being directed through the targeted bit location. As a result, the write pole is less efficient in its write operation when this leakage occurs. A more uniform gap or even a gap that diverges rather than converges (when viewed from the perspective of moving towards an air bearing surface) would cause less leakage to occur.
In accordance with one embodiment a new process is disclosed that allows one to form a substantially uniform write gap between two magnetic materials as well as a resulting writer structure for a recording head. A magnetic overlayer with appropriate seeds (magnetic or non-magnetic) may also be formed on top of a non-magnetic write gap immediately following the deposition of any write gap layers of material. The write gap, together with the magnetic overlayer may be tailored to form a unique structure. In accordance with one embodiment, the process may be used to form a substantially uniform write gap, to reduce the gap thickness sigma, and to improve write performance of a write head with a narrow write gap. A deliberately selected non-magnetic seed may be used to enable a high moment magnetic layer to be in direct contact with a write gap without sacrificing the magnetic softness of the high moment magnetic materials. Moreover, configuring the material on both sides of the gap to have high moments without changing the magnetic softnesss of the magnetic materials can help to achieve improved writability. While the embodiments described as examples herein use a write head as an example, the process and structures may also be applied to other magnetic layers that are separated by a gap of material.
With reference now to
Information may be written to and read from the bits on the disc 102 in different data tracks 110. A transducer head 124 is mounted on an actuator assembly 120 at an end distal to an actuator axis of rotation 122. The transducer head 124 flies in close proximity above the surface of the disc 102 during disc operation. The actuator assembly 120 rotates during a seek operation about the actuator axis of rotation 122 positioned adjacent to the disc 102. The seek operation positions the transducer head 124 over a target data track of the data tracks 110.
The exploded view 140 illustrates a cross-section of a portion of the transducer head 124 (not to scale). The cross-section shows a substantially uniform write-gap that can be configured in accordance with one embodiment.
As the areal density of magnetic recording media increases, information can be stored in smaller and smaller locations. This requires that the read head and write heads be able to read from and write to, respectively, those locations. A write gap is the non-magnetic gap separating the main writer pole from the front shield in a write head. The thickness of the write gap and the magnetic materials that are in the vicinity of the write gap can have great impact upon the writability and the trailing edge (TE) field gradient. To date, the write gap thicknesses are in the range of about 30 nm.
During the process of forming write gaps, it is not uncommon to perform photolithography and etch processes on the deposited write gap material. This results in the write gap being deteriorated unevenly across its surface. Where the write gap contains a bevel edge, one result is that the write gap can become tapered or pinched near the top of the bevel point. Thus, a non-uniform write gap is often produced by these photolithography and etching steps. A non-uniform write gap can result in more flux shunt to the front shield from the main writer pole during operation. This loss of flux makes a write operation less efficient and possibly defective. It can be referred to as suppressing writability.
Referring now to
In
In
In
In
In
Once the gap is restored to a substantially uniform thickness, a second layer of magnetic material may be deposited. For example,
As can be seen from
Referring now to
In
According to block 406, an etch or other processing step may be performed on the structure. Such processing may remove portions of the sacrificial layer while not necessarily removing the entire sacrificial layer so as to expose any underlying layers, particularly along the bevel edge area. The result of the etching or other processing will be that the sacrificial layer will be uneven. Thus, in block 408, additional sacrificial material may be deposited on the etched sacrificial layer. The deposition can be controlled so as to form a substantially uniform gap between the main pole layer and a subsequently applied front shield layer, as shown in block 410. Then, a front shield layer of material may be applied on top of the sacrificial layer.
In accordance with another embodiment, a different utility can be achieved. Namely, current processes typically utilize a magnetic material such as NiFe as a seed layer prior to depositing a layer of magnetic material, such as FeCo, as the front shield layer. The NiFe has a magnetic moment property of about 1.0 T. This use of magnetic material as the seed layer can degrade the trailing edge (TE) field gradient which in turn decreases the performance of the recording head.
To address this issue, one embodiment utilizes a non-magnetic material as the seed layer for the magnetic material used in the front shield layer. This non-magnetic material allows a better field gradient to be achieved in contrast to a magnetic material such as NiFe. Different materials may be utilized as the non-magnetic material seed layer. But, one possible choice is Ruthenium. Other possible materials are NiRu, NiCr, Cu, and high moment material with combinations of Fe, Ni, and Co alloys, for example. The thickness of the seed layer can be in the range of 1-10 nm, for example.
The deposition process can be similar to that shown with respect to
In flow chart 500 of
In block 606, a second layer of magnetic material may be deposited. This layer may be used, for example, as a front shield in a write head. This second layer may be deposited directly adjacent the non-magnetic gap material so as to form a sufficient gradient. Moreover, this non-magnetic gap material may be used as a seed layer for the second layer of magnetic material, as shown by block 608. As shown by block 610, FeCo may be utilized as the material for the second layer of magnetic material. Block 612 illustrates that the second layer of magnetic material may be formed into a front shield for use in a write head.
It is noted that many of the structures, materials, and acts recited herein can be recited as means for performing a function or step for performing a function. Therefore, it should be understood that such language is entitled to cover all such structures, materials, or acts disclosed within this specification and their equivalents, including any matter incorporated by reference.
It is thought that the apparatuses and methods of embodiments described herein will be understood from this specification. While the above description is a complete description of specific embodiments, the above description should not be taken as limiting the scope of the patent as defined by the claims.
