Non-polar and semi-polar light emitting devices

Abstract

An (Al, Ga, In)N light emitting device, such as a light emitting diode (LED), in which high light generation efficiency is realized by fabricating the device on non-polar or semi-polar III-Nitride crystal geometries. Because non-polar and semi-polar emitting devices have significantly lower piezoelectric effects than c-plane emitting devices, higher efficiency emitting devices at higher current densities can be realized.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to high efficiency non-polar and semi-polar light emitting devices such as light emitting diodes (LEDs) and laser diodes (LDs).

2. Description of the Related Art

(Note: This application references a number of different publications as indicated throughout the specification. In addition, a list of a number of different publications can be found below in the section entitled “References.” Each of these publications is incorporated by reference herein.)

Currently, most commercial gallium nitride (GaN) based light emitting devices are constructed on c-axis oriented crystals. As a result, strong piezo-electric fields control light emission efficiency. In the structure of conventional LEDs and LDs, the thickness of the quantum well (QW) is only around 2-5 nm. When the thickness of the QW layer becomes larger than 5 nm, the conduction energy band and valence energy band of the QW layer is bent due to a strong piezoelectric field, and then the radiative recombination efficiency becomes small, and then the emitting efficiency of the LED and LD becomes smaller.

However, in the case of non-polar or semi-polar GaN, the piezoelectric polarization is minimized. So, the energy band bending in the QW is small. It is expected that the thickness of the QW can be increased to improve the emitting efficiency of the LED and LD. Recently, the inventors of the present invention found that the thickness of the QW should be increased up to 10 nm in the case of non-polar and semi-polar LED and LD to increase the emitting efficiency.

In the case of conventional LEDs, in order to increase the light output power from the front side of the LED, the emitted light is reflected by a mirror placed on the backside of the substrate or is reflected by a mirror coating on the lead frame, even if there are no mirrors on the backside of the sapphire substrate, and if the bonding material is transparent on the emission wavelength. However, this reflected light is re-absorbed by the emitting layer (active layer), because the photon energy is almost same as the band-gap energy of the light emitting species, such as AlInGaN multiple quantum wells (MQWs). The efficiency or output power of the LEDs is decreased due to this re-absorption of the LED light by the emitting layer. See, for example, FIGS. 1, 2 and 3, which are described in more detail below. See also J. J. Appl. Phys. 34, L797-99 (1995) and J. J. Appl. Phys. 43, L180-82 (2004).

What is needed in the art are LED and LD structures that generate light more efficiently in the blue, green, amber, and red regions and that more effectively extract light. The present invention satisfies that need.

SUMMARY OF THE INVENTION

The present invention describes an (Al, Ga, In)N light emitting device in which high light generation efficiency is realized by fabricating the device of novel non-polar or semi-polar GaN crystal geometries. Because non-polar and semi-polar devices have significantly lower piezoelectric effects than polar devices, higher efficiency LEDs and LDs can be realized.

The devices of the present invention can have greater QW thickness, namely greater than 4 nm, preferably from approximately 8-12 μm, and more preferably approximately 10 nm. Through the use of thicker quantum wells in non-polar and semi-polar LEDs, higher efficiencies at higher current densities are achieved. For LDs, the thicker QWs result in increased modal gain, and decreased threshold current density. In another instance, a larger number of QWs can be used to increase efficiency without suffering from higher voltages.

By fabricating the non-polar and semi-polar LEDs with a transparent contact layer, nearly ideal light extraction is realized, even at high current density.

An additional benefit is the fact that the non-polar and semi-polar LEDs generate polarized light much more effectively than c-plane devices. Polarized light emission ratios as high as 0.83 have been observed, making them useful for numerous applications, such as LCD back-lighting, signs, protection displays, and illumination.

The present invention also minimizes internal reflections within the LED by eliminating mirrors and/or mirrored surfaces, in order to minimize re-absorption of light by the emitting or active layer of the LED. To assist in minimizing internal reflections, transparent electrodes, such as ITO or ZnO, may be used.

Surface roughening, texturing, patterning or shaping, for example, by means of anisotropically etching (i.e., creating a cone shaped surface) or otherwise, may also assist in light extraction, as well as minimizing internal reflections. Die shaping also realizes higher light extraction efficiencies.

BRIEF DESCRIPTION OF THE DRAWINGS

Referring now to the drawings in which like reference numbers represent corresponding parts throughout:

FIG. 1 is a schematic of a hexagonal würtzite crystal structure of gallium nitride.

