Claims
- 1. A method for producing a non-oriented electrical steel sheet having an average grain size of 50 to 180 microns and a Vickers hardness of 130 to 210 comprising the steps of:(1) preparing a slab having the following chemical composition on a mass % basis, C: 0.01% or less, Si: 2.5% or less, Mn: 2% or less, Al: 1 to 5%, Si+Al+0.5×Mn: 2.5 to 5%, Sb: 0.3% or less, Sn: 0.3% or less, B: 0.01% or less, the balance: Fe and impurities; (2) heating the slab at a temperature of 1300° C. or less and hot rolling the slab to a plate; (3) after the hot rolling, cold rolling the plate to a sheet until its thickness becomes 0.1 to 0.4 mm; and (4) finish annealing the sheet at a temperature of 700 to 1150° C.
- 2. The method according to claim 1, wherein the ratio (Al/Si) of Al to Si in the slab is 0.7 to 1.4.
- 3. The method according to claim 1, wherein the cold rolling is performed with a roll whose surface roughness is 1.5 μm or less in terms of the arithmetical mean roughness Ra.
- 4. The method according to claim 2, wherein the cold rolling is performed with a roll whose surface roughness is 1.5 μm or less in terms of the arithmetical mean roughness Ra.
- 5. The method according to claim 1, further comprises annealing the plate or the sheet at 600 to 1000° C. before cold rolling, or before cold rolling and between plural times of cold rolling.
- 6. The method according to claim 2, comprises annealing the plate or the sheet at 600 to 1000° C. before cold rolling, or before cold rolling and between plural times of cold rolling.
- 7. The method according to claim 3, further comprises annealing the plate or the sheet at 600 to 1000° C. before cold rolling, or before cold rolling and between plural times of cold rolling.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11/169759 |
Jun 1999 |
JP |
|
Parent Case Info
This application is a divisional of application Ser. No. 09/593,744, filed on June 14, 2000 now U.S. Pat. No. 6,340,399.
This application claims priority under 35 U.S.C. §§119 and/or 365 to Japan Patent Application No. 11-169759 filed in Japan on Jun. 16, 1999, the entire content of which is herein incorporated by reference.
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