BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings.
FIG. 1A illustrates a conventional touch-sensor pad having diamond shaped electrodes.
FIG. 2 illustrates another conventional touch-sensor pad having triangular shaped electrodes.
FIG. 3A illustrates how a conductive object may affect the capacitance of a capacitive touch-sensing sensor element.
FIG. 3B is a conceptual cross-section view of the capacitive sensor element 300 of FIG. 3A.
FIG. 4A illustrates hexagonal shaped adjacent sensor elements within a sensor array according to one embodiment of the present invention.
FIG. 4B illustrates two embodiments of the gaps between hexagonal and octagonal shaped sensor elements.
FIG. 5A illustrates a top-side view of one embodiment of a sensor array having a plurality of hexagonal shaped sensor elements for detecting a presence of a conductive object on the sensor array.
FIG. 5B illustrates a block diagram of one embodiment of a capacitive sensor coupled to the sensor array of FIG. 5A.
FIG. 5C illustrates a top-side view of one embodiment of a two-layer touch-sensor pad.
FIG. 5D illustrates a cross section view of one embodiment of the two-layer touch-sensor pad of FIG. 5C.
FIG. 6 is a cross-sectional view illustrating a non-planar touch senor pad according to an alternative embodiment of the present invention.
FIG. 7 is a perspective view illustrating a dome-shaped touch sensor pad.
FIG. 8 is a two dimensional view illustrating the sensor elements of the dome-shaped touch sensor pad of FIG. 7 according to one embodiment of the present invention.
FIG. 9 illustrates a block diagram of one embodiment of an electronic system having a processing device and touch-sensor pad for detecting a presence of a conductive object according to one embodiment of the present invention.