FIG. 2 is another schematic of the crystalline structure of gallium nitride.

FIGS. 3A, 3B, 3C and 3D illustrate the motivation behind using non-polar of gallium nitride planes for device structures and growth.

FIG. 4 is a schematic of a device structure according to the present invention.

FIGS. 5A, 5B and 5C illustrate the External Quantum Efficiency (EQE) versus Peak Wavelength (nm) for various polar and non-polar gallium nitride devices.

FIG. 6 illustrates the Power Output and External Quantum Efficiency (EQE) vs. Current (mA) for a device manufactured in accordance with the present invention.

FIG. 7 illustrates the Intensity (arbitrary units) vs. Polarizer Angle (degrees) for polarized light of non-polar (or semi-polar) and polar light emitting diodes.

FIG. 8 illustrates additional device structures and additional advantages associated with the present invention.

FIGS. 9A and 9B illustrate the structure of c-plane light emitting diodes, which are typically grown along the c-axis.

FIG. 10 is a schematic illustrating a side-emitting m-plane light emitting diode in accordance with the present invention.

FIG. 11 is a schematic illustrates an vertical top-emitting m-plane light emitting diode in accordance with the present invention.

FIG. 12 is a schematic illustrating a top view of a side-emitting m-plane light emitting diode in accordance with the present invention.

FIG. 13 is a schematic illustrating a side-emitting m-plane light emitting diode in accordance with the present invention.

FIG. 14 is a schematic illustrating a shaped m-plane light emitting diode in accordance with the present invention.

FIG. 15 is a schematic that illustrates a non-polar light emitting diode with multiple emitting layers that emits white light in accordance with the present invention.

FIG. 16 is a graph that illustrates External Quantum Efficiency (EQE) percentage measurements vs. Current (mA) of the non-polar light emitting diodes of the present invention.

FIG. 17 is a graph that illustrates Quick Test Power (mV) vs. Current (mA) of the non-polar light emitting diodes of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

In the following description of the preferred embodiment, reference is made to the accompanying drawings which form a part hereof, and in which is shown by way of illustration a specific embodiment in which the invention may be practiced. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention.

Overview

GaN and its alloys are most stable in the hexagonal würtzite crystal structure, in which the structure is described by two (or three) equivalent basal plane axes that are rotated 120° with respect to each other (the a-axes), all of which are perpendicular to a unique c-axis.

FIG. 1 is a schematic of a hexagonal würtzite crystal structure 100 of GaN that illustrates the major planes of interest, namely the a-plane {11-20} 102, m-plane {1-100} 104, r-plane {10-12} 106, c-plane [0001] 108, with these axes a1 [1000] 110, a2 [0100] 112, and a3 [0010], along with the c-axis 116, identified therein, wherein the fill patterns are intended to illustrate the planes of interest 102, 104 and 106, but do not represent the materials of the structure 100.

FIG. 2 is another schematic of the crystalline structure 200 of GaN, illustrating the placement of Ga atoms 202 and N atoms 204, and showing a semi-polar plane (10-11) 206, which is shown as the shaded plane in the crystalline structure. The group III atoms 202 and nitrogen atoms 204 occupy alternating c-planes along the c-axis of the crystal 200. The symmetry elements included in the würtzite structure 200 dictate that III-nitrides possess a bulk spontaneous polarization along this c-axis. Furthermore, as the würtzite crystal structure 200 is non-centro-symmetric, würtzite nitrides can and do additionally exhibit piezoelectric polarization, also along the c-axis.

Current nitride technology for electronic and optoelectronic devices employs nitride films grown along the polar c-direction. However, conventional c-plane quantum well structures in III-nitride based optoelectronic and electronic devices suffer from the undesirable quantum-confined Stark effect (QCSE), due to the existence of strong piezoelectric and spontaneous polarizations. The strong built-in electric fields along the c-direction cause spatial separation of electrons and holes that in turn give rise to restricted carrier recombination efficiency, reduced oscillator strength, and red-shifted emission.

FIGS. 3A, 3B, 3C and 3D illustrate the motivation behind using non-polar GaN planes for device structures and growth.

FIG. 3A illustrates the spontaneous polarization (P_SP) and piezoelectric polarization (P_PE) effects in c-plane (Ga face) structures, wherein ⊕ indicates a positive charge, ⊙ indicates a negative charge, the arrows represent the direction of polarization, and −σ₁, +σ₂, −σ₂, and −σ₁, represent energy band inflection points for the GaN (p-type and n-type) and InGaN (active) layers. FIG. 3B illustrates the energy band diagram corresponding to FIG. 3A for the valence band (Ev) and conduction band (Ec).

FIG. 3C illustrates the lack of spontaneous polarization (P_SP) and piezoelectric polarization (P_PE) effects in non-polar (a-plane) structures. FIG. 3D illustrates the energy band diagram corresponding to FIG. 3C for the valence band (Ev) and conduction band (Ec).

When using certain planes of the GaN structure, polarization and piezoelectric polarization cause band bending and charge separation, which leads to a light emission red shift, a low recombination efficiency, and a high threshold current, all of which create problems in finished devices. This is especially apparent in the c-plane (Ga face) where the Ev and Ec bands are shown as very disjointed.

FIG. 4 is a schematic of a device structure according to the present invention, that further illustrates the motivation behind using non-polar III-nitride layers, which may comprise m-plane or a-plane III-nitride layers. In this figure, a non-polar III-nitride light emitting device comprises a laser diode (LD) structure 400, which includes a Ti—Al contact layer 402, a-plane n-GaN layer 404, n-AlGaN cladding layer 406, n-GaN guiding layer 408, GaN active layer 410, p-GaN guiding layer 412, GaN active layer 414, p-AlGaN cladding layer 416, p-GaN layer 418 and Ni—Au contact layer 420. When a-plane and m-plane growth is achieved, lower dislocation densities are achieved. Further, no polarization field-induced charge separation in the quantum wells occurs, and there is higher mobility in the layers. This results in a lower threshold current, and higher reliability for the finished devices.

FIGS. 5A, 5B and 5C illustrate the External Quantum Efficiency (EQE) versus Peak Wavelength (nm) for various polar and non-polar GaN devices. The polarization fields in the quantum well region discussed above creates a “gap” in emission in the green region of the visible spectrum, as well as in the ultraviolet region. By using non-polar (m-plane or a-plane) devices, rather than polar c-plane devices, or by using semi-polar device structures, the polarization fields in the quantum well region are reduced or eliminated, which can solve the emission gap problem.

FIG. 6 illustrates the Power Output and External Quantum Efficiency (EQE) vs. Current (mA) for a device manufactured in accordance with the present invention. The EQE is a figure of merit for these devices. Further, a 25 milliwatt (mW) device is shown at a 20 milliamp (mA) current input. This result far exceeds any results seen by any non-polar LED device to date.

FIG. 7 illustrates the Intensity (arbitrary units) vs. Polarizer Angle (degrees) for polarized light of non-polar (or semi-polar) and polar LEDs. Further, non-polar and semi-polar LEDs made in accordance with the present invention directly emit polarized light. This is useful for many applications, such as Liquid Crystal Display (LCD) back-lighting, which requires polarized light. With the devices of the present invention, a polarizing filter is not required between the light source and the LCD display, because the light being emitted is already polarized.

FIG. 8 illustrates additional device structures and additional advantages associated with the present invention. For example, the non-polar or semi-polar devices manufactured according to the present invention can be used for LCD back-lighting, because these devices reduce or eliminate built-in polarization fields. A structure for LCD back-lighting includes a light source 800, polarizer 802, alignment film 804, liquid crystals 806, alignment film 808, polarizer 810, which when activated by an AC voltage source 812 results in light output 814. Moreover, the devices provide a p-type concentration of approximately 7×10¹⁸ cm⁻³ with minimal LED peak wavelength shift vs. current. In addition, as discussed with respect to FIG. 7, since the non-polar (e.g., m-plane or a-plane) or semi-polar LEDs directly emit polarized light, more light 814 is available for the LCD displays. Typically, an additional percentage of light 814 is available, and such percentage has been observed to be approximately 40-70% additional light is available. However, a larger or smaller percentage of light may be available without departing from the scope of the present invention.

FIGS. 9A and 9B illustrate the structure of c-plane LEDs, which are typically grown along the c-axis. In FIG. 9A, the c-plane LED 900 includes a substrate 902, p-type layer 904, active layer 906, n-type layer 908, electrode 910, bonding pad 912 and electrode 914. FIG. 9B shows a similar c-plane LED 916, wherein the emitting surface is typically on the nitrogen face (N face), which can be roughened 918 or otherwise treated to increase light production from such devices.

FIG. 10 is a schematic illustrating a non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a side-emitting m-plane LED 1000, which includes a metal lead frame 1002, an ensemble 1004 of p-GaN/GaN/n-GaN layers that emit light 1006, transparent electrode layers 1008, 1010 and p-contact 1012. One or more emitting surfaces of the device 1000 may be a roughened, textured, patterned or shaped surface 1012 to enhance the extraction of light (e.g., the emitting surface of the device 1000 may be a cone shaped surface). Further, the device 1000 comprises a side-emitting device, with appropriate placement of the contact 1012 and metal frame 1002 shown.

FIG. 11 is a schematic illustrating another non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a vertical top-emitting m-plane LED 1100, which includes a substrate 1102, an ensemble 1104 of p-GaN/GaN/n-GaN layers that emit light, a top transparent layer 1006, as well as p-contact 1008 and n-contact 1010. In this embodiment, the ensemble 1104 includes an active region 1112 that comprises one or more QWs having a thickness greater than 4 nm, preferably a thickness of approximately 8-12 nm, and more preferably a thickness of approximately 10 nm.

FIG. 12 is a schematic illustrating another non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a top view of a side-emitting m-plane LED 1200, which includes a p-type electrode layer 1202, a metal p-type bonding pad 1204, and a roughened, textured, patterned or shaped surface 1206 to enhance the extraction of light 1208.

The p-type electrode layer 1202 is an electrically conductive transparent layer that may be roughened, textured, patterned or shaped. The p-type electrode layer 1202 is typically an ITO or ZnO layer, but can be other transparent metal oxides or other conductive materials which are substantially or completely transparent at the wavelengths of interest. The p-type electrode layer 1202 is formed adjacent the ensemble of non-polar III-nitride layers and covers substantially the entire top of the die. A current spreading layer may deposited before the p-type electrode layer 1202, and a metal bonding pad 1204 is deposited on the p-type electrode layer 1202 and occupies a small portion of the p-type electrode layer 1202. The bulk of the emissions 1208 emanate from the side of the device 1200, although some emissions may exit through the p-type electrode layer 1202 as well.

FIG. 13 is a schematic illustrating another non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a side-emitting m-plane LED 1300, which includes a transparent conducting mount 1302, an ensemble 1304 of p-GaN/GaN/n-GaN layers that emit light, transparent electrode layers 1306, 1308 and p-contact 1310. This device 1300 also includes a roughened, textured, patterned or shaped surface 1312 to enhance the extraction of light 1314. Further, the device 1300 comprises a side-emitting device, with appropriate placement of contacts 1306, 1308. The device 1300 may be placed on a transparent mounting structure 1302, which is substantially or completely transparent at the wavelengths of interest, and is comprised of glass, epoxy, plastics, or other transparent materials.

FIG. 14 is a schematic illustrating another non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a shaped m-plane LED 1400, which includes a transparent lead frame (not shown), an ensemble 1402 of p-GaN/GaN/n-GaN layers that emit light, transparent electrode layer 1404 and p-contact 1406. Moreover, more than one emitting surface 1408, 1410, and 1412 of the device 1400 is roughened, textured, patterned or shaped to enhance the extraction of light 1414 from multiple facets of the device 1400 (although extraction from surface 1408 is the only one shown in FIG. 14).

FIG. 15 is a schematic illustrating another non-polar III-nitride light emitting device having a plurality of non-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers in accordance with the present invention. In this embodiment, the device is a non-polar LED 1500 with multiple emitting layers that emit white light. The non-polar LED 1500 includes an ensemble 1502 of p-GaN/GaN/n-GaN layers that emit light, transparent layers 1504, 1506, as well as p-contact 15008. In this embodiment, the ensemble 1502 includes an active region 1510, which can be a QW well layer if desired, comprised of multiple emitting layers emitting light at more than one wavelength. For example, the active region 1510 preferably emits at red, green, and blue wavelengths, which when combined, creates white light (or any other color of light). This is now possible because of the lack of interfering field-induced charge separations that are present in c-plane devices.

FIG. 16 is a graph that illustrates EQE percentage measurements vs. Current (mA) of the non-polar LEDs of the present invention. As seen, the non-polar LEDs of the present invention have a flattened EQE once the forward current reaches a threshold.

FIG. 17 is a graph that illustrates Quick Test Power (mV) vs. Current (mA) of the non-polar LEDs of the present invention. The power output shown is linear with respect to current input for m-plane LEDs of the present invention.

REFERENCES

The following references are incorporated by reference herein:

• 1. Appl. Phys. Lett. 56, 737-39 (1990).
• 2. Appl. Phys. Lett. 64, 2839-41 (1994).
• 3. Appl. Phys. Lett. 81, 3152-54 (2002).
• 4. Jpn. J. Appl. Phys., 43, L1275-77 (2004).
• 5. Jpn. J. Appl. Phys., 45, L1084-L1086 (2006).
• 6. Jpn. J. Appl. Phys., 34, L797-99 (1995).
• 7. Jpn. J. Appl. Phys., 43, L180-82 (2004).
• 8. Fujii T., Gao Y., Sharma R., Hu E. L., DenBaars S. P., Nakamura S., “Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening,” Appl. Phys. Lett., vol. 84, no. 6, 9 Febuary 2004, pp. 855-7.

CONCLUSION

Although discussed primarily with respect to m-plane gallium nitride, other non-polar and semi-polar geometries of gallium nitride and other related material systems can benefit from the present invention. Further, other materials that are used for other electronic devices or similar electronic devices, can also benefit from the present invention, such as Laser Diodes (LDs), High Electron Mobility Transistors (HEMTs), Vertical Cavity Side Emitting Lasers (VCSELs), solar cells, transistors, diodes, other emitting devices, and other devices fabricated using semiconductor processing techniques.

This concludes the description of the preferred embodiment of the present invention. The foregoing description of one or more embodiments of the invention has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching.

Claims

1. A non-polar or semi-polar III-nitride light emitting device, comprising: a plurality of non-polar or semi-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers, wherein the active region includes one or more quantum wells having a thickness greater than 4 nanometers.

2. The device of claim 1, wherein the quantum wells have a thickness of approximately 8-12 nanometers.

3. The device of claim 1, wherein the quantum wells have a thickness of approximately 10 nanometers.

4. The device of claim 1, wherein the non-polar III-nitride layers comprise m-plane or a-plane III-nitride layers.

5. The device of claim 1, wherein one or more emitting surfaces of the device is roughened, textured, patterned or shaped.

6. The device of claim 5, wherein more than one emitting surface of the device is roughened, textured, patterned or shaped.

7. The device of claim 5, wherein the emitting surface of the device is a cone shaped surface.

8. The device of claim 1, wherein the active region is comprised of multiple emitting layers emitting light at more than one wavelength.

9. The device of claim 1, further comprising a transparent electrode layer is formed adjacent the non-polar or semi-polar III-nitride layers.

10. The device of claim 9, wherein the transparent electrode layer is an electrically conductive contact layer.

11. The device of claim 9, wherein a surface of the transparent layer is roughened, textured, patterned or shaped.

12. The device of claim 9, wherein a current spreading layer is deposited before the transparent electrode layer.

13. The device of claim 1, wherein the device is placed on a transparent mounting structure.

14. A method of fabricating a non-polar or semi-polar III-nitride light emitting device, comprising: forming a plurality of non-polar or semi-polar III-nitride layers comprising one or more p-type layers, an active region, and one or more n-type layers, wherein the active region includes one or more quantum wells having a thickness greater than 4 nanometers.

15. The method of claim 14, wherein the quantum wells have a thickness of approximately 8-12 nanometers.

16. The method of claim 14, wherein the quantum wells have a thickness of approximately 10 nanometers.

17. The method of claim 14, wherein the non-polar III-nitride layers comprise m-plane or a-plane III-nitride layers.

18. The method of claim 14, wherein one or more emitting surfaces of the device is roughened, textured, patterned or shaped.

19. The method of claim 18, wherein more than one emitting surface of the device is roughened, textured, patterned or shaped.

20. The method of claim 18, wherein the emitting surface of the device is a cone shaped surface.

21. The method of claim 14, wherein the active region is comprised of multiple emitting layers emitting light at more than one wavelength.

22. The method of claim 14, further comprising forming a transparent electrode layer adjacent the non-polar or semi-polar III-nitride layers.

23. The method of claim 22, wherein the transparent electrode layer is an electrically conductive contact layer.

24. The method of claim 22, wherein a surface of the transparent layer is roughened, textured, patterned or shaped.

25. The method of claim 22, wherein a current spreading layer is deposited before the transparent electrode layer.

26. The method of claim 14, wherein the device is placed on a transparent mounting structure.